VLSI refers to very large scale integration in electronics, involving the integration of millions of transistors on a single chip. The document discusses the history and evolution of integration levels from SSI to VLSI to ULSI. It describes the CMOS fabrication process and design styles used in VLSI. Key phases in chip creation are design, fabrication, testing and packaging. Advanced computer-aided design tools are needed to design complex VLSI circuits. Applications include analog, ASIC and system-on-chip designs. Challenges to VLSI include power dissipation and scaling issues as integration increases. The future of VLSI involves continued device miniaturization and increasing transistor densities on chips.
Routing in Integrated circuits is an important task which requires extreme care while placing the modules and circuits and connecting them with each other.
Note : To get more understanding Recommending to see first section - Low power in vlsi with upf basics part 1
With Increase in Portable devices, VLSI chips has to consider about Power usages in VLSI silicon chips. So Power Aware design and verification is so important in Industry. To get basic knowledge on Low Power Design and Verification with UPF basics Go through this Slides.
Low Power VLSI design architecture for EDA (Electronic Design Automation) and Modern Power Estimation, Reduction and Fixing technologies including clock gating and power gating
TYPES OF PLACEMENT,GOOD PLACEMENT VS. BAD PLACEMENT ,ALGORITHMS, ASIC DESIGN FLOW DIAGRAM,DEFINITION OF PLACEMENT,TECHNIQUES USED FOR PLACEMENT,PLACEMENT TRENDS,SOLUTIONS
Semiconductor engineering is becoming more dynamic fiels since the technology scaling is taking place. Power reduction techniques are lucrative solutions to the performance, area and power trade off. Therefore Power reduction of VLSI designs are critical.
Problems of dynamic logic circuits and how it is solved by Domino logic circuits, is explained over here. Why it is called domino and how domino logic works, that also explained here.
Very Large Scale Integration is the technology used now a day everywhere. Diploma as well as degree students can refer this
(For Downloads, send me mail
agarwal.avanish@yahoo.com)
With Increase in Portable devices, VLSI chips has to consider about Power usages in VLSI silicon chips. So Power Aware design and verification is so important in Industry. To get basic knowledge on Low Power Design and Verification with UPF basics Go through this Slides.
Gate Diffusion Input Technology (Very Large Scale Integration)Ashwin Shroff
The aim of project is by using GDI technique the power consumption, delay, chip area and connection and parasitic capacitors is decreased. In this project, we are implementing the new T-flip flop using GDI technique for low power and high speed in order to achieve power delay product (PDP)
I made this presentation for you , I hope its useful for you all, and I hate Plagiarism please, I also used some slides here but I mentioned all in the last slide :)
Hope you can get benefits from it
Routing in Integrated circuits is an important task which requires extreme care while placing the modules and circuits and connecting them with each other.
Note : To get more understanding Recommending to see first section - Low power in vlsi with upf basics part 1
With Increase in Portable devices, VLSI chips has to consider about Power usages in VLSI silicon chips. So Power Aware design and verification is so important in Industry. To get basic knowledge on Low Power Design and Verification with UPF basics Go through this Slides.
Low Power VLSI design architecture for EDA (Electronic Design Automation) and Modern Power Estimation, Reduction and Fixing technologies including clock gating and power gating
TYPES OF PLACEMENT,GOOD PLACEMENT VS. BAD PLACEMENT ,ALGORITHMS, ASIC DESIGN FLOW DIAGRAM,DEFINITION OF PLACEMENT,TECHNIQUES USED FOR PLACEMENT,PLACEMENT TRENDS,SOLUTIONS
Semiconductor engineering is becoming more dynamic fiels since the technology scaling is taking place. Power reduction techniques are lucrative solutions to the performance, area and power trade off. Therefore Power reduction of VLSI designs are critical.
Problems of dynamic logic circuits and how it is solved by Domino logic circuits, is explained over here. Why it is called domino and how domino logic works, that also explained here.
Very Large Scale Integration is the technology used now a day everywhere. Diploma as well as degree students can refer this
(For Downloads, send me mail
agarwal.avanish@yahoo.com)
With Increase in Portable devices, VLSI chips has to consider about Power usages in VLSI silicon chips. So Power Aware design and verification is so important in Industry. To get basic knowledge on Low Power Design and Verification with UPF basics Go through this Slides.
Gate Diffusion Input Technology (Very Large Scale Integration)Ashwin Shroff
The aim of project is by using GDI technique the power consumption, delay, chip area and connection and parasitic capacitors is decreased. In this project, we are implementing the new T-flip flop using GDI technique for low power and high speed in order to achieve power delay product (PDP)
I made this presentation for you , I hope its useful for you all, and I hate Plagiarism please, I also used some slides here but I mentioned all in the last slide :)
Hope you can get benefits from it
Ultra-thin body SOI MOSFETs: Term Paper_class presentation on Advanced topics...prajon
This slide describes one of the technology n the field of semiconductor devices, Ultra thin body SOI (Silicon on Insulator) MOSFETs and its various uses and characteristics.
