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Lecture 8
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- 2. 2 1950 1955 19601975 1980 1985 1990 1995 2000 2001 2002 2003 2004 2005 2006 2006 1952 3 Amp power Transistor 1960 Si-Base Transistor 1979 16-Bit Processor MC68000 1975 MC6800 is first microprocessor used in automotive application 1984 32-Bit Processor MC68020 1989 MC68302 Communications Processor Late 1980’s Development of the first surface micromachined inertial sensors for the automotive airbag 1991 PowerPC® (1) Alliance 1994 First PowerPC® (1) MPC601 1991 Company becomes leading supplier of automotive embedded processors 1998 First PowerQUICC II communications processor (MPC8260) 2001 MPC7455 SOI Volume Production 2003 Low-K Volume Production 2003 First single core modem: MXC. “Smartphone-on –a-postage stamp” 2003 The pressure sensor portfolio expands with the tire pressure monitor sensor with capacitive technology to save power 2004 60 millionth applications processor for portable multimedia devices 2005 First PowerQUICC communications processor with QUICC Engine (MPC8360E) Building on a 50+ Year Heritage of Innovation 1995 MPC860 PowerQUICC™ 2005 i.MX31 processor for mobile multimedia entertainment 2006 MC9RS08KA2 Ultra-low end MCU with RS08 core 2006 MSC8144 multicore DSP targeting wireless and wireline infrastructure 2006 Industry’s First Commercial MRAM Product
- 3. Semiconductor Manufacturing InA Nutshell 3 1. Silicon 2. Wafer 4. Product 3. Chip
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- 5. The Semiconductor ManufacturingSupply Chain Data Flow 5 Equipment MES Inventory Logistics PlanningSales Finance
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- 7. Data Analysis forYield Improvement – Wafer Maps Single Wafer Multiple Wafer A single wafer map represents 100’s to 1,000’s of data points; a multiple wafer map can represent 1,000’s to 100,000’s of data points. Very high performance graphical data visualization …
- 8. The IC Market •The semiconductor industry is approaching $300B/yr in sales Transportation 8% Consumer Electronics 16% Communications 24% Computers 42% Industrial 8% Military 2% Courtesy of Dr. Bill Flounders, UC Berkeley Microlab
- 9. IC Technology Advancement Improvementsin IC performance and cost have been enabled by the steady miniaturization of the transistor Better Performance/Cost Market Growth 2000 2005 2010 2015 2020 1 10 100 GATELENGTH(nm) YEAR LOW POWER HIGH PERFORMANCE International Technology Roadmap for Semiconductors Transistor Scaling Investment SMIC’s Fab 4 (Beijing, China) Photo by L.R. Huang, DigiTimes PITCH YEAR: 2004 2007 2010 2013 2016 HALF-PITCH: 90nm 65nm 45nm 32nm 22nm
- 10. The Nanometer SizeScale Carbon nanotube MOSFET
- 11. • Goal: Massfabrication (i.e. simultaneous fabrication) of many IC “chips” on each wafer, each containing millions or billions of transistors • Approach: Form thin films of semiconductors, metals, and insulators over an entire wafer, and pattern each layer with a process much like printing (lithography). IC Fabrication Planar processing consists of a sequence of additive and subtractive steps with lateral patterning oxidation deposition ion implantation etching lithography
- 12. • DEPOSITION ofa thin film • LITHOGRAPHY – Coat with a protective layer – Selectively expose the protective layer – Develop the protective layer • ETCH to selectively remove the thin film • Strip (etch) the protective layer Planar Processing (patented by Fairchild Semiconductor in 1959: J. A. Hoerni, US Patent 3,064,167) Courtesy of Dr. Bill Flounders, UC Berkeley Microlab
- 13. Deposition/growth Etch Epitaxy Anneal CMP Ion Implantation Test CD SEM Metrology Defect Detection Lithography MaskPattern Generation Bare Silicon Wafer Processed Wafer Overview of IC Process Steps Courtesy of Dr. Bill Flounders, UC Berkeley Microlab
- 14. G S D Si classical multi-gate G SDSi G high-k gate dielectric metallic gate strained Si Lg (nm): 50 40 30 20 10 MOSFET Scaling Scenario • Advanced structures will enable Si MOSFET scaling to Lg <10 nm forward body biasing
- 15. The End isNot the Limit ! Information technology pervasive embedded human-centered solving societal- scale problems Philips Innovations in process technology, materials, and device design will sustain the Si revolution Lower Power, Lower Cost Market Growth Technology, Device & Circuit Innovations, Heterogeneous Integration Investment Acknowledgement: Mark Weiser UbiComp (>1 computers per person) today SALES($)/YR TIME PCs (1 person/computer) Mainframes (>1 persons per computer) Transportation Health care Disaster response Energy Environment Sensatex Information technology will be pervasive embedded human-centered for better quality-of-life