Deep analysis of the 400Gb optical transceiver from a leading Chinese company.
More information: https://www.systemplus.fr/reverse-costing-reports/innolights-400g-qsfp-dd-optical-transceiver/
We are offering a comprehensive high speed networking solution which is including 3.2T Co-packaged Optic (CPO), 100G, 200G, 400G & 800G transceivers, DACs, AOCs, ACCs & Loopback modules. We are fulfil your research (R&D) stage product development, DVT/EVT pre-product testing, mass production and also for final application use.
Welcome to contact us for more product info.
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
Ayar Labs TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth In-Pack...inside-BigData.com
Today at Hot Chips 2019, Intel engineers presented technical details on hybrid chip packaging technology, Intel Optane DC persistent memory and chiplet technology for optical I/O.
"To get to a future state of ‘AI everywhere,’ we’ll need to address the crush of data being generated and ensure enterprises are empowered to make efficient use of their data, processing it where it’s collected when it makes sense and making smarter use of their upstream resources," said Naveen Rao, Intel vice president and GM, Artificial Intelligence Products Group. "Data centers and the cloud need to have access to performant and scalable general purpose computing and specialized acceleration for complex AI applications. In this future vision of AI everywhere, a holistic approach is needed—from hardware to software to applications.”
Learn more: https://www.intel.ai/accelerating-for-ai/?elq_cid=1192980
Sign up for our insideHPC Newsletter: http://insidehpc.com/newsletter
Benjamin Wohlfeil's presentation at the EPIC Online Technology Meeting explored how innovation in co-packaged optics is addressing key data center interconnect challenges.
We are offering a comprehensive high speed networking solution which is including 3.2T Co-packaged Optic (CPO), 100G, 200G, 400G & 800G transceivers, DACs, AOCs, ACCs & Loopback modules. We are fulfil your research (R&D) stage product development, DVT/EVT pre-product testing, mass production and also for final application use.
Welcome to contact us for more product info.
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
Ayar Labs TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth In-Pack...inside-BigData.com
Today at Hot Chips 2019, Intel engineers presented technical details on hybrid chip packaging technology, Intel Optane DC persistent memory and chiplet technology for optical I/O.
"To get to a future state of ‘AI everywhere,’ we’ll need to address the crush of data being generated and ensure enterprises are empowered to make efficient use of their data, processing it where it’s collected when it makes sense and making smarter use of their upstream resources," said Naveen Rao, Intel vice president and GM, Artificial Intelligence Products Group. "Data centers and the cloud need to have access to performant and scalable general purpose computing and specialized acceleration for complex AI applications. In this future vision of AI everywhere, a holistic approach is needed—from hardware to software to applications.”
Learn more: https://www.intel.ai/accelerating-for-ai/?elq_cid=1192980
Sign up for our insideHPC Newsletter: http://insidehpc.com/newsletter
Benjamin Wohlfeil's presentation at the EPIC Online Technology Meeting explored how innovation in co-packaged optics is addressing key data center interconnect challenges.
Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels f...Leah Wilkinson
OIF Presents:
Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels for Next-Generation Data Center Systems
ECOC Market Focus
New Technologies & Systems/New Markets/New Packaging Platforms
Wed, 15 September 2021
Jeff Hutchins / Ranovus
OIF PLL Working Group Co-Packaging Vice Chair
Real Fibre optic FTTH FTTX network design, engineering & planning software fo...van den Dool Dick
ITS-NetDesign™
Our Fibre optic FTTH / FTTX network design, engineering & planning software for Autocad® is an important member of our suite of software solutions & planning tools.
Simply: design, engineer & plan FTTH / FTTX optical fibre networks.
Advanced modelling of P2P & GPON networks.
Real network design & engineering software for Autocad®.
Faster and more flexible than any GIS.
Software details, engine, installation, usage, customization, examples, LISP programming
SiC & GaN - Technology & market knowledge updatePntPower.com
Wide Band Gap semiconductor are more and more used in power electronics. Silicon Carbide and Gallium Nitride are now involved in the race to replace silicon. With huge R&D investments and start-ups facing historical players, market and technology knowledge becomes key. Point The Gap presented a SiC & GaN market knowledge update. All the information needed to understand this market, gathered in a few slides by a power electronics market intelligence specialist. Also available on www.PointThePower.com.
Including company names like Transphorm, Infineon, EPC corp., Cambridge electronics, Rohm, Cree, Toyota, Finsix, Zolt, Avogy, etc...
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
RF Front End modules and components for cellphones 2017 - Report by Yole Deve...Yole Developpement
A dynamic market with high responsivity to technical innovation, the RF front end industry is set to grow at 14% CAGR to reach $22.7B in 2022.
