Three dimensional silicon integration
•Download as PPTX, PDF•
1 like•594 views
Three Dimensional silicon integration. Including 3D IC history, benefits and leading industrial companies.
Report
Share
Report
Share
Recommended
The steel frame structures
Most steel construction is done with a type of steel called mild steel. Mild steel is a material that is immensely strong. Take a circular bar of steel 1 inch / 25mm in diameter. If you were to attach this bar securely to your ceiling, you could hang from it 20,000 Kg (which is 20 tons)
This immense strength is of great advantage to buildings. The other important feature of steel framing is its flexibility. It can bend without cracking, which is another great advantage, as a steel building can flex when it is pushed to one side by say, wind, or an earthquake. The third characteristic of steel is its plasticity or ductility.
Steel frame work
The document discusses options for constructing a mobile showroom with large spans and within a short timeframe. It analyzes using pre-cast concrete or a steel frame. A steel frame is proposed due to requirements for immediacy, its single-story design, ability to have large spans without restrictions, and advantages of speedy erection, less on-site work, flexibility, and value. Standard steel sections, connections, and passive fire protection via spray coating are presented.
Era retail hotel
The document discusses several furniture production and delivery projects for various brands around Europe and the world. It mentions producing fixtures and displays for stores like Michael Kors, Levi's, Tommy Hilfiger, John Lewis, Samsonite, Clark's, St. Regis, Raffles Hotels, Prada Istanbul and Armani Istanbul. The products utilized materials like brass, wood, steel and were finished with techniques like lacquering, aging, plating and printing. Production occurred in locations like Istanbul and details were developed for technical specifications.
BRS Bearing
Luoyang BRS Bearing Co.,Ltd(BRS Bearing) is Chinese supplier specialized in slewing ring bearings, crossed roller bearing, split bearing, harmonic drive output bearing, rolling mill bearings.
Construction of post tension slab
This document provides an overview of the construction process for post-tension slabs. It begins with a brief history of post-tensioned concrete before defining post-tension slabs as reinforced concrete slabs supported directly by columns without beams. The construction process involves installing strands or tendons in ducts before pouring concrete, stressing the strands after the concrete reaches strength, and then grouting the ducts. Key advantages of post-tension slabs are that they are lighter, allow for greater flexibility in design, and have reduced costs compared to conventional slabs.
Bearing basics SKF
This document discusses materials, heat treatments, and dimensional stability of rolling bearings used in SKF bearings. The key points are:
1) Bearing rings and rolling elements are made of through-hardening carbon chromium steel or case-hardening chromium-nickel steel and manganese-chromium steel.
2) Heat treatments include bainitic hardening, case hardening, and martensite hardening, each with advantages like dimensional stability or hardness, and disadvantages like cost or risk of cracks.
3) Dimensional stability is highest in bainite-hardened materials and martensite-hardened bearings can experience the most diameter change with heat.
More About STEEL FRAME STRUCTURES
Most steel construction is done with a type of steel called mild steel. Mild steel is a material that is immensely strong.
Recommended
The steel frame structures
Most steel construction is done with a type of steel called mild steel. Mild steel is a material that is immensely strong. Take a circular bar of steel 1 inch / 25mm in diameter. If you were to attach this bar securely to your ceiling, you could hang from it 20,000 Kg (which is 20 tons)
This immense strength is of great advantage to buildings. The other important feature of steel framing is its flexibility. It can bend without cracking, which is another great advantage, as a steel building can flex when it is pushed to one side by say, wind, or an earthquake. The third characteristic of steel is its plasticity or ductility.
Steel frame work
The document discusses options for constructing a mobile showroom with large spans and within a short timeframe. It analyzes using pre-cast concrete or a steel frame. A steel frame is proposed due to requirements for immediacy, its single-story design, ability to have large spans without restrictions, and advantages of speedy erection, less on-site work, flexibility, and value. Standard steel sections, connections, and passive fire protection via spray coating are presented.
Era retail hotel
The document discusses several furniture production and delivery projects for various brands around Europe and the world. It mentions producing fixtures and displays for stores like Michael Kors, Levi's, Tommy Hilfiger, John Lewis, Samsonite, Clark's, St. Regis, Raffles Hotels, Prada Istanbul and Armani Istanbul. The products utilized materials like brass, wood, steel and were finished with techniques like lacquering, aging, plating and printing. Production occurred in locations like Istanbul and details were developed for technical specifications.
BRS Bearing
Luoyang BRS Bearing Co.,Ltd(BRS Bearing) is Chinese supplier specialized in slewing ring bearings, crossed roller bearing, split bearing, harmonic drive output bearing, rolling mill bearings.
