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©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 1
22 Bd Benoni Goullin
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Audi-Bosch FPK Generation 2
Instrument Cluster (Ref. 83A 920 790 )
SP20511 - System report by Guillaume ROBICHON
February 2020 – SAMPLE
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o Main Chipset
o Block Diagram
o Reverse Costing Methodology
o Glossary
Company Profile 10
Teardown Analysis 13
o Views and Dimensions of the System
o System Opening
o Display Module
o Main Electronic Board
 Top Side – Global view
 Top Side – High definition photo
 Top Side – PCB markings
 Top Side – Main & IC components markings
 Top Side – Main & IC components identification
 Top Side – Discrete components markings
 Top Side – Discrete components identification
 Top Side – Passive components markings
 Top Side – Passive components identification
 Bottom Side
o LED Right Board
o LED Middle Board
o LED Left Board
o NVIDIA T124XA-P1-A1 Summary of the Physical Analysis
Cost Analysis 101
o Accessing the BOM
o Display Cost
o PCBs Cost
o Components Cost
o BOM Cost – Main Board
o Housing Parts – Estimation
o BOM Cost - Housing
o Material Cost Breakdown by Sub-Assembly
o Material Cost Breakdown by Component Categories
o Accessing the Added Value (AV) cost
o Main Board Manufacturing Flow
o Details of the Main Board AV Cost
o Details of the System Assembly AV Cost
o Added-Value Cost Breakdown
o Manufacturing Cost Breakdown
Estimated Price Analysis 156
o Financial Ratios
o Estimation of the Manufacturer Price
Give us your Feedbacks!
Company Services 161
©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 3
Overview / Introduction
o Executive Summary
o Main Chipset
o Block Diagram
o Reverse Costing
Methodology
o Glossary
Company Profile
Physical Analysis
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Block Diagram
The block diagram of the Audi Q3 Instrument Cluster (83A 920 790) is described in the following schematics:
©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 4
Overview / Introduction
o Executive Summary
o Main Chipset
o Block Diagram
o Reverse Costing
Methodology
o Glossary
Company Profile
Physical Analysis
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
The reverse costing analysis is conducted in 3 phases:
Teardown
analysis
• Package is analyzed and measured.
• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin
out, die marking.
• Setup of the manufacturing process.
Costing
analysis
• Setup of the manufacturing environment.
• Cost simulation of the process steps.
Selling price
analysis
• Supply chain analysis.
• Analysis of the selling price.
Reverse Costing Methodology - Components
©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 5
Overview / Introduction
o Executive Summary
o Main Chipset
o Block Diagram
o Reverse Costing
Methodology
o Glossary
Company Profile
Physical Analysis
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
The reverse costing analysis is conducted in several phases:
Reverse Costing Methodology
• The initialization of the analysis
Pictures of the elements to be studied.
Identification of the components.
• Description of the material in the “SYScost+” software
Creation of an “estimation project” of the studied board with SYScost+ software.
Construction of the Bill of Material (BOM).
• Assessing the material
Searching for the price of each reference among distributors and manufacturers.
Assessing the cost of the PCB and of the unaccounted references (unknown by distributors)
The BOM is valued with SYScost+ : price simulation according to the requested quantities.
• Assessing the assembling and test phases
Assembly and test lines are modeled with the SYScost+ software.
The assembly and tests costs are estimated.
• Production cost & manufacturer price
Estimation of the production cost & manufacturer price.
• Report
A report is edited.
SYS.cost+©, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More information on the
software can be found at www.systemplus.fr.
©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 6
Overview / Introduction
Company Profile
Physical Analysis
o Views & Dimensions
o System Opening
o Display Modules
o Electronic Board
o NVIDIA T124XA-P1-A1
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
System Opening
System opening
©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 7
Overview / Introduction
Company Profile
Physical Analysis
o Views & Dimensions
o System Opening
o Display Modules
o Electronic Board
o NVIDIA T124XA-P1-A1
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Main Board – Top Side – Main Components Identification
©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 8
Overview / Introduction
Company Profile
Physical Analysis
o Views & Dimensions
o System Opening
o Display Modules
o Electronic Board
o NVIDIA T124XA-P1-A1
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
NVIDIA T124XA-P1-A1 – Summary of the Physical Analysis
©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 9
Overview / Introduction
Physical Analysis
Cost Analysis
o Assessing the BOM
o Display Cost
o PCBs Cost
o Components Cost
o BOM Cost – Electronics
o Housing Parts Estimation
o BOM Cost - Housing
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Display Module Cost
©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 10
Overview / Introduction
Physical Analysis
Cost Analysis
o Assessing the BOM
o Display Cost
o PCBs Cost
o Components Cost
o BOM Cost – Electronics
o Housing Parts Estimation
o BOM Cost - Housing
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
PCBs Cost – Main Board
The cost of the Printed Circuit Boards (PCB) has been estimated through the PCB costing model of PCB Price+.