A market that will more than double in six years!
The radio-frequency (RF) front end and components market for cellphones is highly dynamic. From being worth $10.1B last year, it is expected to reach $22.7B in 2022. Such high growth is definitely something that players in other semiconductor markets would envy. However, the growth is not evenly distributed.
Filters represent the biggest business in the RF front end industry, and the value of this business will more than triple from 2016 to 2022. Most of this growth will derive from additional filtering needs from new antennas as well as the need for more filtering functionality due to multiple carrier aggregation (CA).
Power amplifiers (PAs) and low noise amplifiers (LNAs), the second biggest business, will be almost flat over the same period. High-end LTE PA market growth will be balanced by a shrinking 2G/3G market. The LNA market will grow steadily, especially thanks to the addition of new antennas.
Switches, the third biggest business, will double. This market will mainly be driven by antenna switches.
Lastly, antenna tuners, a small business today with an estimated $36M market value, will expand 7.5-fold to reach $272M in 2022. This growth is mainly due to tuning being added to both the main and the diversity antennas.
For more discussion, please visit our website: http://www.i-micronews.com/reports.html
GaN and SiC for power electronics applications 2015 Report by Yole DeveloppementYole Developpement
The SiC market is expected to treble and GaN is expected to explode - if challenges are overcome
In 2014, the SiC chip business was worth more than $133M. As in previous years, power factor correction (PFC) and photovoltaics (PV) are still the leading applications.
SiC diodes represent more than 80% of the market. In 2020, diodes will remain the main contributor across various applications, including electric and hybrid electric vehicles (EV/HEV), PV, PFC, wind, Uninterruptible Power Supplies (UPS) and motor drives.
SiC transistors will grow in parallel with diodes, driven by PV inverters. Challenges must be overcome prior to the adoption of pure SiC solutions for EV power train inverters, which is nevertheless expected by 2020.
Including the growth in both diodes and transistors we expect the total SiC market to more than treble by 2020, reaching $436M...
In this slidecast, Brian Welch from Luxtera presents: Silicon Photonics for HPC Interconnects. Luxtera is the first company to overcome the complex technical obstacles involved with integrating high performance optics directly with silicon electronics on a mainstream CMOS chip, bringing direct “fiber to the chip” connectivity to market.
Silicon Photonics for Extreme Computing - Challenges and Opportunitiesinside-BigData.com
In this video from the 2017 Argonne Training Program on Extreme-Scale Computing, Keren Bergman from Columbia University presents: Silicon Photonics for Extreme Computing - Challenges and Opportunities.
"As they confront ever more complex and data-intensive problems, scientists and researchers increasingly look to the next generation of supercomputing--the high-end segment of high-performance computing. That next generation will play out in so-called exaflop computers--machines capable of executing at least a quintillion (1E18) floating-point operations per second. Such a computer would represent a thousand-fold improvement over the current standard, the petaflop machines that first came on line in 2008. But while exaflop computers already appear on funders' technology roadmaps, making the exaflop leap on the short timescales of those roadmaps constitutes a formidable challenge."
Watch the video: https://wp.me/p3RLHQ-hvV
Learn more: https://extremecomputingtraining.anl.gov/
Sign up for our insideHPC Newsletter: http://insidehpc.com/newsletter
High Speed & RF Design and Layout: RFI/EMI Considerations (Design Conference ...Analog Devices, Inc.
At very high frequencies, every trace and pin is an RF emitter and receiver. If careful design practices are not followed, the unwanted signals can easily mask those a designer is trying to handle. The design choices begin at the architecture level and extend down to submillimeter placement of traces. There are tried and proven techniques for managing this process. The practical issues of real system design is covered in this session, along with ways to minimize signal degradation in the RF environment.
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
Deep dive analysis of the fourth generation of mid/high band front-end module for 4G and 5G from Broadcom.
More information : https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8200-pamid-in-the-apple-iphone-12-series/
Hamamatsu Photodiode and Laser in Livox’s Horizon LiDARsystem_plus
Analysis of the six channels and 905nm pulsed laser and photodiode from Hamamatsu, in Livox’s LiDAR for automotive ADAS.
More information: https://www.systemplus.fr/reverse-costing-reports/hamamatsu-photodiode-and-laser-in-livox-horizon-lidar/
Qualcomm QCA9500 60 GHz Chipset - reverse costing report published by System ...system_plus
Disruptive double side molded system-in-package-based chipset for millimeter-wave applications targeting consumer devices, including integrated antennae.
