This document discusses ASIC placement, which involves assigning exact locations to circuit components within a chip's core area. The goals of placement are to minimize the total interconnect length and costs while meeting timing requirements. It describes two main placement techniques - global placement, which groups cells to minimize interconnect between groups, and detailed placement, which further optimizes placement objectives. The document outlines various placement algorithms, goals, and trends like mixed-size placement and whitespace distribution to improve routability and performance.
Power gating is the main power reduction techniques for the static power. As long as technology scaling is taking place, static power becomes paramount important factor to the VLSI designs.Therefore Power gating is the recent power reduction technique that is actively in research areas.
Timing and Design Closure in Physical Design Flows Olivier Coudert
A physical design flow consists of producing a production-worthy layout from a gate-level netlist subject to a set of constraints. We focus on the problems imposed by shrinking process technologies. It exposes the problems of timing closure, signal integrity, design variable dependencies, clock and power/ground routing, and design signoff. It also surveys some physical design flows, and outlines a refinement-based flow.
Routing in Integrated circuits is an important task which requires extreme care while placing the modules and circuits and connecting them with each other.
https://www.udemy.com/vlsi-academy
Usually, while drawing any circuit on paper, we have only one 'vdd' at the top and one 'vss' at the bottom. But on a chip, it becomes necessary to have a grid structure of power, with more than one 'vdd' and 'vss'. The concept of power grid structure would be uploaded soon. It is actually the scaling trend that drives chip designers for power grid structure.
In semiconductor design, standard-cell methodology is a method of designing application-specific integrated circuits (ASICs) with mostly digital-logic features. Standard-cell methodology is an example of design abstraction, whereby a low-level very-large-scale integration (VLSI) layout is encapsulated into an abstract logic representation (such as a NAND gate).
Cell-based methodology – the general class to which standard cells belong – makes it possible for one designer to focus on the high-level (logical function) aspect of digital design, while another designer focuses on the implementation (physical) aspect. Along with semiconductor manufacturing advances, standard-cell methodology has helped designers scale ASICs from comparatively simple single-function ICs (of several thousand gates), to complex multi-million gate system-on-a-chip (SoC) devices.
Define Width and Height of Core and Die (http://www.vlsisystemdesign.com/PD-F...VLSI SYSTEM Design
https://www.udemy.com/vlsi-academy
The very first step in chip design is floorplanning, in which the width and height of the chip, basically the area of the chip, is defined. A chip consists of two parts, 'core' and 'die'.
Power gating is the main power reduction techniques for the static power. As long as technology scaling is taking place, static power becomes paramount important factor to the VLSI designs.Therefore Power gating is the recent power reduction technique that is actively in research areas.
Timing and Design Closure in Physical Design Flows Olivier Coudert
A physical design flow consists of producing a production-worthy layout from a gate-level netlist subject to a set of constraints. We focus on the problems imposed by shrinking process technologies. It exposes the problems of timing closure, signal integrity, design variable dependencies, clock and power/ground routing, and design signoff. It also surveys some physical design flows, and outlines a refinement-based flow.
Routing in Integrated circuits is an important task which requires extreme care while placing the modules and circuits and connecting them with each other.
https://www.udemy.com/vlsi-academy
Usually, while drawing any circuit on paper, we have only one 'vdd' at the top and one 'vss' at the bottom. But on a chip, it becomes necessary to have a grid structure of power, with more than one 'vdd' and 'vss'. The concept of power grid structure would be uploaded soon. It is actually the scaling trend that drives chip designers for power grid structure.
In semiconductor design, standard-cell methodology is a method of designing application-specific integrated circuits (ASICs) with mostly digital-logic features. Standard-cell methodology is an example of design abstraction, whereby a low-level very-large-scale integration (VLSI) layout is encapsulated into an abstract logic representation (such as a NAND gate).
