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Chips and it’s
Manufacturing
Muhammad Ali(BCS19-244)
Computer Architecture
Computer Chips:
• Computer chip, also called chip, integrated circuit or small
wafer of semiconductor material embedded with
integrated circuitry. Chips comprise the processing and
memory units of the modern digital computer (see
microprocessor; RAM).
• Chip making is extremely precise and is usually done in a
“clean room,” since even microscopic contamination could
render a chip defective. As transistor components shrank,
the number per chip doubled about every 18 months (a
phenomenon known as Moore’s law), from a few thousand
in 1971 (Intel Corp.’s first chip) to more than 10 billion in
2016. Nanotechnology made transistors even smaller and
chips correspondingly more powerful as the technology
advanced.
Step 1:It all starts with Sand
The process of making a computer chip starts with a particular kind of
sand called Silica Sand, which is made of silicon dioxide. The foundation
component of semiconductor fabrication, silicon, needs to be pure in
order to be employed in the production process. With about 25% (mass)
Silicon is – after Oxygen – the second most frequent chemical element in
the earth’s crust. Sand – especially Quartz - has high percentages of
Silicon in the form of Silicon dioxide (SiO2) and is the base ingredient for
semiconductor manufacturing.
Step 2:Purify to obtain Silicon
Ingot
Silicon is purified in multiple steps to finally reach semiconductor
manufacturing quality which is called Electronic Grade Silicon. Electronic Grade
Silicon may only have one alien atom every one billion Silicon atoms. In this
picture you can see how one big crystal is grown from the purified silicon melt.
The resulting mono crystal is called Ingot.
Step 3:Cut Wafers
The next step involves slicing the circular silicon ingot into wafers. Chip
manufacturers first cut silicon wafers to the desired size to make a computer
chip. The wafers are then polished and cleaned before any further processing
can take place. Once they are cut, they undergo a series of processes that
add layers of different materials to the surface of the die. These layers serve
different purposes, such as creating electrical paths or isolating different
regions of the chip.
Point to Ponder:
The Ingot is cut
into individual
silicon discs
called wafers.
Step 4:Photolithography
A layer of photoresist is then spread thinly across the wafer. In
photolithography, a light-sensitive material is used to transfer a pattern onto
a substrate. The first step is to coat the substrate with a light-sensitive
material called a photoresist. Next, the wafer is exposed to light using a
mask that contains the desired pattern. The exposed areas of the photoresist
are then developed, which creates openings in the resist that correspond to
the desired pattern. The wafer is then etched, which transfers the pattern
into the underlying substrate.
Step 5&6:Ions and Doping and
Etching
Doping is the process of bombarding the silicon wafer with ions to change its
conductivity once the exposed photoresist has been wiped off. After washing
off the leftover photoresist, a pattern of impacted and unaffected material is
revealed. A thin silicon layer is removed from the surface by applying
reactive chemicals. By repeatedly etching and re-imaging this way, engineers
can create complex patterns for different components like memory chips and
processors.
The pattern formed by the etching process is called a “mask,” and it’s what
gives the chip its shape and functionality
Step 7:Electroplating
The nearly finished transistor is covered in an insulating layer, and three
holes are carved into it. Then, manufacturers apply copper ions to the
transistor’s surface using a procedure called electroplating to create a layer
of copper on top of the insulator. Only three copper deposits remain in the
insulating layer holes after the extra copper has been cleaned away.
Here individual positively charged metal molecules dissolved in an electrolyte
solution are reduced and plated using an electric current.
Step 8:Layering Interconnects
The computer chips that power our devices comprise many layers of
interconnects, each just a few atoms thick. Interconnects are made of metal
wires that connect different types of electrical components. Each wire has a
specific function, designed to be compatible with each other so they can
communicate with one another. Now that every transistor is interconnected,
the chip can perform processor-like operations.
Point to Ponder:
Designing an layout
of interconnects is
vital in its proper
functioning,
performance and
efficiency.
Step 9:Test and Slice Die
The wafer is cut into small squares, called a die. Each die contains millions of
transistors. The dies are then tested and sliced into individual chips. The
chips are then packaged and shipped to computer manufacturers.
Step 10:Packaging
The packaging of the dies includes a substrate and a heat spreader, and they
take on the recognizable shape of a desktop CPU. Heat is transferred from
the silicon by the heat spreader into the heatsink positioned on top of it.
After that, processors are tested in terms of power use, maximum frequency,
and other performance indicators.
Major Chip Manufacturer
TSMC is the world’s largest chip maker and a vital supplier to the United States
and other Western nations.A top developer of chip fab equipment. Intel
Corporation is the world’s largest semiconductor chip manufacturer based on
its 2020 sales. Taiwan Semiconductor. Slowly but surely, Taiwan Semiconductor
has built itself into the world’s largest manufacturer of microchips.
Samsung Intel Nvidia. …
Broadcom. … Qualcomm. … Texas Instruments. …
Advanced micro devices. …Applied materials
Questions that arises?
The Short Story: How are chips for computers made?
Microchips are created by layering interconnected patterns on a silicon
wafer. From design to mass production, the microchip manufacturing
process contains hundreds of processes and can take up to four months.
What makes computer chips work for computer?
Transistors function as tiny electrical switches on the chip that can turn a
current on or off. A multilayered latticework of connected forms is formed
on the silicon wafer to create the pattern of microscopic switches.
How do computer chips store data?
Each binary bit of data is stored on a semiconductor memory chip in a
memory cell, a small circuit made up of one to many transistors. The
memory cells on the chip’s surface are arranged in rectangular arrays.
“I don't know what's more impressive - the
microchip, or the machine that made the
microchip.”
Thanks for
Listening!
(Any Questions!)
