A dynamic market with high responsivity to technical innovation, the RF front end industry is set to grow at 14% CAGR to reach $22.7B in 2022.
A market that will more than double in six years!
The radio-frequency (RF) front end and components market for cellphones is highly dynamic. From being worth $10.1B last year, it is expected to reach $22.7B in 2022. Such high growth is definitely something that players in other semiconductor markets would envy. However, the growth is not evenly distributed.
Filters represent the biggest business in the RF front end industry, and the value of this business will more than triple from 2016 to 2022. Most of this growth will derive from additional filtering needs from new antennas as well as the need for more filtering functionality due to multiple carrier aggregation (CA).
Power amplifiers (PAs) and low noise amplifiers (LNAs), the second biggest business, will be almost flat over the same period. High-end LTE PA market growth will be balanced by a shrinking 2G/3G market. The LNA market will grow steadily, especially thanks to the addition of new antennas.
Switches, the third biggest business, will double. This market will mainly be driven by antenna switches.
Lastly, antenna tuners, a small business today with an estimated $36M market value, will expand 7.5-fold to reach $272M in 2022. This growth is mainly due to tuning being added to both the main and the diversity antennas.
For more discussion, please visit our website: http://www.i-micronews.com/reports.html
5G’s Impact on RF Front-End Module and Connectivity for Cell phones 2019 by Y...Yole Developpement
The battle for 5G still rages: integration in-module or with discrete parts?
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2019/
This document discusses challenges for future mmWave technology in mobile devices and potential solutions. It begins by reviewing increasing complexity in current RF front-end modules driven by the adoption of new cellular standards and frequency bands. It then discusses the need for integrated mmWave front-end and transceiver modules to support 5G, including requirements for high performance, low-loss backend-of-line technology, and accurate RF modeling. The document argues that RF SOI is well suited to meet these needs through transistor stacking, reduced parasitics, and demonstrated high performance at mmWave frequencies in power amplifiers, switches, and low-noise amplifiers.
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
Technical and cost overview of the evolution of radio frequency front-end module technologies integrated in 5G mmWave and Sub-6 GHz Phones.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-2-focus-on-5g-chipset/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Deep dive analysis of the fourth generation of mid/high band front-end module for 4G and 5G from Broadcom.
More information : https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8200-pamid-in-the-apple-iphone-12-series/
5G’s Impact on RF Front-End Module and Connectivity for Cell phones 2019 by Y...Yole Developpement
The battle for 5G still rages: integration in-module or with discrete parts?
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2019/
This document discusses challenges for future mmWave technology in mobile devices and potential solutions. It begins by reviewing increasing complexity in current RF front-end modules driven by the adoption of new cellular standards and frequency bands. It then discusses the need for integrated mmWave front-end and transceiver modules to support 5G, including requirements for high performance, low-loss backend-of-line technology, and accurate RF modeling. The document argues that RF SOI is well suited to meet these needs through transistor stacking, reduced parasitics, and demonstrated high performance at mmWave frequencies in power amplifiers, switches, and low-noise amplifiers.
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
Technical and cost overview of the evolution of radio frequency front-end module technologies integrated in 5G mmWave and Sub-6 GHz Phones.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-2-focus-on-5g-chipset/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Deep dive analysis of the fourth generation of mid/high band front-end module for 4G and 5G from Broadcom.
More information : https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8200-pamid-in-the-apple-iphone-12-series/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
Begin your evolution with Ericsson’s new small cell solutions.
There is need for the multi-operator dots, multi-dot enclosure, and strand -mounted bracket. The complicated arrangements are made easier with Ericsson small cell solutions.
Technical and cost overview of the evolution of the radio frequency front-end module technologies integrated in the Apple iPhone series from 2016 - 2020.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-1-focus-on-apple/
Status of The Advanced Packaging Industry_Yole Développement reportYole Developpement
IoT driven semiconductor industry consolidation is reflecting into a highly dynamic Advanced Packaging landscape. Demand for advanced packaging and market size is increasing. Focus is turning
to integration and wafer level packages to enable a functionality driven roadmap and revive the cost/performance curve.
This report from Yole Développement analyzes the high-end performance packaging market. It defines high-end performance packaging as technologies that provide high IO density (≥16/mm2) and fine IO pitch (≤130μm). The report aims to identify relevant technologies, analyze market drivers and challenges, describe technology trends and roadmaps, examine the supply chain landscape, and provide market forecasts. It evaluates the market by technology, end application, and region. The report also profiles key players' technology roadmaps and analyzes intellectual property in the 3D SoC hybrid bonding space.
This document provides an overview of Ericsson's 5G NR-RAN Release for the fourth quarter of 2018. It describes the NR non-standalone architecture, including dual connectivity functionality and interfaces. It also covers topics like numerology, frame structure, deployment scenarios for mid-band and high-band spectrum, and transport functionality between the gNodeB and eNodeB.
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
Second Generation of TSMC’s Integrated Fan-Out (inFO) Packaging for the Apple...system_plus
The latest Apple application processor engine : from the stacked board to the A11, and reverse costing of TSMC's updated inFO packaging
More information on that report at http://www.systemplus.fr/reverse-costing-reports/second-generation-of-tsmcs-integrated-fan-out-info-packaging-for-the-apple-a11-found-in-the-iphone-x/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
The document discusses the shift towards using coherent optical technology at the network edge. It argues that 100G QSFP28 ports using coherent 100ZR technology will dominate the optical edge in the coming years. This will allow for longer transmission reaches of over 300km compared to traditional direct detection. Key advantages of coherent 100ZR include lower power consumption of 5W or less in a QSFP28 form factor, simplified deployment without manual tuning, and compatibility with existing network infrastructure. The technology could enable seamless upgrades to 100G speeds at aggregation points across access networks.