Construction of post tension slab
This document provides an overview of the construction process for post-tension slabs. It begins with a brief history of post-tensioned concrete before defining post-tension slabs as reinforced concrete slabs supported directly by columns without beams. The construction process involves installing strands or tendons in ducts before pouring concrete, stressing the strands after the concrete reaches strength, and then grouting the ducts. Key advantages of post-tension slabs are that they are lighter, allow for greater flexibility in design, and have reduced costs compared to conventional slabs.
Bearing basics SKF
This document discusses materials, heat treatments, and dimensional stability of rolling bearings used in SKF bearings. The key points are:
1) Bearing rings and rolling elements are made of through-hardening carbon chromium steel or case-hardening chromium-nickel steel and manganese-chromium steel.
2) Heat treatments include bainitic hardening, case hardening, and martensite hardening, each with advantages like dimensional stability or hardness, and disadvantages like cost or risk of cracks.
3) Dimensional stability is highest in bainite-hardened materials and martensite-hardened bearings can experience the most diameter change with heat.
More About STEEL FRAME STRUCTURES
Most steel construction is done with a type of steel called mild steel. Mild steel is a material that is immensely strong.
3D Integrated Circuits and their economic feasibility
The document discusses 3D integrated circuits (3D ICs) and provides an agenda for a presentation on the topic. The agenda includes an introduction to 3D ICs, advantages of 3D ICs such as reduced timing delay and chip area, challenges in developing 3D IC technology including design tools and manufacturing processes, and business opportunities for 3D ICs in applications like autonomous vehicles, wearables, and smart home devices. Speakers are listed to discuss various aspects of 3D ICs.
Silicon Valley Test Workshop - 2.5D-3D What - Ira Feldman 111111
2.5D? 3D? What? Overview of 3D Integrated Circuit Packaging and Test Challenges presented at Silicon Valley Test Workshop (November 11, 2011) by Ira Feldman (www.hightechbizdev.com)
Easiest Monolithic 3D IC
A Game Changing technology, enabling monolithic 3D IC integration to any fab line without the need for change in the transistor process
3D IC Technology
3D IC technology stacks multiple layers of active electronic components on top of one another to address challenges from increasing interconnect delays and power consumption in traditional 2D chip designs. By stacking components, 3D ICs can reduce chip footprint and cost while shortening interconnect lengths to decrease RC delays and power usage. However, 3D designs also introduce new challenges related to thermal management and design complexity that still require ongoing research and development.
3d ic
The 3D IC technology involves stacking two or more layers of active electronic components vertically and horizontally on a single circuit. This document discusses the concept of integrated microchannel cooling for 3D ICs. It describes the fabrication process, theoretical analysis, experimental characterization, benefits, and challenges of this technology. Microchannel cooling allows for improved thermal resistance over air cooling methods. The 3D IC technology enables shorter interconnect lengths and reduced switching energy.
3d ic's ppt..
3D packaging stacks separate chips in a single package to save space without integrating the chips. Monolithic 3D ICs build components in layers on a single wafer then dice it, avoiding alignment and bonding issues. Multi-wafer 3D ICs build components on separate wafers, which must be aligned, bonded, and thinned with vertical connections added through silicon vias. 3D ICs promise benefits like reduced cost from improved yield, lower power from shorter wires, and new design possibilities from added connectivity, but challenges include heat dissipation, design complexity, and testing of independent dies.
A Review on Thermal Aware Optimization of Three Dimensional Integrated Circui...
This document summarizes techniques for thermal optimization in 3D integrated circuits (3Ds ICs). It discusses heat transfer models, thermal-aware floorplanning algorithms, thermal-aware placement algorithms, and algorithms for through-silicon via (TSV) planning. For floorplanning, algorithms aim to minimize peak temperature, thermal gradients, and weighted sums of area and wirelength. Placement algorithms integrate thermal issues by placing hot cells near heat sinks. TSV planning algorithms consider leakage power, temperature, and timing dependencies to optimize number of vias.
3D ICs
The document presents information on 3D integrated circuits (3D ICs). It discusses the idea for 3D ICs to reduce delays and power consumption compared to 2D chips. It describes 3D IC architecture as stacking layers of active components vertically and horizontally. The manufacturing technologies for 3D ICs include monolithic, wafer on wafer, die on wafer, and die on die approaches. Advantages of 3D ICs include reduced wiring, capacitances, power dissipation, and improved performance. Concerns include thermal and reliability issues. Research is ongoing to introduce cheaper 3D ICs for applications like memory.