2018 will be a key milestone in the journey towards 5G communication. Several areas, from semiconductor to packaging, will improve their technologies to be suitable for 5G deployment. We now know that the 5G frequency will be in the millimeter wave (mmWave) range.
More information on that report at http://www.i-micronews.com/reports.html
Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels f...Leah Wilkinson
OIF Presents:
Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels for Next-Generation Data Center Systems
ECOC Market Focus
New Technologies & Systems/New Markets/New Packaging Platforms
Wed, 15 September 2021
Jeff Hutchins / Ranovus
OIF PLL Working Group Co-Packaging Vice Chair
Real Fibre optic FTTH FTTX network design, engineering & planning software fo...van den Dool Dick
ITS-NetDesign™
Our Fibre optic FTTH / FTTX network design, engineering & planning software for Autocad® is an important member of our suite of software solutions & planning tools.
Simply: design, engineer & plan FTTH / FTTX optical fibre networks.
Advanced modelling of P2P & GPON networks.
Real network design & engineering software for Autocad®.
Faster and more flexible than any GIS.
Software details, engine, installation, usage, customization, examples, LISP programming
SiC & GaN - Technology & market knowledge updatePntPower.com
Wide Band Gap semiconductor are more and more used in power electronics. Silicon Carbide and Gallium Nitride are now involved in the race to replace silicon. With huge R&D investments and start-ups facing historical players, market and technology knowledge becomes key. Point The Gap presented a SiC & GaN market knowledge update. All the information needed to understand this market, gathered in a few slides by a power electronics market intelligence specialist. Also available on www.PointThePower.com.
Including company names like Transphorm, Infineon, EPC corp., Cambridge electronics, Rohm, Cree, Toyota, Finsix, Zolt, Avogy, etc...
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
RF Front End modules and components for cellphones 2017 - Report by Yole Deve...Yole Developpement
A dynamic market with high responsivity to technical innovation, the RF front end industry is set to grow at 14% CAGR to reach $22.7B in 2022.
A market that will more than double in six years!
The radio-frequency (RF) front end and components market for cellphones is highly dynamic. From being worth $10.1B last year, it is expected to reach $22.7B in 2022. Such high growth is definitely something that players in other semiconductor markets would envy. However, the growth is not evenly distributed.
Filters represent the biggest business in the RF front end industry, and the value of this business will more than triple from 2016 to 2022. Most of this growth will derive from additional filtering needs from new antennas as well as the need for more filtering functionality due to multiple carrier aggregation (CA).
Power amplifiers (PAs) and low noise amplifiers (LNAs), the second biggest business, will be almost flat over the same period. High-end LTE PA market growth will be balanced by a shrinking 2G/3G market. The LNA market will grow steadily, especially thanks to the addition of new antennas.
Switches, the third biggest business, will double. This market will mainly be driven by antenna switches.
Lastly, antenna tuners, a small business today with an estimated $36M market value, will expand 7.5-fold to reach $272M in 2022. This growth is mainly due to tuning being added to both the main and the diversity antennas.
For more discussion, please visit our website: http://www.i-micronews.com/reports.html
GaN and SiC for power electronics applications 2015 Report by Yole DeveloppementYole Developpement
The SiC market is expected to treble and GaN is expected to explode - if challenges are overcome
In 2014, the SiC chip business was worth more than $133M. As in previous years, power factor correction (PFC) and photovoltaics (PV) are still the leading applications.
SiC diodes represent more than 80% of the market. In 2020, diodes will remain the main contributor across various applications, including electric and hybrid electric vehicles (EV/HEV), PV, PFC, wind, Uninterruptible Power Supplies (UPS) and motor drives.
SiC transistors will grow in parallel with diodes, driven by PV inverters. Challenges must be overcome prior to the adoption of pure SiC solutions for EV power train inverters, which is nevertheless expected by 2020.
Including the growth in both diodes and transistors we expect the total SiC market to more than treble by 2020, reaching $436M...
In this slidecast, Brian Welch from Luxtera presents: Silicon Photonics for HPC Interconnects. Luxtera is the first company to overcome the complex technical obstacles involved with integrating high performance optics directly with silicon electronics on a mainstream CMOS chip, bringing direct “fiber to the chip” connectivity to market.
Silicon Photonics for Extreme Computing - Challenges and Opportunitiesinside-BigData.com
In this video from the 2017 Argonne Training Program on Extreme-Scale Computing, Keren Bergman from Columbia University presents: Silicon Photonics for Extreme Computing - Challenges and Opportunities.
