Diode-Transistor Logic (DTL) was an early logic family that used diodes and bipolar transistors. It suffered from voltage degradation between stages. Transistor-Transistor Logic (TTL) replaced the diode inputs of DTL with a single multi-emitter bipolar transistor, making it more area efficient. TTL also had faster switching speeds than DTL due to its use of an active pull-up transistor and totem-pole output. Standard TTL gates like the 7400 series had propagation delays of 12ns, fanout of 10, and power dissipation of 10mW.
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Introduction to DTL, discussing diode logic functions (AND, OR), voltage degradation, and limitations in integrated circuits.
Explains level-shifted diode logic which avoids voltage degradation, and limitations like rail-to-rail logic and needing transistors for inversion.
DTL structure, NOR and NAND gate operations, with emphasis on voltage outputs and current hogging challenges.
Voltage transfer characteristics (VTC), power dissipation considerations, fanout capabilities, and tradeoffs between speed and power.
Introduction to the 930 series DTL, evolution from DTL to TTL, and specific characteristics like voltage outputs and propagation delays.
Comparison with DTL, highlighting design efficiency due to multi-emitter BJTs and improvements in switching speed.
Delay analysis, improvements in switching times with active pullup circuits, and challenges associated with passive designs.
Explanation of totem pole output design, turn-off characteristics, and implications for switching performance.
Typical specifications for 74xx series TTL, focusing on propagation delays, input currents, fanout, and dissipation.
Innovations in TTL designs including Schottky clamping, Darlington pullups, squaring circuits, and details about the Schottky series.
Diode Logic
VA VOUT AND VCC
VB GATE
VA VOUT
OR
GATE VB
n Diode Logic suffers from voltage degradation from one stage to
the next.
n Diode Logic only permits the OR and AND functions.
n Diode Logic is used extensively but not in integrated circuits!
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3.
Level-Shifted Diode Logic
VCC=5V With either input at 0V, Vx=0.7V,
AND DL is just cut off, and VOUT=0V.
GATE RH With both inputs at 1V, VX=1.7V and
VA VOUT VOUT=1V.
x
DL RL
VB
With VA=VB=5V, both input diodes
are cut off. Then
VCC − 0.7V
VOUT = RL
RH + RL
n Level shifting eliminates the voltage degradation from the input to the
ouput. However,
n the logic swing falls short of rail-to-rail, and
n the inverting function still is not available without using a transistor!
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4.
Diode-Transistor Logic (DTL)
VCC
VA RC
VB VOUT Primitive Precursor
to DTL
VC Q1
n If any input goes high, the transistor saturates and VOUT goes low.
n If all inputs are low, the transistor cuts off and VOUT goes high.
n This is a NOR gate.
n “Current Hogging” is a problem because the bipolar transistors can
not be matched precisely.
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5.
Diode-Transistor Logic (DTL)
VCC
RB RC
VOUT Improved gate with
VA
reversed diodes.
VB Q1
VC
n If all inputs are high, the transistor saturates and VOUT goes low.
n If any input goes low, the base current is diverted out through the
input diode. The transistor cuts off and VOUT goes high.
n This is a NAND gate.
n The gate works marginally because VD = VBEA = 0.7V.
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6.
Diode-Transistor Logic (DTL)
VCC
RB RC Basic DTL
VA x VOUT NAND gate.
VB Q1
VC RD
n If all inputs are high, Vx = 2.2V and the transistor is saturated.
n If any input goes low (0.2V), Vx=0.9V, and the transistor cuts off.
n The added resistor RD provides a discharge path for stored base
charge in the BJT, to provide a reasonable tPLH.
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7.
DTL VTC
VCC 5
VOUT
4
RB RC
3
VA x VOUT
2
VB Q1
1
VC RD
0
0 1 2 3 4 5
VIN
VOH = VIL =
VOL = VIH =
n The noise margins are more symmetric than in the RTL case.
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8.
DTL Power Dissipation
RB=3.4kΩ VCC
RC=4.8kΩ PL =
RD=1.6kΩ
RB RC
VA x VOUT
VB Q1
VC RD
PH =
n Scaling RB and RC involves a
direct tradeoff between speed
and power. P=
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9.
DTL Fanout
RB=3.4kΩ
RC=4.8kΩ VCC I CS =
RD=1.6kΩ
βF=50 RB RC
VA x VOUT
VB Q1
VC RD
I BS =
I CS =
n Good fanout requires high
β F, large RD /RB.
N max =
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10.
930 Series DTL(ca 1964 A.D.)
βF=50 VCC n One of the series diodes is
replaced by Q1, providing
1.75kΩ 6kΩ more base drive for Q2 and
improving the fanout (Nmax
2kΩ = 45).
VA Q1 n Does Q1 saturate?
