Comparison of main players AP: Apple A10 with inFO vs. Qualcomm Snapdragon 820 with MCeP packaging technology vs. HiSilicon Kirin 955 & Samsung Exynos 8 with standard Package-on-Package
Five major players are sharing the smartphone application processors (AP) market. Among them, Qualcomm, Apple, Samsung and HiSilicon propose the most powerful AP. They use almost the same technology node for the die, and the innovation is now at the packaging level. During this year, we observed different technologies inside the four main smartphone flagships: classic Package-on-Package (PoP) developed by Amkor for the Kirin 955 and for the Exynos 8, Molded Core Embedded Package (MCeP) technology developed by Shinko for the Snapdragon 820 and integrated Fan-Out packaging (inFO) developed by TSMC for the A10.
Located under the DRAM chip on the main board, the AP are packaged using PoP technology. The Apple A10 can be found in the iPhone 7 series. The HiSilicon Kirin 955 can be found in the Huawei P9 and the Samsung Exynos 8 as the Qualcomm Snapdragon 820 can be found in the Samsung Galaxy S7 series depending on the world version (US and Asia for the Snapdragon and International for the Exynos).
In this report, we highlight the differences and the innovations of the packages chosen by the end-user OEMs. Whereas some AP providers like for HiSilicon or Samsung choose to consider conventional PoP with embedded land-side capacitor (LSC), others like Apple or Qualcomm use innovative technologies like Fan-Out PoP and silicon based Deep Trench LSC or embedded die packaging with advanced PCB substrate. The detailed comparison between the four players will give the pros and the cons of the packaging technologies.
This report also compares the costs of the different approaches and includes a detailed technical comparison between the packaging structure of the Qualcomm Snapdragon 820, the Samsung Exynos 8, the HiSilicon Kirin 955 and the Apple A10.
More information on: http://www.i-micronews.com/reports.html
Panasonic 600 V GaN HEMT PGA26E19BA 2017 teardown reverse costing report publ...Yole Developpement
Panasonic adopts a DFN 8x8 package for its normally-off GaN HEMT structure
System Plus Consulting unveils the first GaN HEMT from Panasonic assembled in a dual flat no-lead (DFN) 8x8 package. Panasonic decided to abandon the standard TO220 package, probably because of poor electrical performance. Thanks to its proprietary X-GaN transistor structure and new die design the company has managed to produce a very competitive normally-off component.
The new PGA26E19BA from Panasonic features a medium breakdown voltage of 600V for a current of 10A at 25°C, with very low on-resistance with respect to its competitors and the TO220 assembled component.The transistor is optimized to be used in power supplies and AC-DC, photovoltaic and motor inverters.
Take a look at the fifth generation of EPC’s low voltage transistor
The low voltage GaN device market is increasingly important, and Efficient Power Conversion Corporation (EPC) is a major player in low voltage GaN-on-silicon high-electron-mobility transistor (HEMT) devices. 100V GaN HEMTs are a very new technology but they already compete with silicon transistors, especially in the field of megahertz high frequency applications.
System Plus Consulting has investigated the company’s EPC2045 device, its latest driving 100V for applications such as single-stage 48V converters, USB-C data and power connectors, LiDAR sensors, point-of-load converters and loads in open rack server architectures.
With its new transistor and GaN epitaxy design, the EPC2045 achieves a breakdown voltage of 100V for a current of 16A at 25°C, and a very low RdsOn on-resistance of 7mΩ compared to the previous generation.
The chip-scale packaging of EPC products reduces the final device cost and decreases its inductance, bringing advantages not only with respect to competitors in GaN, but also silicon.
Compared to silicon transistors, GaN process developments have significantly lowered capacitance. This translates into lower gate drive losses and lower device switching losses at higher frequencies for the same on-resistance and voltage rating.
More information on that report at http://www.i-micronews.com/reports.html
The 1st generation 1200V SiC MOSFET device from STMicroelectronics has good current density at a very competitive cost
The STC30N120 is the first generation 1200V SiC MOSFET device from STMicroelectronics. The device has a planar structure and a design that allows good electrical performance, such as high current density. Moreover, the supply chain and manufacturing choices lead to a very competitive cost.
The device is suitable for high power applications like motor drives, inverters, DC-DC converters and power supplies.
The STC30N120 integrates first generation high-voltage SiC power MOSFET dies in a dedicated discrete package.
The device is assumed to operate at very high temperature, up to 200°C, and to have an on-resistance of 90mΩ, with generally standard SiC manufacturing technology.
The report goes into depth in its analysis of the packaging and the components, with images of the complex planar SiC structure.
It also includes production cost analysis and detailed comparison with Rohm and Wolfspeed’s SiC MOSFETs and with 1200V silicon IGBTs. The comparison highlights differences in the electrical parameters, supply chain and production cost.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Texas Instruments’ Time of Flight Image Sensor 2017 teardown reverse costing ...Yole Developpement
A look into Texas Instruments’ system-on-chip, including Sony/Softkinetic’s time-of-flight pixel technology, for industrial applications
Today, Time-of-Flight (ToF) systems are among the most innovative technologies offering imaging companies an opportunity to lead the market. Every major player wants to integrate these devices to provide functions such as 3D imaging, proximity sensing, ambient light sensing and gesture recognition.
Sony/Softkinetic has been investigating this technology deeply, providing a unique pixel technology to several image sensor manufacturers in three application areas: consumer, automotive and industrial. For industrial applications, Sony/Softkinetic has licensed its technology to Texas Instruments, which is providing ToF imagers for human detection or robot-human interaction.
The OPT8241 3D ToF imager is packaged using Chip-On-Glass (COG) technology. The device comprises a system-on-chip (SoC) and glass filter in the same component in thin, 0.7 mm-thick, packaging.
This report analyzes the complete component, from the glass near-infrared band-pass filter to the collector based on ToF pixel licenses developed by Sony/Softkinetic and adapted by Texas Instruments. The report includes a complete cost analysis and price estimation of the device based on a detailed description of the package, and the ToF imager.
It also features a complete ToF pixel technology comparison with the Infineon/pmd, STMicroelectronics and Melexis automotive ToF imagers, which are all also based on Sony/Softkinetic technology, with details on the companies’ design choices.
More information on that report at http://www.i-micronews.com/reports.html
Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...Yole Developpement
Panasonic’s first 600V GaN HEMT has an innovative structure designed to integrate a normally-off transistor in a standard package, without a cascade structure
System Plus Consulting unveils Panasonic’s first GaN HEMT, assembled in a standard TO220 package. Thanks to its specific die design, the component is normally-off without using a cascade structure or special packaging.
Panasonic’s PGA26C09DV features a medium-voltage breakdown of 600V for a current of 15A (25°C), with very low RdsOn compared to its competitors. The transistor is optimized for AC-DC power supply, photovoltaic, and motor inverters.
The GaN and AlGaN layers are deposited by epitaxy on a silicon substrate. A complex buffer and template layer structure is used to reduce stress and dislocation. This is complemented by a thick superlattice structure clearly visible in the TEM analysis.
Based on a complete teardown analysis, this report also provides a production cost estimate for the epitaxy, HEMT, and package.
Moreover, this report offers a comparison with GaN Systems’ GS66504B and Transphorm’s GaN HEMT, highlighting the huge differences in design and manufacturing process and their impact on device size and production cost.
For more information visite us at: http://www.i-micronews.com/reports.html
InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sens...Yole Developpement
World’s first ‘7-Axis’ motion tracking device targeting drone application
Having supplied Apple for many years, InvenSense (TDK) is a leader in the inertial measurement unit (IMU) market. It has a large market share, competing with Bosch and others. This year, with the acquisition of Sensirion’s barometric pressure sensor division, InvenSense has entered a new market area. It has now released of its first ‘7-axis’ motion tracking combo, bringing together a 6-axis IMU and a pressure sensor, moving it into drone applications.
The ICM-20789 7-axis combo sensor released by InvenSense features a 6-axis device, incorporating a 3-axis gyroscope and a 3-axis accelerometer, and a barometric pressure sensor previously developed by Sensirion in the same package. Compared with the stand-alone sensor hub, this approach eliminates a package and minimizes board area requirements.
More information on that report at http://www.i-micronews.com/reports.html
Safran Colibrys VS1000 Series - teardown reverse costing report published by ...Yole Developpement
Safran Colibrys is the leading European supplier of high-performance silicon-based MEMS providing long-term bias stability under harsh environments. In a global market worth around $100M in 2016, high-performance silicon-based MEMS accelerometers address a wide range of applications, from commercial aerospace applications to the defense market. Amongst these, the industrial market remains attractive and the most dynamic. Thanks to performance improvements and reduced size and cost, more opportunities are appearing.
The VS1000 series consists of vibration sensors based on Colibrys’ MEMS accelerometer. They offer the best match for low- to medium-frequency sensing, as well as the best performance stability, with shock resistance and the lowest non-linearity and noise available on the market. The VS1000 is available in various acceleration ranges, from ±2g to ±200g.
The VS1000 features an innovative low-noise application specific integrated circuit (ASIC) developed by HMT microelectronic AG and manufactured in a European foundry with a bipolar CMOS-DMOS process using Deep Trench Isolation (DTI). The ASIC is highly integrated in order to use only one die compared to four dies in the previous versions.
The MEMS die uses a capacitive detection principle and is manufactured by Colibrys using its mature 3-stack bulk micromachining process, providing a very stable MEMS device. The ASIC and MEMS dies are hermetically sealed in a ceramic package to ensure robustness and durability.
More information on: http://www.i-micronews.com/reports.html
Comparative analysis of thermal management solution analysis of 10 flagship smartphones from Apple, Samsung, Huawei, LG and Xiaomi.
A smartphone contains several components that generate heat and other components sensitive to heat; to maintain acceptable temperature levels in these small handheld devices, manufacturers propose different solutions which require high performance and design constraints.
To complement Yole Développement’s Market Opportunities for Thermal Management Components in Smartphones report, System Plus Consulting has conducted a comparative technology review to provide insights into the assembling structure and thermal management technology of 10 flagship smartphones from leading suppliers: Apple, Samsung, Huawei, LG and Xiaomi.
In this report, we highlight the differences and the innovations in the thermal management solutions chosen by the end-user OEMs.
Panasonic 600 V GaN HEMT PGA26E19BA 2017 teardown reverse costing report publ...Yole Developpement
Panasonic adopts a DFN 8x8 package for its normally-off GaN HEMT structure
System Plus Consulting unveils the first GaN HEMT from Panasonic assembled in a dual flat no-lead (DFN) 8x8 package. Panasonic decided to abandon the standard TO220 package, probably because of poor electrical performance. Thanks to its proprietary X-GaN transistor structure and new die design the company has managed to produce a very competitive normally-off component.