"As they confront ever more complex and data-intensive problems, scientists and researchers increasingly look to the next generation of supercomputing--the high-end segment of high-performance computing. That next generation will play out in so-called exaflop computers--machines capable of executing at least a quintillion (1E18) floating-point operations per second. Such a computer would represent a thousand-fold improvement over the current standard, the petaflop machines that first came on line in 2008. But while exaflop computers already appear on funders' technology roadmaps, making the exaflop leap on the short timescales of those roadmaps constitutes a formidable challenge."
Watch the video: https://wp.me/p3RLHQ-hvV
Learn more: https://extremecomputingtraining.anl.gov/
Sign up for our insideHPC Newsletter: http://insidehpc.com/newsletter
High Speed & RF Design and Layout: RFI/EMI Considerations (Design Conference ...Analog Devices, Inc.
At very high frequencies, every trace and pin is an RF emitter and receiver. If careful design practices are not followed, the unwanted signals can easily mask those a designer is trying to handle. The design choices begin at the architecture level and extend down to submillimeter placement of traces. There are tried and proven techniques for managing this process. The practical issues of real system design is covered in this session, along with ways to minimize signal degradation in the RF environment.
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
Deep dive analysis of the fourth generation of mid/high band front-end module for 4G and 5G from Broadcom.
More information : https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8200-pamid-in-the-apple-iphone-12-series/
Hamamatsu Photodiode and Laser in Livox’s Horizon LiDARsystem_plus
Analysis of the six channels and 905nm pulsed laser and photodiode from Hamamatsu, in Livox’s LiDAR for automotive ADAS.
More information: https://www.systemplus.fr/reverse-costing-reports/hamamatsu-photodiode-and-laser-in-livox-horizon-lidar/
Qualcomm QCA9500 60 GHz Chipset - reverse costing report published by System ...system_plus
Disruptive double side molded system-in-package-based chipset for millimeter-wave applications targeting consumer devices, including integrated antennae.
2018 will be a key milestone in the journey towards 5G communication. Several areas, from semiconductor to packaging, will improve their technologies to be suitable for 5G deployment. We now know that the 5G frequency will be in the millimeter wave (mmWave) range.
More information on that report at http://www.i-micronews.com/reports.html
MEMS Fabry-Perot interferometer in a very tiny NIR spectrometer.
More information: https://www.systemplus.fr/reverse-costing-reports/spectral-engines-nirone-sensor-x/
Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Editionsystem_plus
Early glimpse of very compact form millimeter-wave chipset commercially available for handset applications.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/qualcomm-60ghz-wigigwifi-802-11ad-chipset-worlds-first-smartphone-edition/
World’s first 76-81 GHz automotive single-chip radar in a System-on-Chip device with integrated Antenna-in-Package using Fan-Out packaging technology.
Reverse Costing - Structure, process and cost report by System Plus Consulting - find more here: https://www.systemplus.fr/reverse-costing-reports/mediatek-autus-r10-mt2706-77-79-ghz-ewlbaip-radar-chipset/
SiGe based millimeter-wave chipset commercially available for
backhaul applications with beamforming capability.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/peraso-x710-chipset-60ghz-outdoor-wireless-broadband-solution/
Technology and cost review of nine RF IPD found on the market from different suppliers: Broadcom, IPDiA, Murata, Qorvo, Skyworks and STMicroelectronics.
With integrated passive devices (IPD) accounting for almost 70 % of the PCB area in smartphones, integration is a challenge that several integrated device manufacturers (IDM) and outsourced semiconductor assembly & test (OSAT) companies have accepted in the last few years. Players active in the RF applications market include IDM companies like Qorvo, Skyworks, Murata, Broadcom, and STMicroelectronics, as well as OSATs such as STATS ChipPAC, ASE, Amkor, and TSMC.
STMicroelectronics Proximity & Flood Illuminator in the Apple iPhone X - reve...system_plus
A unique combination of STMicroelectronics’ latest proximity sensor, based on single-photon avalanche diode (SPAD) technology and a VCSEL illuminator, all in Apple’s most advanced handset.
More information on that report at http://www.i-micronews.com/reports.html
This is an overview of the Gigalight company, including the Gigalight optical interconnect solutions such as high-speed optical transceivers from 25G to 400G and active optical cables, as well as passive optical components (WDM, CWDM, DWDM, PLC splitters etc.).
Broadcom AFEM-8072 – Mid and High Band LTE RF Front-End Module (FEM) - teardo...system_plus
The first mid/high band Long Term Evolution (LTE) Radio Frequency (RF) FEM in the Apple iPhone X integrates the latest generation of Film Bulk Acoustic Resonator (FBAR) technology with advanced and innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8072-mid-and-high-band-lte-rf-front-end-module-fem/
Apple iPhone X – Infrared Dot Projector 2017 teardown reverse costing report ...system_plus
The world’s most advanced dot projector for 3D sensing
with four innovative parts:
Its package; a dedicated VCSEL; a folded optic; and the active DOE.