Tensile structures for architects
Tensile structures provide large column-free interior spaces through the use of tensioned fabric membranes maintained under tension by cable or truss networks. They offer several advantages over conventional structures like flexibility in design, natural daylighting, low costs, and minimal maintenance. However, the lightweight nature of fabric requires careful consideration of structural form finding, static and dynamic load analysis, and material patterning during the design process to develop stable, efficient tensile structures.
Steel reinforcement
This document provides an overview of steel reinforcement used in reinforced concrete structures. It discusses the history and development of reinforcement in India, starting from the use of mild steel bars with a yield strength of 250 MPa, to the introduction of cold twisted deformed bars with higher yield strengths of around 405 MPa in the 1970s. However, CTD bars have issues with ductility, weldability, and corrosion resistance. In the 1980s-1990s, thermomechanically treated bars were developed that can achieve even higher strengths up to 600 MPa, while also having better properties compared to CTD bars. The document outlines the manufacturing processes for various bar types and highlights some issues regarding quality and standards in India.
Magnetic moulding
The document discusses several metal casting and molding processes including magnetic mould casting, centrifugal casting, and metal injection molding. Magnetic mould casting uses electromagnetism to form a mould out of steel shots for casting metals. Centrifugal casting involves pouring molten metal into a rotating mould to produce axisymmetric parts like pipes and cylinders. Metal injection molding mixes metal powder with a binder to create a feedstock that is molded and then undergoes debinding and sintering to produce high-strength metal parts.
Semiconductor-based transistors (1).pptx
The document summarizes the history and evolution of semiconductor transistors from their inception to modern FinFET and GAA technologies. It traces transistors from early patents in the 1920s-1930s to the first working transistor in 1947. Key developments include the switch to silicon in the 1950s, the MOSFET in 1959, and planar processing techniques in the 1960s which led to MOSFET dominance by the 1970s. The document then discusses post-scaling innovations like strained silicon and high-k dielectrics in the 2000s. It introduces FinFETs which addressed short channel effects below 28nm with 3D tri-gate structures starting in 2007. Future technologies discussed include GAA which provides full gate control with nano-sheets to
VLSI Trends.pptx
The document discusses the history and structure of MOSFET transistors. It begins with the conception of transistors in 1947 and integrated circuits in 1958. MOSFETs became important building blocks as they require almost zero control current when idle. The document outlines the development of MOSFET logic gates in 1963, and the scaling of integration from SSI to VLSI. It describes full custom and gate array ASIC design approaches using prefabricated cells.
Dos & Donts in Civil Engg-converted.pdf
The PPT is prepared to create awareness in practicing civil engineers to minimize the mistakes in construction so as to enhance the stability and durability of structures
Cosworth process
The Cosworth process is a precision sand casting method developed in 1987 for high volume production of high-quality aluminum automotive castings. It uses an electromagnetic pump to slowly displace molten metal from the mid-depth of a holding furnace into molds in a non-turbulent manner, minimizing oxide films. This results in castings with no porosity, improved mechanical properties, and thinner sections allowing lighter components. While installation costs are high, it produces castings suitable for applications like helicopter and aircraft engines due to their high integrity and strength.
Introduction and types of Form Work in civil engineering
Introduction and various types of form work and their applicability in field of civil engineering.
Marvellous 'Baha'i Temple' or ' Lotus Temple'
The document summarizes the design, construction, and components of the Baha'i House of Worship in New Delhi, India. It describes the architect's design evolution of a symmetrical half-open lotus flower structure and the complex analysis and construction process. Key aspects included the reinforced concrete shells and domes, white marble cladding, and specialized construction techniques needed to complete the intricate geometric design. The completed structure was hailed as an architectural and engineering marvel.
STEEL_REINFORCEMENT_An_Overview_A_PRESEN.pdf
Steel reinforcement is a key component of reinforced concrete structures. Cold twisted deformed (CTD) rebars were widely used in India from the 1970s due to their higher yield strength compared to plain mild steel, allowing for less steel to be used. However, CTD rebars have inherent problems including inferior ductility, weldability, and increased corrosion due to residual stresses and higher carbon content. Thermomechanically treated (TMT) rebars, introduced in the 1980s, provide higher strength with better ductility, weldability, bendability, and corrosion resistance compared to CTD rebars. TMT rebars have now become the dominant rebar type used in India.
Basic R C C structurs
These slides gives a basic idea about R C C structures. Elementary knowledge about different methods of design and detailing as IS code IS 456-2000 has been discussed in a lucid way.