The new PGA26E19BA from Panasonic features a medium breakdown voltage of 600V for a current of 10A at 25°C, with very low on-resistance with respect to its competitors and the TO220 assembled component.The transistor is optimized to be used in power supplies and AC-DC, photovoltaic and motor inverters.
Take a look at the fifth generation of EPC’s low voltage transistor
The low voltage GaN device market is increasingly important, and Efficient Power Conversion Corporation (EPC) is a major player in low voltage GaN-on-silicon high-electron-mobility transistor (HEMT) devices. 100V GaN HEMTs are a very new technology but they already compete with silicon transistors, especially in the field of megahertz high frequency applications.
System Plus Consulting has investigated the company’s EPC2045 device, its latest driving 100V for applications such as single-stage 48V converters, USB-C data and power connectors, LiDAR sensors, point-of-load converters and loads in open rack server architectures.
With its new transistor and GaN epitaxy design, the EPC2045 achieves a breakdown voltage of 100V for a current of 16A at 25°C, and a very low RdsOn on-resistance of 7mΩ compared to the previous generation.
The chip-scale packaging of EPC products reduces the final device cost and decreases its inductance, bringing advantages not only with respect to competitors in GaN, but also silicon.
Compared to silicon transistors, GaN process developments have significantly lowered capacitance. This translates into lower gate drive losses and lower device switching losses at higher frequencies for the same on-resistance and voltage rating.
More information on that report at http://www.i-micronews.com/reports.html
The 1st generation 1200V SiC MOSFET device from STMicroelectronics has good current density at a very competitive cost
The STC30N120 is the first generation 1200V SiC MOSFET device from STMicroelectronics. The device has a planar structure and a design that allows good electrical performance, such as high current density. Moreover, the supply chain and manufacturing choices lead to a very competitive cost.
The device is suitable for high power applications like motor drives, inverters, DC-DC converters and power supplies.
The STC30N120 integrates first generation high-voltage SiC power MOSFET dies in a dedicated discrete package.
The device is assumed to operate at very high temperature, up to 200°C, and to have an on-resistance of 90mΩ, with generally standard SiC manufacturing technology.
The report goes into depth in its analysis of the packaging and the components, with images of the complex planar SiC structure.
It also includes production cost analysis and detailed comparison with Rohm and Wolfspeed’s SiC MOSFETs and with 1200V silicon IGBTs. The comparison highlights differences in the electrical parameters, supply chain and production cost.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Texas Instruments’ Time of Flight Image Sensor 2017 teardown reverse costing ...Yole Developpement
A look into Texas Instruments’ system-on-chip, including Sony/Softkinetic’s time-of-flight pixel technology, for industrial applications
Today, Time-of-Flight (ToF) systems are among the most innovative technologies offering imaging companies an opportunity to lead the market. Every major player wants to integrate these devices to provide functions such as 3D imaging, proximity sensing, ambient light sensing and gesture recognition.
Sony/Softkinetic has been investigating this technology deeply, providing a unique pixel technology to several image sensor manufacturers in three application areas: consumer, automotive and industrial. For industrial applications, Sony/Softkinetic has licensed its technology to Texas Instruments, which is providing ToF imagers for human detection or robot-human interaction.
The OPT8241 3D ToF imager is packaged using Chip-On-Glass (COG) technology. The device comprises a system-on-chip (SoC) and glass filter in the same component in thin, 0.7 mm-thick, packaging.
This report analyzes the complete component, from the glass near-infrared band-pass filter to the collector based on ToF pixel licenses developed by Sony/Softkinetic and adapted by Texas Instruments. The report includes a complete cost analysis and price estimation of the device based on a detailed description of the package, and the ToF imager.
It also features a complete ToF pixel technology comparison with the Infineon/pmd, STMicroelectronics and Melexis automotive ToF imagers, which are all also based on Sony/Softkinetic technology, with details on the companies’ design choices.
More information on that report at http://www.i-micronews.com/reports.html
Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...Yole Developpement
Panasonic’s first 600V GaN HEMT has an innovative structure designed to integrate a normally-off transistor in a standard package, without a cascade structure
System Plus Consulting unveils Panasonic’s first GaN HEMT, assembled in a standard TO220 package. Thanks to its specific die design, the component is normally-off without using a cascade structure or special packaging.
Panasonic’s PGA26C09DV features a medium-voltage breakdown of 600V for a current of 15A (25°C), with very low RdsOn compared to its competitors. The transistor is optimized for AC-DC power supply, photovoltaic, and motor inverters.
The GaN and AlGaN layers are deposited by epitaxy on a silicon substrate. A complex buffer and template layer structure is used to reduce stress and dislocation. This is complemented by a thick superlattice structure clearly visible in the TEM analysis.
Based on a complete teardown analysis, this report also provides a production cost estimate for the epitaxy, HEMT, and package.
Moreover, this report offers a comparison with GaN Systems’ GS66504B and Transphorm’s GaN HEMT, highlighting the huge differences in design and manufacturing process and their impact on device size and production cost.
For more information visite us at: http://www.i-micronews.com/reports.html
InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sens...Yole Developpement
World’s first ‘7-Axis’ motion tracking device targeting drone application
Having supplied Apple for many years, InvenSense (TDK) is a leader in the inertial measurement unit (IMU) market. It has a large market share, competing with Bosch and others. This year, with the acquisition of Sensirion’s barometric pressure sensor division, InvenSense has entered a new market area. It has now released of its first ‘7-axis’ motion tracking combo, bringing together a 6-axis IMU and a pressure sensor, moving it into drone applications.
The ICM-20789 7-axis combo sensor released by InvenSense features a 6-axis device, incorporating a 3-axis gyroscope and a 3-axis accelerometer, and a barometric pressure sensor previously developed by Sensirion in the same package. Compared with the stand-alone sensor hub, this approach eliminates a package and minimizes board area requirements.
More information on that report at http://www.i-micronews.com/reports.html
Safran Colibrys VS1000 Series - teardown reverse costing report published by ...Yole Developpement
Safran Colibrys is the leading European supplier of high-performance silicon-based MEMS providing long-term bias stability under harsh environments. In a global market worth around $100M in 2016, high-performance silicon-based MEMS accelerometers address a wide range of applications, from commercial aerospace applications to the defense market. Amongst these, the industrial market remains attractive and the most dynamic. Thanks to performance improvements and reduced size and cost, more opportunities are appearing.
The VS1000 series consists of vibration sensors based on Colibrys’ MEMS accelerometer. They offer the best match for low- to medium-frequency sensing, as well as the best performance stability, with shock resistance and the lowest non-linearity and noise available on the market. The VS1000 is available in various acceleration ranges, from ±2g to ±200g.
The VS1000 features an innovative low-noise application specific integrated circuit (ASIC) developed by HMT microelectronic AG and manufactured in a European foundry with a bipolar CMOS-DMOS process using Deep Trench Isolation (DTI). The ASIC is highly integrated in order to use only one die compared to four dies in the previous versions.
The MEMS die uses a capacitive detection principle and is manufactured by Colibrys using its mature 3-stack bulk micromachining process, providing a very stable MEMS device. The ASIC and MEMS dies are hermetically sealed in a ceramic package to ensure robustness and durability.
More information on: http://www.i-micronews.com/reports.html
Comparative analysis of thermal management solution analysis of 10 flagship smartphones from Apple, Samsung, Huawei, LG and Xiaomi.
A smartphone contains several components that generate heat and other components sensitive to heat; to maintain acceptable temperature levels in these small handheld devices, manufacturers propose different solutions which require high performance and design constraints.
To complement Yole Développement’s Market Opportunities for Thermal Management Components in Smartphones report, System Plus Consulting has conducted a comparative technology review to provide insights into the assembling structure and thermal management technology of 10 flagship smartphones from leading suppliers: Apple, Samsung, Huawei, LG and Xiaomi.
In this report, we highlight the differences and the innovations in the thermal management solutions chosen by the end-user OEMs.
Thermo Fisher Ion 520 DNA Sequencing Chip 2017 teardown reverse costing repor...Yole Developpement
Next generation of silicon/polymer microfluidic technology for fast throughput DNA sequencing from Thermo Fisher Ion Torrent®
Today a main challenge in life science research is to reduce the price of genomic analysis, and the time taken to do it. Back in 2003, the cost of sequencing the human genome was almost $3B. That decreased to $10,000 in 2011, and is headed towards $1,000 in the next few years.
Thermo Fisher, with 8% of the microfluidic product market, is one of the companies most involved in sequencing applications, along with its rival Illumina. However, the two companies have different objectives.
Thermo Fisher intends to reduce analysis time with fast throughput and short single-end reads. Illumina has high throughput with short paired reads. To deliver fast reading, Thermo Fisher uses Ion Torrent® technology, which relies on technology similar to an image sensor.
The innovative Ion 520 DNA sequencing chip uses this Ion Torrent technology. It includes a multiwell array, which captures the sphere particles that have DNA attached. The particles react with a solution of nucleotides, which changes the charge in the wells, which in turn is detected by the circuit and allows the DNA sequencing.
More information on that report at http://www.i-micronews.com/reports.html
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...Yole Developpement
Infrared camera and electronic control unit for advanced driver assistance systems based on FLIR night vision imaging technology
Based on a high definition ISC0901 microbolometer from FLIR, the Autoliv night vision infrared camera targets the high-end automotive market using two FLIR cores. Based on the solid first design from 2009, the microbolometer offers better performance in definition and frame rate. The camera also embraces the quality approach with a complex optical system and powers its night vision using sophisticated numerical processing based on an Altera field-programmable gate array (FPGA) and custom algorithm.
The Autoliv night vision camera consists of two modules, the camera and a remote processing unit. The system is made very compact and easy to integrate for car makers.
The ISC0901 thermal camera uses FLIR’s 17µm pixel design, optimized for automotive applications. Based on vanadium oxide technology, the ISC0901 microbolometer features a 336x256 resolution wafer level package, achieving an incredibly compact design.
The ISC0901 is the automotive version of a surveillance microbolometer. By using wafer level package technology to encapsulate the microbolometer FLIR offers the best price performance ratio.