Apple has made a great technology choice with its 3D facial identification for the iPhone X. The new technology is presented as being 20 times more accurate than the older fingerprint approach with a one-in-a million probability of a random person unlocking your iPhone.
400G QSFP-DD to QSFP-DD AOC Active optical Cable Data Sheet By JTOPTICSJayani Technologies Ltd
The JTOPTICS® 400G QSFP-DD AOC (active optical cable) is a cutting-edge 400 Gb/s parallel active optical cable designed to transmit parallel 8×50 Gb/s PAM4 signals over multi-mode fiber (MMF) cables, delivering exceptional performance for distances up to 100m. This cable adheres to the standards set by QSFP-DD MSA and the CMIS 4.0. With support for eight electrical interface lanes, each operating at a data rate of 53.125G, the cable provides an impressive aggregate bandwidth of up to 425Gb/s.
Key Features:
Hot-pluggable QSFP-DD active optical cable assemblies for convenient and versatile connectivity.
8x 50G PAM4 electrical interface for high-speed data transfer.
8x 50G PAM4 optical interface ensuring efficient and reliable communication.
Data rate up to 53.125Gbps per channel, delivering fast and robust performance.
8-channels 850nm VCSEL array and PIN photo-detector array for reliable signal transmission.
Compliant with QSFP-DD MSA, CMIS, and IEEE 802.3 standards for industry compatibility.
Low power dissipation for energy-efficient operations.
Compliant with IEEE 802.3cd 200GBASE-SR4 and InfiniBand HDR/HDR100, meeting advanced networking requirements.
MMF cable with customizable length up to 70m (OM3) or 100m (OM4/OM5), allowing flexible installations.
10W maximum power dissipation per 400G QSFP-DD SR8 module for optimized power management.
Commercial case operating temperature range ensuring suitability for various environments.
Single 3.3V power supply simplifying power management.
Built-in digital diagnostic functionality for advanced monitoring.
RoHS compliant (lead-free) adhering to environmental standards.
Infiberone will demonstrate 200 g qsfp dd sr8 during the 2017 cioe and ecoc e...Cindy Ke
It’s recently reported that Infiberone has pushed out 200G QSFP DD SR8(2X 100GBASE-SR4) optical module officially and will have a demonstration on the spot during the CIOE2017 and ECOC2017 exhibition.
Get more details here:
https://www.infiberone.com/Plate_Detail_331.html
Orbbec’s Front 3D Depth Sensing System in the Oppo Find Xsystem_plus
The first introduction of Orbbec’s 3D front depth sensing system in a mobile application featuring a global shutter, a dot projector and a custom system-on-chip.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/orbbecs-front-3d-depth-sensing-system-in-the-oppo-find-x/
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Seriessystem_plus
Cost effective third generation of mid/high band Front-End Module with advanced and innovative packaging.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8100-system-in-package-in-the-apple-iphone-11-series/
Fingerprint Cards’ FPC1268 in the Huawei Mate 9 Pro & P10 series 2017 teardow...Yole Developpement
The world’s first capacitive fingerprint successfully integrated under glass, in collaboration with TPK
Fingerprint Cards AB (FPC), a leader in capacitive fingerprint technology, has over the last year equipped a large number of smartphones worldwide. One of its biggest clients, Huawei, traditionally integrates the latest technology in its flagship model every year. With the integration of the FPC1268 in the Huawei Mate 9 Pro and the Huawei P10 series, FPC has introduced a new kind of capacitive fingerprint integration: one that can be successfully integrated under glass. This technology, developed in collaboration with TPK, aims to be the new low-cost solution for fingerprint scanner integration.
Following the Mate 9 Pro, the Huawei P10 is the latest smartphone to feature the capacitive fingerprint completely hidden behind the cover glass. The sensor is located under the home button in the device’s front, under a unique TPK-developed glass cover that allows for new, highly attractive designs like the ultrasonic fingerprint.
Using the same process as FPC’s previous flagship product, the 1025, the integration no longer requires wire bonding but instead a specific TSV designed by an identified OSAT and based on Tessera’s WLCSP solution. While previously used for CIS integration, this is the first time it has been used for fingerprint. Along with the ASIC, the fingerprint is integrated into an LGA package which is soldered on a flex PCB and covered by TPK’s specially-designed glass.
Thanks to conductive layers, TPK’s solution allows for the precise detection and identification of the fingerprint under glass. Everything is packaged in a metal ring that forms part of the home button.