VOUT
VB
Q2
VC 930 DTL Characteristics
5kΩ
VOH / VOL 5.0V / 0.2V
VIH / VIL 1.5V / 1.4V
Fanout 45
Dissipation 10mW
tP 75ns
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11.
930 DTL PropagationDelays
βF =50
CL=5pF VCC n tPLH >> tPHL
1.75kΩ 6kΩ n tPLH = tS+tr /2
2kΩ ts =
VA Q1
VOUT
VB
Q2
VC
5kΩ
tr ≈
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Why TTL?
n The DTL input uses a
VA
number of diodes which take
VB DTL up considerable chip area.
VC
n In TTL, a single multi-emitter
BJT replaces the input
diodes, resulting in a more
VA
area-efficient design.
VB TTL
VC n DTL was ousted by faster
TTL gates by 1974.
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14.
Basic TTL NANDGate.
VCC=5V
n ALL INPUTS HIGH.
• QI is reverse active.
RB RCP
• QO is saturated.
VOUT
D1 • VOL = VCES
VA QI QO
VB RD n ANY INPUT LOW.
VC • QI is saturated.
• QO is cut off.
• VOH = VCC
Multi-emitter transistor. Forward-biased emitter base junctions
override reverse-biased junctions in determining the base and
collector currents.
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15.
TTL Switching Speed:tPLH
VCC=5V n The depletion capacitance
of the QI EB junction must
discharge;
RB RC RCP
n Base charge must be
removed from the saturated
VOUT QS;
VA QI QS
QO n Ditto for QO; and
VB
CL n The capactive load must be
VC RD
charged to VCC.
Multi-emitter transistor. Forward-biased emitter base junctions
override reverse-biased junctions in determining the base and
collector currents.
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16.
TTL Switching Speed:tPLH
VCC=5V n The time required to
discharge the QI depletion
layers is << 1ns.
RB RC RCP
n The time required to extract
the QS base charge is also
VOUT << 1ns:
VA QI QS
VB QO • QI becomes forward
CL active;
VC RD
• |IBR| becomes large for
QS
n Removal of base charge from QO is similar to the DTL case.
With RD = 1 kΩ, ts = 10ns (these are typical values for 7400
series TTL).
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17.
TTL Switching Speed:tPLH
VOUT
VCC=5V 5
4
RB RC RCP
3
VOUT 2
VA QI QS
VB QO 1
CL
VC RD
0 t (ns)
0 100 200 300
n Charging of the capacitive load can be slow with “passive
pullup.” e.g., with a 5kΩ pull-up resistor and a 15 pF load (ten
TTL gates) RC = 75 ns and tr = 2.3RC = 173 ns!
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18.
TTL with ActivePullup
n In the previous example, the dominant switching speed
limitation was the charging of capacitive loads through the
pullup resistor.
n A small pullup resistance will improve the switching speed but
will also increase the power and reduce the fanout.
VCC With active pullup, we can achieve the best
of both worlds:
RC
n When the output is low, QP is cutoff,
QP minimizing the power and maximizing the
VOUT fanout;
QO n when the output goes high, QP becomes
forward active to provide maximum drive
RD
current for a quick rise time.
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19.
TTL with ActivePullup
n With a high output, VCC=5V
n QS is cutoff
RB RC
n QP is forward active
n With a low output, QP
VOUT
n QS is saturated VA QI QS
n QP should be cutoff VB QO
The low output case is unsatisfactory VC RD
with this circuit:
VBP = VEP =
VBEP =
The “Totem Pole Output” solves this problem.
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20.
TTL with “TotemPole Output”
VCC=5V n During turn-off, QS switches
off before QO.
RB RC RCP n QP begins to conduct when
VCS = VCESO+VD+VBEAP
QP = 1.6V
n Initially,
VA QI QS DL
VB VOUT I BP =
VC QO
RD
RCP limits the collector current
to a safe value.
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21.
Typical 74xx SeriesTTL
VCC=5V
74xx TTL Characteristics
tPLH 12 ns
4kΩ 1.6kΩ 130Ω
tPHL 8 ns
Fanout 10
QP Dissipation 10 mW
VA QI QS PDP 100 pJ
DL
VB VOUT
VC QO
The anti-ringing diodes at the
1kΩ input are normally cut off.
During switching transients,
1/3 T. I. 7410 they turn on if an input goes
triple 3-input NAND
more negative than -0.7V.
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22.
Standard TTL: VTC
β F =70
VCC=5V n VIN=0. QI is saturated; QS, QO
β R = 0.1
are cutoff; QP is forward active.
4kΩ RC 130Ω
1.6kΩ VOH =
QP
VIN QI QS DL (the drop in the base resistor is
VOUT small)
QO
n First Breakpoint. QS turns on.