Next-Generation Closed-Loop Automation - an Inside ViewLaurent Ciavaglia
The document provides an overview of next-generation closed-loop automation by three experts - Laurent Ciavaglia from Nokia, Pedro Henrique Gomes from Ericsson, and Ishan Vaishnavi from Lenovo. It introduces the speakers and their backgrounds working on closed-loop automation standards. The tutorial aims to share experience in standards development and present the latest developments in standards and open source towards multi-vendor coordinated closed-loop automation solutions.
5G Impact on RF Front-end Module and Connectivity for Cell Phones Report by Y...Yole Developpement
How is 5G enabling new business opportunities despite flat mobile growth?
More information on : https://www.i-micronews.com/category-listing/product/p5g%E2%80%99s-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2018.html
Continental, Veoneer, ZF, Valeo, Bosch, Aptiv, Denso, Ainstein: Discover the technologies used in the main Radar Systems and Chipsets.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/automotive-radar-comparison-2018/
PLNOG 13: Krzysztof Konkowski: Cisco Access Architectures: GPON, Ethernet, Ac...PROIDEA
Krzysztof Konkowski – Consulting Systems Engineer working in IP NGN Team, Cisco. Mainly focused on carrier class solutions for broad range of customer segments: service provider, public sector, enterprise. Main technical expertise: MPLS/IP, Carrier Ethernet, BNG, Multicast. Holder of many certificates – amongst others CCIE RS i CCIE SP #20050.
Topic of Presentation: Cisco Access Architectures: GPON, Ethernet, Access for business
Language: Polish
Abstract: TBD
This document discusses software defined radio (SDR) technology. It begins with an overview of radio technology and terms. It then discusses SDR, explaining that it implements components like mixers, filters, and modulators/demodulators through software instead of hardware. Examples of low-cost SDR devices like the RLT-SDR are provided. The document concludes with a demonstration of listening to signals like FM radio, airplanes, satellites, and wireless networks using SDR software and devices.
The document is a 2019 market and technology report from Yole Développement on the impact of 5G on RF front-end modules and connectivity for cell phones. It includes a glossary, table of contents, report objectives and scope, methodology, authors, companies cited, what was predicted correctly and incorrectly in previous reports, and an executive summary. The executive summary likely provided an overview of the key findings and trends discussed in the full report around 5G network rollouts, the transition to 5G technologies in mobile devices, and the impact on the RF front-end module and connectivity component markets.
Advanced RF SiP for Cellphones 2017 report from Yole Développement Yole Developpement
This document is a sample report from Yole Développement titled "Advanced RF SiP for Cell Phones 2017" that discusses packaging technologies and market forecasts for 5G radio frequency system-in-package solutions for smartphones. The report covers topics such as the methodology used, an executive summary of key findings, market drivers and trends related to 5G packaging, disruptions and opportunities in the supply chain, and technology roadmaps and forecasts through 2022 for RF SiP wafers, units, and revenue. It also profiles major players and discusses emerging packaging platforms that could be used for 5G solutions.
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
Begin your evolution with Ericsson’s new small cell solutions.
There is need for the multi-operator dots, multi-dot enclosure, and strand -mounted bracket. The complicated arrangements are made easier with Ericsson small cell solutions.
Technical and cost overview of the evolution of the radio frequency front-end module technologies integrated in the Apple iPhone series from 2016 - 2020.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-1-focus-on-apple/
Status of The Advanced Packaging Industry_Yole Développement reportYole Developpement
IoT driven semiconductor industry consolidation is reflecting into a highly dynamic Advanced Packaging landscape. Demand for advanced packaging and market size is increasing. Focus is turning
to integration and wafer level packages to enable a functionality driven roadmap and revive the cost/performance curve.
This report from Yole Développement analyzes the high-end performance packaging market. It defines high-end performance packaging as technologies that provide high IO density (≥16/mm2) and fine IO pitch (≤130μm). The report aims to identify relevant technologies, analyze market drivers and challenges, describe technology trends and roadmaps, examine the supply chain landscape, and provide market forecasts. It evaluates the market by technology, end application, and region. The report also profiles key players' technology roadmaps and analyzes intellectual property in the 3D SoC hybrid bonding space.
This document provides an overview of Ericsson's 5G NR-RAN Release for the fourth quarter of 2018. It describes the NR non-standalone architecture, including dual connectivity functionality and interfaces. It also covers topics like numerology, frame structure, deployment scenarios for mid-band and high-band spectrum, and transport functionality between the gNodeB and eNodeB.
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
Second Generation of TSMC’s Integrated Fan-Out (inFO) Packaging for the Apple...system_plus
The latest Apple application processor engine : from the stacked board to the A11, and reverse costing of TSMC's updated inFO packaging
More information on that report at http://www.systemplus.fr/reverse-costing-reports/second-generation-of-tsmcs-integrated-fan-out-info-packaging-for-the-apple-a11-found-in-the-iphone-x/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
The document discusses the shift towards using coherent optical technology at the network edge. It argues that 100G QSFP28 ports using coherent 100ZR technology will dominate the optical edge in the coming years. This will allow for longer transmission reaches of over 300km compared to traditional direct detection. Key advantages of coherent 100ZR include lower power consumption of 5W or less in a QSFP28 form factor, simplified deployment without manual tuning, and compatibility with existing network infrastructure. The technology could enable seamless upgrades to 100G speeds at aggregation points across access networks.