This report is divided into two parts, one focused on the microbolometer and the second on the other systems. It is based on a complete teardown analysis of the night vision camera and the associated electronic control unit. Using this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The report’s final component is a comparison between the characteristics of the FLIR ISC0901, FLIR Lepton 3 and the PICO384P from ULIS. The comparison highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
The ARS4-A is a 77 GHz radar sensor offering simultaneous long and short range detection
The Continental ARS4-A Radar is designed for forward collision warning, emergency brake assist, collision mitigation system or Adaptive Cruise Control (ACC). A special feature of the device is the simultaneous measurement of long distances, up to 250m with +/-0.2m accuracy, and short range, up to 70m, relative velocity and angle between two objects. It is thus able to detect stationary objects without any camera support.
The system integrates two electronic boards including an NXP Semiconductor microcontroller and Broadcom Ethernet transceiver. The radio-frequency (RF) board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate and is equipped with planar antennas.
The NXP Semiconductor multi-channel 77 GHz radar transceiver chipset, composed of four receivers, two transmitters and an associated voltage controlled oscillator (VCO), is used as high-frequency transmitter and receiver. The RF dies are packaged in redistributed chip package (RCP) fan-out wafer level packages initially developed and manufactured by Freescale.
Based on a complete teardown analysis of the Continental radar, the report provides the bill-of-material (BOM) and the manufacturing cost of the radar sensor.
A complete physical analysis and manufacturing cost estimation of the NXP semiconductor monolithic microwave integrated circuits (MMICs) is available in a separate report.
More information on that report at http://www.i-micronews.com/reports.html
Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in P...Yole Developpement
Taiyo Yuden’s Well-Proven Metal Seal Packaging and SAW/BAW technology in LTE Band 7 high isolation duplexer used in Skyworks’ PAMiD
In the last five years, Skyworks has been the largest radio-frequency (RF) component supplier for Huawei. In Huawei’s last flagship, the Mate 9 Pro, and the P10 series, Skyworks supplies entire Long-Term Evolution (LTE) front-end solutions based on its SkyOne® Technology. The solutions comprise Low-, Mid- and High-Band front end modules (FEMs) featuring Surface Acoustic Wave (SAW) and Bulk Acoustic Wave (BAW) filters. Skyworks is known to produce its own SAW filter and to outsource the BAW filter. In its High-Band PA Module integrated Duplexer (PAMiD), Skyworks integrates a duplexer supplied by Taiyo Yuden in metal seal packaging featuring a SAW and a Thin Film Bulk Acoustic Resonator (FBAR)-BAW filter based on Taiyo Yuden Technology.
The filters are located in a System In Package (SiP) with a power amplifier, switch and a RF integrated circuit. The device is a custom version of a Taiyo Yuden commercial device. The duplexer’s SAW filter uses sapphire and lithium tantalate substrates and its BAW filter has an original FBAR design using an air gap cavity on a silicon substrate.
In this report, the complete duplexer is analyzed, from the filters to the packaging developed by Fujitsu Media Limited, which was bought by Taiyo Yuden. The report includes a complete analysis of the package, the SAW filter and the BAW filter, featuring a cost analysis and price estimation for the device. A schematic of the BAW filter is also provided to understand the difference between shunt and series cells.
Finally, the report includes complete performance and technology comparisons with the previous generation of the band 7 duplexer from Taiyo Yuden and a technology comparison with BAW filters and packaging solutions from Qorvo and Broadcom.
More information on that report at http://www.i-micronews.com/reports.html
Detailed analysis of HTC's smart approach to the VR experience
The Virtual Reality (VR) market has raised expectations extremely high. It is already worth several billion US dollars per year and growing rapidly, with millions of headsets due to be sold in coming years.
Three main companies lead thiHTC CMOS Image Sensor Die System Plus Consultings new market: HTC Corporation, Oculus VR, which was bought by Facebook in 2014 for $2 billion, and Sony Playstation.
They think this market has enough potential to invest billions of dollars to get ahead of their competitors. Most other major manufacturers also want good market shares, including Microsoft, Intel, Google, AMD, Samsung, Huawei, Archos and Alcatel.
Winning in this market is now HTC’s all-or-nothing strategy. The HTC Vive VR Head-Mounted Display (HMD) is aimed at saving HTC from collapse. Vive VR can be used in different sectors, including gaming, entertainment, health, automotive, retail and education. It promises a premium VR experience.
For more information please visit our website: http://www.i-micronews.com/reports.html
Tiny MEMS digital barometer for smartphones and wearables
The first barometric sensor from Infineon for the consumer market is targeting altitude, GPS, indoor and weather forecasting applications in portable devices. This MEMS sensor positions Infineon to compete with STMicroelectronics and Bosch Sensortec.
Infineon’s DPS310 pressure-sensing device is manufactured using a proprietary MEMS technology developed for and already sold for several years in the automotive market. The sensing element in the DPS310 is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is very small compared to traditional silicon micro-machined membranes. Moreover, Infineon has developed a capacitive sensor to be more accurate and less sensitive to temperature change compared to piezoresistive solutions.
For the DPS310, Infineon has introduced two important innovations. The first is a two-die solution more scalable than the monolithic solution used for some automotive pressure sensors.
The second innovation is a plastic metallized lid to replace the classic metal lid. The device comes in a tiny 2x2.5x0.9mm HLGA molded package.
The report presents a detailed analysis of the sensor’s structure and cost. Comparison with the characteristics of the STMicroelectronics pressure sensor LPS22HB and the Bosch Sensortec BMP280 highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
Samsung’s Galaxy S9 Plus Processor Packages: Samsung’s iPoP vs. Qualcomm/Shin...system_plus
Comparison of both Samsung Galaxy S9 processor packages: Samsung Exynos 9810 with new TMV Package-on-Package vs. Qualcomm Snapdragon 845 with MCeP Packaging.
More information on that report at: https://www.i-micronews.com/report/product/samsung’s-galaxy-s9-plus-processor-packages-samsung’s-ipop-vs-qualcomm-shinko-mcep.html
The new 1200V MOSFET module from Rohm – with the first trench SiC MOSFET on the market – reduces power losses and has a higher performance/cost ratio than the previous generation
The BSM180D12P3C007 is a 1200V 180A SiC MOSFET module from Rohm for high power applications like motor drives, inverters, photovoltaics and induction heating equipment. In comparison with the previous generation of SiC MOSFETs, which have a planar structure, the trench structure halves on-resistance and reduces switching losses by 42%.
The BSM180D12P3C007 integrates the third generation high-voltage SiC power MOSFET dies with a current of 36A and the innovative trench structure. Ten SiC Schottky Barrier diodes are also integrated into the power module.
The BSM180D12P3C007 offers a higher operating temperature (up to 150°C) in a 45mm x 122mm x 21mm package.
The report goes into depth in its analysis of the packaging and the components, with images of the complex trench SiC structure.
It also includes production cost analysis and overall comparison with the planar SiC MOSFET from Rohm and the Cree CAS120M12BM2 module.
More information on that report at http://www.i-micronews.com/reports.html
Apple iPhone X: MEMS Microphones from Goertek, Knowles, and AAC Technologies ...system_plus
Analysis and comparison of the design and process evolution used by Apple’s three MEMS microphone suppliers.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/apple-iphone-x-mems-microphones-from-goertek-knowles-and-aac-technologies/
This document provides an analysis of Tesla's UBQ01B0 chip used for full self-driving capabilities. It includes a physical analysis of the die and packaging, an overview of the manufacturing process, and a cost analysis. The chip is a system-on-chip designed and produced by Tesla to power its driver-assist and autonomous driving features. It utilizes quad-core ARM processors alongside a GPU and NPU for processing sensor data and neural network operations. The analysis examines the chip's design and architecture at the physical, manufacturing, and cost levels.
SPR21610 - Vitesco Technologies Power Module in Jaguar I-PACE Invertersystem_plus
Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/vitesco-technologies-power-module-in-jaguar-i-pace-inverter/
- The document provides a full reverse costing analysis of the Transphorm TPH3206PS 600V GaN-on-silicon HEMT power transistor.
- The analysis includes detailed photos and SEM analysis of the epitaxial layers and transistor structure, as well as an examination of the Quiet-Tab packaging.
- The manufacturing process flows for the GaN HEMT, resistor, MOSFET, and packaging are presented, along with an in-depth cost breakdown analysis.
- Estimates of the manufacturing cost and suggested manufacturer price are provided, and comparisons are made to Transphorm's TPH3002 and GaN Systems' GS66504B.
In its new series of SiC MOSFETs, Rohm uses trench structures for 650V and 1200V products, while 1700V products use planar structures
After more than five years since SiC MOSFETs were first released, they are gradually penetrating different industries for power conversion applications. The market outlook is promising with a compound annual growth rate of 42% from 2015 to 2021. The forecast for 2017 is expected to be even better than previous years with increasingly positive signals from the industry.
Against this backdrop, Rohm offers a series of new SiC products at different voltages. It appears that it uses trench structures for 650V and 1200V products, while 1700V products use planar structures.
The SCT2H12NZGC11 is a 1700V SiC MOSFET from Rohm for industrial and commercial power application such as power supplies. The device offers a quite low on-resistance but very high current density and integrates the second generation high-voltage SiC power MOSFET dies, which now achieve 3.7A current.
Thanks to the die design the device’s cost is very competitive. The gate structure is very simple and the packaging is optimized to save costs.
The report presents a deep technology analysis of the packaging and components with images of the planar SiC structure.
More information on that report at http://www.i-micronews.com/reports.html
The world’s smallest MEMS barometer for smartphone and smartwatch, with a lot of innovation
The LPS22HB Nano Pressure Sensor is the world’s smallest barometric sensor, incorporating the VENSENS process and the new BASTILLE process, featuring abundant design innovation. Targeting altitude and weather forecasting applications in portable devices, this MEMS sensor positions STMicroelectronics for double-digit growth in the pressure sensor market.
STMicroelectronics LPS22HB pressure- sensing device is manufactured using a proprietary MEMS technology called “VENSENS”, which allows the pressure sensor to be fabricated on a monolithic silicon chip. The LPS22HB’s sensing element is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is tiny compared to traditional silicon micro-machined membranes. The device is allowing some waterproof functionalities, detailed in the report.
For the LPS22HB, STMicroelectronics has introduced two significant innovations. The first one is a holed cap in silicon, bonded on the sensor to integrate the pressure sensor into a small molded package of 2x2x0.76mm HLGA. This package resembles the one used for the HTS221 humidity sensor. The second one is a spring structure to increase the sensor’s sensitivity and reliability. These two innovations are the core of the new “Bastille” MEMS technology.
This report presents a detailed analysis of the sensor structure and cost, as well as a characteristics comparison with the 1st-generation STMicroelectronics LPS331AP pressure sensor and the Bosch Sensortec BMP280, highlighting differences in each company’s technical choices.