The cost varies according to the used technology as well as the size of the board and of the panels on which the boards will be laid-out.
Chinese manufacturing costs have been used for these calculations.
©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 11
Overview / Introduction
Physical Analysis
Cost Analysis
o Assessing the BOM
o Display Cost
o PCBs Cost
o Components Cost
o BOM Cost – Electronics
o Housing Parts Estimation
o BOM Cost - Housing
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
PCBs Cost – Main Board
©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 12
Overview / Introduction
Physical Analysis
Cost Analysis
o Assessing the BOM
o Display Cost
o PCBs Cost
o Components Cost
o BOM Cost – Electronics
o Housing Parts Estimation
o BOM Cost - Housing
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Estimation of the Cost of the Cypress Component
©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 13
Overview / Introduction
Physical Analysis
Cost Analysis
o Assessing the BOM
o Display Cost
o PCBs Cost
o Components Cost
o BOM Cost – Electronics
o Housing Parts Estimation
o BOM Cost - Housing
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Estimation of the Cost of the Cypress Component
©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 14
Overview / Introduction
Physical Analysis
Cost Analysis
o Assessing the BOM
o Display Cost
o PCBs Cost
o Components Cost
o BOM Cost – Electronics
o Housing Parts Estimation
o BOM Cost - Housing
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
BOM Cost – Main Board
©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 15
Overview / Introduction
Physical Analysis
Cost Analysis
o Assessing the BOM
o Display Cost
o PCBs Cost
o Components Cost
o BOM Cost – Electronics
o Housing Parts Estimation
o BOM Cost - Housing
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Manufacturing Cost Breakdown
©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 16
Overview / Introduction
Physical Analysis
Cost Analysis
Manufacturer Price Analysis
o Financial Ratios
o Manufacturer Price
Feedbacks
Related Reports
About System Plus
Estimation of the Manufacturer Price
©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 18
COMPANY
SERVICES
©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 19
Overview / Introduction
Company Profile
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
o Company services
o Contact
o Legal
Business Models Fields of Expertise
Custom Analyses
(>130 analyses per year)
Reports
(>60 reports per year)
Costing Tools
Trainings
©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 20
Overview / Introduction
Company Profile
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
o Company services
o Contact
o Legal
Contact
Headquarters
22 bd Benoni Goullin
44200 Nantes
FRANCE
+33 2 40 18 09 16
sales@systemplus.fr
Europe Sales Office
Lizzie LEVENEZ
Frankfurt am Main
GERMANY
+49 151 23 54 41 82
llevenez@systemplus.fr
www.systemplus.fr
NANTES
Headquarter
FRANKFURT/MAIN
Europe Sales Office
LYON
YOLE HQ
TOKYO
YOLE KK
GREATER CHINA
YOLE
CHARLOTTE
YOLE Inc.