Next-Generation Closed-Loop Automation - an Inside ViewLaurent Ciavaglia
The document provides an overview of next-generation closed-loop automation by three experts - Laurent Ciavaglia from Nokia, Pedro Henrique Gomes from Ericsson, and Ishan Vaishnavi from Lenovo. It introduces the speakers and their backgrounds working on closed-loop automation standards. The tutorial aims to share experience in standards development and present the latest developments in standards and open source towards multi-vendor coordinated closed-loop automation solutions.
5G Impact on RF Front-end Module and Connectivity for Cell Phones Report by Y...Yole Developpement
How is 5G enabling new business opportunities despite flat mobile growth?
More information on : https://www.i-micronews.com/category-listing/product/p5g%E2%80%99s-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2018.html
Continental, Veoneer, ZF, Valeo, Bosch, Aptiv, Denso, Ainstein: Discover the technologies used in the main Radar Systems and Chipsets.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/automotive-radar-comparison-2018/
PLNOG 13: Krzysztof Konkowski: Cisco Access Architectures: GPON, Ethernet, Ac...PROIDEA
Krzysztof Konkowski – Consulting Systems Engineer working in IP NGN Team, Cisco. Mainly focused on carrier class solutions for broad range of customer segments: service provider, public sector, enterprise. Main technical expertise: MPLS/IP, Carrier Ethernet, BNG, Multicast. Holder of many certificates – amongst others CCIE RS i CCIE SP #20050.
Topic of Presentation: Cisco Access Architectures: GPON, Ethernet, Access for business
Language: Polish
Abstract: TBD
This document discusses software defined radio (SDR) technology. It begins with an overview of radio technology and terms. It then discusses SDR, explaining that it implements components like mixers, filters, and modulators/demodulators through software instead of hardware. Examples of low-cost SDR devices like the RLT-SDR are provided. The document concludes with a demonstration of listening to signals like FM radio, airplanes, satellites, and wireless networks using SDR software and devices.
The document is a 2019 market and technology report from Yole Développement on the impact of 5G on RF front-end modules and connectivity for cell phones. It includes a glossary, table of contents, report objectives and scope, methodology, authors, companies cited, what was predicted correctly and incorrectly in previous reports, and an executive summary. The executive summary likely provided an overview of the key findings and trends discussed in the full report around 5G network rollouts, the transition to 5G technologies in mobile devices, and the impact on the RF front-end module and connectivity component markets.
Advanced RF SiP for Cellphones 2017 report from Yole Développement Yole Developpement
This document is a sample report from Yole Développement titled "Advanced RF SiP for Cell Phones 2017" that discusses packaging technologies and market forecasts for 5G radio frequency system-in-package solutions for smartphones. The report covers topics such as the methodology used, an executive summary of key findings, market drivers and trends related to 5G packaging, disruptions and opportunities in the supply chain, and technology roadmaps and forecasts through 2022 for RF SiP wafers, units, and revenue. It also profiles major players and discusses emerging packaging platforms that could be used for 5G solutions.
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
5G’s Impact on Telecom Infrastructure 2019 report by Yole DéveloppementYole Developpement
Network evolution and 5G implementation are driving massive structural changes.
More information on: https://www.i-micronews.com/products/5gs-impact-on-telecom-infrastructure-2019/
Internet of Things RF Protocols and their Impacts on the Electronics IndustryYole Developpement
The challenge for Radio-Frequency (RF) electronics manufacturers to secure value in the Internet of Things (IoT) industry stays relevant today.
More information on that report at: https://www.i-micronews.com/report/product/internet-of-things-rf-protocols-and-their-impacts-on-the-electronics-industry.html
This report provides an analysis of the RF GaN technology and market from 2010 to 2020. It discusses the increasing demand for high-power, high-frequency transistors and how GaN devices can meet this demand by offering higher efficiency, bandwidth, linearity, and temperature tolerance compared to existing silicon and GaAs technologies. The report examines the applications of GaN devices in markets like wireless infrastructure, CATV, satellite communications, and defense. It also analyzes the industrial landscape, including mergers and acquisitions, as well as forecasts the potential growth of the RF GaN device market over the next decade under different scenarios.
Apple iPhone 12 series mmWave 5G Chipset and Antennasystem_plus
A study of the complete first generation of the 5G millimeter-wave chipset for Apple’s phones including custom antenna, front-end module and antenna-on-package.
More information : https://www.systemplus.fr/reverse-costing-reports/apple-iphone-12-series-mmwave-5g-chipset-and-antenna/
The world is going wireless. For many years we have been discussing mobile broadband and always-on services and applications. This is maturing to reality with new devices in different shapes and forms such as mobile devices, tablets and netbooks. The introduction of LTE (Long Term Evolution) is the technology behind the compelling user experience required for their success. New industry initiatives such as VoLTE and VoLGA are allowing for real-time multimedia communication yet there are many challenges for realizing this technology.
The webinar will discuss the future of voice and SMS services, supplementary and Advanced Services in the era of all IP mobile networks, network architecture issues and interconnectivity with Legacy and current 2G and 3G access.