More information on that report at http://www.i-micronews.com/reports.html
Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer 2015 teardown r...Yole Developpement
Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer
Automotive MEMS Combo
Murata’s Second Generation Combo Sensors for Automotive & Harsh Environments
Murata SCC2000 series sensors are combined accelerometer and gyroscope devices aimed at use in tough environments such as those encountered in automotive and industrial applications. The SCC2000 series has best in class temperature dependency, shock sensitivity and bias stability characteristics and consists of a low-g 3-axis accelerometer with two angular rate sensor options of either X or Z-axis detection.
The SCC2000 series features independent acceleration and angular rate sensing elements manufactured with Murata proprietary High Aspect Ratio (HAR) 3D-MEMS process and using SOI and cavity-SOI (c-SOI) substrates. A single ASIC produced with an advanced BCD process is used.
The acceleration sensing element consists of four acceleration sensitive masses and the angular rate sensing element consists of moving masses that are purposely exited to in-plane drive motion.
The SCC2000 devices are packaged in a SOIC 24-pin premolded plastic housing measuring 15.0x8.5x4.1mm. The combo sensor is compliant to the ISO26262 automotive safety standard and the AEC-Q100 stress test qualification requirements for electronic components used in automotive applications.
SCC2000 series is targeted for applications demanding high stability with tough environmental requirements. Typical applications include: IMUs for highly demanding environments, platform stabilization and control, machine control systems, Electronic Stability Control (ESC), Hill Start Assist (HSA), roll over detection and Navigation systems.
The report includes the analysis of all combo sensors in the SCC2000 series: the SCC2230-E02, SCC2230-D08 and SCC2130-D08. Also a comparison with previous generation SCC1300 series is included.
More information on that report at http://www.i-micronews.com/reports.html
Tesla Model 3 Inverter with SiC Power Module from STMicroelectronicssystem_plus
The first SiC power module in commercialized electric vehicles.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/tesla-model-3-inverter-with-sic-power-module-from-stmicroelectronics/
Discover Infineon‘s first double sided cooling power module for automotive.
More information on that report at https://www.i-micronews.com/category-listing/product/infineon-ff400r07a01e3-double-side-cooled-igbt-module.html
Qorvo QPF4006 39GHz GaN MMIC Front End Modulesystem_plus
The first MMIC FEM targeting 5G base stations and terminals using a 0.15µm GaN-on-SiC process.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/qorvo-qpf4006-39ghz-gan-mmic-front-end-module/
Deep analysis of the 400Gb optical transceiver from a leading Chinese company.
More information: https://www.systemplus.fr/reverse-costing-reports/innolights-400g-qsfp-dd-optical-transceiver/
Sharepoint on-premise office365 and hybrid Pros, Cons and ComparisonFaisal Masood
Softvative presentation on SharePoint on-premise Office 365 and Hybrid - Pros, Cons and Comparison covers more than 10 aspects of the three environment for intelligent decision making.
By: Faisal Masood - PMP, MCITP, MCTS
Sharepoint, MS Project Server EPM / PPM Consultant
Softvative Inc
Piracy is increasing, especially off the coast of Somalia, where ships are being targeted. In 2009, there were over 200 attacks and 30 hijackings. Most attacks occur when ships are low and slow, making them vulnerable targets. The pirates' goal is ransom, with over $200 million paid in ransoms in 2009 alone. Navies like the European Union Naval Force are working to counter piracy by patrolling the waters and intercepting pirate ships, but the future remains uncertain as weather conditions can impact pirate activity.
Thermo Fisher Ion 520 DNA Sequencing Chip 2017 teardown reverse costing repor...Yole Developpement
Next generation of silicon/polymer microfluidic technology for fast throughput DNA sequencing from Thermo Fisher Ion Torrent®
Today a main challenge in life science research is to reduce the price of genomic analysis, and the time taken to do it. Back in 2003, the cost of sequencing the human genome was almost $3B. That decreased to $10,000 in 2011, and is headed towards $1,000 in the next few years.
Thermo Fisher, with 8% of the microfluidic product market, is one of the companies most involved in sequencing applications, along with its rival Illumina. However, the two companies have different objectives.
Thermo Fisher intends to reduce analysis time with fast throughput and short single-end reads. Illumina has high throughput with short paired reads. To deliver fast reading, Thermo Fisher uses Ion Torrent® technology, which relies on technology similar to an image sensor.
The innovative Ion 520 DNA sequencing chip uses this Ion Torrent technology. It includes a multiwell array, which captures the sphere particles that have DNA attached. The particles react with a solution of nucleotides, which changes the charge in the wells, which in turn is detected by the circuit and allows the DNA sequencing.
More information on that report at http://www.i-micronews.com/reports.html
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...Yole Developpement
Infrared camera and electronic control unit for advanced driver assistance systems based on FLIR night vision imaging technology
Based on a high definition ISC0901 microbolometer from FLIR, the Autoliv night vision infrared camera targets the high-end automotive market using two FLIR cores. Based on the solid first design from 2009, the microbolometer offers better performance in definition and frame rate. The camera also embraces the quality approach with a complex optical system and powers its night vision using sophisticated numerical processing based on an Altera field-programmable gate array (FPGA) and custom algorithm.
The Autoliv night vision camera consists of two modules, the camera and a remote processing unit. The system is made very compact and easy to integrate for car makers.
The ISC0901 thermal camera uses FLIR’s 17µm pixel design, optimized for automotive applications. Based on vanadium oxide technology, the ISC0901 microbolometer features a 336x256 resolution wafer level package, achieving an incredibly compact design.
The ISC0901 is the automotive version of a surveillance microbolometer. By using wafer level package technology to encapsulate the microbolometer FLIR offers the best price performance ratio.
This report is divided into two parts, one focused on the microbolometer and the second on the other systems. It is based on a complete teardown analysis of the night vision camera and the associated electronic control unit. Using this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The report’s final component is a comparison between the characteristics of the FLIR ISC0901, FLIR Lepton 3 and the PICO384P from ULIS. The comparison highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
The ARS4-A is a 77 GHz radar sensor offering simultaneous long and short range detection
The Continental ARS4-A Radar is designed for forward collision warning, emergency brake assist, collision mitigation system or Adaptive Cruise Control (ACC). A special feature of the device is the simultaneous measurement of long distances, up to 250m with +/-0.2m accuracy, and short range, up to 70m, relative velocity and angle between two objects. It is thus able to detect stationary objects without any camera support.
The system integrates two electronic boards including an NXP Semiconductor microcontroller and Broadcom Ethernet transceiver. The radio-frequency (RF) board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate and is equipped with planar antennas.
The NXP Semiconductor multi-channel 77 GHz radar transceiver chipset, composed of four receivers, two transmitters and an associated voltage controlled oscillator (VCO), is used as high-frequency transmitter and receiver. The RF dies are packaged in redistributed chip package (RCP) fan-out wafer level packages initially developed and manufactured by Freescale.
Based on a complete teardown analysis of the Continental radar, the report provides the bill-of-material (BOM) and the manufacturing cost of the radar sensor.
A complete physical analysis and manufacturing cost estimation of the NXP semiconductor monolithic microwave integrated circuits (MMICs) is available in a separate report.
More information on that report at http://www.i-micronews.com/reports.html
Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in P...Yole Developpement
Taiyo Yuden’s Well-Proven Metal Seal Packaging and SAW/BAW technology in LTE Band 7 high isolation duplexer used in Skyworks’ PAMiD
In the last five years, Skyworks has been the largest radio-frequency (RF) component supplier for Huawei. In Huawei’s last flagship, the Mate 9 Pro, and the P10 series, Skyworks supplies entire Long-Term Evolution (LTE) front-end solutions based on its SkyOne® Technology. The solutions comprise Low-, Mid- and High-Band front end modules (FEMs) featuring Surface Acoustic Wave (SAW) and Bulk Acoustic Wave (BAW) filters. Skyworks is known to produce its own SAW filter and to outsource the BAW filter. In its High-Band PA Module integrated Duplexer (PAMiD), Skyworks integrates a duplexer supplied by Taiyo Yuden in metal seal packaging featuring a SAW and a Thin Film Bulk Acoustic Resonator (FBAR)-BAW filter based on Taiyo Yuden Technology.
The filters are located in a System In Package (SiP) with a power amplifier, switch and a RF integrated circuit. The device is a custom version of a Taiyo Yuden commercial device. The duplexer’s SAW filter uses sapphire and lithium tantalate substrates and its BAW filter has an original FBAR design using an air gap cavity on a silicon substrate.
In this report, the complete duplexer is analyzed, from the filters to the packaging developed by Fujitsu Media Limited, which was bought by Taiyo Yuden. The report includes a complete analysis of the package, the SAW filter and the BAW filter, featuring a cost analysis and price estimation for the device. A schematic of the BAW filter is also provided to understand the difference between shunt and series cells.
Finally, the report includes complete performance and technology comparisons with the previous generation of the band 7 duplexer from Taiyo Yuden and a technology comparison with BAW filters and packaging solutions from Qorvo and Broadcom.
More information on that report at http://www.i-micronews.com/reports.html
Detailed analysis of HTC's smart approach to the VR experience
The Virtual Reality (VR) market has raised expectations extremely high. It is already worth several billion US dollars per year and growing rapidly, with millions of headsets due to be sold in coming years.
Three main companies lead thiHTC CMOS Image Sensor Die System Plus Consultings new market: HTC Corporation, Oculus VR, which was bought by Facebook in 2014 for $2 billion, and Sony Playstation.
They think this market has enough potential to invest billions of dollars to get ahead of their competitors. Most other major manufacturers also want good market shares, including Microsoft, Intel, Google, AMD, Samsung, Huawei, Archos and Alcatel.
Winning in this market is now HTC’s all-or-nothing strategy. The HTC Vive VR Head-Mounted Display (HMD) is aimed at saving HTC from collapse. Vive VR can be used in different sectors, including gaming, entertainment, health, automotive, retail and education. It promises a premium VR experience.
For more information please visit our website: http://www.i-micronews.com/reports.html
Tiny MEMS digital barometer for smartphones and wearables
The first barometric sensor from Infineon for the consumer market is targeting altitude, GPS, indoor and weather forecasting applications in portable devices. This MEMS sensor positions Infineon to compete with STMicroelectronics and Bosch Sensortec.
Infineon’s DPS310 pressure-sensing device is manufactured using a proprietary MEMS technology developed for and already sold for several years in the automotive market. The sensing element in the DPS310 is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is very small compared to traditional silicon micro-machined membranes. Moreover, Infineon has developed a capacitive sensor to be more accurate and less sensitive to temperature change compared to piezoresistive solutions.