This report provides a complete analysis of chip fabrication and package processes, along with a cost estimate. Also included is a comparison with FPC’s previous capacitive fingerprint generation, the FPC1025, and Qualcomm’s new ultrasonic fingerprint, the Sense ID.
More information on that report at http://www.i-micronews.com/reports.html
2-Axis Gyroscopes for Optical Image Stabilization: STMicroelectronics L2G2IS ...Yole Developpement
Complete reports and comparison of the latest generation products for smartphones from the leading optical image stabilization gyro players.
2-Axis Gyroscopes for Optical Image Stabilization (OIS) constitute a market where 123 million units were shipped in 2015, according to Yole Développement. This market originates only from high-end smartphones and two players share most of it: InvenSense, with 49%, and STMicroelectronics, with 39%.
The 2-axis gyroscopes are located inside the camera module of high-end smartphones. The main constraints are a small footprint and, more importantly, thinness.
Previously, thickness was the same as standard land grid array (LGA) or quad flat no-leads (QFN) package, close to 1mm. Now the standard is 0.65mm, which products from both InvenSense and STMicroelectronics attain.
InvenSense was first, with the IDG-2030, a 2.3x2.3x0.65mm gyroscope, which is still the smallest on the market. Since its introduction we found it in several smartphones from various manufacturers. The IDG-2030 uses the same Nasiri platform as other InvenSense inertial devices, with wafer-level integration of the MEMS sensor on top of the application specific integrated circuit (ASIC), thus providing only one die in the final LGA package.
Months later, STMicroelectronics released the L2G2IS, which shares the same dimensions. The device is manufactured using the same THELMA process as all STMicroelectronics inertial devices. The THELMA platform involves a two-die approach that is challenging for very thin package integration. However, both players now offer very low-cost gyros thanks to die size reduction and process optimization.
Both gyroscopes analyzed are 2-axis X, Y (Pitch, Roll). The two reports can be purchased separately or together in order to compare the technology and pricing of the main smartphone OIS gyro players, including previous generation products.
More information on that report at http://www.i-micronews.com/reports.html
Similar to InnoLight’s 400G QSFP-DD Optical Transceiver (20)
First self-made SoC for advanced driving in Tesla Driver Assist Autopilot 3.0
More : https://www.systemplus.fr/reverse-costing-reports/tesla-ubq01b0-fsd-chip/
SPR21610 - Vitesco Technologies Power Module in Jaguar I-PACE Invertersystem_plus
Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/vitesco-technologies-power-module-in-jaguar-i-pace-inverter/
SP20569 - IRay T3S Thermal Camera for Smartphonesystem_plus
Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/iray-t3s-thermal-camera-for-smartphone/
Technical and cost overview of the evolution of radio frequency front-end module technologies integrated in 5G mmWave and Sub-6 GHz Phones.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-2-focus-on-5g-chipset/
Technical and cost overview of the evolution of the radio frequency front-end module technologies integrated in the Apple iPhone series from 2016 - 2020.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-1-focus-on-apple/
Apple iPhone 12 series mmWave 5G Chipset and Antennasystem_plus
A study of the complete first generation of the 5G millimeter-wave chipset for Apple’s phones including custom antenna, front-end module and antenna-on-package.
More information : https://www.systemplus.fr/reverse-costing-reports/apple-iphone-12-series-mmwave-5g-chipset-and-antenna/
NVIDIA’s new generation Graphics Processing Unit (GPU) with TSMC CoWoS, 40GB Samsung HBM2, 2.5D and 3D packaging.
More information: https://www.systemplus.fr/reverse-costing-reports/nvidia-a100-ampere-gpu/
EPC’s 70 V ePower stage with separate and independent high and low side control inputs.
More information: https://www.systemplus.fr/reverse-costing-reports/epc2152-half-bridge-monolithic-gan-ic/
Microsoft - Holographic Lens from Hololens 2system_plus
See-through holographic display for mixed reality smartglasses.
More on : https://www.systemplus.fr/reverse-costing-reports/microsoft-holographic-lens-from-hololens-2/
Cost-effective 1 mm2 miniature camera with customizable wafer-level optics for endoscopy and novel medical imaging devices.
More information : https://www.systemplus.fr/reverse-costing-reports/ams-naneye-mini-camera/
Discover Axis’s high-end product integrating its latest ARTPEC-7 in-house system-on-chip dedicated to network video and machine learning capabilities.
More information : https://www.systemplus.fr/reverse-costing-reports/axis-p1375-e-network-camera/
Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1)system_plus
Dig deep into Hikvision’s AI-powered thermal network camera for security applications.