Deployment challenges and migration solutions will be covered as well as LTE network elements with the underlying standard IP Multimedia Subsystem (IMS) network infrastructure and endpoint devices. Speakers will discuss the development tools required, from the basic building blocks of IMS protocol stacks to the intricate details of application deployment. IMS standardization and interoperability efforts to overcome growing complexities of this new network architecture will be discussed as well.
By attending this webinar, you will learn:
• LTE and IMS market and technology trends
• Challenges in building Next Generation core and endpoint devices
• Unique requirements for Voice over LTE
• RADVISION solutions for LTE networks
Who should attend:
• Developers, architects
• Product Managers
• CTOs, VP R&D
• Marketing executives
Segments – Core Network Devices, SBCs, Media Gateways, Media Servers, Terminal End Points, and any other device that can connect to NGN/IMS Networks
This document summarizes an interview with Chris Day from TriQuint Semiconductor discussing the benefits and drawbacks of Gallium Nitride (GaN) technology compared to other technologies like Gallium Arsenide (GaAs) for use in RF amplifiers. Some key points made are that GaN allows for higher RF output levels and power handling compared to GaAs, but it is also a more expensive and difficult technology to fabricate. Hybrid designs that combine the strengths of GaN and GaAs are seen as an optimal solution to maximize performance while minimizing costs. Overall GaN is seen as the future for RF amplifiers due to its strong performance, but other technologies may also be useful depending on specific application needs and costs.
While LTE and LTE-Advanced deployments are still underway, mobile operators and vendors have already embarked on R&D initiatives to develop so-called 5G technology, with a vision of commercialization by 2020.
Mobile devices such as smartphones and tablets are driving significant growth and innovation in computing. Smartphone shipments are increasing rapidly and surpassing PC shipments. Smartphones are also changing consumer behavior, with people using their phones for many activities like social networking, games, navigation, and commerce. This is resulting in explosive growth in mobile data traffic that is straining mobile networks. However, new technologies like 4G LTE networks and advanced LTE standards are helping to address this challenge and enable new services.
Radar and Wireless for Automotive: Market and Technology Trends 2019 report b...Yole Developpement
The radar and 5G/V2X markets will both grow – one through market pull, the other through prospective enablement.
More information on https://www.i-micronews.com/products/radar-and-v2x-for-automotive-technologies-and-market-trends-2019/
5G will connect billions of devices, things and people and bring an Ocean of new opportunities to cope with continuous traffic growth, low latency service expectations, energy efficiency, urban density and many other requirements demanding more and more innovation in the CMOS, MEMS and Protonics space but also many other areas.
Recent research and the current scenario as well as future market potential of "The 5G Wireless Ecosystem: 2015 - 2025 - Technologies, Applications, Verticals, Strategies & Forecasts" globally.
The document discusses LTE and IMS technologies and their role in enabling new voice and messaging services. It introduces VoLTE as a solution for voice over LTE using IMS. IMS is presented as the solution that allows operators to continue providing services over LTE. The document also discusses the Rich Communication Suite (RCS) as an initiative to develop interoperable enriched communication services beyond voice and SMS. RADVISION solutions for IMS and RCS application development are also summarized.
The report analyzes the patent landscape related to antenna integrated in package (AiP). Over 140 entities have filed AiP patents, with the main assignees being SJ Semiconductor, TSMC, Samsung Electro-Mechanics, Huawei, MediaTek, IBM, ASE, SPIL, NCAP, Qualcomm, and Murata. The report provides a detailed analysis of these players' patent portfolios, technologies, strategies, and key patents. It also includes an Excel database of over 1,500 analyzed AiP patents. The report finds the IP landscape is dominated by foundries/OSATs and major companies, with newcomers being Chinese firms focusing on wafer-level packaging for integrated antennas. The IP
The document discusses the challenges of increasing mobile broadband usage and the need for LTE and small cell solutions. It describes how mobile data usage is doubling every 9 months, driven by new internet-enabled devices and content. LTE and femtocells can help meet this exponential growth in bandwidth demand by providing significantly higher data rates and network offloading capabilities. Femtocells in particular deliver cost-effective indoor coverage and capacity by leveraging consumer broadband connections.
This white paper summarizes 5G technology components included in 3GPP Release 14, 15 and 16 specifications. Key technologies discussed include small cell enhancements, device-to-device communication, network solutions, mobility enhancements, machine communications, and coverage enhancements. 5G aims to support higher data rates, lower latency, and more connected devices compared to previous standards. However, challenges remain regarding interference management, efficient medium access control, and optimizing 5G for both human and machine traffic.
Radar Technologies For Automotive 2018 report by Yole Développement Yole Developpement
How will radar sensor technology shape the cars of the future? Prepare for the automotive sensor industry’s golden age, in which radar will be increasingly viewed as a key technology for autonomous vehicles.
AUTOMOTIVE IS EXPERIENCING AN EXPLOSION OF NEW HIGH-TECH APPLICATIONS
Automatic emergency braking, adaptive cruise control, and lane-change assist are some examples of these new applications. Spurred by the New Car Assessment Program, OEMs are designing cars with numerous sensors that enable applications like these. And since most of these new applications are safety-related, the sensors must be highly accurate. This means very tight specifications for object detection and classification, as well as being ultra-reliable: operable in every weather condition, in poor lighting, near or far, and with a wide field of view. Radar technology is well-suited to fulfill most of these requirements. We say “most” because object classification is not currently possible with radar, but certain companies are moving quickly to unlock this capability in imaging radar.