For the DPS310, Infineon has introduced two important innovations. The first is a two-die solution more scalable than the monolithic solution used for some automotive pressure sensors.
The second innovation is a plastic metallized lid to replace the classic metal lid. The device comes in a tiny 2x2.5x0.9mm HLGA molded package.
The report presents a detailed analysis of the sensor’s structure and cost. Comparison with the characteristics of the STMicroelectronics pressure sensor LPS22HB and the Bosch Sensortec BMP280 highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
Samsung’s Galaxy S9 Plus Processor Packages: Samsung’s iPoP vs. Qualcomm/Shin...system_plus
Comparison of both Samsung Galaxy S9 processor packages: Samsung Exynos 9810 with new TMV Package-on-Package vs. Qualcomm Snapdragon 845 with MCeP Packaging.
More information on that report at: https://www.i-micronews.com/report/product/samsung’s-galaxy-s9-plus-processor-packages-samsung’s-ipop-vs-qualcomm-shinko-mcep.html
The new 1200V MOSFET module from Rohm – with the first trench SiC MOSFET on the market – reduces power losses and has a higher performance/cost ratio than the previous generation
The BSM180D12P3C007 is a 1200V 180A SiC MOSFET module from Rohm for high power applications like motor drives, inverters, photovoltaics and induction heating equipment. In comparison with the previous generation of SiC MOSFETs, which have a planar structure, the trench structure halves on-resistance and reduces switching losses by 42%.
The BSM180D12P3C007 integrates the third generation high-voltage SiC power MOSFET dies with a current of 36A and the innovative trench structure. Ten SiC Schottky Barrier diodes are also integrated into the power module.
The BSM180D12P3C007 offers a higher operating temperature (up to 150°C) in a 45mm x 122mm x 21mm package.
The report goes into depth in its analysis of the packaging and the components, with images of the complex trench SiC structure.
It also includes production cost analysis and overall comparison with the planar SiC MOSFET from Rohm and the Cree CAS120M12BM2 module.
More information on that report at http://www.i-micronews.com/reports.html
Apple iPhone X: MEMS Microphones from Goertek, Knowles, and AAC Technologies ...system_plus
Analysis and comparison of the design and process evolution used by Apple’s three MEMS microphone suppliers.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/apple-iphone-x-mems-microphones-from-goertek-knowles-and-aac-technologies/
This document provides an analysis of Tesla's UBQ01B0 chip used for full self-driving capabilities. It includes a physical analysis of the die and packaging, an overview of the manufacturing process, and a cost analysis. The chip is a system-on-chip designed and produced by Tesla to power its driver-assist and autonomous driving features. It utilizes quad-core ARM processors alongside a GPU and NPU for processing sensor data and neural network operations. The analysis examines the chip's design and architecture at the physical, manufacturing, and cost levels.
SPR21610 - Vitesco Technologies Power Module in Jaguar I-PACE Invertersystem_plus
Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/vitesco-technologies-power-module-in-jaguar-i-pace-inverter/
- The document provides a full reverse costing analysis of the Transphorm TPH3206PS 600V GaN-on-silicon HEMT power transistor.
- The analysis includes detailed photos and SEM analysis of the epitaxial layers and transistor structure, as well as an examination of the Quiet-Tab packaging.
- The manufacturing process flows for the GaN HEMT, resistor, MOSFET, and packaging are presented, along with an in-depth cost breakdown analysis.
- Estimates of the manufacturing cost and suggested manufacturer price are provided, and comparisons are made to Transphorm's TPH3002 and GaN Systems' GS66504B.
In its new series of SiC MOSFETs, Rohm uses trench structures for 650V and 1200V products, while 1700V products use planar structures
After more than five years since SiC MOSFETs were first released, they are gradually penetrating different industries for power conversion applications. The market outlook is promising with a compound annual growth rate of 42% from 2015 to 2021. The forecast for 2017 is expected to be even better than previous years with increasingly positive signals from the industry.
Against this backdrop, Rohm offers a series of new SiC products at different voltages. It appears that it uses trench structures for 650V and 1200V products, while 1700V products use planar structures.
The SCT2H12NZGC11 is a 1700V SiC MOSFET from Rohm for industrial and commercial power application such as power supplies. The device offers a quite low on-resistance but very high current density and integrates the second generation high-voltage SiC power MOSFET dies, which now achieve 3.7A current.
Thanks to the die design the device’s cost is very competitive. The gate structure is very simple and the packaging is optimized to save costs.
The report presents a deep technology analysis of the packaging and components with images of the planar SiC structure.
More information on that report at http://www.i-micronews.com/reports.html
The world’s smallest MEMS barometer for smartphone and smartwatch, with a lot of innovation
The LPS22HB Nano Pressure Sensor is the world’s smallest barometric sensor, incorporating the VENSENS process and the new BASTILLE process, featuring abundant design innovation. Targeting altitude and weather forecasting applications in portable devices, this MEMS sensor positions STMicroelectronics for double-digit growth in the pressure sensor market.
STMicroelectronics LPS22HB pressure- sensing device is manufactured using a proprietary MEMS technology called “VENSENS”, which allows the pressure sensor to be fabricated on a monolithic silicon chip. The LPS22HB’s sensing element is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is tiny compared to traditional silicon micro-machined membranes. The device is allowing some waterproof functionalities, detailed in the report.
For the LPS22HB, STMicroelectronics has introduced two significant innovations. The first one is a holed cap in silicon, bonded on the sensor to integrate the pressure sensor into a small molded package of 2x2x0.76mm HLGA. This package resembles the one used for the HTS221 humidity sensor. The second one is a spring structure to increase the sensor’s sensitivity and reliability. These two innovations are the core of the new “Bastille” MEMS technology.
This report presents a detailed analysis of the sensor structure and cost, as well as a characteristics comparison with the 1st-generation STMicroelectronics LPS331AP pressure sensor and the Bosch Sensortec BMP280, highlighting differences in each company’s technical choices.
More information on that report at http://www.i-micronews.com/reports.html
Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer 2015 teardown r...Yole Developpement
Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer
Automotive MEMS Combo
Murata’s Second Generation Combo Sensors for Automotive & Harsh Environments
Murata SCC2000 series sensors are combined accelerometer and gyroscope devices aimed at use in tough environments such as those encountered in automotive and industrial applications. The SCC2000 series has best in class temperature dependency, shock sensitivity and bias stability characteristics and consists of a low-g 3-axis accelerometer with two angular rate sensor options of either X or Z-axis detection.
The SCC2000 series features independent acceleration and angular rate sensing elements manufactured with Murata proprietary High Aspect Ratio (HAR) 3D-MEMS process and using SOI and cavity-SOI (c-SOI) substrates. A single ASIC produced with an advanced BCD process is used.
The acceleration sensing element consists of four acceleration sensitive masses and the angular rate sensing element consists of moving masses that are purposely exited to in-plane drive motion.
The SCC2000 devices are packaged in a SOIC 24-pin premolded plastic housing measuring 15.0x8.5x4.1mm. The combo sensor is compliant to the ISO26262 automotive safety standard and the AEC-Q100 stress test qualification requirements for electronic components used in automotive applications.
SCC2000 series is targeted for applications demanding high stability with tough environmental requirements. Typical applications include: IMUs for highly demanding environments, platform stabilization and control, machine control systems, Electronic Stability Control (ESC), Hill Start Assist (HSA), roll over detection and Navigation systems.
The report includes the analysis of all combo sensors in the SCC2000 series: the SCC2230-E02, SCC2230-D08 and SCC2130-D08. Also a comparison with previous generation SCC1300 series is included.
More information on that report at http://www.i-micronews.com/reports.html
Tesla Model 3 Inverter with SiC Power Module from STMicroelectronicssystem_plus
The first SiC power module in commercialized electric vehicles.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/tesla-model-3-inverter-with-sic-power-module-from-stmicroelectronics/
Discover Infineon‘s first double sided cooling power module for automotive.
More information on that report at https://www.i-micronews.com/category-listing/product/infineon-ff400r07a01e3-double-side-cooled-igbt-module.html
Qorvo QPF4006 39GHz GaN MMIC Front End Modulesystem_plus
The first MMIC FEM targeting 5G base stations and terminals using a 0.15µm GaN-on-SiC process.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/qorvo-qpf4006-39ghz-gan-mmic-front-end-module/
Deep analysis of the 400Gb optical transceiver from a leading Chinese company.
More information: https://www.systemplus.fr/reverse-costing-reports/innolights-400g-qsfp-dd-optical-transceiver/
Sharepoint on-premise office365 and hybrid Pros, Cons and ComparisonFaisal Masood
Softvative presentation on SharePoint on-premise Office 365 and Hybrid - Pros, Cons and Comparison covers more than 10 aspects of the three environment for intelligent decision making.
By: Faisal Masood - PMP, MCITP, MCTS
Sharepoint, MS Project Server EPM / PPM Consultant
Softvative Inc
Piracy is increasing, especially off the coast of Somalia, where ships are being targeted. In 2009, there were over 200 attacks and 30 hijackings. Most attacks occur when ships are low and slow, making them vulnerable targets. The pirates' goal is ransom, with over $200 million paid in ransoms in 2009 alone. Navies like the European Union Naval Force are working to counter piracy by patrolling the waters and intercepting pirate ships, but the future remains uncertain as weather conditions can impact pirate activity.
Management Information Systems (MIS) are used to collect, process, store, and disseminate information to support decision making and problem solving. MIS involves acquiring, using, and discarding information efficiently through activities like input, processing, output, and feedback. It requires skills like computer literacy, information literacy, and the ability to share information. Key computer-based MIS subsystems include accounting, management, decision support, office automation, and expert systems. Specialists involved with MIS include systems analysts, database administrators, network specialists, programmers, and operators.
Shipping Management Expert System (SES) ERP is a specialized ERP system designed for ship management and shipping companies. It consists of several modules including technical operations, human resources, purchasing, chartering, and financials. The financial module is globally acknowledged and can produce a large number of accounting reports, analyze expenses like running expenses, and provide cash flow and profit/loss statements. SES ERP integrates all business functions and provides real-time operational and financial insights for shipping companies.
This document discusses the key types of information systems used in businesses and how they support different organizational levels and functions. It describes transaction processing systems, management information systems, decision support systems, and executive support systems, which operate at the operational, management, and strategic levels. These systems can also be categorized by the business functions they support, like finance or production. The document emphasizes that many important systems integrate across organizational levels and business functions through business processes like order fulfillment.
Information System Concepts & Types of Information SystemsVR Talsaniya
Best slides on the information system concepts and to understand the types of information systems.