Integratedcircuits
This document discusses integrated circuits (ICs). It provides a brief history starting from the 1940s and covers the scale of integration from small to ultra-large scale. The key types of ICs and wafer fabrication process involving shaping, etching, cleaning and film deposition are summarized. The advantages of ICs include their small size, low weight and high speed. Applications include automobiles, appliances and computers.
2. oem lifecycle chris mc comb
Chris McComb has experience in the cable and hose making industries spanning several decades. He discusses key factors in the lifecycle of an OEM system, including initial design considerations, selecting qualified panel builders and installers, and establishing service and support. McComb emphasizes the importance of knowledge transfer throughout the process to ensure successful solutions, including verified design, accredited partners, installation best practices, and certified long-term maintenance and support. Digitalization brings new opportunities through technologies like simulation, remote support, and digital twins to improve design, installation, production, and training.
Website presentation from Vector Minima Inc and World of Modular full
METALOQ from Vector Minima Inc is a disruptive solution for modular builders and cold formed steel providers to enter this highest growth industry.
More Related Content
Viewers also liked
3D Integrated Circuits and their economic feasibility
The document discusses 3D integrated circuits (3D ICs) and provides an agenda for a presentation on the topic. The agenda includes an introduction to 3D ICs, advantages of 3D ICs such as reduced timing delay and chip area, challenges in developing 3D IC technology including design tools and manufacturing processes, and business opportunities for 3D ICs in applications like autonomous vehicles, wearables, and smart home devices. Speakers are listed to discuss various aspects of 3D ICs.
Silicon Valley Test Workshop - 2.5D-3D What - Ira Feldman 111111
2.5D? 3D? What? Overview of 3D Integrated Circuit Packaging and Test Challenges presented at Silicon Valley Test Workshop (November 11, 2011) by Ira Feldman (www.hightechbizdev.com)
Easiest Monolithic 3D IC
A Game Changing technology, enabling monolithic 3D IC integration to any fab line without the need for change in the transistor process
3D IC Technology
3D IC technology stacks multiple layers of active electronic components on top of one another to address challenges from increasing interconnect delays and power consumption in traditional 2D chip designs. By stacking components, 3D ICs can reduce chip footprint and cost while shortening interconnect lengths to decrease RC delays and power usage. However, 3D designs also introduce new challenges related to thermal management and design complexity that still require ongoing research and development.
3d ic
The 3D IC technology involves stacking two or more layers of active electronic components vertically and horizontally on a single circuit. This document discusses the concept of integrated microchannel cooling for 3D ICs. It describes the fabrication process, theoretical analysis, experimental characterization, benefits, and challenges of this technology. Microchannel cooling allows for improved thermal resistance over air cooling methods. The 3D IC technology enables shorter interconnect lengths and reduced switching energy.
3d ic's ppt..
3D packaging stacks separate chips in a single package to save space without integrating the chips. Monolithic 3D ICs build components in layers on a single wafer then dice it, avoiding alignment and bonding issues. Multi-wafer 3D ICs build components on separate wafers, which must be aligned, bonded, and thinned with vertical connections added through silicon vias. 3D ICs promise benefits like reduced cost from improved yield, lower power from shorter wires, and new design possibilities from added connectivity, but challenges include heat dissipation, design complexity, and testing of independent dies.
A Review on Thermal Aware Optimization of Three Dimensional Integrated Circui...
This document summarizes techniques for thermal optimization in 3D integrated circuits (3Ds ICs). It discusses heat transfer models, thermal-aware floorplanning algorithms, thermal-aware placement algorithms, and algorithms for through-silicon via (TSV) planning. For floorplanning, algorithms aim to minimize peak temperature, thermal gradients, and weighted sums of area and wirelength. Placement algorithms integrate thermal issues by placing hot cells near heat sinks. TSV planning algorithms consider leakage power, temperature, and timing dependencies to optimize number of vias.
3D ICs
The document presents information on 3D integrated circuits (3D ICs). It discusses the idea for 3D ICs to reduce delays and power consumption compared to 2D chips. It describes 3D IC architecture as stacking layers of active components vertically and horizontally. The manufacturing technologies for 3D ICs include monolithic, wafer on wafer, die on wafer, and die on die approaches. Advantages of 3D ICs include reduced wiring, capacitances, power dissipation, and improved performance. Concerns include thermal and reliability issues. Research is ongoing to introduce cheaper 3D ICs for applications like memory.