Radar has an impressive technology roadmap allowing for huge resolution improvement as well as device miniaturization and cost reduction. Despite small growth (~3%) in global car sales until 2022, Yole Développement expects an average growth rate of 25% for radar module sales, and an average growth rate of 22% for radar chip sales over the next five years - with autonomous driving being the next long-term driver for radar technology growth.
More information on that report at http://www.i-micronews.com/reports.html
At Analysys Mason (2008) Next Generation Radio Technologiesmehulmite
4G technologies like LTE and WiMAX aim to improve wireless services by providing better coverage, voice quality, data speeds, and revenue for operators. LTE employs OFDM and MIMO to achieve high spectrum efficiency and handle multipath fading, while WiMAX uses OFDM and is optimized for developing markets with limited wired infrastructure but available spectrum. Both technologies have strengths and weaknesses and may coexist, though LTE has broader device and network support currently from major mobile operators.
Similar to RF Front End modules and components for cellphones 2017 - Report by Yole Developpement (20)
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
The report provides a market analysis of the GaAs wafer and epiwafer markets from 2019 to 2025. It forecasts that the GaAs wafer market will increase from $200 million in 2019 to $348 million in 2025, with the largest application segments being RF, photonics, and LED. The open epiwafer market is also analyzed, with IQE and VPEC together comprising almost 80% of the $262 million total market in 2019. Key drivers of growth are discussed for various applications such as 5G adoption for RF and increasing use of VCSELs for 3D sensing and LiDAR.
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
The one million robotic vehicle milestone will be reached by end of the decade: The industrial phase has been launched.
More information on: https://www.i-micronews.com/products/sensors-for-robotic-mobility-2020/
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...Yole Developpement
High-end inertial sensors are the backbone of systems that will enable autonomous transportation and the new space industry.
More information on: https://www.i-micronews.com/products/high-end-inertial-sensors-for-defense-aerospace-and-industrial-applications-2020/
Emerging Non-Volatile Memory 2020 report by Yole DéveloppementYole Developpement
The stand-alone emerging NVM market keeps soaring, led by storage-class memory applications. Meanwhile, foundries are propelling the embedded business.
More info on: https://www.i-micronews.com/products/emerging-non-volatile-memory-2020/
(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...Yole Developpement
High-Performance Computing and cloud gaming are setting the bar for leadership in the high-end CPU and GPU markets.
More info on: https://www.i-micronews.com/products/xpu-high-end-cpu-and-gpu-for-datacenter-applications-2020/
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
Nano-Imprint Technology Trends for Semiconductor Applications 2019 Report by...Yole Developpement
Nano-Imprint Lithography is revived by photonics and biochips as well as front-end memory applications.
More information on: https://www.i-micronews.com/products/nano-imprint-technology-trends-for-semiconductor-applications-2019/
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
Full-RAG: A modern architecture for hyper-personalizationZilliz
Mike Del Balso, CEO & Co-Founder at Tecton, presents "Full RAG," a novel approach to AI recommendation systems, aiming to push beyond the limitations of traditional models through a deep integration of contextual insights and real-time data, leveraging the Retrieval-Augmented Generation architecture. This talk will outline Full RAG's potential to significantly enhance personalization, address engineering challenges such as data management and model training, and introduce data enrichment with reranking as a key solution. Attendees will gain crucial insights into the importance of hyperpersonalization in AI, the capabilities of Full RAG for advanced personalization, and strategies for managing complex data integrations for deploying cutting-edge AI solutions.
GridMate - End to end testing is a critical piece to ensure quality and avoid...ThomasParaiso2
End to end testing is a critical piece to ensure quality and avoid regressions. In this session, we share our journey building an E2E testing pipeline for GridMate components (LWC and Aura) using Cypress, JSForce, FakerJS…
How to Get CNIC Information System with Paksim Ga.pptxdanishmna97
Pakdata Cf is a groundbreaking system designed to streamline and facilitate access to CNIC information. This innovative platform leverages advanced technology to provide users with efficient and secure access to their CNIC details.
GraphSummit Singapore | The Art of the Possible with Graph - Q2 2024Neo4j
Neha Bajwa, Vice President of Product Marketing, Neo4j
Join us as we explore breakthrough innovations enabled by interconnected data and AI. Discover firsthand how organizations use relationships in data to uncover contextual insights and solve our most pressing challenges – from optimizing supply chains, detecting fraud, and improving customer experiences to accelerating drug discoveries.
Encryption in Microsoft 365 - ExpertsLive Netherlands 2024Albert Hoitingh
In this session I delve into the encryption technology used in Microsoft 365 and Microsoft Purview. Including the concepts of Customer Key and Double Key Encryption.
Epistemic Interaction - tuning interfaces to provide information for AI supportAlan Dix
Paper presented at SYNERGY workshop at AVI 2024, Genoa, Italy. 3rd June 2024
https://alandix.com/academic/papers/synergy2024-epistemic/
As machine learning integrates deeper into human-computer interactions, the concept of epistemic interaction emerges, aiming to refine these interactions to enhance system adaptability. This approach encourages minor, intentional adjustments in user behaviour to enrich the data available for system learning. This paper introduces epistemic interaction within the context of human-system communication, illustrating how deliberate interaction design can improve system understanding and adaptation. Through concrete examples, we demonstrate the potential of epistemic interaction to significantly advance human-computer interaction by leveraging intuitive human communication strategies to inform system design and functionality, offering a novel pathway for enriching user-system engagements.
GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using Deplo...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
A tale of scale & speed: How the US Navy is enabling software delivery from l...sonjaschweigert1
Rapid and secure feature delivery is a goal across every application team and every branch of the DoD. The Navy’s DevSecOps platform, Party Barge, has achieved:
- Reduction in onboarding time from 5 weeks to 1 day
- Improved developer experience and productivity through actionable findings and reduction of false positives
- Maintenance of superior security standards and inherent policy enforcement with Authorization to Operate (ATO)
Development teams can ship efficiently and ensure applications are cyber ready for Navy Authorizing Officials (AOs). In this webinar, Sigma Defense and Anchore will give attendees a look behind the scenes and demo secure pipeline automation and security artifacts that speed up application ATO and time to production.
We will cover:
- How to remove silos in DevSecOps
- How to build efficient development pipeline roles and component templates
- How to deliver security artifacts that matter for ATO’s (SBOMs, vulnerability reports, and policy evidence)
- How to streamline operations with automated policy checks on container images
GraphSummit Singapore | The Future of Agility: Supercharging Digital Transfor...Neo4j
Leonard Jayamohan, Partner & Generative AI Lead, Deloitte
This keynote will reveal how Deloitte leverages Neo4j’s graph power for groundbreaking digital twin solutions, achieving a staggering 100x performance boost. Discover the essential role knowledge graphs play in successful generative AI implementations. Plus, get an exclusive look at an innovative Neo4j + Generative AI solution Deloitte is developing in-house.
Sudheer Mechineni, Head of Application Frameworks, Standard Chartered Bank
Discover how Standard Chartered Bank harnessed the power of Neo4j to transform complex data access challenges into a dynamic, scalable graph database solution. This keynote will cover their journey from initial adoption to deploying a fully automated, enterprise-grade causal cluster, highlighting key strategies for modelling organisational changes and ensuring robust disaster recovery. Learn how these innovations have not only enhanced Standard Chartered Bank’s data infrastructure but also positioned them as pioneers in the banking sector’s adoption of graph technology.
Removing Uninteresting Bytes in Software FuzzingAftab Hussain
Imagine a world where software fuzzing, the process of mutating bytes in test seeds to uncover hidden and erroneous program behaviors, becomes faster and more effective. A lot depends on the initial seeds, which can significantly dictate the trajectory of a fuzzing campaign, particularly in terms of how long it takes to uncover interesting behaviour in your code. We introduce DIAR, a technique designed to speedup fuzzing campaigns by pinpointing and eliminating those uninteresting bytes in the seeds. Picture this: instead of wasting valuable resources on meaningless mutations in large, bloated seeds, DIAR removes the unnecessary bytes, streamlining the entire process.
In this work, we equipped AFL, a popular fuzzer, with DIAR and examined two critical Linux libraries -- Libxml's xmllint, a tool for parsing xml documents, and Binutil's readelf, an essential debugging and security analysis command-line tool used to display detailed information about ELF (Executable and Linkable Format). Our preliminary results show that AFL+DIAR does not only discover new paths more quickly but also achieves higher coverage overall. This work thus showcases how starting with lean and optimized seeds can lead to faster, more comprehensive fuzzing campaigns -- and DIAR helps you find such seeds.
- These are slides of the talk given at IEEE International Conference on Software Testing Verification and Validation Workshop, ICSTW 2022.
Unlock the Future of Search with MongoDB Atlas_ Vector Search Unleashed.pdfMalak Abu Hammad
Discover how MongoDB Atlas and vector search technology can revolutionize your application's search capabilities. This comprehensive presentation covers:
* What is Vector Search?
* Importance and benefits of vector search
* Practical use cases across various industries
* Step-by-step implementation guide
* Live demos with code snippets
* Enhancing LLM capabilities with vector search
* Best practices and optimization strategies
Perfect for developers, AI enthusiasts, and tech leaders. Learn how to leverage MongoDB Atlas to deliver highly relevant, context-aware search results, transforming your data retrieval process. Stay ahead in tech innovation and maximize the potential of your applications.
#MongoDB #VectorSearch #AI #SemanticSearch #TechInnovation #DataScience #LLM #MachineLearning #SearchTechnology
DevOps and Testing slides at DASA ConnectKari Kakkonen
My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
Alt. GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using ...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
In the rapidly evolving landscape of technologies, XML continues to play a vital role in structuring, storing, and transporting data across diverse systems. The recent advancements in artificial intelligence (AI) present new methodologies for enhancing XML development workflows, introducing efficiency, automation, and intelligent capabilities. This presentation will outline the scope and perspective of utilizing AI in XML development. The potential benefits and the possible pitfalls will be highlighted, providing a balanced view of the subject.
We will explore the capabilities of AI in understanding XML markup languages and autonomously creating structured XML content. Additionally, we will examine the capacity of AI to enrich plain text with appropriate XML markup. Practical examples and methodological guidelines will be provided to elucidate how AI can be effectively prompted to interpret and generate accurate XML markup.
Further emphasis will be placed on the role of AI in developing XSLT, or schemas such as XSD and Schematron. We will address the techniques and strategies adopted to create prompts for generating code, explaining code, or refactoring the code, and the results achieved.
