Broadcom AFEM8200 MBHB PAMiD

©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 1
22 bd Benoni Goullin
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Broadcom AFEM-8200 PAMiD in the Apple
iPhone 12 Series
Deep dive analysis of the fourth generation of mid/high band front-
end module for 4G and 5G from Broadcom.
SPR21606 - RF report by Stéphane ELISABETH
Laboratory analysis by Peggy LE GALLOIS & Nicolas RADUFE
February 2021 – Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o Broadcom
o Filter technologies
o Apple iPhone 12 Pro Max Teardown
Market Analysis 24
o RF Components Market Forecast
o Supply Chain
Physical Analysis 29
o Summary of the Physical Analysis 30
o Module 32
✓ Package Views & Dimensions
✓ Package Opening:
Power amplifier, Switch, RF IC, Filters
✓ Bloc Diagram Estimation
✓ Package Cross-Section:
Overview,CT Scan, Dimensions, Substrate, Internal & External Shielding
✓ Summary of physical data
o Power Amplifier, Switch, LNA 68
✓ Die Views & Dimensions
✓ Die Cross-Section
✓ Die Process Characteristics
o Filter Dies 108
✓ High/Mid band repartition
✓ Dies Views, Dimensions & Opening
✓ Dies Overview: Cap, Substrate, Cells
✓ Die Cross-Section:
Sealing Frame, Anchor, TSV, Holes, FBAR Structure
✓ Die Physical Data Summary
Comparison with previous Mid/High band FEM from Broadcom 143
o Package Evolution with Technology Enabler
o Package Cross-Section
o Package Integration Evolution:
Die Number, Die Distribution, EMI Shielding, Die Area, Die Cost
o Supplier Evolution: Power Amplifier, Switches
Manufacturing Process 155
o Global Overview
o Switch & matching RFIC Die Front-End Process
o Filter Die Front-End Process & Fabrication Unit
o Filter Die Front-End Process Flow
o Packaging Process & Fabrication Unit
o Packaging Process Flow
Cost Analysis 185
o Summary of the cost analysis
o Yields Explanation & Hypotheses
o PA die
✓ Die Front-End Cost
✓ Die front Cost per process steps
✓ Die Wafer & Die Cost
o Switch & LNA Die
o Filter die
✓ Die front Cost per process steps
o Packaged Component
✓ Packaging Cost
✓ Packaging Cost per process steps
✓ Component Cost
Front-End Module Estimated Price 218
Feedbacks 222
Company services 224

Overview / Introduction
o Executive Summary
o Reverse Costing Methodology
o Glossary
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
ManufacturingProcess Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data,
manufacturing cost and selling price of the Broadcom AFEM-8200.
In 2020, Broadcom remains the only supplier of the same module for several versions of the latest
Apple iPhone series: 12, 12 Mini, 12 Pro and 12 Pro Max. Like its predecessor, the AFEM-8100, the
AFEM-8200 is a Mid- and High-Band (MB and HB) Long Term Evolution (LTE) and 5G FEM. It
features several dies: Power Amplifier (PA), Silicon-on-Insulator (SOI) Switch and Film Bulk Acoustic
Resonator (FBAR) Filters. The filters are still using Avago’s Microcap bonded wafer Chip-Scale
Packaging (CSP) technology with Through-Silicon Vias (TSVs) enabling Electrical contacts and
Scandium Doped Aluminum Nitride (AlScN) as a piezoelectric material.
For this special version, Broadcom innovates on several points. Thanks to the dual side molding
BGA technology, the density of the packaging has growth and the critical dies (master switches,
Power management IC (PMIC) and Low-Noise Amplifier (LNA)) has been completely isolated from
the filtering part. On the EMI management, a novel compartmental shielding using silver wire bond
has allowed a huge reduction in the packaging cost. Finally, with the latest GaAs PA technology
using Flip-Chip configuration, only two PA remains in the module. Thanks to all these innovations,
Broadcom managed to deliver a miniaturized package despite the complexity added with 5G.
The report contains a complete analysis of the FEM SiP, including a detailed analysis of the PA, the
switches, the LNA, the filtering dies, and the internal/external EMI shielding. The report also
features a cost analysis and a price estimation of the component. Finally, it also integrates a
comparison with the AFEM-8072, MB/HB LTE FEM in the Apple iPhone X, the AFEM-8092, MB/HB
LTE FEM in the Apple iPhone Xs and the AFEM-8100, MB/HB LTE FEM in the Apple 11 series.

o Broadcom
o In Smartphones
o Filter technology
o Apple iPhone 12 Pro Max
Teardown
Market Analysis
Physical Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
Apple Smartphone History and RF Front-End Major Players
Q1 2016 Q4 2016 Q4 2017 Q4 2018 Q4 2019 Q1 2020 Q4 2020
• Apple used to release a single high-end series of phone per year. This year, we have seen the release of the second generation of
low–end segment from Apple. This could become a rule. One high-end per year and one low-end every four years.
• For the supply chain, the company has relied on Broadcom(formerly Avago) and Skyworks since 2016. Since the iPhone 7, Qorvo
has a role in the supply chain mainly for antenna tuner.
• Since the iPhone Xs, Murata integrate the supplier cercle mainly with diversity modules along with Skyworks.

Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Views & Dimensions
o Opening & Overview
o Bloc Diagram
o Cross-Section
o Power Amplifier Analysis
o Switch Analysis
o LNA Analysis
o Filter Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
Package Views & Dimensions
Package Top View – Optical View
©2020 by System Plus Consulting
Package Bottom View – Optical View
Package Side View – Optical View
• Package Type: xxx balls BGA
• Dimensions: xx mm²x xx mm
(xxx x xxx x xxx mm)
• Pin Pitch: xxx mm
• Marking: <LogoAvago>
8200
KA031
NL091
xxx
mm
xxx
mm
xxx mm

Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Bloc Diagram
o Cross-Section
o Switch Analysis
o LNA Analysis
o Filter Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
Module CT Scan
Apple iPhone 12 Pro Max – Main Board – CT Scan

Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Bloc Diagram
o Cross-Section
o Switch Analysis
o LNA Analysis
o Filter Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
Package Opening
Package Opened View – Optical View
The opening reveals 24 dies in flip
configuration, and 56 SMD components
(Inductors, Resistors, Capacitors).
Additional wire bondings are placed
around the dies.
We assume that these wire bonding are
placed to avoid interferences.

Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Bloc Diagram
o Cross-Section
o Switch Analysis
o LNA Analysis
o Filter Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
Package Overview – LNA Bank
Package Opened View – Optical View
LNA Top View – Optical View
• Die area: xxx mm²
(xxx x xxx mm)
• Die marking: 4HA8A 19 BRK0
• Die substrate: xxx

Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Bloc Diagram
o Cross-Section
o Switch Analysis
o LNA Analysis
o Filter Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
Package Cross-Section – Dimensions
Package Cross-Section – SEM View

Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Bloc Diagram
o Cross-Section
o Switch Analysis
o LNA Analysis
o Filter Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
Power Amplifier – Die Overview
Power Amplifier Die View – Optical View

Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Bloc Diagram
o Cross-Section
o Switch Analysis
o LNA Analysis
o Filter Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
Power Amplifier – Die Cross-Section
Die Cross-Section – SEM View

Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Bloc Diagram
o Cross-Section
o Switch Analysis
o LNA Analysis
o Filter Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
Switch – Die Delayering

Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Bloc Diagram
o Cross-Section
o Switch Analysis
o LNA Analysis
o Filter Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
Switch – Die Process
Die Process – SEM View

Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Bloc Diagram
o Cross-Section
o Switch Analysis
o LNA Analysis
o Filter Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
Switch – Die Cross-Section

Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Bloc Diagram
o Cross-Section
o Switch Analysis
o LNA Analysis
o Filter Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
LNA – Die Views & Dimensions
LNA Die View – Optical View
• Die Area: xxxmm²
(xxx x xxx mm)
• Nb of PGDW per 12-inch wafer: xxx
• Pad number: xxxx

Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Bloc Diagram
o Cross-Section
o Switch Analysis
o LNA Analysis
o Filter Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
LNA – Die Cross-Section

Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Bloc Diagram
o Cross-Section
o Switch Analysis
o LNA Analysis
o Filter Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
Filter – Die Overview – Tx – Cap

Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Bloc Diagram
o Cross-Section
o Switch Analysis
o LNA Analysis
o Filter Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
Filters – Die Opening – Substrate
Die Opening – Optical View

Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Bloc Diagram
o Cross-Section
o Switch Analysis
o LNA Analysis
o Filter Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
Filter – Die Cross-Section

Market Analysis
Physical Analysis
o Evolution
o Die Number & Distribution
o EMI Shielding
o Die Area and Cost
o Components Supply
Cost Analysis
Feedbacks
Related Analyses
About System Plus
Package Opening – Die Cost

Market Analysis
Physical Analysis
o Summary
o PA Fabrication Unit
o PA Process Flow
o Switch, LNA, and RFIC Process &
Fabrication Unit
o Filter Fabrication Unit
o Filter Process Flow
o Packaging Fabrication Unit
Cost Analysis
Feedbacks
Related Analyses
About System Plus
Power Amplifier Front-End Process
HEMT Wafer Process:
o The manufacturing of the HEMT begins with the epitaxy and patterned.
o Ohmic contact is formed on the cap layer.
o Then, Conductive Seed layer is deposited and patterned.
o Gold Au #1 is electroplated then Silicon Nitride SiN #1 is deposited and patterned.
o Oxide layer and Conductive Seed layer are deposited and patterned.
o Conductive Seed layer is deposited and patterned.
o PBO #1 layer is deposited and patterned.
o Seed layer are deposited and patterned.
o Next, PBO #2 layer is deposited and patterned. Gold Au #4 is electroplated.
drawingnotto scale