Best for the CA Final Students for Information System Control & Audit (ISCA) subject.
The document summarizes key concepts from a textbook chapter on information systems in enterprises. It describes six main types of information systems and how they serve different organizational levels and functions. It also discusses how information systems enable business processes, customer relationship management, supply chain management and enterprise systems. Current trends include extended enterprises and industrial networks.
1. The document describes an expert system and its components.
2. It defines an expert system as an intelligent computer program that uses knowledge and reasoning to solve problems that usually require human expertise.
3. The key components of an expert system are the knowledge base, inference engine, explanation facility, and knowledge acquisition facility.
Managing International Information Systems Mostafa Ewees
This document discusses managing international information systems. It identifies key opportunities and challenges, such as lowering costs through global scale economies or difficulties managing change across cultures. It recommends solutions like agreeing on common requirements, coordinating applications development, and encouraging local support for global systems. The growth of international business drivers and how information systems can support different global strategies are also examined.
Expert systems are AI programs that use knowledge bases to achieve expert-level competence in solving problems in a particular task domain. They consist of two main components: a knowledge base containing factual and heuristic knowledge about the domain, and an inference engine that uses reasoning methods like backward and forward chaining to derive answers. Expert systems have applications in fields like medicine, agriculture, and education, where they can provide consistent advice and help clarify decision making. However, they lack common sense and cannot respond creatively to unusual situations.
The document provides an overview of management information systems (MIS). It defines key concepts such as data, information, and systems. It explains that an MIS is a system for collecting, processing, storing, and distributing data to managers within an organization. The main outputs of an MIS are scheduled reports, key indicator reports, demand reports, and exception reports. These help managers monitor performance and make decisions. Overall, the document serves as an introduction to MIS, covering essential elements like the relationship between data, information, and systems.
Second Generation of TSMC’s Integrated Fan-Out (inFO) Packaging for the Apple...system_plus
The latest Apple application processor engine : from the stacked board to the A11, and reverse costing of TSMC's updated inFO packaging
More information on that report at http://www.systemplus.fr/reverse-costing-reports/second-generation-of-tsmcs-integrated-fan-out-info-packaging-for-the-apple-a11-found-in-the-iphone-x/
Samsung Exynos 9110 with ePLP: First Generation of Samsung’s Fan-Out Panel Le...system_plus
This report provides a reverse cost analysis of Samsung's Exynos 9110 application processor module used in the Samsung Galaxy Watch. The module utilizes Samsung's innovative ePLP (embedded Panel-Level Packaging) technology, which enables a package-on-package configuration with an embedded DRAM die. The ePLP module is extremely small at less than 80mm2 and includes the Exynos 9110 application processor die and a Samsung power management die embedded on a fan-out substrate with four redistribution layers. The report includes physical analysis of the package and dies, comparison to other advanced packaging technologies, manufacturing process flow analysis, and cost analysis.
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Seriessystem_plus
This document provides a reverse costing analysis of the Broadcom AFEM-8100 SiP used in the Apple iPhone 11 series. It includes a physical analysis of the module and its dies, as well as a manufacturing process flow and cost analysis. Broadcom remains the sole supplier of the multi-die module, which features power amplifier, switch, filter and other dies. The analysis finds innovations that reduce the package size and cost, including a new EMI shielding integration method.
Sensirion SGP30 Gas Sensor 2018 - teardown reverse costing report published b...system_plus
The first monolithic multi-gas sensor from Sensirion, with a unique and innovative design using metal oxide technology.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/sgp30-gas-sensor-from-sensirion/
Sensirion, a leading manufacturer of digital microsensors and systems, recently released a gas sensor designed for consumer and appliance applications: the SGP30 Multi-Pixel. The SGP30 gas sensor is a new kind of sensor which measures different gas types in any environment. With a DFN package volume under 5.5 mm3, this gas sensor can be embedded in a variety of low-power systems, including smartphones, tablets, and laptops.
Deep dive analysis of the fourth generation of mid/high band front-end module for 4G and 5G from Broadcom.
More information : https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8200-pamid-in-the-apple-iphone-12-series/
Broadcom AFEM-8072 – Mid and High Band LTE RF Front-End Module (FEM) - teardo...system_plus
The first mid/high band Long Term Evolution (LTE) Radio Frequency (RF) FEM in the Apple iPhone X integrates the latest generation of Film Bulk Acoustic Resonator (FBAR) technology with advanced and innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8072-mid-and-high-band-lte-rf-front-end-module-fem/
Fingerprint Cards’ FPC1268 in the Huawei Mate 9 Pro & P10 series 2017 teardow...Yole Developpement
This report analyzes FPC's FPC1268 fingerprint sensor used in the Huawei Mate 9 Pro and P10 smartphones. It provides a teardown of the sensor package, including photos of the sensor and ASIC dies. The report details the manufacturing processes for the sensor and ASIC, from wafer fabrication to packaging. It estimates the costs for materials and manufacturing steps. Comparisons are made to FPC's previous FPC1025 sensor and Qualcomm's ultrasonic fingerprint sensor. This is the first capacitive fingerprint sensor successfully integrated under a glass cover, in a collaboration between FPC and TPK.
SiGe based millimeter-wave chipset commercially available for
backhaul applications with beamforming capability.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/peraso-x710-chipset-60ghz-outdoor-wireless-broadband-solution/
Qualcomm QCA9500 60 GHz Chipset - reverse costing report published by System ...system_plus
Disruptive double side molded system-in-package-based chipset for millimeter-wave applications targeting consumer devices, including integrated antennae.
2018 will be a key milestone in the journey towards 5G communication. Several areas, from semiconductor to packaging, will improve their technologies to be suitable for 5G deployment. We now know that the 5G frequency will be in the millimeter wave (mmWave) range.
More information on that report at http://www.i-micronews.com/reports.html
Advanced packaging technology in the Apple Watch Series 4’s System-in-Packagesystem_plus
Four major packaging technologies: TSMC’s info, ASE’s Double Side Molding/SESUB and SiP, Skyworks’ Double Side BGA.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/advanced-packaging-technology-in-the-apple-watch-series-4s-system-in-package/
UnitedSiC UJN1205K 1200V SiC JFET report published by System Plus Consultingsystem_plus
Discover the technological choices made by United Silicon Carbide Inc. (UnitedSiC) for its most advanced SiC JFET and its associated features
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/unitedsic-ujn1205k-1200v-sic-jfet/
The Audi A8 zFAS ADAS Platform by Aptivsystem_plus
The first level 3 autonomous driving system, designed by Audi and manufactured by Aptiv (Delphi), integrates high-performance processors from Nvidia (Tegra K1), Altera (Cyclon V), Infineon (Aurix), and Mobileye (EyeQ3 image processor)
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/the-audi-a8-zfas-adas-platform-by-aptiv/
Analog Devices ADIS16460 6-axis MEMS Inertial Sensorsystem_plus
High precision 6-Axis Inertial Measurement Unit for industrial and harsh environments.
More information on that report at: http://www.systemplus.fr/fr/reverse-costing-reports/analog-devices-adis16460-6-axis-mems-inertial-sensor/
World’s first 76-81 GHz automotive single-chip radar in a System-on-Chip device with integrated Antenna-in-Package using Fan-Out packaging technology.
Reverse Costing - Structure, process and cost report by System Plus Consulting - find more here: https://www.systemplus.fr/reverse-costing-reports/mediatek-autus-r10-mt2706-77-79-ghz-ewlbaip-radar-chipset/
This document provides an overview of NVIDIA's new A100 Ampere GPU. Some key points:
- It uses TSMC's 7nm process and CoWoS packaging to integrate over 6,000mm2 of silicon onto a single 55mm x 55mm package.
- It features a 7nm GPU die with 54 billion transistors and 40/80GB of HBM2 memory in a 3D stacked configuration connected via microbumps and TSVs.
- The report includes a physical analysis of the package, dies, and assembly, as well as a cost analysis and estimated price. It finds the A100 provides significantly higher performance than previous generations like the V100.
ams’ Spectral Sensor Portfolio: the AS726X Series report 2018 published by Sy...system_plus
Apple iPhone X capacities, with a standard offer from ams.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/ams-spectral-sensor-portfolio-the-as726x-series/
Denso’s Monocular Forward ADAS Camera in the Toyota Alphardsystem_plus
Denso has developed a new monocular forward camera for improved night vision, using Sony’s high-sensitivity 1.27M-pixel image sensor and Toshiba’s new advanced image recognition processor.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/densos-monocular-forward-adas-camera-in-the-toyota-alphard/
ams’ Multi-Spectral Sensor in the Apple iPhone X 2017 teardown reverse costi...system_plus
The most advanced multispectral 6-channel ambient light sensor, supplied and produced by ams for its biggest customer, Apple.
For the semiconductor industry, the smartphone is a gold mine. Each component inside every OEM’s flagship phone holds substantial value for the component supplier, which sometimes gains a significant portion of the phone’s sales revenue too. Apple is one of the major OEMs that every supplier fights to work with, and for many years ams AG has been the world’s leading ambient light sensor (ALS) producer, due to its presence in every Apple iPhone.
STMicroelectronics Proximity & Flood Illuminator in the Apple iPhone X - reve...system_plus
A unique combination of STMicroelectronics’ latest proximity sensor, based on single-photon avalanche diode (SPAD) technology and a VCSEL illuminator, all in Apple’s most advanced handset.
More information on that report at http://www.i-micronews.com/reports.html
The first 600V system-in-package half-bridge driver from STMicroelectronics integrating two GaN-based HEMTs.
More information: https://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-mastergan1-half-bridge-driver/
Similar to 2016 Comparison of Application Processor Packaging - teardown reverse costing report published by Yole Developpement (20)
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
This report from Yole Développement analyzes the high-end performance packaging market. It defines high-end performance packaging as technologies that provide high IO density (≥16/mm2) and fine IO pitch (≤130μm). The report aims to identify relevant technologies, analyze market drivers and challenges, describe technology trends and roadmaps, examine the supply chain landscape, and provide market forecasts. It evaluates the market by technology, end application, and region. The report also profiles key players' technology roadmaps and analyzes intellectual property in the 3D SoC hybrid bonding space.
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
The report provides a market analysis of the GaAs wafer and epiwafer markets from 2019 to 2025. It forecasts that the GaAs wafer market will increase from $200 million in 2019 to $348 million in 2025, with the largest application segments being RF, photonics, and LED. The open epiwafer market is also analyzed, with IQE and VPEC together comprising almost 80% of the $262 million total market in 2019. Key drivers of growth are discussed for various applications such as 5G adoption for RF and increasing use of VCSELs for 3D sensing and LiDAR.