Viewers also liked (8)
3D Integrated Circuits and their economic feasibility
3D Integrated Circuits and their economic feasibility
Silicon Valley Test Workshop - 2.5D-3D What - Ira Feldman 111111
Silicon Valley Test Workshop - 2.5D-3D What - Ira Feldman 111111
A Review on Thermal Aware Optimization of Three Dimensional Integrated Circui...
A Review on Thermal Aware Optimization of Three Dimensional Integrated Circui...
Similar to Three dimensional silicon integration
Tensile structures for architects
Tensile structures provide large column-free interior spaces through the use of tensioned fabric membranes maintained under tension by cable or truss networks. They offer several advantages over conventional structures like flexibility in design, natural daylighting, low costs, and minimal maintenance. However, the lightweight nature of fabric requires careful consideration of structural form finding, static and dynamic load analysis, and material patterning during the design process to develop stable, efficient tensile structures.
Steel reinforcement
This document provides an overview of steel reinforcement used in reinforced concrete structures. It discusses the history and development of reinforcement in India, starting from the use of mild steel bars with a yield strength of 250 MPa, to the introduction of cold twisted deformed bars with higher yield strengths of around 405 MPa in the 1970s. However, CTD bars have issues with ductility, weldability, and corrosion resistance. In the 1980s-1990s, thermomechanically treated bars were developed that can achieve even higher strengths up to 600 MPa, while also having better properties compared to CTD bars. The document outlines the manufacturing processes for various bar types and highlights some issues regarding quality and standards in India.
Magnetic moulding
The document discusses several metal casting and molding processes including magnetic mould casting, centrifugal casting, and metal injection molding. Magnetic mould casting uses electromagnetism to form a mould out of steel shots for casting metals. Centrifugal casting involves pouring molten metal into a rotating mould to produce axisymmetric parts like pipes and cylinders. Metal injection molding mixes metal powder with a binder to create a feedstock that is molded and then undergoes debinding and sintering to produce high-strength metal parts.
Semiconductor-based transistors (1).pptx
The document summarizes the history and evolution of semiconductor transistors from their inception to modern FinFET and GAA technologies. It traces transistors from early patents in the 1920s-1930s to the first working transistor in 1947. Key developments include the switch to silicon in the 1950s, the MOSFET in 1959, and planar processing techniques in the 1960s which led to MOSFET dominance by the 1970s. The document then discusses post-scaling innovations like strained silicon and high-k dielectrics in the 2000s. It introduces FinFETs which addressed short channel effects below 28nm with 3D tri-gate structures starting in 2007. Future technologies discussed include GAA which provides full gate control with nano-sheets to
VLSI Trends.pptx
The document discusses the history and structure of MOSFET transistors. It begins with the conception of transistors in 1947 and integrated circuits in 1958. MOSFETs became important building blocks as they require almost zero control current when idle. The document outlines the development of MOSFET logic gates in 1963, and the scaling of integration from SSI to VLSI. It describes full custom and gate array ASIC design approaches using prefabricated cells.
Dos & Donts in Civil Engg-converted.pdf
The PPT is prepared to create awareness in practicing civil engineers to minimize the mistakes in construction so as to enhance the stability and durability of structures
Cosworth process
The Cosworth process is a precision sand casting method developed in 1987 for high volume production of high-quality aluminum automotive castings. It uses an electromagnetic pump to slowly displace molten metal from the mid-depth of a holding furnace into molds in a non-turbulent manner, minimizing oxide films. This results in castings with no porosity, improved mechanical properties, and thinner sections allowing lighter components. While installation costs are high, it produces castings suitable for applications like helicopter and aircraft engines due to their high integrity and strength.
Introduction and types of Form Work in civil engineering
Introduction and various types of form work and their applicability in field of civil engineering.
Marvellous 'Baha'i Temple' or ' Lotus Temple'
The document summarizes the design, construction, and components of the Baha'i House of Worship in New Delhi, India. It describes the architect's design evolution of a symmetrical half-open lotus flower structure and the complex analysis and construction process. Key aspects included the reinforced concrete shells and domes, white marble cladding, and specialized construction techniques needed to complete the intricate geometric design. The completed structure was hailed as an architectural and engineering marvel.
STEEL_REINFORCEMENT_An_Overview_A_PRESEN.pdf
Steel reinforcement is a key component of reinforced concrete structures. Cold twisted deformed (CTD) rebars were widely used in India from the 1970s due to their higher yield strength compared to plain mild steel, allowing for less steel to be used. However, CTD rebars have inherent problems including inferior ductility, weldability, and increased corrosion due to residual stresses and higher carbon content. Thermomechanically treated (TMT) rebars, introduced in the 1980s, provide higher strength with better ductility, weldability, bendability, and corrosion resistance compared to CTD rebars. TMT rebars have now become the dominant rebar type used in India.
