Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies. More : https://www.systemplus.fr/reverse-costing-reports/iray-t3s-thermal-camera-for-smartphone/

1. ©2020 by System Plus Consulting | IRay T3S Thermal Camera for Smartphone|Sample 1
+33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
IRay T3S Thermal Camera for Smartphone
Deep dive analysis of the IRay T3S thermal camera for
smartphone including structural and cost analysis.
SP20569 – System report by David Le Gac
August 2020 – Sample
22 Bd Benoni Goullin
44200 NANTES - FRANCE

2. ©2020 by System Plus Consulting | IRay T3S Thermal Camera for Smartphone|Sample 2
Table of Contents
Overview / Introduction 3
o Executive Summary
o Main Chipset
o Block Diagram
o Supply Chain
o Reverse Costing Methodology
Company Profile 9
o T3S Camera Main Features
Teardown Analysis 11
o Global View of the Camera
o Views and Dimensions of the Camera
o Camera Opening
o Microbolometer Views and Opening
o Lens Module views and cross section
o Main Board
✓ Top Side – Angled view – High Resolution photo
✓ Top Side – Top view - High Resolution photo
✓ Top Side – Components markings
✓ Top Side – Components identification
✓ Bottom Side – High resolution photos
✓ Bottom Side – Components markings
✓ Bottom Side – Components identification
o Flex Board
Cost Analysis 37
o Accessing the BOM
o PCBs Cost
o MCU Cost
o BOM Cost – Electronic Boards
o Housing Part – Estimation
o BOM Cost – Mechanical Parts
o Material Cost Breakdown by Sub-Assembly
o Material Cost Breakdown by Component Category
o Accessing the Added Value (AV) cost
o Main Board Manufacturing Flow
o Details of the Main Board AV Cost
o Details of the System Assembly AV Cost
o Added-Value Cost Breakdown
o Manufacturing Cost Breakdown
Estimated Manufacturing price Analysis 67
o Estimation of the Manufacturing Price
Customer feedbacks 70
Related Products 73
Company services 74

3. ©2020 by System Plus Consulting | IRay T3S Thermal Camera for Smartphone|Sample 3
Overview / Introduction
o Executive Summary
o Main Chipset
o Block Diagram
o Supply Chain
o Reverse Costing
Methodology
Company Profile & Main
Features
Physical Analysis
Cost Analysis
ManufacturingPrice
Feedbacks
Related Analyses
About System Plus
Block Diagram

4. ©2020 by System Plus Consulting | IRay T3S Thermal Camera for Smartphone|Sample 4
Overview / Introduction
Company Profile & Main
Features
Physical Analysis
o Views & Dimensions
o Camera Opening
o Microbolometer Views &
Opening
o Lens module
o Electronic Boards
Cost Analysis
ManufacturingPrice
Feedbacks
Related Analyses
About System Plus
Main Board – Top Side – Main Components Identification

5. ©2020 by System Plus Consulting | IRay T3S Thermal Camera for Smartphone|Sample 5
Overview / Introduction
Company Profile & Main
Features
Physical Analysis
Cost Analysis
o Accessing the BOM
o PCBs Costs
o MCU Cost
o BOM Cost – Electronics
o Housing Parts Estimation
o BOM Cost – Mech. Parts
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
ManufacturingPrice
Feedbacks
Related Analyses
About System Plus
PCBs Costs

6. ©2020 by System Plus Consulting | IRay T3S Thermal Camera for Smartphone|Sample 6
Overview / Introduction
Company Profile & Main
Features
Physical Analysis
Cost Analysis
o Accessing the BOM
o PCBs Costs
o MCU Cost
o BOM Cost – Electronics
o Housing Parts Estimation
o BOM Cost – Mech. Parts
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
ManufacturingPrice
Feedbacks
Related Analyses
About System Plus
PCBs Costs – Main Board

7. ©2020 by System Plus Consulting | IRay T3S Thermal Camera for Smartphone|Sample 7
Overview / Introduction
Company Profile & Main
Features
Physical Analysis
Cost Analysis
o Accessing the BOM
o PCBs Costs
o MCU Cost
o BOM Cost – Electronics
o Housing Parts Estimation
o BOM Cost – Mech. Parts
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
ManufacturingPrice
Feedbacks
Related Analyses
About System Plus
BOM Cost – Main Board (1/2)