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
Driving Business Innovation: Latest Generative AI Advancements & Success StorySafe Software
Are you ready to revolutionize how you handle data? Join us for a webinar where we’ll bring you up to speed with the latest advancements in Generative AI technology and discover how leveraging FME with tools from giants like Google Gemini, Amazon, and Microsoft OpenAI can supercharge your workflow efficiency.
During the hour, we’ll take you through:
Guest Speaker Segment with Hannah Barrington: Dive into the world of dynamic real estate marketing with Hannah, the Marketing Manager at Workspace Group. Hear firsthand how their team generates engaging descriptions for thousands of office units by integrating diverse data sources—from PDF floorplans to web pages—using FME transformers, like OpenAIVisionConnector and AnthropicVisionConnector. This use case will show you how GenAI can streamline content creation for marketing across the board.
Ollama Use Case: Learn how Scenario Specialist Dmitri Bagh has utilized Ollama within FME to input data, create custom models, and enhance security protocols. This segment will include demos to illustrate the full capabilities of FME in AI-driven processes.
Custom AI Models: Discover how to leverage FME to build personalized AI models using your data. Whether it’s populating a model with local data for added security or integrating public AI tools, find out how FME facilitates a versatile and secure approach to AI.
We’ll wrap up with a live Q&A session where you can engage with our experts on your specific use cases, and learn more about optimizing your data workflows with AI.
This webinar is ideal for professionals seeking to harness the power of AI within their data management systems while ensuring high levels of customization and security. Whether you're a novice or an expert, gain actionable insights and strategies to elevate your data processes. Join us to see how FME and AI can revolutionize how you work with data!
OpenID AuthZEN Interop Read Out - AuthorizationDavid Brossard
During Identiverse 2024 and EIC 2024, members of the OpenID AuthZEN WG got together and demoed their authorization endpoints conforming to the AuthZEN API
AI 101: An Introduction to the Basics and Impact of Artificial IntelligenceIndexBug
Imagine a world where machines not only perform tasks but also learn, adapt, and make decisions. This is the promise of Artificial Intelligence (AI), a technology that's not just enhancing our lives but revolutionizing entire industries.
Best 20 SEO Techniques To Improve Website Visibility In SERPPixlogix Infotech
Boost your website's visibility with proven SEO techniques! Our latest blog dives into essential strategies to enhance your online presence, increase traffic, and rank higher on search engines. From keyword optimization to quality content creation, learn how to make your site stand out in the crowded digital landscape. Discover actionable tips and expert insights to elevate your SEO game.
Monitoring and Managing Anomaly Detection on OpenShift.pdfTosin Akinosho
Monitoring and Managing Anomaly Detection on OpenShift
Overview
Dive into the world of anomaly detection on edge devices with our comprehensive hands-on tutorial. This SlideShare presentation will guide you through the entire process, from data collection and model training to edge deployment and real-time monitoring. Perfect for those looking to implement robust anomaly detection systems on resource-constrained IoT/edge devices.
Key Topics Covered
1. Introduction to Anomaly Detection
- Understand the fundamentals of anomaly detection and its importance in identifying unusual behavior or failures in systems.
2. Understanding Edge (IoT)
- Learn about edge computing and IoT, and how they enable real-time data processing and decision-making at the source.
3. What is ArgoCD?
- Discover ArgoCD, a declarative, GitOps continuous delivery tool for Kubernetes, and its role in deploying applications on edge devices.
4. Deployment Using ArgoCD for Edge Devices
- Step-by-step guide on deploying anomaly detection models on edge devices using ArgoCD.
5. Introduction to Apache Kafka and S3
- Explore Apache Kafka for real-time data streaming and Amazon S3 for scalable storage solutions.
6. Viewing Kafka Messages in the Data Lake
- Learn how to view and analyze Kafka messages stored in a data lake for better insights.
7. What is Prometheus?
- Get to know Prometheus, an open-source monitoring and alerting toolkit, and its application in monitoring edge devices.
8. Monitoring Application Metrics with Prometheus
- Detailed instructions on setting up Prometheus to monitor the performance and health of your anomaly detection system.
9. What is Camel K?
- Introduction to Camel K, a lightweight integration framework built on Apache Camel, designed for Kubernetes.
10. Configuring Camel K Integrations for Data Pipelines
- Learn how to configure Camel K for seamless data pipeline integrations in your anomaly detection workflow.
11. What is a Jupyter Notebook?
- Overview of Jupyter Notebooks, an open-source web application for creating and sharing documents with live code, equations, visualizations, and narrative text.
12. Jupyter Notebooks with Code Examples
- Hands-on examples and code snippets in Jupyter Notebooks to help you implement and test anomaly detection models.
Let's Integrate MuleSoft RPA, COMPOSER, APM with AWS IDP along with Slackshyamraj55
Discover the seamless integration of RPA (Robotic Process Automation), COMPOSER, and APM with AWS IDP enhanced with Slack notifications. Explore how these technologies converge to streamline workflows, optimize performance, and ensure secure access, all while leveraging the power of AWS IDP and real-time communication via Slack notifications.
Unlocking Productivity: Leveraging the Potential of Copilot in Microsoft 365, a presentation by Christoforos Vlachos, Senior Solutions Manager – Modern Workplace, Uni Systems
UiPath Test Automation using UiPath Test Suite series, part 6DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 6. In this session, we will cover Test Automation with generative AI and Open AI.
UiPath Test Automation with generative AI and Open AI webinar offers an in-depth exploration of leveraging cutting-edge technologies for test automation within the UiPath platform. Attendees will delve into the integration of generative AI, a test automation solution, with Open AI advanced natural language processing capabilities.
Throughout the session, participants will discover how this synergy empowers testers to automate repetitive tasks, enhance testing accuracy, and expedite the software testing life cycle. Topics covered include the seamless integration process, practical use cases, and the benefits of harnessing AI-driven automation for UiPath testing initiatives. By attending this webinar, testers, and automation professionals can gain valuable insights into harnessing the power of AI to optimize their test automation workflows within the UiPath ecosystem, ultimately driving efficiency and quality in software development processes.
What will you get from this session?
1. Insights into integrating generative AI.
2. Understanding how this integration enhances test automation within the UiPath platform
3. Practical demonstrations
4. Exploration of real-world use cases illustrating the benefits of AI-driven test automation for UiPath
Topics covered:
What is generative AI
Test Automation with generative AI and Open AI.
UiPath integration with generative AI
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
Removing Uninteresting Bytes in Software FuzzingAftab Hussain
Imagine a world where software fuzzing, the process of mutating bytes in test seeds to uncover hidden and erroneous program behaviors, becomes faster and more effective. A lot depends on the initial seeds, which can significantly dictate the trajectory of a fuzzing campaign, particularly in terms of how long it takes to uncover interesting behaviour in your code. We introduce DIAR, a technique designed to speedup fuzzing campaigns by pinpointing and eliminating those uninteresting bytes in the seeds. Picture this: instead of wasting valuable resources on meaningless mutations in large, bloated seeds, DIAR removes the unnecessary bytes, streamlining the entire process.
In this work, we equipped AFL, a popular fuzzer, with DIAR and examined two critical Linux libraries -- Libxml's xmllint, a tool for parsing xml documents, and Binutil's readelf, an essential debugging and security analysis command-line tool used to display detailed information about ELF (Executable and Linkable Format). Our preliminary results show that AFL+DIAR does not only discover new paths more quickly but also achieves higher coverage overall. This work thus showcases how starting with lean and optimized seeds can lead to faster, more comprehensive fuzzing campaigns -- and DIAR helps you find such seeds.
- These are slides of the talk given at IEEE International Conference on Software Testing Verification and Validation Workshop, ICSTW 2022.
HCL Notes und Domino Lizenzkostenreduzierung in der Welt von DLAUpanagenda
Webinar Recording: https://www.panagenda.com/webinars/hcl-notes-und-domino-lizenzkostenreduzierung-in-der-welt-von-dlau/
DLAU und die Lizenzen nach dem CCB- und CCX-Modell sind für viele in der HCL-Community seit letztem Jahr ein heißes Thema. Als Notes- oder Domino-Kunde haben Sie vielleicht mit unerwartet hohen Benutzerzahlen und Lizenzgebühren zu kämpfen. Sie fragen sich vielleicht, wie diese neue Art der Lizenzierung funktioniert und welchen Nutzen sie Ihnen bringt. Vor allem wollen Sie sicherlich Ihr Budget einhalten und Kosten sparen, wo immer möglich. Das verstehen wir und wir möchten Ihnen dabei helfen!
Wir erklären Ihnen, wie Sie häufige Konfigurationsprobleme lösen können, die dazu führen können, dass mehr Benutzer gezählt werden als nötig, und wie Sie überflüssige oder ungenutzte Konten identifizieren und entfernen können, um Geld zu sparen. Es gibt auch einige Ansätze, die zu unnötigen Ausgaben führen können, z. B. wenn ein Personendokument anstelle eines Mail-Ins für geteilte Mailboxen verwendet wird. Wir zeigen Ihnen solche Fälle und deren Lösungen. Und natürlich erklären wir Ihnen das neue Lizenzmodell.
Nehmen Sie an diesem Webinar teil, bei dem HCL-Ambassador Marc Thomas und Gastredner Franz Walder Ihnen diese neue Welt näherbringen. Es vermittelt Ihnen die Tools und das Know-how, um den Überblick zu bewahren. Sie werden in der Lage sein, Ihre Kosten durch eine optimierte Domino-Konfiguration zu reduzieren und auch in Zukunft gering zu halten.
Diese Themen werden behandelt
- Reduzierung der Lizenzkosten durch Auffinden und Beheben von Fehlkonfigurationen und überflüssigen Konten
- Wie funktionieren CCB- und CCX-Lizenzen wirklich?
- Verstehen des DLAU-Tools und wie man es am besten nutzt
- Tipps für häufige Problembereiche, wie z. B. Team-Postfächer, Funktions-/Testbenutzer usw.
- Praxisbeispiele und Best Practices zum sofortigen Umsetzen
Cosa hanno in comune un mattoncino Lego e la backdoor XZ?Speck&Tech
ABSTRACT: A prima vista, un mattoncino Lego e la backdoor XZ potrebbero avere in comune il fatto di essere entrambi blocchi di costruzione, o dipendenze di progetti creativi e software. La realtà è che un mattoncino Lego e il caso della backdoor XZ hanno molto di più di tutto ciò in comune.