The discussion will extend to how AI can be used to transform XML content. In particular, the focus will be on the use of AI XPath extension functions in XSLT, Schematron, Schematron Quick Fixes, or for XML content refactoring.
The presentation aims to deliver a comprehensive overview of AI usage in XML development, providing attendees with the necessary knowledge to make informed decisions. Whether you’re at the early stages of adopting AI or considering integrating it in advanced XML development, this presentation will cover all levels of expertise.
By highlighting the potential advantages and challenges of integrating AI with XML development tools and languages, the presentation seeks to inspire thoughtful conversation around the future of XML development. We’ll not only delve into the technical aspects of AI-powered XML development but also discuss practical implications and possible future directions.
Goodbye Windows 11: Make Way for Nitrux Linux 3.5.0!SOFTTECHHUB
As the digital landscape continually evolves, operating systems play a critical role in shaping user experiences and productivity. The launch of Nitrux Linux 3.5.0 marks a significant milestone, offering a robust alternative to traditional systems such as Windows 11. This article delves into the essence of Nitrux Linux 3.5.0, exploring its unique features, advantages, and how it stands as a compelling choice for both casual users and tech enthusiasts.
17. COMPLETE TEARDOWN
WITH:
• Detailed photos
• Precise measurements
• Complete bills-of-
materials for the
modules
• Comparison between
suppliers
• Comparison between
OEMs
Smartphone RF Front-End Module Review
Title: RF Front-End
Module Review
Pages: 295
Date: February 2017
Format: PDF & Excel file
Price: Full report:
EUR 4,990
Bundle offer: EUR 8,890
with RF Front End
Modules and
Components for
Cellphones report by
Yole Développement
Review of RF front-end modules and components found in five flagship
smartphones: Apple iPhone 7 Plus, Samsung Galaxy S7, Huawei P9, LG
G5, and Xiaomi Mi5
communications like GSM, 2G or 3G, as high quality competitors shift focus to
the 4G and 5G market with BAW filters. This comes along with better
integration of all the front-end communication devices, now in just one
module. This is therefore the perfect time to examine every player, and
particularly to compare integration technologies of the original equipment
manufacturers (OEMs) who make smartphones and the RF front-end module
suppliers.
This comparative technology study provides technology data for RF front-end
modules in smartphones. The report includes at least 16 front-end modules and
several components found in five flagship smartphones: the Apple iPhone 7 Plus,
Samsung Galaxy S7 Edge, Huawei P9, LG G5 and Xiaomi Mi5.
After teardowns of a large variety of smartphones, we have extracted and
physically analyzed the main RF modules. We have studied their sizes and
technologies, and present a large panel of OEM technical and economical
choices and an overview of the market. The major players remain
Broadcom/Avago and Qorvo but there are several other players, including
Skyworks, Murata, Epcos/TDK, and we have analyzed their products.
The report includes a description of each component and statistical analyses for
most front-end modules. It also tries to explain the OEMs’ choices and supplier
tendencies. Wi-Fi and Bluetooth module analyses are not covered in this report.
The upcoming 5G communication
technology is creating a new order in the
communication market. All the major RF
front-end players are battling to provide
devices that could be integrated in
smartphones. Not all technologies suit the
5G requirement, but every player could
w i n s o m e t h i n g . T h e r e w i l l b e
opportunities for low cost competitors in
the SAW filter market for low band
18. AUTHORS:
TABLE OF CONTENTS
Overview / Introduction
Company Profile
Smartphone Teardowns
Apple iPhone 7 Plus, Samsung Galaxy S7, Huawei
P9, LG G5, Xiaomi Mi5 Physical Analysis
• Front-End Modules
Package Views and Dimensions
Package Openings
Active Die Views and Dimensions
Power Amplifier
SPxT Switch
RFIC
Passive Die View and Dimensions
SAW Filters
BAW Filters
IPDs
SMD Components
Component Summaries
Area and Section Number Comparison
Comparison Analysis
• Apple vs. Samsung vs. Huawei vs. LG vs. Xiaomi
• Integration Comparison
Stéphane
Elisabeth
Stéphane has a
deep knowledge of
materials chara-
cterizations and electronics
systems. He holds an
engineering degree in electronics
and numerical tech-nology, and a
PhD in materials for micro-
electronics.
Nicolas
Radufe (Lab)
Nicolas is in charge
of physical analysis.
He has deep know-
ledge in chemical and physical
analyses. He previously worked
in microelectronics R&D for
CEA/LETI in Grenoble and for
STMicroelectronics in Crolles.
KEY FEATURES OF THE REPORT
• Market landscape and forecast for 2016-
2022 including revenues, players, and
volumes
• Back to Basics: A detailed description of
each RF device function, their challenges
and key characteristics
• 4G and 5G characteristics and the future
outlook, including QAM, CA, MIMO and
OFDM coding
• Roadmap for technology evolution and
future developments
• RF front-end industry strategy
RELATED REPORT
Date: March 2017
Format: PDF & Excel file
Price: EUR 6,490
Bundle offer: EUR 8,890 with
Smartphone RF Front-End Module
Review by System Plus Consulting
RF Front End Modules and Components for Cellphones, Technology and Market
report by Yole Développement
A dynamic market with high responsivity to technical innovation, the RF front end industry is set to
grow at 14% CAGR to reach $22.7B in 2022.
