3D IC technology stacks multiple layers of active electronic components on top of one another to address challenges from increasing interconnect delays and power consumption in traditional 2D chip designs. By stacking components, 3D ICs can reduce chip footprint and cost while shortening interconnect lengths to decrease RC delays and power usage. However, 3D designs also introduce new challenges related to thermal management and design complexity that still require ongoing research and development.

1. 3D IC technology

2. Contents
• Introduction
• Why 3D IC
• Motivation
• 2D, 2.5D, 3D
• Advantages
• Challenges
• Conclusion

3. Introduction
Could be Heterogeneous… “Stacked” 2D (Conventional) ICs

4. Why 3D IC?
2D 3D

5. Motivation
• Interconnect structures increasingly consume more of the power
and delay budgets in modern design
• Solution: increase the number of “nearest neighbors” seen by each
transistor by using 3D IC design
• Smaller wire cross-sections, smaller wire pitch and longer lines to
traverse larger chips increase RC delay.
• RC delay is increasingly becoming the dominant factor

6. 2D

7. 2.5D

8. 3D

9. Advantages
• Footprint
• Cost
• Shorter interconnect
• Power
• Heterogeneous integration

10. Challenges
• Cost
• Heat
• Design complexity

11. Conclusion
• The 3D-IC seems to be the avenue for future development in
μelectronics industry
• 3D IC design is a relief to interconnect driven IC design
• Researches are still going on in this sector for the better
enhancement and application of this technology

12. THANK YOU