Cell-based methodology – the general class to which standard cells belong – makes it possible for one designer to focus on the high-level (logical function) aspect of digital design, while another designer focuses on the implementation (physical) aspect. Along with semiconductor manufacturing advances, standard-cell methodology has helped designers scale ASICs from comparatively simple single-function ICs (of several thousand gates), to complex multi-million gate system-on-a-chip (SoC) devices.
Define Width and Height of Core and Die (http://www.vlsisystemdesign.com/PD-F...VLSI SYSTEM Design
https://www.udemy.com/vlsi-academy
The very first step in chip design is floorplanning, in which the width and height of the chip, basically the area of the chip, is defined. A chip consists of two parts, 'core' and 'die'.
Triad Semiconductor Analog and Mixed Signal ASIC Company OverviewTriad Semiconductor
Triad Semiconductor, www.triadsemi.com, designs and manufactures analog and mixed-signal custom IC solutions. We support customers in consumer, automotive, industrial, medical and defense markets. Learn how to get your products to market quickly (we've gone from kickoff to working silicon in 60 days), how to fix problems quickly and inexpensively (we've fixed problems in hours that take others months), and how to ship cost effectively (our customers are shipping over 50-million devices per year using our Agile ASIC™ technology).
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Many intellectual property (IP) modules are present in contemporary system on chips (SoCs). This could provide an issue with interconnection among different IP modules, which would limit the system's ability to scale. Traditional bus-based SoC architectures have a connectivity bottleneck, and network on chip (NoC) has evolved as an embedded switching network to address this issue. The interconnections between various cores or IP modules on a chip have a significant impact on communication and chip performance in terms of power, area latency and throughput. Also, designing a reliable fault tolerant NoC became a significant concern. In fault tolerant NoC it becomes critical to identify faulty node and dynamically reroute the packets keeping minimum latency. This study provides an insight into a domain of NoC, with intention of understanding fault tolerant approach based on the XY routing algorithm for 4×4 mesh architecture. The fault tolerant NoC design is synthesized on field programmable gate array (FPGA).
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- Synthesized the design in Synopsys Design Vision and functionality was verified using the Modelsim
- Final physical design was generated using the IC Compiler.
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Artificial Intelligence (AI) technologies such as Generative AI, Image Generators and Large Language Models have had a dramatic impact on teaching, learning and assessment over the past 18 months. The most immediate threat AI posed was to Academic Integrity with Higher Education Institutes (HEIs) focusing their efforts on combating the use of GenAI in assessment. Guidelines were developed for staff and students, policies put in place too. Innovative educators have forged paths in the use of Generative AI for teaching, learning and assessments leading to pockets of transformation springing up across HEIs, often with little or no top-down guidance, support or direction.
This Gasta posits a strategic approach to integrating AI into HEIs to prepare staff, students and the curriculum for an evolving world and workplace. We will highlight the advantages of working with these technologies beyond the realm of teaching, learning and assessment by considering prompt engineering skills, industry impact, curriculum changes, and the need for staff upskilling. In contrast, not engaging strategically with Generative AI poses risks, including falling behind peers, missed opportunities and failing to ensure our graduates remain employable. The rapid evolution of AI technologies necessitates a proactive and strategic approach if we are to remain relevant.
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1. ASIC DESIGN
MODULE - III
ASIC CONSTUCTION :
PLACEMENT
PRESENTED BY
HARSHADA BURUTE.
2. Contents
Introduction
Definition of placement
Goals and objectives
Placement layout
Types of placements
Placement steps
Placement trends(solutions)
References
3. Introduction
Placement is an essential step in physical design flow since it assigns exact locations
for various circuit components within the chips core area.
A placer takes a given synthesized circuit netlist together with a technology library and
produces a valid placement layout.
Decide the locations of cells in a block.
Selects the specific location for each logic block in the FPGA, while trying to
minimize the total length of interconnect required.
Placement is much more suited to automation than floorplanning.
Placement is a key step in physical design.
Placement placed in ASIC design flow step no. 6 in physical design.