In the world of Very Large Scale Integration (VLSI), the Physical Design process plays a crucial role in transforming a logical design into a physical layout that can be manufactured. Among the various steps involved in the Physical Design flow, Place and Route (PnR) stand out as a critical phase. PnR consists in placing the different components of a design on a chip and routing the connections between them. In this article, we will delve into the PnR flow, exploring its key steps, challenges, and the tools involved.
1. Partitioning:
Partitioning is a preliminary step in the PnR flow that divides the design into manageable blocks or modules based on functionality, hierarchy, or timing constraints. It enables parallel processing during subsequent steps and facilitates easier placement and routing. Partitioning algorithms aim to balance the workload across partitions and minimize inter-partition communication.
2. Floorplanning:
Floorplanning is a critical aspect of the placement process, defining the overall chip's top-level structure and organizing the different functional blocks. It involves allocating space for each block, determining their relative positions, and defining the placement regions. Effective floorplanning ensures proper utilization of available chip areas, reduces congestion, and facilitates efficient routing.
3. Power Planning:
Power planning focuses on distributing power supply and ensuring a stable power delivery network throughout the chip. It involves inserting power distribution networks, decoupling capacitors, and voltage regulators to minimize voltage drop, signal noise, and power supply fluctuations. Power planning techniques aim to optimize power grid layout, reduce IR drop, and mitigate electromigration issues.
4. Placement:
Placement is the first step in the PnR flow and involves determining the optimal location for each logic component on the chip. The primary objective of placement is to minimize wire length, power consumption, and timing delays while adhering to various constraints such as blockages, power grid, and signal integrity.
5. Clock Tree Synthesis (CTS):
Clock Tree Synthesis is a crucial step in PnR flow that ensures the efficient distribution of clock signals to all sequential elements of the design. CTS aims to minimize clock skew, and power dissipation, and provide a balanced clock network. CTS algorithms construct a tree-like structure by inserting buffers and optimizing wire length to achieve reliable clock distribution.
6. Routing:
6.1 Global Routing:
Once the placement is complete, the next step is global routing, which establishes the connections between the placed components. Global routing generates a coarse routing structure using minimum spanning trees, maze routing, or other algorithms. It focuses on achieving reasonable wirelength and reducing congestion without considering the precise details of the interconnects.
Model Attribute Check Company Auto PropertyCeline George
In Odoo, the multi-company feature allows you to manage multiple companies within a single Odoo database instance. Each company can have its own configurations while still sharing common resources such as products, customers, and suppliers.
The French Revolution, which began in 1789, was a period of radical social and political upheaval in France. It marked the decline of absolute monarchies, the rise of secular and democratic republics, and the eventual rise of Napoleon Bonaparte. This revolutionary period is crucial in understanding the transition from feudalism to modernity in Europe.
For more information, visit-www.vavaclasses.com
Ethnobotany and Ethnopharmacology:
Ethnobotany in herbal drug evaluation,
Impact of Ethnobotany in traditional medicine,
New development in herbals,
Bio-prospecting tools for drug discovery,
Role of Ethnopharmacology in drug evaluation,
Reverse Pharmacology.
The Indian economy is classified into different sectors to simplify the analysis and understanding of economic activities. For Class 10, it's essential to grasp the sectors of the Indian economy, understand their characteristics, and recognize their importance. This guide will provide detailed notes on the Sectors of the Indian Economy Class 10, using specific long-tail keywords to enhance comprehension.
For more information, visit-www.vavaclasses.com
Students, digital devices and success - Andreas Schleicher - 27 May 2024..pptxEduSkills OECD
Andreas Schleicher presents at the OECD webinar ‘Digital devices in schools: detrimental distraction or secret to success?’ on 27 May 2024. The presentation was based on findings from PISA 2022 results and the webinar helped launch the PISA in Focus ‘Managing screen time: How to protect and equip students against distraction’ https://www.oecd-ilibrary.org/education/managing-screen-time_7c225af4-en and the OECD Education Policy Perspective ‘Students, digital devices and success’ can be found here - https://oe.cd/il/5yV
This is a presentation by Dada Robert in a Your Skill Boost masterclass organised by the Excellence Foundation for South Sudan (EFSS) on Saturday, the 25th and Sunday, the 26th of May 2024.
He discussed the concept of quality improvement, emphasizing its applicability to various aspects of life, including personal, project, and program improvements. He defined quality as doing the right thing at the right time in the right way to achieve the best possible results and discussed the concept of the "gap" between what we know and what we do, and how this gap represents the areas we need to improve. He explained the scientific approach to quality improvement, which involves systematic performance analysis, testing and learning, and implementing change ideas. He also highlighted the importance of client focus and a team approach to quality improvement.
2024.06.01 Introducing a competency framework for languag learning materials ...Sandy Millin
http://sandymillin.wordpress.com/iateflwebinar2024
Published classroom materials form the basis of syllabuses, drive teacher professional development, and have a potentially huge influence on learners, teachers and education systems. All teachers also create their own materials, whether a few sentences on a blackboard, a highly-structured fully-realised online course, or anything in between. Despite this, the knowledge and skills needed to create effective language learning materials are rarely part of teacher training, and are mostly learnt by trial and error.