KOREA
YOLE
Asia Sales Office
Takashi ONOZAWA
Tokyo
JAPAN
T : +81 804 371 4887
onozawa@yole.fr
Mavis WANG
TAIWAN
T :+886 979 336 809
CN: +8613661566824
wang@yole.fr
America Sales Office
Steve LAFERRIERE
WESTERN US
T : +1 310 600 8267
laferriere@yole.fr
Chris YOUMAN
EASTERN US & CANADA
T : +1 919 607 9839
chris.youman@yole.fr

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Audi-Bosch FPK Generation 2 Instrument Cluster

  • 1. ©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 1 22 Bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr Audi-Bosch FPK Generation 2 Instrument Cluster (Ref. 83A 920 790 ) SP20511 - System report by Guillaume ROBICHON February 2020 – SAMPLE REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
  • 2. ©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 2 Table of Contents Overview / Introduction 4 o Executive Summary o Main Chipset o Block Diagram o Reverse Costing Methodology o Glossary Company Profile 10 Teardown Analysis 13 o Views and Dimensions of the System o System Opening o Display Module o Main Electronic Board  Top Side – Global view  Top Side – High definition photo  Top Side – PCB markings  Top Side – Main & IC components markings  Top Side – Main & IC components identification  Top Side – Discrete components markings  Top Side – Discrete components identification  Top Side – Passive components markings  Top Side – Passive components identification  Bottom Side o LED Right Board o LED Middle Board o LED Left Board o NVIDIA T124XA-P1-A1 Summary of the Physical Analysis Cost Analysis 101 o Accessing the BOM o Display Cost o PCBs Cost o Components Cost o BOM Cost – Main Board o Housing Parts – Estimation o BOM Cost - Housing o Material Cost Breakdown by Sub-Assembly o Material Cost Breakdown by Component Categories o Accessing the Added Value (AV) cost o Main Board Manufacturing Flow o Details of the Main Board AV Cost o Details of the System Assembly AV Cost o Added-Value Cost Breakdown o Manufacturing Cost Breakdown Estimated Price Analysis 156 o Financial Ratios o Estimation of the Manufacturer Price Give us your Feedbacks! Company Services 161
  • 3. ©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 3 Overview / Introduction o Executive Summary o Main Chipset o Block Diagram o Reverse Costing Methodology o Glossary Company Profile Physical Analysis Cost Analysis Manufacturer Price Analysis Feedbacks Related Reports About System Plus Block Diagram The block diagram of the Audi Q3 Instrument Cluster (83A 920 790) is described in the following schematics:
  • 4. ©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 4 Overview / Introduction o Executive Summary o Main Chipset o Block Diagram o Reverse Costing Methodology o Glossary Company Profile Physical Analysis Cost Analysis Manufacturer Price Analysis Feedbacks Related Reports About System Plus The reverse costing analysis is conducted in 3 phases: Teardown analysis • Package is analyzed and measured. • The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking. • Setup of the manufacturing process. Costing analysis • Setup of the manufacturing environment. • Cost simulation of the process steps. Selling price analysis • Supply chain analysis. • Analysis of the selling price. Reverse Costing Methodology - Components
  • 5. ©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 5 Overview / Introduction o Executive Summary o Main Chipset o Block Diagram o Reverse Costing Methodology o Glossary Company Profile Physical Analysis Cost Analysis Manufacturer Price Analysis Feedbacks Related Reports About System Plus The reverse costing analysis is conducted in several phases: Reverse Costing Methodology • The initialization of the analysis Pictures of the elements to be studied. Identification of the components. • Description of the material in the “SYScost+” software Creation of an “estimation project” of the studied board with SYScost+ software. Construction of the Bill of Material (BOM). • Assessing the material Searching for the price of each reference among distributors and manufacturers. Assessing the cost of the PCB and of the unaccounted references (unknown by distributors) The BOM is valued with SYScost+ : price simulation according to the requested quantities. • Assessing the assembling and test phases Assembly and test lines are modeled with the SYScost+ software. The assembly and tests costs are estimated. • Production cost & manufacturer price Estimation of the production cost & manufacturer price. • Report A report is edited. SYS.cost+©, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More information on the software can be found at www.systemplus.fr.
  • 6. ©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 6 Overview / Introduction Company Profile Physical Analysis o Views & Dimensions o System Opening o Display Modules o Electronic Board o NVIDIA T124XA-P1-A1 Cost Analysis Manufacturer Price Analysis Feedbacks Related Reports About System Plus System Opening System opening
  • 7. ©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 7 Overview / Introduction Company Profile Physical Analysis o Views & Dimensions o System Opening o Display Modules o Electronic Board o NVIDIA T124XA-P1-A1 Cost Analysis Manufacturer Price Analysis Feedbacks Related Reports About System Plus Main Board – Top Side – Main Components Identification
  • 8. ©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 8 Overview / Introduction Company Profile Physical Analysis o Views & Dimensions o System Opening o Display Modules o Electronic Board o NVIDIA T124XA-P1-A1 Cost Analysis Manufacturer Price Analysis Feedbacks Related Reports About System Plus NVIDIA T124XA-P1-A1 – Summary of the Physical Analysis
  • 9. ©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 9 Overview / Introduction Physical Analysis Cost Analysis o Assessing the BOM o Display Cost o PCBs Cost o Components Cost o BOM Cost – Electronics o Housing Parts Estimation o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacturing Cost Manufacturer Price Analysis Feedbacks Related Reports About System Plus Display Module Cost
  • 10. ©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 10 Overview / Introduction Physical Analysis Cost Analysis o Assessing the BOM o Display Cost o PCBs Cost o Components Cost o BOM Cost – Electronics o Housing Parts Estimation o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacturing Cost Manufacturer Price Analysis Feedbacks Related Reports About System Plus PCBs Cost – Main Board The cost of the Printed Circuit Boards (PCB) has been estimated through the PCB costing model of PCB Price+. The cost varies according to the used technology as well as the size of the board and of the panels on which the boards will be laid-out. Chinese manufacturing costs have been used for these calculations.