Market Analysis
Physical Analysis
o Summary
o PA Process Flow
Fabrication Unit
Cost Analysis
Feedbacks
Related Analyses
About System Plus
Power Amplifier – Process Flow (3/8)
GaAs Wafer
• Lithography #4
• Pattern & Etch
• Plasma Ashing
GaAs Wafer
• Ohmic Contact
Au/Ti/Au Deposition
• Lithography #5
• Pattern & Etch
• Plasma Ashing
GaAs Wafer
• Ti Deposition
• Lithography #6
• Pattern & Etch
• Metal 1
• Au Deposition
• Plasma Ashing
• Ti Etching
drawingnot to scale

Market Analysis
Physical Analysis
o Summary
o PA Process Flow
Fabrication Unit
Cost Analysis
Feedbacks
Related Analyses
About System Plus
Filters – Process Flow (6/8)
Silicon Wafer
#1 & #2
• Au-Au thermo-
compression
bonding
Silicon Wafer
#1 & #2
• Cap thinning
drawing not to scale
drawingnot to scale
drawingnot to scale
drawingnot to scale

Market Analysis
Physical Analysis
Cost Analysis
o Cost Analysis Summary
o Yields Explanation &
Hypotheses
o PA Wafer and Die Cost
o Switch Wafer and Die Cost
o LNA Wafer and Die Cost
o Filter Wafer and Die Cost
o Packaging Cost
o Component Cost
Feedbacks
Related Analyses
About System Plus
PA Front-End Cost
The front-end cost for the PA ranges from $xxxto $xxx according to
yield variations.
The largest portion of the manufacturing cost is due to the xxx at xxx
% and to the xxxx at xxxx%.

Market Analysis
Physical Analysis
Cost Analysis
Hypotheses
o Packaging Cost
o Component Cost
Feedbacks
Related Analyses
About System Plus
PA Front-End Cost per process steps (2/2)
M4 Gold Electroplating steps
represent the largest part of
wafer step costs.

Market Analysis
Physical Analysis
Cost Analysis
Hypotheses
o Packaging Cost
o Component Cost
Feedbacks
Related Analyses
About System Plus
LNA Wafer & Die Cost
By adding the probe test cost and the dicing, the LNA wafer cost ranges from $xxx to
$xxx according to yield variations.
The number of good dies per wafer is estimated to ranges from xxx to xxxx according
to yield variations, which results in a die cost ranging from $xxx to $xxx.

Market Analysis
Physical Analysis
Cost Analysis
Hypotheses
o Packaging Cost
o Component Cost
Feedbacks
Related Analyses
About System Plus
Filter Front-End Cost
The front-end cost for the Filter ranges from $xxx to $xxx according to
yield variations.
The largest portion of the manufacturing cost is due to the xxxx at xxxx
%.

Market Analysis
Physical Analysis
Cost Analysis
Hypotheses
o Packaging Cost
o Component Cost
Feedbacks
Related Analyses
About System Plus
Filter Front-End Cost per process steps (1/2)
Cleaning and the Gold contact steps represent the largest part of wafer step costs.

Market Analysis
Physical Analysis
Cost Analysis
Hypotheses
o Packaging Cost
o Component Cost
Feedbacks
Related Analyses
About System Plus
Component Cost

R E L A T E D
A N A L Y S E S
R E L A T E D
A N A L Y S E S

Market Analysis
Physical Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
o Company services
o Contact
Related Analyses
RELATEDTEARDOWNTRACKS
RELATEDREPORTS
By System Plus Consulting:
• Broadcom AFEM-8100 System-
in-Package in the Apple iPhone
11 Series
• Skyworks’ FBAR-BAW Filter
Technology in 2G/UHB PAMiD
SKY78221
• RF Front-End Module
Comparison 2020 – Volume 4
By Yole Développement:
• 5G’s Impact on RF Front-End
and Connectivity for
Cellphones 2020
• System-in-Package Technology
and Market Trends 2020
By System Plus Consulting:
• Consumer Track – Phone

COMPANY
SERVICES

Market Analysis
Physical Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
o Company services
o Contact
A Structure, Process and Cost Analysis
Reverse Costing® consists in disassembling a device or a system, in order
to identify its technology and determine its manufacturing processes and
cost, using in-house models and tools.
Our Core Activity : The Reverse Costing®

Market Analysis
Physical Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
o Company services
o Contact
Fields Of Expertise

Market Analysis
Physical Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
o Company services
o Contact
Business Model
Teardown
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and 3 parametric
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Methods
Training
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Market Analysis
Physical Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
o Company services
o Contact
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100+ collaborators in 8 different countries
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Market Analysis
Physical Analysis
Cost Analysis
Feedbacks
Related Analyses
About System Plus
o Company services
o Contact
Contact
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