Basic R C C structurs
These slides gives a basic idea about R C C structures. Elementary knowledge about different methods of design and detailing as IS code IS 456-2000 has been discussed in a lucid way.
Integratedcircuits
This document discusses integrated circuits (ICs). It provides a brief history starting from the 1940s and covers the scale of integration from small to ultra-large scale. The key types of ICs and wafer fabrication process involving shaping, etching, cleaning and film deposition are summarized. The advantages of ICs include their small size, low weight and high speed. Applications include automobiles, appliances and computers.
2. oem lifecycle chris mc comb
Chris McComb has experience in the cable and hose making industries spanning several decades. He discusses key factors in the lifecycle of an OEM system, including initial design considerations, selecting qualified panel builders and installers, and establishing service and support. McComb emphasizes the importance of knowledge transfer throughout the process to ensure successful solutions, including verified design, accredited partners, installation best practices, and certified long-term maintenance and support. Digitalization brings new opportunities through technologies like simulation, remote support, and digital twins to improve design, installation, production, and training.
Website presentation from Vector Minima Inc and World of Modular full
METALOQ from Vector Minima Inc is a disruptive solution for modular builders and cold formed steel providers to enter this highest growth industry.
Continuous casting of steel
This is the presentation on Continuous casting of steel, types and defects along with electromagnetic stirrer.
various connection of steel structure
This document discusses different techniques for connecting steel structures, including riveted, bolted, and welded connections. Riveted connections were commonly used in the past but have become less popular. Bolted connections are now more common as they are easier to install and do not require skilled labor. Welded connections provide a strong bond but require more precision. The document explores the advantages and disadvantages of each connection type and describes processes like electric arc welding and oxy-acetylene welding.
Steel Structures - Building technology.pptx
Steel structures are commonly used for high-rise buildings, long-span structures, industrial and warehouse buildings, and temporary structures due to steel's strength, light weight, speed of construction, and ability to create large spaces. Steel structures have advantages such as strength, flexibility, ductility, stability, earthquake resistance, and lighter weight compared to other materials. However, steel loses strength at high temperatures and is susceptible to corrosion. Common steel sections include angles, channels, I-beams, T-beams, round/square bars, and plates. Steel connections are made through bolting, riveting, and welding. Portal frames provide wide spans and are lightweight but require large members and cranes for erection.
Journey to tmt bars
1. Reinforced concrete uses rebar to strengthen concrete which contracts and grips the rebar through bonding.
2. Early rebar in India was imported or produced domestically as plain mild steel. Deformed rebar was introduced in 1965 to improve bonding.
3. Thermo-mechanically treated (TMT) rebar, involving controlled quenching, was developed internationally in the 1980s and later introduced in India to further increase strength. However, substandard rebar lacking proper processing sometimes enters the market.
Concrete and steel bridges
This document discusses different types of bridges, focusing on steel and concrete bridges. It describes the main advantages and disadvantages of steel and concrete as materials for bridge construction. It then outlines different structural types of steel bridges like beam/girder, truss, plate girder, box girder, and cable-stayed bridges. For concrete bridges, it discusses slab, beam, box girder, and continuous girder bridges.
Fabrication of metal matrix composites using stir casting method
This document summarizes a project to fabricate metal-matrix composites using stir casting. The project aims to produce aluminum-silicon carbide (AlSiC) composites through stir casting to create strong, lightweight materials for use in industries like automotive and aerospace. Experiments are conducted by varying the composition of silicon carbide added to molten aluminum from 5-30% and stirring to ensure homogeneous mixing. The composites are then tested for properties like hardness and impact strength. The goal is to develop low-cost metal-matrix composite materials for industrial applications requiring high strength, stiffness, and other properties.
Similar to Three dimensional silicon integration (20)
Introduction and types of Form Work in civil engineering
Introduction and types of Form Work in civil engineering
Website presentation from Vector Minima Inc and World of Modular full
Website presentation from Vector Minima Inc and World of Modular full
Fabrication of metal matrix composites using stir casting method
Fabrication of metal matrix composites using stir casting method
Recently uploaded
UNLOCKING HEALTHCARE 4.0: NAVIGATING CRITICAL SUCCESS FACTORS FOR EFFECTIVE I...