More information: https://www.systemplus.fr/reverse-costing-reports/hikvision-intelligent-thermal-network-camera-ds-2td2166-15-v1/
The first 600V system-in-package half-bridge driver from STMicroelectronics integrating two GaN-based HEMTs.
More information: https://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-mastergan1-half-bridge-driver/
Physical and cost analysis of Micron’s fifth-generation low-power DRAM memory.
More information: https://www.systemplus.fr/reverse-costing-reports/micron-lpddr5-12gb-mobile-memory/
In-depth physical and cost analysis of Samsung’s ‘1y-nm’ low power DRAM.
More information: https://www.systemplus.fr/reverse-costing-reports/samsung-lpddr5-12gb-mobile-memory/
Safran Colibrys MS1010 and MEMSIC MXA2500M High-End Accelerometerssystem_plus
Detailed technology and cost analysis of the high-end single-axis and dual-axis accelerometers integrated in the STIM318 IMU.
More information: https://www.systemplus.fr/reverse-costing-reports/safran-colibrys-ms1010-and-memsic-mxa2500m-high-end-accelerometers/
Sensonor STIM318 Inertial Measurement Unit (IMU)system_plus
Newest IMU with 9-axis detection and gyro bias instability of 0.3°/h from Sensonor.
More information: https://www.systemplus.fr/reverse-costing-reports/sensonor-stim318-inertial-measurement-unit-imu/
Everspin’s Spin Transfer Torque MRAM with perpendicular magnetic tunnel junction.
More information: https://www.systemplus.fr/reverse-costing-reports/everspin-emd3d256m-sttmram-memory/
Deep analysis of the latest generation of under-display optical fingerprint sensors using micro-optics.
Reverse Costing - Structure, process and cost report by System Plus Consulting - find more here: https://www.systemplus.fr/reverse-costing-reports/goodixs-ultra-thin-optical-in-display-fingerprint/
Advanced System-in-Package Technology in Apple’s AirPods Prosystem_plus
Analysis of Apple’s first SiP found in the latest AirPods, featuring a fully integrated SiP for audio codec and Bluetooth connectivity.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/advanced-system-in-package-technology-in-apples-airpods-pro/
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...UiPathCommunity
💥 Speed, accuracy, and scaling – discover the superpowers of GenAI in action with UiPath Document Understanding and Communications Mining™:
See how to accelerate model training and optimize model performance with active learning
Learn about the latest enhancements to out-of-the-box document processing – with little to no training required
Get an exclusive demo of the new family of UiPath LLMs – GenAI models specialized for processing different types of documents and messages
This is a hands-on session specifically designed for automation developers and AI enthusiasts seeking to enhance their knowledge in leveraging the latest intelligent document processing capabilities offered by UiPath.
Speakers:
👨🏫 Andras Palfi, Senior Product Manager, UiPath
👩🏫 Lenka Dulovicova, Product Program Manager, UiPath
UiPath Test Automation using UiPath Test Suite series, part 4DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 4. In this session, we will cover Test Manager overview along with SAP heatmap.
The UiPath Test Manager overview with SAP heatmap webinar offers a concise yet comprehensive exploration of the role of a Test Manager within SAP environments, coupled with the utilization of heatmaps for effective testing strategies.
Participants will gain insights into the responsibilities, challenges, and best practices associated with test management in SAP projects. Additionally, the webinar delves into the significance of heatmaps as a visual aid for identifying testing priorities, areas of risk, and resource allocation within SAP landscapes. Through this session, attendees can expect to enhance their understanding of test management principles while learning practical approaches to optimize testing processes in SAP environments using heatmap visualization techniques
What will you get from this session?
1. Insights into SAP testing best practices
2. Heatmap utilization for testing
3. Optimization of testing processes
4. Demo
Topics covered:
Execution from the test manager
Orchestrator execution result
Defect reporting
SAP heatmap example with demo
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using Deplo...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
Essentials of Automations: Optimizing FME Workflows with ParametersSafe Software
Are you looking to streamline your workflows and boost your projects’ efficiency? Do you find yourself searching for ways to add flexibility and control over your FME workflows? If so, you’re in the right place.
Join us for an insightful dive into the world of FME parameters, a critical element in optimizing workflow efficiency. This webinar marks the beginning of our three-part “Essentials of Automation” series. This first webinar is designed to equip you with the knowledge and skills to utilize parameters effectively: enhancing the flexibility, maintainability, and user control of your FME projects.
Here’s what you’ll gain:
- Essentials of FME Parameters: Understand the pivotal role of parameters, including Reader/Writer, Transformer, User, and FME Flow categories. Discover how they are the key to unlocking automation and optimization within your workflows.