Kindly keep your questions relevant to the topic.

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Chips and it’s Manufacturing.pptx

  • 1. Chips and it’s Manufacturing Muhammad Ali(BCS19-244) Computer Architecture
  • 2. Computer Chips: • Computer chip, also called chip, integrated circuit or small wafer of semiconductor material embedded with integrated circuitry. Chips comprise the processing and memory units of the modern digital computer (see microprocessor; RAM). • Chip making is extremely precise and is usually done in a “clean room,” since even microscopic contamination could render a chip defective. As transistor components shrank, the number per chip doubled about every 18 months (a phenomenon known as Moore’s law), from a few thousand in 1971 (Intel Corp.’s first chip) to more than 10 billion in 2016. Nanotechnology made transistors even smaller and chips correspondingly more powerful as the technology advanced.
  • 3. Step 1:It all starts with Sand The process of making a computer chip starts with a particular kind of sand called Silica Sand, which is made of silicon dioxide. The foundation component of semiconductor fabrication, silicon, needs to be pure in order to be employed in the production process. With about 25% (mass) Silicon is – after Oxygen – the second most frequent chemical element in the earth’s crust. Sand – especially Quartz - has high percentages of Silicon in the form of Silicon dioxide (SiO2) and is the base ingredient for semiconductor manufacturing.
  • 4. Step 2:Purify to obtain Silicon Ingot Silicon is purified in multiple steps to finally reach semiconductor manufacturing quality which is called Electronic Grade Silicon. Electronic Grade Silicon may only have one alien atom every one billion Silicon atoms. In this picture you can see how one big crystal is grown from the purified silicon melt. The resulting mono crystal is called Ingot.
  • 5. Step 3:Cut Wafers The next step involves slicing the circular silicon ingot into wafers. Chip manufacturers first cut silicon wafers to the desired size to make a computer chip. The wafers are then polished and cleaned before any further processing can take place. Once they are cut, they undergo a series of processes that add layers of different materials to the surface of the die. These layers serve different purposes, such as creating electrical paths or isolating different regions of the chip. Point to Ponder: The Ingot is cut into individual silicon discs called wafers.
  • 6. Step 4:Photolithography A layer of photoresist is then spread thinly across the wafer. In photolithography, a light-sensitive material is used to transfer a pattern onto a substrate. The first step is to coat the substrate with a light-sensitive material called a photoresist. Next, the wafer is exposed to light using a mask that contains the desired pattern. The exposed areas of the photoresist are then developed, which creates openings in the resist that correspond to the desired pattern. The wafer is then etched, which transfers the pattern into the underlying substrate.
  • 7. Step 5&6:Ions and Doping and Etching Doping is the process of bombarding the silicon wafer with ions to change its conductivity once the exposed photoresist has been wiped off. After washing off the leftover photoresist, a pattern of impacted and unaffected material is revealed. A thin silicon layer is removed from the surface by applying reactive chemicals. By repeatedly etching and re-imaging this way, engineers can create complex patterns for different components like memory chips and processors. The pattern formed by the etching process is called a “mask,” and it’s what gives the chip its shape and functionality
  • 8. Step 7:Electroplating The nearly finished transistor is covered in an insulating layer, and three holes are carved into it. Then, manufacturers apply copper ions to the transistor’s surface using a procedure called electroplating to create a layer of copper on top of the insulator. Only three copper deposits remain in the insulating layer holes after the extra copper has been cleaned away. Here individual positively charged metal molecules dissolved in an electrolyte solution are reduced and plated using an electric current.
  • 9. Step 8:Layering Interconnects The computer chips that power our devices comprise many layers of interconnects, each just a few atoms thick. Interconnects are made of metal wires that connect different types of electrical components. Each wire has a specific function, designed to be compatible with each other so they can communicate with one another. Now that every transistor is interconnected, the chip can perform processor-like operations. Point to Ponder: Designing an layout of interconnects is vital in its proper functioning, performance and efficiency.
  • 10. Step 9:Test and Slice Die The wafer is cut into small squares, called a die. Each die contains millions of transistors. The dies are then tested and sliced into individual chips. The chips are then packaged and shipped to computer manufacturers.
  • 11. Step 10:Packaging The packaging of the dies includes a substrate and a heat spreader, and they take on the recognizable shape of a desktop CPU. Heat is transferred from the silicon by the heat spreader into the heatsink positioned on top of it. After that, processors are tested in terms of power use, maximum frequency, and other performance indicators.
  • 12. Major Chip Manufacturer TSMC is the world’s largest chip maker and a vital supplier to the United States and other Western nations.A top developer of chip fab equipment. Intel Corporation is the world’s largest semiconductor chip manufacturer based on its 2020 sales. Taiwan Semiconductor. Slowly but surely, Taiwan Semiconductor has built itself into the world’s largest manufacturer of microchips. Samsung Intel Nvidia. … Broadcom. … Qualcomm. … Texas Instruments. … Advanced micro devices. …Applied materials
  • 13. Questions that arises? The Short Story: How are chips for computers made? Microchips are created by layering interconnected patterns on a silicon wafer. From design to mass production, the microchip manufacturing process contains hundreds of processes and can take up to four months. What makes computer chips work for computer? Transistors function as tiny electrical switches on the chip that can turn a current on or off. A multilayered latticework of connected forms is formed on the silicon wafer to create the pattern of microscopic switches. How do computer chips store data? Each binary bit of data is stored on a semiconductor memory chip in a memory cell, a small circuit made up of one to many transistors. The memory cells on the chip’s surface are arranged in rectangular arrays. “I don't know what's more impressive - the microchip, or the machine that made the microchip.”
  • 14. Thanks for Listening! (Any Questions!) Kindly keep your questions relevant to the topic.