The Fourth Industrial Revolution is transforming industries, including healthcare, by integrating digital,
physical, and biological technologies. This study examines the integration of 4.0 technologies into
healthcare, identifying success factors and challenges through interviews with 70 stakeholders from 33
countries. Healthcare is evolving significantly, with varied objectives across nations aiming to improve
population health. The study explores stakeholders' perceptions on critical success factors, identifying
challenges such as insufficiently trained personnel, organizational silos, and structural barriers to data
exchange. Facilitators for integration include cost reduction initiatives and interoperability policies.
Technologies like IoT, Big Data, AI, Machine Learning, and robotics enhance diagnostics, treatment
precision, and real-time monitoring, reducing errors and optimizing resource utilization. Automation
improves employee satisfaction and patient care, while Blockchain and telemedicine drive cost reductions.
Successful integration requires skilled professionals and supportive policies, promising efficient resource
use, lower error rates, and accelerated processes, leading to optimized global healthcare outcomes.
2008 BUILDING CONSTRUCTION Illustrated - Ching Chapter 02 The Building.pdf
2008 BUILDING CONSTRUCTION Illustrated - Ching Chapter 02 The Building
BRAIN TUMOR DETECTION for seminar ppt.pdf
BRAIN TUMOR DETECTION
AND CLASSIFICATION USING
ARTIFICIAL INTELLIGENCE
Embedded machine learning-based road conditions and driving behavior monitoring
Car accident rates have increased in recent years, resulting in losses in human lives, properties, and other financial costs. An embedded machine learning-based system is developed to address this critical issue. The system can monitor road conditions, detect driving patterns, and identify aggressive driving behaviors. The system is based on neural networks trained on a comprehensive dataset of driving events, driving styles, and road conditions. The system effectively detects potential risks and helps mitigate the frequency and impact of accidents. The primary goal is to ensure the safety of drivers and vehicles. Collecting data involved gathering information on three key road events: normal street and normal drive, speed bumps, circular yellow speed bumps, and three aggressive driving actions: sudden start, sudden stop, and sudden entry. The gathered data is processed and analyzed using a machine learning system designed for limited power and memory devices. The developed system resulted in 91.9% accuracy, 93.6% precision, and 92% recall. The achieved inference time on an Arduino Nano 33 BLE Sense with a 32-bit CPU running at 64 MHz is 34 ms and requires 2.6 kB peak RAM and 139.9 kB program flash memory, making it suitable for resource-constrained embedded systems.
DEEP LEARNING FOR SMART GRID INTRUSION DETECTION: A HYBRID CNN-LSTM-BASED MODEL
As digital technology becomes more deeply embedded in power systems, protecting the communication
networks of Smart Grids (SG) has emerged as a critical concern. Distributed Network Protocol 3 (DNP3)
represents a multi-tiered application layer protocol extensively utilized in Supervisory Control and Data
Acquisition (SCADA)-based smart grids to facilitate real-time data gathering and control functionalities.
Robust Intrusion Detection Systems (IDS) are necessary for early threat detection and mitigation because
of the interconnection of these networks, which makes them vulnerable to a variety of cyberattacks. To
solve this issue, this paper develops a hybrid Deep Learning (DL) model specifically designed for intrusion
detection in smart grids. The proposed approach is a combination of the Convolutional Neural Network
(CNN) and the Long-Short-Term Memory algorithms (LSTM). We employed a recent intrusion detection
dataset (DNP3), which focuses on unauthorized commands and Denial of Service (DoS) cyberattacks, to
train and test our model. The results of our experiments show that our CNN-LSTM method is much better
at finding smart grid intrusions than other deep learning algorithms used for classification. In addition,
our proposed approach improves accuracy, precision, recall, and F1 score, achieving a high detection
accuracy rate of 99.50%.
IEEE Aerospace and Electronic Systems Society as a Graduate Student Member
IEEE Aerospace and Electronic Systems Society as a Graduate Student Member
Use PyCharm for remote debugging of WSL on a Windo cf5c162d672e4e58b4dde5d797...
This document serves as a comprehensive step-by-step guide on how to effectively use PyCharm for remote debugging of the Windows Subsystem for Linux (WSL) on a local Windows machine. It meticulously outlines several critical steps in the process, starting with the crucial task of enabling permissions, followed by the installation and configuration of WSL.
The guide then proceeds to explain how to set up the SSH service within the WSL environment, an integral part of the process. Alongside this, it also provides detailed instructions on how to modify the inbound rules of the Windows firewall to facilitate the process, ensuring that there are no connectivity issues that could potentially hinder the debugging process.
The document further emphasizes on the importance of checking the connection between the Windows and WSL environments, providing instructions on how to ensure that the connection is optimal and ready for remote debugging.