19. Avago AFEM-9040
Avago’s New Generation
Front-End Module
Qorvo TQF6405 in
iPhone 6s Plus
SMR-BAW High Band Filter
Avago AFEM8030
in iPhone 6s Plus
FBAR-BAW Mid-Band Filter
Avago has introduced a new
generation of film bulk acoustic
resonator (FBAR-BAW) technology
in the Samsung Galaxy S7.
Apple integrates in its
smartphone the innovative Solid
Mounted Resonators developed
by Qorvo.
Apple integrates in its
smartphone the innovative Film
Bulk Acoustic Resonators
developed by Avago.
Pages: 112
Date: June 2016
Full report: EUR 3,290*
Pages: 86
Date: March 2016
Full report: EUR 2,990*
Pages: 90
Date: March 2016
Full report: EUR 2,990*
ANNUAL SUBSCRIPTION OFFER
You can choose to buy over 12
months a set of 3, 4, 5, 7, 10 or
15 Reverse Costing® reports.
Up to 47% discount!
• MEMS & Sensors:
Accelerometer - Compass - Display /
Optics - Environment - Fingerprint -
Gyroscope - IMU/Combo - Light -
Microphone - Oscillator - Pressure sensor
• Power:
GaN - IGBT - MOSFET - Si Diode - SiC
• Systems:
Automotive - Consumer - Energy -
Medical - Telecom
Each year System Plus Consulting releases a comprehensive collection of new reverse engineering &
costing analyses in various domains.
• Imaging:
Infrared - Visible
• Integrated Circuits & RF:
Integrated Circuit (IC) - RF IC
• LEDs:
LED Lamp - UV LED - White/blue LED
• Packaging:
3D Packaging - Embedded - SIP - WLP
Performed by
More than 60 reports released each year on the following topics (considered for 2017):
SYSTEM PLUS CONSULTING RELATED REPORTS
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology
and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using
silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50
collaborators worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics,
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costing analysis
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micronews.com/reports.html
Please process my order for “Smartphone RF Front-End Module Review” Reverse Costing Report
Full RF Module Review report: EUR 4,990*
Bundle with RF Front End Modules and Components for Cellphones report by Yole EUR 8,890*
Bundle of 3 reports: EUR 11,990*
Ref.: SP17316
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The Seller shall by no means be responsible for any delay in respect of article 2.2 above, and including incases where a new event or access to new contradictory information would require for the analyst extra time to
compute or compare the data in order to enable the Seller to deliver a high quality Products.
2.3 The mailing of the Product will occur only upon payment by the Buyer, in accordance with the conditions contained in article 3.
2.4. The mailing is operated through electronic means either by email via the sales department or automatically online via an email/password. If the Product’s electronic delivery format is defective, the Seller undertakes to
replace it at no charge to the Buyer provided that it is informed of the defective formatting within 90 days from the date of the original download or receipt of the Product.
2.5 The person receiving the Products on behalf of the Buyer shall immediately verify the quality of the Products and their conformity to the order. Any claim for apparent defects or for non-conformity shall be sent in
writing to the Seller within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects. .
2.6 No return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. Any Product returned to the Seller without providing prior information to the Seller as required under
article 2.5 shall remain at the Buyer’s risk.
3. Price, invoicing and payment
3.1 Prices are given in the orders corresponding to each Product sold on a unit basis or corresponding to annual subscriptions. They are expressed to be inclusive of all taxes. The prices may be reevaluated from time
to time. The effective price is deemed to be the one applicable at the time of the order.
3.2 Yole may offer a pre release discount for the companies willing to acquire in the future the specific report and agreeing on the fact that the report may be release later than the anticipated release date. In exchange
to this uncertainty, the company will get a discount that can vary from 15% to 10%.
3.3 Payments due by the Buyer shall be sent by cheque payable to Yole Développement, credit card or by electronic transfer to the following account:
HSBC, 1 place de la Bourse 69002 Lyon France
Bank code: 30056
Branch code: 00170
Account n°: 0170 200 1565 87
BIC or SWIFT code: CCFRFRPP
IBAN: FR76 3005 6001 7001 7020 0156 587
To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order.
3.4 Payment is due by the Buyer to the Seller within 30 days from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the latter shall be
entitled to invoice interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L. 441-6 of the French Commercial Code. Our publications (report, database, tool...) are delivered
only after reception of the payment.
3.5 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages.
4. Liabilities
4.1 The Buyer or any other individual or legal person acting on its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the use and
interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement
4.3 In no event shall the Seller be liable for:
a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or information) arising out of
the use of or inability to use the Seller’s website or the Products, or any information provided on the website, or in the Products;
b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof.
4.4All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot
be guaranteed to be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the
liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of
any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in
article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the
orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down
payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take
reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that
any Product will be free from infection.
5. Force majeure
The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties,
equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller.
6. Protection of the Seller’s IPR
6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the
Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as:
- Information storage and retrieval systems;
- Recordings and re-transmittals over any network (including any local area network);
- Use in any timesharing, service bureau, bulletin board or similar arrangement or public display;
- Posting any Product to any other online service (including bulletin boards or the Internet);
- Licensing, leasing, selling, offering for sale or assigning the Product.
6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall
personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the
copyrights and will guaranty that the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a
maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company,
the joint venture done with a third party etc..cannot access the report and should pay a full license price.
7. Termination
7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such
delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without
solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.
8. Miscellaneous
All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due
time.
9. Governing law and jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which
shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.
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