Knowledge and skills frameworks, generally called competency frameworks, for ELT teachers, trainers and managers have existed for a few years now. However, until I created one for my MA dissertation, there wasn’t one drawing together what we need to know and do to be able to effectively produce language learning materials.
This webinar will introduce you to my framework, highlighting the key competencies I identified from my research. It will also show how anybody involved in language teaching (any language, not just English!), teacher training, managing schools or developing language learning materials can benefit from using the framework.
2. VLSI Design
What is VLSI?
“Very Large Scale Integration”
Defines integration level
1980s hold-over from outdated taxonomy for integration levels
Obviously influenced from frequency bands, i.e. HF, VHF, UHF
Sources disagree on what is measured (gates or transistors?)
SSI – Small-Scale Integration (0-102)
MSI – Medium-Scale Integration (102-103)
LSI – Large-Scale Integration (103-105)
VLSI – Very Large-Scale Integration (105-107)
ULSI – Ultra Large-Scale Integration (>=107)
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3. Moore’s Law
In 1960 Gordon Moore predicted “the number of
components that can be integrated on a single chip
would increase at such a rapid rate that it will become
twice in every 18 months”.
So by using Moore’s law we get an approximate
integration level trend at any time.
But now moore’s law has reached its physical limit.
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5. Integrated Circuits/MEMs
Today, VLSI refers to systems implementation with integrated
circuits
Integrated circuit refers mostly to general manufacturing technique
micro/nano-scale devices on a semiconductor (crystalline) substrate
Formed using chemical/lithography processing
What kind of devices / structures?
transistors (bipolar, MOSFET)
wires (interconnects and passives)
diodes (junction, LEDs, VCSELs, MSM, photoconductor, PiN)
MEMs (piezoelectric integration, accelerometers, gyroscopes,
pressure sensors, micro-mirrors)
For CMOS digital design, we only use MOSFET transistors (used
as switches) and wires
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6. Chips
Integrated circuits consist of:
A small square or rectangular “die”, < 1mm thick
Small die: 1.5 mm x 1.5 mm => 2.25 mm2
Large die: 15 mm x 15 mm => 225 mm2
Larger die sizes mean:
More logic, memory
Less volume
Less yield
Dies are made from silicon (substrate)
Substrate provides mechanical support and electrical common point
6
7. CMOS technique of IC fabrication
Common metal oxide semiconductor for constructing
FET on wafer chip
N-well technique of fabrication on doped silicon, poly
silicon, metal oxide and silicon oxide layer is
implemented.
On this pattern of various layers Optical lithography
followed by photo resisting and etching is done.
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9. Chip Design styles
Design styles
Full custom Semi custom
Array based Cell based
Pre diffused like Macro cell like
gate arrays, sea PLA gate matrix
of gates etc etc
Pre wired like
Standard cell,
anti fuse based
hierarchical cell
memory based
9
10. Phases of creating microelectronic
chips
Design : Circuit representation is converted into
geometric representation
Fabrication : involves method of deposition and
diffusion on wafer
Testing : circuit is tested to meet design specifications
Packaging : each circuit is packaged by establishing
interconnections.
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12. Concept of VLSI design
Polygons represent layers deposited on the substrate
More of an art than science
Scale:
approximately
10 um x 10 um
One 2-input NAND gate with 4 transistors
Typical microprocessor contains 50 – 200 million
transistors (10-50 million gates)
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13. Need of computerized design tools
Manual layout of complex large scale design is obviously not practical
Design complexity:
Manually drawing layout for a billion transistors would take too long
Even if we could… there are many problems like…
How to verify (test) designs for functionality, speed, power, etc.?
Complexity scales faster than actual design
How to reuse designs?
How to create human-readable designs?
How to speed-up design process?
These problems form a great deal of work
Electronic Design Automation (EDA)
a.k.a. CAD
13
14. VLSI CAD
Various software like synopsys , cadence etc. are used
by designers to synthesize highly efficient VLSI chips.
Hardware description for IC is written in Verilog or
VHDL.
It describes the hardware ,interconnection of circuit
blocks and functionality.
VHDL(very high speed IC hardware design language)
is the C of VLSI technology.
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15. VLSI applications
Basically three areas of application exist today for VLSI
Analog : Small transistor count precision circuits such
as Amplifiers, Data converters, filters, Phase Locked
Loops, Sensors etc.
ASIC: application specific IC a microchip to perform and
execute a particular task like digital signal processing,
image compression etc.
SoC: systems on a chip are highly complex mixed signal
processors like a network chip or a wireless radio chip.
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16. Challenges to VLSI technology
As integration increases VLSI chips somewhat suffer
from the challenges such as
Power dissipation due to increasing components
Noise delays due to capacitive or inductive coupling
Decrease in clock frequency by skin effect on VLSI chip
Improper scaling of wires for increasing components.
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19. Future of VLSI
Technology is evolving everyday and VLSI is the most
progressing one it is moving to ULSI.
It has been predicted that VLSI will develop more in
the coming decade.
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