A presentation on Three-Dimensional Integrated Circuits

1. THREE-DIMENSIONAL
INTEGRATED CIRCUIT
ARQAM FAZAL MIRZA
ROLL NO.:-1140434009
EC-3, BBD UNIVERSITY
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2. CONTENTS
 INTRODUCTION
 WHAT IS TSV?
 MAKING OF TSV
 MANUFACTURING OF 3D-IC
 3D VS 2D CIRCUIT
 WHY 3D OVER 2D-CIRCUIT?
 CHALLENGES
 NOTABLE 3D CHIPS
 CONCLUSION
 REFERENCES
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3. INTRODUCTION
 3D-IC is a circuit formed by the stacking silicon wafers/dies
and interconnecting them vertically with the help of TSVs so
they behave as a single device to achieve performance
improvements at reduced power .
Fig. 1
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4. INTRODUCTION
 3D-ICs offer significant improvements over 2D circuits as it
reduces both the footprint and interconnect length without
shrinking the resistors
Fig.2
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5. WHAT IS TSV?
 Through-silicon via, in electronic engineering, is a vertical
electrical connection passing completely through a silicon
wafer/die.
 It allows to establish an electrical connection from the active
side to the backside of the die/wafer.
Fig.3
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6. WHAT IS TSV?
 TSVs are a high performance interconnect techniques used as
an alternative to wire-bond and flip chips to create 3D
packages and 3D integrated circuits because the density of vias
is substantially higher, and because the length of connections
in shorter.
Fig.4 6

7. MAKING OF TSV
In order to make a TSV, the following processes are done :-
• Via Drilling
• Via Filling
• Chemical and mechanical polishing
• TSV revealing
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8. MAKING OF TSV
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Fig.5

9. MANUFACTURING OF 3D-IC
• A 3D-IC can be manufactured in the same manner as a normal
2D-Circuit
• Multiple 2D-Circuits are formed in order to form a 3D-IC
• Then these multiple circuits are joined together using the TSV
technology
Fig.6
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10. MANUFACTURING OF 3D-IC
• Only one power supply is needed for one 3D-IC
• Different power supplies for different layers are not required
Fig.7
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11. 3D VS 2D CIRCUIT
2D 3D DIFFEREN
CE (%)
• Footprint
(in sq.mm)
2.54 1.31 -48.4
• Wirelength
(in mm)
3.41 3.19 -6.4
• Power (in
mW)
172.9 164.0 -5.1
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12. WHY 3D-IC OVER 2D-IC?
• FOOTPRINT
• COST
• SHORTER INTERCONNECT
• POWER
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13. CHALLENGES
• YIELD
• HEAT
• DESIGN COMPLEXITY
• TESTING
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14. NOTABLE 3D-CHIPS
• Tezzeron Semiconductors built a 3D chip in 2004. The first
chip was a simple memory register, but the most notable being
an 8051 processor/memory stack.
• INTEL presented a 3D version of Pentium 4 processor named
as Pentium 4 Remix in 2004.
• Samsung announced in December, 2008 that it has started the
mass production of 8GB memory using 3D technology.
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15. CONCLUSION
• 3D technology is a technology which will bring a revolution in
the industry.
• In an era where smaller devices are preferred over large
devices, a 3D-technology can help multiple circuits fit into a
space where only one 2D-Circuit can fit.
• Imagine how great it will be when a 64 or 128 GB of memory
can be installed in a device which occupies a space less than a
8 GB memory.
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16. REFERENCES
• “ELECTRONIC DESIGN AUTOMATION FOR IC
IMPLEMENTATION CIRCUIT DESIGN, AND PROCESS
TECHNOLOGY” BY- LUCIANO LAVANGO (CRC PRESS)
• “TSV(THROUGH SILICON VIA)” BY- ALKITA ELPIDA
MEMORY ISSUED ON 08/11/2008
• “DEVELOPMENT OF CHIP STACKING TECHNOLOGY
USING THROUGH ELECTRODES” VOL.74#3 BY-OKI
TECHNICAL REVIEW NOV.,2007 ISSUE
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17. QUERIES??
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18. THANK YOU
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