- Practical Applications in FME Form: Delve into key user parameter types including choice, connections, and file URLs. Allow users to control how a workflow runs, making your workflows more reusable. Learn to import values and deliver the best user experience for your workflows while enhancing accuracy.
- Optimization Strategies in FME Flow: Explore the creation and strategic deployment of parameters in FME Flow, including the use of deployment and geometry parameters, to maximize workflow efficiency.
- Pro Tips for Success: Gain insights on parameterizing connections and leveraging new features like Conditional Visibility for clarity and simplicity.
We’ll wrap up with a glimpse into future webinars, followed by a Q&A session to address your specific questions surrounding this topic.
Don’t miss this opportunity to elevate your FME expertise and drive your projects to new heights of efficiency.
Key Trends Shaping the Future of Infrastructure.pdfCheryl Hung
Keynote at DIGIT West Expo, Glasgow on 29 May 2024.
Cheryl Hung, ochery.com
Sr Director, Infrastructure Ecosystem, Arm.
The key trends across hardware, cloud and open-source; exploring how these areas are likely to mature and develop over the short and long-term, and then considering how organisations can position themselves to adapt and thrive.
Smart TV Buyer Insights Survey 2024 by 91mobiles.pdf91mobiles
91mobiles recently conducted a Smart TV Buyer Insights Survey in which we asked over 3,000 respondents about the TV they own, aspects they look at on a new TV, and their TV buying preferences.
DevOps and Testing slides at DASA ConnectKari Kakkonen
My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...Ramesh Iyer
In today's fast-changing business world, Companies that adapt and embrace new ideas often need help to keep up with the competition. However, fostering a culture of innovation takes much work. It takes vision, leadership and willingness to take risks in the right proportion. Sachin Dev Duggal, co-founder of Builder.ai, has perfected the art of this balance, creating a company culture where creativity and growth are nurtured at each stage.
Connector Corner: Automate dynamic content and events by pushing a buttonDianaGray10
Here is something new! In our next Connector Corner webinar, we will demonstrate how you can use a single workflow to:
Create a campaign using Mailchimp with merge tags/fields
Send an interactive Slack channel message (using buttons)
Have the message received by managers and peers along with a test email for review
But there’s more:
In a second workflow supporting the same use case, you’ll see:
Your campaign sent to target colleagues for approval
If the “Approve” button is clicked, a Jira/Zendesk ticket is created for the marketing design team
But—if the “Reject” button is pushed, colleagues will be alerted via Slack message
Join us to learn more about this new, human-in-the-loop capability, brought to you by Integration Service connectors.
And...
Speakers:
Akshay Agnihotri, Product Manager
Charlie Greenberg, Host
Let's dive deeper into the world of ODC! Ricardo Alves (OutSystems) will join us to tell all about the new Data Fabric. After that, Sezen de Bruijn (OutSystems) will get into the details on how to best design a sturdy architecture within ODC.
GraphRAG is All You need? LLM & Knowledge GraphGuy Korland
Guy Korland, CEO and Co-founder of FalkorDB, will review two articles on the integration of language models with knowledge graphs.
1. Unifying Large Language Models and Knowledge Graphs: A Roadmap.
https://arxiv.org/abs/2306.08302
2. Microsoft Research's GraphRAG paper and a review paper on various uses of knowledge graphs:
https://www.microsoft.com/en-us/research/blog/graphrag-unlocking-llm-discovery-on-narrative-private-data/
LF Energy Webinar: Electrical Grid Modelling and Simulation Through PowSyBl -...DanBrown980551
Do you want to learn how to model and simulate an electrical network from scratch in under an hour?
Then welcome to this PowSyBl workshop, hosted by Rte, the French Transmission System Operator (TSO)!
During the webinar, you will discover the PowSyBl ecosystem as well as handle and study an electrical network through an interactive Python notebook.
PowSyBl is an open source project hosted by LF Energy, which offers a comprehensive set of features for electrical grid modelling and simulation. Among other advanced features, PowSyBl provides:
- A fully editable and extendable library for grid component modelling;
- Visualization tools to display your network;
- Grid simulation tools, such as power flows, security analyses (with or without remedial actions) and sensitivity analyses;
The framework is mostly written in Java, with a Python binding so that Python developers can access PowSyBl functionalities as well.
What you will learn during the webinar:
- For beginners: discover PowSyBl's functionalities through a quick general presentation and the notebook, without needing any expert coding skills;
- For advanced developers: master the skills to efficiently apply PowSyBl functionalities to your real-world scenarios.