It also offers an in-depth guide on how to configure the WSL interpreter and files within the PyCharm environment. This is essential for ensuring that the debugging process is set up correctly and that the program can be run effectively within the WSL terminal.
Additionally, the document provides guidance on how to set up breakpoints for debugging, a fundamental aspect of the debugging process which allows the developer to stop the execution of their code at certain points and inspect their program at those stages.
Finally, the document concludes by providing a link to a reference blog. This blog offers additional information and guidance on configuring the remote Python interpreter in PyCharm, providing the reader with a well-rounded understanding of the process.
ISPM 15 Heat Treated Wood Stamps and why your shipping must have one
For International shipping and maritime laws all wood must contain the ISPM 15 Stamp. Here is how and why.
Unit-III-ELECTROCHEMICAL STORAGE DEVICES.ppt
Batteries -Introduction – Types of Batteries – discharging and charging of battery - characteristics of battery –battery rating- various tests on battery- – Primary battery: silver button cell- Secondary battery :Ni-Cd battery-modern battery: lithium ion battery-maintenance of batteries-choices of batteries for electric vehicle applications.
Fuel Cells: Introduction- importance and classification of fuel cells - description, principle, components, applications of fuel cells: H2-O2 fuel cell, alkaline fuel cell, molten carbonate fuel cell and direct methanol fuel cells.
Casting-Defect-inSlab continuous casting.pdf
Casting-Defect-inSlab continuous casting. Casting-Defect-inSlab continuous casting. Casting-Defect-inSlab continuous casting. Casting-Defect-inSlab continuous casting. Casting-Defect-inSlab continuous casting. Casting-Defect-inSlab continuous casting. Casting-Defect-inSlab continuous casting. Casting-Defect-inSlab continuous casting
Recently uploaded (20)
UNLOCKING HEALTHCARE 4.0: NAVIGATING CRITICAL SUCCESS FACTORS FOR EFFECTIVE I...
UNLOCKING HEALTHCARE 4.0: NAVIGATING CRITICAL SUCCESS FACTORS FOR EFFECTIVE I...
2008 BUILDING CONSTRUCTION Illustrated - Ching Chapter 02 The Building.pdf
2008 BUILDING CONSTRUCTION Illustrated - Ching Chapter 02 The Building.pdf
Embedded machine learning-based road conditions and driving behavior monitoring
Embedded machine learning-based road conditions and driving behavior monitoring
DEEP LEARNING FOR SMART GRID INTRUSION DETECTION: A HYBRID CNN-LSTM-BASED MODEL
DEEP LEARNING FOR SMART GRID INTRUSION DETECTION: A HYBRID CNN-LSTM-BASED MODEL
IEEE Aerospace and Electronic Systems Society as a Graduate Student Member
IEEE Aerospace and Electronic Systems Society as a Graduate Student Member
john krisinger-the science and history of the alcoholic beverage.pptx
john krisinger-the science and history of the alcoholic beverage.pptx
gray level transformation unit 3(image processing))
gray level transformation unit 3(image processing))
Use PyCharm for remote debugging of WSL on a Windo cf5c162d672e4e58b4dde5d797...
Use PyCharm for remote debugging of WSL on a Windo cf5c162d672e4e58b4dde5d797...
ML Based Model for NIDS MSc Updated Presentation.v2.pptx
ML Based Model for NIDS MSc Updated Presentation.v2.pptx
ISPM 15 Heat Treated Wood Stamps and why your shipping must have one
ISPM 15 Heat Treated Wood Stamps and why your shipping must have one
Three dimensional silicon integration
- 1. Three Dimensional Silicon Integration Presented To: • Prof. Mohamed Aboudina Presented By: • Mohamed Ashraf Atwa • Mohamed Badr
- 2. Content • Intoduction • History • Benefits and challenges • TSVs • Wafer Thinning • References
- 3. Definition • Integrated Circuit manufactured by stacking silicon wafers and/or dies and interconnecting them vertically using Through-Silicon Vias (TSVs).
- 5. Why ?! • Footprint • Cost • Heterogeneous Integration • Shorter Interconnects • Power Efficiency • Design • Bandwidth • Noise
- 6. TSV (Through Silicon Vias) • Critical Component • Joins two separate wafers • Cylindrical structure composed of copper, aluminum, tungsten or polysilicon. • Introduced early 1950s by William Shockley then an exponential growth by 1990s • Industrial leaders • 5 Major to form TSVs
- 8. • Mechanical grinding with mesh size #325 then #2000 • About 20% of the TSV fabrication cost • The BOX acts an etch stop while thinning • Improves the alignment of layers. Wafer Thinning