  • 11. ©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 11 Overview / Introduction Physical Analysis Cost Analysis o Assessing the BOM o Display Cost o PCBs Cost o Components Cost o BOM Cost – Electronics o Housing Parts Estimation o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacturing Cost Manufacturer Price Analysis Feedbacks Related Reports About System Plus PCBs Cost – Main Board
  • 12. ©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 12 Overview / Introduction Physical Analysis Cost Analysis o Assessing the BOM o Display Cost o PCBs Cost o Components Cost o BOM Cost – Electronics o Housing Parts Estimation o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacturing Cost Manufacturer Price Analysis Feedbacks Related Reports About System Plus Estimation of the Cost of the Cypress Component
  • 13. ©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 13 Overview / Introduction Physical Analysis Cost Analysis o Assessing the BOM o Display Cost o PCBs Cost o Components Cost o BOM Cost – Electronics o Housing Parts Estimation o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacturing Cost Manufacturer Price Analysis Feedbacks Related Reports About System Plus Estimation of the Cost of the Cypress Component
  • 14. ©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 14 Overview / Introduction Physical Analysis Cost Analysis o Assessing the BOM o Display Cost o PCBs Cost o Components Cost o BOM Cost – Electronics o Housing Parts Estimation o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacturing Cost Manufacturer Price Analysis Feedbacks Related Reports About System Plus BOM Cost – Main Board
  • 15. ©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 15 Overview / Introduction Physical Analysis Cost Analysis o Assessing the BOM o Display Cost o PCBs Cost o Components Cost o BOM Cost – Electronics o Housing Parts Estimation o BOM Cost - Housing o Material Cost Breakdown o Added-Value Cost o Manufacturing Cost Manufacturer Price Analysis Feedbacks Related Reports About System Plus Manufacturing Cost Breakdown
  • 16. ©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 16 Overview / Introduction Physical Analysis Cost Analysis Manufacturer Price Analysis o Financial Ratios o Manufacturer Price Feedbacks Related Reports About System Plus Estimation of the Manufacturer Price
  • 17. ©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 18 COMPANY SERVICES
  • 18. ©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 19 Overview / Introduction Company Profile Physical Analysis Manufacturing Process Flow Cost Analysis Manufacturer Price Analysis Feedbacks Related Reports About System Plus o Company services o Contact o Legal Business Models Fields of Expertise Custom Analyses (>130 analyses per year) Reports (>60 reports per year) Costing Tools Trainings
  • 19. ©2020 by System Plus Consulting | Audi Q3 Instrument Cluster 20 Overview / Introduction Company Profile Physical Analysis Manufacturing Process Flow Cost Analysis Manufacturer Price Analysis Feedbacks Related Reports About System Plus o Company services o Contact o Legal Contact Headquarters 22 bd Benoni Goullin 44200 Nantes FRANCE +33 2 40 18 09 16 sales@systemplus.fr Europe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY +49 151 23 54 41 82 llevenez@systemplus.fr www.systemplus.fr NANTES Headquarter FRANKFURT/MAIN Europe Sales Office LYON YOLE HQ TOKYO YOLE KK GREATER CHINA YOLE CHARLOTTE YOLE Inc. KOREA YOLE Asia Sales Office Takashi ONOZAWA Tokyo JAPAN T : +81 804 371 4887 onozawa@yole.fr Mavis WANG TAIWAN T :+886 979 336 809 CN: +8613661566824 wang@yole.fr America Sales Office Steve LAFERRIERE WESTERN US T : +1 310 600 8267 laferriere@yole.fr Chris YOUMAN EASTERN US & CANADA T : +1 919 607 9839 chris.youman@yole.fr