This document provides a reverse costing analysis of the Broadcom AFEM-8100 SiP used in the Apple iPhone 11 series. It includes a physical analysis of the module and its dies, as well as a manufacturing process flow and cost analysis. Broadcom remains the sole supplier of the multi-die module, which features power amplifier, switch, filter and other dies. The analysis finds innovations that reduce the package size and cost, including a new EMI shielding integration method.

1. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 1
22 bd Benoni Goullin
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Broadcom AFEM-8100 System-in-
Package in the Apple iPhone 11 Series
SP20522 – RF report by Stéphane ELISABETH
Laboratory Analysis by Nicolas RADUFE & Guillaume CHEVALIER
March 2020 – SAMPLE
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

2. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o Broadcom
o Company Major Customers in 2019
o Filter technologies
o Apple iPhone 11 Pro Max Teardown
Market Analysis 17
o RF Components Market Forecast
o Supply Chain
Physical Analysis 22
o Summary of the Physical Analysis 23
o Module 25
 Package Views & Dimensions
 Package Opening:
Power amplifier, Switch, RF IC, Filters
 Bloc Diagram Estimation
 Package Cross-Section:
Overview, Dimensions, Substrate, Internal & External Shielding
 Summary of physical data
o Power Amplifier, Switch, LNA 62
 Die Views & Dimensions
 Die Cross-Section
 Die Process Characteristics
o Filter Dies 99
 High/Mid band repartition
 Dies Views, Dimensions & Opening
 Dies Overview: Cap, Substrate, Cells
 Die Cross-Section:
Sealing Frame, Anchor, TSV, Holes, FBAR Structure
 Die Physical Data Summary
Comparison with previous Mid/High band FEM from Broadcom 134
o Package Evolution with Technology Enabler
o Package Cross-Section
o Package Integration Evolution:
Die Number, Die Distribution, EMI Shielding, Die Area, Die Cost
o Supplier Evolution: Power Amplifier, Switches
Manufacturing Process 146
o Global Overview
o Switch & matching RFIC Die Front-End Process
o Filter Die Front-End Process & Fabrication Unit
o Filter Die Front-End Process Flow
o Packaging Process & Fabrication Unit
o Packaging Process Flow
Cost Analysis 178
o Summary of the cost analysis
o Yields Explanation & Hypotheses
o PA die
 Die Front-End Cost
 Die front Cost per process steps
 Die Wafer & Die Cost
o Switch & LNA Die
 Die Front-End Cost
 Die Wafer & Die Cost
o Filter die
 Die Front-End Cost
 Die front Cost per process steps
 Die Wafer & Die Cost
o Packaged Component
 Packaging Cost
 Packaging Cost per process steps
 Component Cost
Filter & Front-End Module Estimated Price 216
Feedbacks 220
Company services 222

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Overview / Introduction
o Executive Summary
o Reverse Costing Methodology
o Glossary
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price
of the Broadcom AFEM-8100.
In 2019, Broadcom remains the only supplier of the same module for several versions of the latest Apple iPhone series: 11, 11
Pro and 11 Pro Max. Like its predecessor, the AFEM-8092, the AFEM-8100 is a Mid- and High-Band (MB and HB) Long Term
Evolution (LTE) FEM. It features several dies, including Power Amplifier (PA), Silicon-on-Insulator (SOI) Switch and Film Bulk
Acoustic Resonator (FBAR) Filters. The filters are still using Avago’s Microcap bonded wafer Chip-Scale Packaging (CSP)
technology with Through-Silicon Vias (TSVs) enabling electrical contacts and scandium doped aluminum nitride (AlScN) as a
piezoelectric material.
For this special version, Broadcom has innovated in several directions. Thanks to the double side BGA technology, the
packaging is denser and the critical master switches and Low-Noise Amplifier dies have been completely isolated from the
filtering part. In the EMI Shielding, a new integration method has allowed a huge reduction in the packaging cost. Finally, with
the latest GaAs PA technology using Flip-Chip configuration, the PA area has shrunk by 30 %. Thanks to all these innovations,
Broadcom is able to supply a cost-effective new component with fewer input/output (I/O) connections.
The report contains a complete analysis of the FEM SiP, including a detailed analysis of the PA, the LNA, the filtering dies, and
the internal/external EMI shielding. The report also features a cost analysis and a price estimation of the component. Finally, it
also integrates a comparison with the AFEM-8072, MB/HB LTE FEM in the Apple iPhone X and the AFEM-8092, MB/HB LTE
FEM in the Apple iPhone Xs.

4. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 4
Overview / Introduction
Company Profile & Supply Chain
o Broadcom
o Major Customer in 2019
o Filter technology
o Apple iPhone 11 Pro Max
Teardown
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Broadcom Major Customers in 2019
Extracted from RF Front-End Module Comparison 2020 – Vol 1.

5. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 5
Overview / Introduction
Company Profile & Supply Chain
o Broadcom
o Major Customer in 2019
o Filter technology
o Apple iPhone 11 Pro Max
Teardown
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Apple iPhone 11 Pro Max Teardown

6. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 6
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Views & Dimensions
o Opening & Overview
o Bloc Diagram
o Cross-Section
o Power Amplifier Analysis
o Switch Analysis
o LNA Analysis
o Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Summary of the Physical Analysis

7. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 7
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Views & Dimensions
o Opening & Overview
o Bloc Diagram
o Cross-Section
o Power Amplifier Analysis
o Switch Analysis
o LNA Analysis
o Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Package Overview
Package Opened View – Optical View
©2020 by System Plus Consulting
• Xx
xx
xx
• PA: X
• BAW Filter: XX
• Switch: X

8. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Views & Dimensions
o Opening & Overview
o Bloc Diagram
o Cross-Section
o Power Amplifier Analysis
o Switch Analysis
o LNA Analysis
o Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Package Overview
Package Bottom View – Optical View
©2020 by System Plus Consulting
• X
X
X
• PMIC: X
• LNA: X
• Switch: X

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Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Views & Dimensions
o Opening & Overview
o Bloc Diagram
o Cross-Section
o Power Amplifier Analysis
o Switch Analysis
o LNA Analysis
o Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Component Overview – Bloc Diagram (Est.) – Rx

10. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 10
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Views & Dimensions
o Opening & Overview
o Bloc Diagram
o Cross-Section
o Power Amplifier Analysis
o Switch Analysis
o LNA Analysis
o Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Package Overview – Package Shielding

11. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 11
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Views & Dimensions
o Opening & Overview
o Bloc Diagram
o Cross-Section
o Power Amplifier Analysis
o Switch Analysis
o LNA Analysis
o Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Package Cross-Section
Package Cross-Section – Optical View
©2020 by System Plus Consulting
• System in Package thickness: XXX µm
 PCB substrate thickness: XXX µm
 Filter dies height (without balls): XXX µm
 Package molding thickness: XXX µm

12. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 12
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Views & Dimensions
o Opening & Overview
o Bloc Diagram
o Cross-Section
o Power Amplifier Analysis
o Switch Analysis
o LNA Analysis
o Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Die Cross-Section – (Est.) HEMT Structure

13. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 13
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Views & Dimensions
o Opening & Overview
o Bloc Diagram
o Cross-Section
o Power Amplifier Analysis
o Switch Analysis
o LNA Analysis
o Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Die Cross-Section
• The switch dies are using SOI substrate with XX nm of
mono-cristal silicon on a XXX nm oxide BOX.

14. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 14
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Views & Dimensions
o Opening & Overview
o Bloc Diagram
o Cross-Section
o Power Amplifier Analysis
o Switch Analysis
o LNA Analysis
o Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Filter – Die Overview

15. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 15
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Views & Dimensions
o Opening & Overview
o Bloc Diagram
o Cross-Section
o Power Amplifier Analysis
o Switch Analysis
o LNA Analysis
o Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Filter – Die Overview – High-Band – Substrate
Because of the size of the filter, we didn’t get all the
substrate intact with the resonator.

16. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 16
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o Summary
o Package Assembly
o Views & Dimensions
o Opening & Overview
o Bloc Diagram
o Cross-Section
o Power Amplifier Analysis
o Switch Analysis
o LNA Analysis
o Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Filter – Die Cross-Section

17. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 17
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
o Evolution
o Die Number & Distribution
o EMI Shielding
o Die Area and Cost
o Components Supply
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Package View & Dimensions – Evolution

18. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 18
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
o Evolution
o Die Number & Distribution
o EMI Shielding
o Die Area and Cost
o Components Supply
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Package Opening – Die Number
AFEM-8072 AFEM-8092 AFEM-8100
Total Number of Dies XX +X % XX -X % XX
Power Amplifier X (XX mm²) -X % X (XX mm²) -X % X (XX mm²)
BAW Filter X (XX mm²) +X % X (XX mm²) +X % X (XX mm²)
Switch X (XX mm²) -X % X (XX mm²) +X % X (XX mm²)
RFIC X (XX mm²) +X % X (XX mm²) -X % X (XX mm²)
LNA X (XX mm²) -X % X (XX mm²) +X % X (XX mm²)

19. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 19
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
o Evolution
o Die Number & Distribution
o EMI Shielding
o Die Area and Cost
o Components Supply
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Package Opening – EMI Shielding
AFEM-8072 AFEM-8092 AFEM-8100
Total Number of Shield Wire XX -X % XX +XX % XX
Number of Bridge Wire bond XX -X % XX +XX % XX
Number of Surrounded Wire Bond XX +X % XX -XX % -
Number of Fence Wire bond - - - +XX % XX
High-Band Area Low-Band Area Isolation

20. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 20
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
o Evolution
o Die Number & Distribution
o EMI Shielding
o Die Area and Cost
o Components Supply
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Package Opening – Die Cost

21. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 21
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
o Summary
o PA Fabrication Unit
o PA Process Flow
o Switch, LNA, and RFIC Process &
Fabrication Unit
o Filter Fabrication Unit
o Filter Process Flow
o Packaging Fabrication Unit
o Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Global Overview

22. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 22
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
o Summary
o PA Fabrication Unit
o PA Process Flow
o Switch, LNA, and RFIC Process &
Fabrication Unit
o Filter Fabrication Unit
o Filter Process Flow
o Packaging Fabrication Unit
o Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Power Amplfier Front-End Process

23. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 23
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
o Summary
o PA Fabrication Unit
o PA Process Flow
o Switch, LNA, and RFIC Process &
Fabrication Unit
o Filter Fabrication Unit
o Filter Process Flow
o Packaging Fabrication Unit
o Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Power Amplifier – Process Flow (2/8)

24. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 24
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
o Summary
o PA Fabrication Unit
o PA Process Flow
o Switch, LNA, and RFIC Process &
Fabrication Unit
o Filter Fabrication Unit
o Filter Process Flow
o Packaging Fabrication Unit
o Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Filter Front-End Process

25. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 25
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
o Summary
o PA Fabrication Unit
o PA Process Flow
o Switch, LNA, and RFIC Process &
Fabrication Unit
o Filter Fabrication Unit
o Filter Process Flow
o Packaging Fabrication Unit
o Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Filters – Process Flow (1/8)

26. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 26
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
o Summary
o PA Fabrication Unit
o PA Process Flow
o Switch, LNA, and RFIC Process &
Fabrication Unit
o Filter Fabrication Unit
o Filter Process Flow
o Packaging Fabrication Unit
o Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Packaging Process

27. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 27
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
o Summary
o PA Fabrication Unit
o PA Process Flow
o Switch, LNA, and RFIC Process &
Fabrication Unit
o Filter Fabrication Unit
o Filter Process Flow
o Packaging Fabrication Unit
o Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Packaging Process Flow (1/4)

28. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 28
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
o Cost Analysis Summary
o Yields Explanation &
Hypotheses
o PA Wafer and Die Cost
o Switch Wafer and Die Cost
o LNA Wafer and Die Cost
o Filter Wafer and Die Cost
o Packaging Cost
o Component Cost
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
PA Front-End Cost per process steps (1/3)

29. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 29
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
o Cost Analysis Summary
o Yields Explanation &
Hypotheses
o PA Wafer and Die Cost
o Switch Wafer and Die Cost
o LNA Wafer and Die Cost
o Filter Wafer and Die Cost
o Packaging Cost
o Component Cost
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Switch #1 Front-End Cost

30. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 30
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
o Cost Analysis Summary
o Yields Explanation &
Hypotheses
o PA Wafer and Die Cost
o Switch Wafer and Die Cost
o LNA Wafer and Die Cost
o Filter Wafer and Die Cost
o Packaging Cost
o Component Cost
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
LNA Wafer & Die Cost

31. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 31
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
o Cost Analysis Summary
o Yields Explanation &
Hypotheses
o PA Wafer and Die Cost
o Switch Wafer and Die Cost
o LNA Wafer and Die Cost
o Filter Wafer and Die Cost
o Packaging Cost
o Component Cost
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Filter Front-End Cost

32. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 32
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
o Cost Analysis Summary
o Yields Explanation &
Hypotheses
o PA Wafer and Die Cost
o Switch Wafer and Die Cost
o LNA Wafer and Die Cost
o Filter Wafer and Die Cost
o Packaging Cost
o Component Cost
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Component Cost

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Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
o Definition of Prices
o Manufacturer Financials
o Component Price
Feedbacks
Related Reports
About System Plus
Complete System Price
Broadcom AFEM-8100 System-in-Package in the Apple iPhone
11 Series

34. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 34
Overview / Introduction
Company Profile & Supply Chain
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Plus
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
RF
• 5G’s Impact on RF Front-End Module and Connectivity for Cell
phones 2019
• Advanced RF System-in-Package for Cellphones 2019
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
RF & PACKAGING
• RF Front-End Module Comparison 2020 – Volume 1
• Qorvo QM76018 RFFEM in the Apple iPhone Xr
• Broadcom AFEM-8092 System-in-Package in the Apple
iPhone Xs/Xr Series
• Qualcomm’s First 5G mmWave Chipset: SDX50M and
QTM052
• Murata Incredible High Performance (IHP) SAW Filter

35. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 35
Company
SERVICES

36. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 36
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
o Company services
o Contact
Business Models Fields of Expertise
Custom Analyses
(>130 analyses per year)
Reports
(>60 reports per year)
Costing Tools
Trainings

37. ©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 37
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
o Company services
o Contact
Contact
Headquarters
22 bd Benoni Goullin
44200 Nantes
FRANCE
+33 2 40 18 09 16
sales@systemplus.fr
Europe Sales Office
Lizzie LEVENEZ
Frankfurt am Main
GERMANY
+49 151 23 54 41 82
llevenez@systemplus.fr
www.systemplus.fr
NANTES
Headquarter
FRANKFURT/MAIN
Europe Sales Office
LYON
YOLE HQ
TOKYO
YOLE KK
GREATER CHINA
YOLE
CORNELIUS
YOLE Inc.
KOREA
YOLE
Asia Sales Office
Takashi ONOZAWA
Tokyo
JAPAN
T : +81 804 371 4887
onozawa@yole.fr
Mavis WANG
TAIWAN
T :+886 979 336 809
CN: +8613661566824
wang@yole.fr
America Sales Office
Steve LAFERRIERE
WESTERN US
T : +1 310 600 8267
laferriere@yole.fr
Chris YOUMAN
EASTERN US & CANADA
T : +1 919 607 9839
chris.youman@yole.fr