5. Definition of placement
Exact placement of the
modules (modules can
be gates, standard cells,
macros…).
The general goal is to
minimize the total area
and interconnect cost.
6. Placement
There are various types of placements.
System-level placement: Place all the PCBs together such that Area
occupied is minimum and Heat dissipation is within limits.
Board-level placement: All the chips have to be placed on a PCB. Area is
fixed. All modules of rectangular shape. The objective is to, minimize the
number of routing layers and Meet system performance requirements.
Chip-level placement: Normally placement carried out along with pin
assignment
7. Placement goals & objectives
Goals
To arrange all the logic cells within the flexible blocks on a chip.
Objectives
Minimize all the critical net delays
Minimize power dissipation
Minimize crosstalk between signals
Minimize the interconnect congestion
Guarantee the router can complete the router step
Minimize the total estimated interconnect length
Specific timing requirement for critical nets
8. PLACEMENT
LAYOUT AREA
ROW CONSIST OF NUMBER OF SITES WHICH
CAN BE OCCUPIED BY THE CIRCUIT
COMPONENT.
LAYOUT AREA SPECIFIES THE FIX HEIGHT OF
ROWS.
STANDARD CELLS HAVE A FIXED HEIGHT
EQUAL TO ROWS HEIGHT BUT HAVE
VARIABLE WIDTHS.
BLOCKS CAN HAVE PREASSIGNED
LOCATIONS.
THIS IS CALLED MIXED MODE PLACEMENT.
10. GLOBAL PLACEMENT
The goal of global placement is to find well spread, ideally with
no overlaps, placement for the given net list that attains
required objectives such as wirelength minimization or timing
specifications.
Standard cells are placed into groups such that the number of
connections between groups is minimized.
This is solved through circuit partitioning.
11. Algorithms
1. Simulated-annealing placers
2. Analytical placers
3. Min–cut placers –
Min cut placers operate in a top-down hierarchical fashion by recursively
partitioning a given netlist into partitions.
Where k>1 multiway partitioning
k=1 bisection partitioning
k=2 quadrisection partitioning
Divided into sub section for better results:
i) Min cut partitioners- k-way min cut partitioning
ii) Cut sequences- cut directions
iii) Capturing global connectivity- useful for improve placement results.
12. DETAILED PLACEMENT AND LEGALIZERS
A placement is illegal if cells or blocks are overlaps.
A detailed placer takes a legal placement and improve some placement objectives like wirelength
congestion.
13. DETAILED PLACEMENT AND
LEGALIZERS
Goals of detailed placer and legalizers
Remove all overlaps, and snap cells to sites with the minimum impact on
wirelength, timing and congestion.
Improve wirelength by reordering groups of cells.
Improve routability by carefully distributing free sites.
Classification of detailed placement into heuristic or exact methods.
1) Heuristic method : typically achieve good results in fast runtime.
2) Exact method : only applicable for a few cases and usually take longer
runtime.
16. Placement trends(solutions)
Mixed size placement
Simultaneously places cells and blocks.
Whitespace distribution
Whitespace or free space is the percentage of placement sites not
occupied by cells and blocks.
Whitespace enlarges the core layout area more than necessary for
placement, in order to provide larger routing area.
Placement algorithms can allocate whitespace to improve performance
in a number of ways including congestion reduction, overlap
minimization, and timing improvement.
Placement benchmarking
Estimate the proper benchmark which described the performance gap
between the reported results.
17. Good placement vs. Bad placement
Good placement
No congestion
Shorter wires
Less metal levels
Smaller delay
Lower power dissipation
Bad placement
Congestion
Longer wire lengths
More metal levels
Longer delay
Higher power dissipation
18. REFERENCES
Michael Smith, “Application Specific Integrated Circuits”
Pearson Education Asia , chapter 16.
Andrew kahng and Reda, “digital layout – placement” ,chapter
5, EDA for IC implementation, circuit design and process
technology.
Physical design flow