Partecipate alla presentazione per immergervi in una storia di interoperabilità, standard e formati aperti, per poi discutere del ruolo importante che i contributori hanno in una comunità open source sostenibile.
BIO: Sostenitrice del software libero e dei formati standard e aperti. È stata un membro attivo dei progetti Fedora e openSUSE e ha co-fondato l'Associazione LibreItalia dove è stata coinvolta in diversi eventi, migrazioni e formazione relativi a LibreOffice. In precedenza ha lavorato a migrazioni e corsi di formazione su LibreOffice per diverse amministrazioni pubbliche e privati. Da gennaio 2020 lavora in SUSE come Software Release Engineer per Uyuni e SUSE Manager e quando non segue la sua passione per i computer e per Geeko coltiva la sua curiosità per l'astronomia (da cui deriva il suo nickname deneb_alpha).
How to Get CNIC Information System with Paksim Ga.pptxdanishmna97
Pakdata Cf is a groundbreaking system designed to streamline and facilitate access to CNIC information. This innovative platform leverages advanced technology to provide users with efficient and secure access to their CNIC details.
“An Outlook of the Ongoing and Future Relationship between Blockchain Technologies and Process-aware Information Systems.” Invited talk at the joint workshop on Blockchain for Information Systems (BC4IS) and Blockchain for Trusted Data Sharing (B4TDS), co-located with with the 36th International Conference on Advanced Information Systems Engineering (CAiSE), 3 June 2024, Limassol, Cyprus.
Programming Foundation Models with DSPy - Meetup SlidesZilliz
Prompting language models is hard, while programming language models is easy. In this talk, I will discuss the state-of-the-art framework DSPy for programming foundation models with its powerful optimizers and runtime constraint system.
29. COMPLETE TEARDOWN
WITH:
• Detailed photos
• Precise measurements
• Manufacturing process
flow comparison
• Supply-chain
evaluation
• Manufacturing cost
comparison
• Comparison of the
Apple A10, HiSilicon
Kirin 955, Samsung
Exynos 8 and
Qualcomm Snapdragon
820
2016 Comparison of Application Processor (AP) Packaging:
TSMC’s inFO vs. Amkor’s PoP vs. Samsung’s PoP vs. Shinko’s MCeP
Title: 2016 Application
Processor Packaging
Comparison
Pages: 100
Date: December 2016
Format: PDF & Excel file
Price: Full report:
EUR 3,490
Comparison of main players AP: Apple A10 with inFO vs. Qualcomm
Snapdragon 820 with MCeP packaging technology vs. HiSilicon Kirin 955
& Samsung Exynos 8 with standard Package-on-Package
Five major players are sharing the smartphone application processors (AP)
market. Among them, Qualcomm, Apple, Samsung and HiSilicon propose the
most powerful AP. They use almost the same technology node for the die, and
the innovation is now at the packaging level. During this year, we observed
different technologies inside the four main smartphone flagships: classic
Package-on-Package (PoP) developed by Amkor for the Kirin 955 and for the
Exynos 8, Molded Core Embedded Package (MCeP) technology developed by
Shinko for the Snapdragon 820 and integrated Fan-Out packaging (inFO)
developed by TSMC for the A10.
Located under the DRAM chip on the main board, the AP are packaged using PoP
technology. The Apple A10 can be found in the iPhone 7 series. The HiSilicon Kirin
955 can be found in the Huawei P9 and the Samsung Exynos 8 as the Qualcomm
Snapdragon 820 can be found in the Samsung Galaxy S7 series depending on the
world version (US and Asia for the Snapdragon and International for the Exynos).
In this report, we highlight the differences and the innovations of the packages
chosen by the end-user OEMs. Whereas some AP providers like for HiSilicon or
Samsung choose to consider conventional PoP with embedded land-side capacitor
(LSC), others like Apple or Qualcomm use innovative technologies like Fan-Out PoP
and silicon based Deep Trench LSC or embedded die packaging with advanced PCB
substrate. The detailed comparison between the four players will give the pros and
the cons of the packaging technologies.
This report also compares the costs of the different approaches and includes a
detailed technical comparison between the packaging structure of the Qualcomm
Snapdragon 820, the Samsung Exynos 8, the HiSilicon Kirin 955 and the Apple A10.
30. Performed by
TABLE OF CONTENTS
Overview/Introduction
Company Profile and Supply
Chain
Smartphone Teardowns: iPhone 7
Plus, Huawei P9, Samsung Galaxy
S7
Physical Analysis
• Physical Analysis Methodology
• A10 inFO Packaging Analysis
Package view and dimensions
Package opening
Package cross-section
• Kirin 955 PoP Packaging Analysis
Package view and dimensions
Package opening
Package cross-section
• Snapdragon 820 MCeP Packaging
Analysis
Package view and dimensions
Package opening
Package cross-section
• Exynos 8 PoP Packaging Analysis
Package view and dimensions
Package opening
Package cross-section
• Package Opening Comparison
• Package Cross-Section Comparison
• Die Comparison
• Package Land-Side Decoupling
Capacitor Comparison
LSC capacitor view comparison
LSC capacitor footprint
comparison
Embedded LSC capacitor
cross-section comparison
Soldered LSC capacitor cross-
section comparison
• Summary of the Physical Data
Manufacturing Process Flow
• Global Overview
• Packaging Fabrication Unit
Cost Analysis
• Synthesis of the Cost Analysis
• Supply Chain Descriptions
• Yield Hypotheses
• PoP Die Cost Analysis
Wafer cost
Die cost
Package manufacturing cost
Cost Comparison between
Apple A10 inFO, HiSilicon Kirin
955 PoP, Qualcomm
Snapdragon 820 MCeP &
Samsung Exynos 8 PoP
ANALYSIS PERFORMED WITH OUR COSTING TOOL 3D PACKAGE COSIM+
System Plus Consulting offers
powerful costing tools to
evaluate the production cost &
selling price from single chip to
complex structures.
3D Package Cosim+
Cost simulation tool to evaluate
the cost of any packaging
process: Wafer-level packaging,
TSV, 3D integration…
3D Package CoSim+ is a process-
based costing tool used to
evaluate the manufacturing cost
per wafer using your own inputs
or using the pre-defined
parameters included in the tool.
It is possible to enter any
package process flow.
3D-Package CoSim+
tronics systems. He holds an
engineering degree in electronics
and numerical technology, and a
PhD in materials for micro-
electronics.
Stéphane Elisabeth
h a s a d e e p
knowledge of
materials characte-
rizations and elec-
mical and physical analyses. He
previously worked in micro-
electronics R&D for CEA/LETI and
STMicroelectronics.
Nicolas Radufe
(Lab) is in charge of
physical analysis.
He has a deep
knowledge in che-
sical technical analyses. He
previously worked for 25 years in
Atmel Nantes Laboratory.
Yvon Le Goff (Lab)
is the laboratory
manager. He has
deep knowledge in
chemical & phy-
AUTHORS:
31. TSMC Integrated Fan-Out
(inFO) Package in
Apple’s A10 Application
Processor
TSMC Deep Trench Capacitor
Land-Side Decoupling
Capacitor in Apple’s A10
Application Processor
Samsung’s Galaxy S7
Processor Packages:
Qualcomm/Shinko’s MCeP
vs. Samsung’s PoP
Reverse engineering and costing of
the new inFO packaging technology
from TSMC used for Apple’s latest
A10 application processor, found in
the iPhone 7 and 7 Plus.
Reverse engineering and costing of
the new Integrated Passive Device
technology from TSMC used for
Apple’s latest A10 application
processor, found in the iPhone 7.
A comparison of Qualcomm
Snapdragon 820 MSM8996 with
MCeP packaging technology vs.
Samsung Exynos 8 with TMV
PoP.
Pages: 100
Date: October 2016
Full report: EUR 3,490*
Pages: 100
Date: October 2016
Full report: EUR 3,490*
Pages: 113
Date: June 2016
Full report: EUR 3,790*
RELATED REPORTS
ANNUAL SUBSCRIPTION OFFER
You can choose to buy over 12
months a set of 3, 4, 5, 7, 10 or
15 Reverse Costing® reports.
Up to 47% discount!
More than 40 reports released each year on the following topics (considered for 2016):
• MEMS & Sensors (20 reports):
• Gyros/Accelerometers/IMU
• Oscillators/RF switches
• Pressure sensors/Gas sensors
• Power Electronics & Systems (12 reports):
• GaN and SiC devices
• Inverters & modules
• Automotive radars
• Head Up displays, Displays
Each year System Plus Consulting releases a comprehensive collection of new reverse engineering &
costing analyses in various domains.
• ICs (3 reports):
• Multimedia SoC
• Ethernet for car IC, etc.
• Imaging & LEDs (11 reports):
• Camera modules, Infrared
sensors & cameras
• LEDs
• Advanced Packaging (5 reports):
• WLP, TSV
• Embedded devices, etc.
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32. *For price in dollars please use the day’s exchange rate. All reports are delivered electronically in pdf format. For French customer, add 20 % for VAT.
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About Yole Développement – www.yole.fr / www.i-micronews.com
Founded in 1998, Yole Développement (Yole) has grown to become a group of companies providing marketing, technology and strategy
consulting, media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro
manufacturing, Yole has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semi., LED, Image
Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaics, Advanced Packaging, Manufacturing and Power Electronics. We
support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends
to develop their business.
CONSULTING
• Market data & research,
marketing analysis
• Technology analysis
• Reverse engineering & costing
services
• Strategy consulting
• Patent analysis
FINANCIAL SERVICES
• Mergers & Acquisitions
• Due diligence
• Fundraising
More information on
www.yolefinance.com
REPORTS
• Collection of technology &
market reports
• Manufacturing cost
simulation tools
• Component reverse
engineering & costing analysis
• Patent investigation
MEDIA & EVENTS
• i-Micronews.com, online disruptive
technologies website
• @Micronews, weekly e-newsletter
• Technology Magazines dedicated to
MEMS, Advanced Packaging, LED and
Power Electronics
• Communication & webcasts services
• Events: Yole Seminars, Market Briefings
SHIP TO PAYMENT
Please process my order for “2016 Application Processor Packaging Comparison” Reverse Costing Report
Multi user license: EUR 3,490*
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“Seller”: Based in Lyon (France headquarters), Yole Développement is a market research and business development consultancy company, facilitating market access for advanced technology industrial projects. With
more than 20 market analysts, Yole works worldwide with the key industrial companies, R&D institutes and investors to help them understand the markets and technology trends.
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Bank code: 30056
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Account n°: 0170 200 1565 87
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To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order.
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interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof.
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reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that
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The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties,
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solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.
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All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due
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9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.
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