8. ©2020 by System Plus Consulting | IRay T3S Thermal Camera for Smartphone|Sample 8
Overview / Introduction
Company Profile & Main
Features
Physical Analysis
Cost Analysis
o Accessing the BOM
o PCBs Costs
o MCU Cost
o BOM Cost – Electronics
o Housing Parts Estimation
o BOM Cost – Mech. Parts
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
ManufacturingPrice
Feedbacks
Related Analyses
About System Plus
Material Cost Breakdown by Component Categories (Details)

9. ©2020 by System Plus Consulting | IRay T3S Thermal Camera for Smartphone|Sample 9
Overview / Introduction
Company Profile & Main
Features
Physical Analysis
Cost Analysis
o Accessing the BOM
o PCBs Costs
o MCU Cost
o BOM Cost – Electronics
o Housing Parts Estimation
o BOM Cost – Mech. Parts
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
ManufacturingPrice
Feedbacks
Related Analyses
About System Plus
Manufacturing Cost Breakdown

10. ©2020 by System Plus Consulting | IRay T3S Thermal Camera for Smartphone|Sample 10
R E L A T E D
A N A L Y S E S
R E L A T E D
A N A L Y S E S

11. ©2020 by System Plus Consulting | IRay T3S Thermal Camera for Smartphone|Sample 11
Overview / Introduction
Company Profile & Main
Features
Physical Analysis
Cost Analysis
ManufacturingPrice
Feedbacks
Related Analyses
About System Plus
o Company services
o Contact
Related Analyses
RELATEDREPORTS
By System Plus Consulting:
• FLIR Boson – a small, innovative, low power, smart thermal camera core
• Apple iPad Pro LiDAR Module
• Smartphone 3D Sensing Modules Comparison 2020
• Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module
By Piséo:
• iRAY T3S Thermal Camera Performance Analysis
• FLIR Boson Thermal Camera Performance Analysis

12. ©2020 by System Plus Consulting | IRay T3S Thermal Camera for Smartphone|Sample 12
COMPANY
SERVICES

13. ©2020 by System Plus Consulting | IRay T3S Thermal Camera for Smartphone|Sample 13
Overview / Introduction
Company Profile & Main
Features
Physical Analysis
Cost Analysis
ManufacturingPrice
Feedbacks
Related Analyses
About System Plus
o Company services
o Contact
Our Core Activity : The Reverse Costing®
A Structure, Process and Cost Analysis
Reverse Costing® consists in disassembling a device or a system, in order
to identify its technology and determine its manufacturing processes and
cost, using in-house models and tools.

14. ©2020 by System Plus Consulting | IRay T3S Thermal Camera for Smartphone|Sample 14
Overview / Introduction
Company Profile & Main
Features
Physical Analysis
Cost Analysis
ManufacturingPrice
Feedbacks
Related Analyses
About System Plus
o Company services
o Contact
Fields Of Expertise

15. ©2020 by System Plus Consulting | IRay T3S Thermal Camera for Smartphone|Sample 15
Overview / Introduction
Company Profile & Main
Features
Physical Analysis
Cost Analysis
ManufacturingPrice
Feedbacks
Related Analyses
About System Plus
o Company services
o Contact
Business Model
Teardown
Track
205+
teardowns per
year
Monitor
1 per year
quarterly
updated
Custom
Analysis
150 custom
analyses per
year
Report
60+ per year
Costing
Tools
5 process-based
and 3 parametric
costing tools
Cost
Methods
Training
On demand

16. ©2020 by System Plus Consulting | IRay T3S Thermal Camera for Smartphone|Sample 16
Overview / Introduction
Company Profile & Main
Features
Physical Analysis
Cost Analysis
ManufacturingPrice
Feedbacks
Related Analyses
About System Plus
o Company services
o Contact
Worldwide presence
100+ collaborators in 8 different countries
Headquarters
› Nantes – System Plus Consulting
› Lyon – Yole Développement
Boise
Cornelius
Raleigh
Phoenix
Austin
Singapore
Hsinchu
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Shenzhen
Seoul
Frankfurt
Nantes
Lyon

17. ©2020 by System Plus Consulting | IRay T3S Thermal Camera for Smartphone|Sample 17
Overview / Introduction
Company Profile & Main
Features
Physical Analysis
Cost Analysis
ManufacturingPrice
Feedbacks
Related Analyses
About System Plus
o Company services
o Contact
Contact
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