1kΩ
VIL =
1/6 NSC 7404
Hex Inverter
(at the edge of conduction, IC=0)
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23.
Standard TTL: VTC
β F =70
VCC=5V n Second Breakpoint. QO turns on.
β R = 0.1
RC
VIN =
4kΩ 130Ω
1.6kΩ
VOUT =
QP
VIN QI QS DL
VOUT n Third Breakpoint. QO saturates.
QO
VIH =
1kΩ
1/6 NSC 7404
Hex Inverter
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24.
Standard TTL: VTC
1/6 NSC 7404
VCC=5V VOUT
Hex Inverter 5
4kΩ RC 130Ω 4
1.6kΩ
3
QP
QI QS 2
VIN DL
VOUT
1
QO
β F =70
β R = 0.1 1kΩ
0 VIN
1 2 3 4 5
VNML = VNMH =
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25.
Standard TTL: LowState ROUT
100 2.4 mA 2 mA For the saturated BJT
1.6 mA with IB = 2.4 mA, the
collector current (mA)
80 output impedance is
0.08V 1.2 mA
60
0.8 mA
ROL =
21 mA
40
The very low output
IB = 0.4mA
impedance means that
20 noise currents are
translated into tiny
Characteristics for a 0
noise voltages. Thus
Texas Instruments only a small noise
junction isolated 0 0.1 0.2 0.3 0.4 0.5
digital npn BJTat 25 oC. margin is neccesary.
collector-emitter voltage (V)
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26.
Standard TTL: InputCurrent
1/4 TI 7400 Quad
VCC=5V n IIH (QI is reverse active)
2-input NAND
RC
I BI =
4kΩ 130Ω
1.6kΩ
QP
VA QI QS DL
VB VOUT I IH =
QO
β F =70
β R = 0.1 1kΩ n IIL (QI is saturated)
I IL =
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27.
Standard TTL: DCFanout
1/4 TI 7400 Quad
VCC=5V n With high inputs,
2-input NAND
I CI =
4kΩ RC 130Ω
1.6kΩ
I CS =
QP
VA QI QS DL I BO =
VB VOUT
QO n To keep QO saturated,
β F =70
β R = 0.1 1kΩ
N max =
AC considerations usually limit the fanout to a much lower number.
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28.
Standard TTL: DCDissipation
1/4 TI 7400 Quad
VCC=5V PH =
2-input NAND
4kΩ RC 130Ω
1.6kΩ
QP
VA QI PL =
QS DL
VB VOUT
QO
β F =70
β R = 0.1 1kΩ
N = 10
P=
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29.
Advanced TTL Designs
n Schottky Clamping. QS and QO may be Schottky clamped,
preventing saturation. This greatly improves tPLH.
n Darlington Pullup. The Darlington pullup arrangement
increases the average output drive current for charging a
capacitive load. Although RCP limits the maximum output
current, this maximum drive is maintained over a wider range of
VOUT than with a single pullup transistor.
n Squaring Circuit. Active pull-down for the base of the output
transistor squares the VTC, improving the low noise margin. An
added benefit is faster charge removal for the output transistor.
n Improved Fabrication. Smaller devices, and oxide isolation,
have steadily reduced parasitic capacitances and reduced RC
time constants.
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30.
Darlington Pullup
n QP2 is added, forming a Darlington
VCC=5V
pair with QP.
RC n The EB junction of QP2 introduces
RCP
900Ω 50Ω a 0.7V level shift, so DL can be
QP
eliminated.
QP2 n QP2 can not saturate, so Schottky
clamping is not neccessary.
REP
3.5kΩ VOUT n REP is needed to provide a
discharge path for QP2 base
charge.
The Darlington emitter follower provides a very low output impedance,
approaching RC /β 2. This greatly reduces the rise time.
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31.
Squaring Circuit
VOUT
5 VIL 7400
VOUT
QS 74S00
QO VOH 4 BP2
RBD 3
RCD
500Ω 2
250Ω
QD 1 BP3
VOL
0 VIN
1 2 3 4 5
VIH
n There is no path for QS emitter current until QD and QO turn on.
n QS and QO begin to conduct simultaneously.
n BP1 is eliminated from the VTC; in other words, the VTC is “squared.”
n VIL is increased, improving the low noise margin.
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32.
Schottky TTL (74S/ 54S Series)
1/4 74S00
quad 2-input NAND VCC=5V
Features:
RB RC RCP n Schottky clamping
2.8kΩ 900Ω 50Ω
n Schottky anti-ringing diodes
QP
n Darlington pullup circuit
QP2
n Squaring circuit
QI QS REP
VA 3.5kΩ n Scaled resistors
VB VOUT
QO
Performance:
RBD
RCD
500Ω n P = 20 mW
250Ω
QD n tP = 3 ns (15 pF)
n PDP = 60 pJ
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