The battle for 5G still rages: integration in-module or with discrete parts?
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2019/
RF Front End modules and components for cellphones 2017 - Report by Yole Deve...Yole Developpement
A dynamic market with high responsivity to technical innovation, the RF front end industry is set to grow at 14% CAGR to reach $22.7B in 2022.
A market that will more than double in six years!
The radio-frequency (RF) front end and components market for cellphones is highly dynamic. From being worth $10.1B last year, it is expected to reach $22.7B in 2022. Such high growth is definitely something that players in other semiconductor markets would envy. However, the growth is not evenly distributed.
Filters represent the biggest business in the RF front end industry, and the value of this business will more than triple from 2016 to 2022. Most of this growth will derive from additional filtering needs from new antennas as well as the need for more filtering functionality due to multiple carrier aggregation (CA).
Power amplifiers (PAs) and low noise amplifiers (LNAs), the second biggest business, will be almost flat over the same period. High-end LTE PA market growth will be balanced by a shrinking 2G/3G market. The LNA market will grow steadily, especially thanks to the addition of new antennas.
Switches, the third biggest business, will double. This market will mainly be driven by antenna switches.
Lastly, antenna tuners, a small business today with an estimated $36M market value, will expand 7.5-fold to reach $272M in 2022. This growth is mainly due to tuning being added to both the main and the diversity antennas.
For more discussion, please visit our website: http://www.i-micronews.com/reports.html
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
The GaN RF market enjoyed a healthy increase in 2015.
2015 was a significant year for the GaN RF industry, with a dramatic increase in wireless infrastructure market sales driven by the massive adoption of LTE networks in China. By year’s end, the total RF GaN market was close to $300M.
Sales will likely not soar as high over the next two years, but growth will continue, mainly driven by increased adoption of GaN technology in the wireless infrastructure and defense markets. A significant boost will occur around 2019 – 2020, led by the implementation of 5G networks. Market size will be multiplied by 2.5 by the end of 2022, posting a CAGR of 14%...
More information on that report at http://www.i-micronews.com/reports.html
Compound Semiconductors,RF, Power Electronics
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
Deep dive analysis of the fourth generation of mid/high band front-end module for 4G and 5G from Broadcom.
More information : https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8200-pamid-in-the-apple-iphone-12-series/
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
RF Front End modules and components for cellphones 2017 - Report by Yole Deve...Yole Developpement
A dynamic market with high responsivity to technical innovation, the RF front end industry is set to grow at 14% CAGR to reach $22.7B in 2022.
A market that will more than double in six years!
The radio-frequency (RF) front end and components market for cellphones is highly dynamic. From being worth $10.1B last year, it is expected to reach $22.7B in 2022. Such high growth is definitely something that players in other semiconductor markets would envy. However, the growth is not evenly distributed.
Filters represent the biggest business in the RF front end industry, and the value of this business will more than triple from 2016 to 2022. Most of this growth will derive from additional filtering needs from new antennas as well as the need for more filtering functionality due to multiple carrier aggregation (CA).
Power amplifiers (PAs) and low noise amplifiers (LNAs), the second biggest business, will be almost flat over the same period. High-end LTE PA market growth will be balanced by a shrinking 2G/3G market. The LNA market will grow steadily, especially thanks to the addition of new antennas.
Switches, the third biggest business, will double. This market will mainly be driven by antenna switches.
Lastly, antenna tuners, a small business today with an estimated $36M market value, will expand 7.5-fold to reach $272M in 2022. This growth is mainly due to tuning being added to both the main and the diversity antennas.
For more discussion, please visit our website: http://www.i-micronews.com/reports.html
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
The GaN RF market enjoyed a healthy increase in 2015.
2015 was a significant year for the GaN RF industry, with a dramatic increase in wireless infrastructure market sales driven by the massive adoption of LTE networks in China. By year’s end, the total RF GaN market was close to $300M.
Sales will likely not soar as high over the next two years, but growth will continue, mainly driven by increased adoption of GaN technology in the wireless infrastructure and defense markets. A significant boost will occur around 2019 – 2020, led by the implementation of 5G networks. Market size will be multiplied by 2.5 by the end of 2022, posting a CAGR of 14%...
More information on that report at http://www.i-micronews.com/reports.html
Compound Semiconductors,RF, Power Electronics
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
Deep dive analysis of the fourth generation of mid/high band front-end module for 4G and 5G from Broadcom.
More information : https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8200-pamid-in-the-apple-iphone-12-series/
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
5G Impact on RF Front-end Module and Connectivity for Cell Phones Report by Y...Yole Developpement
How is 5G enabling new business opportunities despite flat mobile growth?
More information on : https://www.i-micronews.com/category-listing/product/p5g%E2%80%99s-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2018.html
GaN and SiC for power electronics applications 2015 Report by Yole DeveloppementYole Developpement
The SiC market is expected to treble and GaN is expected to explode - if challenges are overcome
In 2014, the SiC chip business was worth more than $133M. As in previous years, power factor correction (PFC) and photovoltaics (PV) are still the leading applications.
SiC diodes represent more than 80% of the market. In 2020, diodes will remain the main contributor across various applications, including electric and hybrid electric vehicles (EV/HEV), PV, PFC, wind, Uninterruptible Power Supplies (UPS) and motor drives.
SiC transistors will grow in parallel with diodes, driven by PV inverters. Challenges must be overcome prior to the adoption of pure SiC solutions for EV power train inverters, which is nevertheless expected by 2020.
Including the growth in both diodes and transistors we expect the total SiC market to more than treble by 2020, reaching $436M...
LiDAR for Automotive and Industrial Applications 2019 by Yole DéveloppementYole Developpement
Is rationalization happening in the LiDAR market?
More information on: https://www.i-micronews.com/produit/lidar-for-automotive-and-industrial-applications-2019/
Technology Manager Andreas Roessler covers 5G basics in this keynote presentation at the RF Lumination 2019 conference in February 2019.
RF Lumination 2019
"Meet 158+ years of RF design & test expertise at one event. If they can't answer your question, it must be a really good question!"
Watch all the presentations here:
https://www.rohde-schwarz-usa.com/RFLuminationContent.html
Andreas Roessler is the Rohde & Schwarz Technology Manager focused on UMTS Long Term Evolution (LTE) and LTE-Advanced. With responsibility for the strategic marketing and product portfolio development for LTE/LTE-Advanced, Andreas follows the standardization process in 3GPP very closely, particularly on core specifications as well as protocol conformance, RRM and RF conformance specifications for device and base stations testing. He graduated from Otto-von-Guericke University in Magdeburg, Germany, and received a Master's Degree in communication engineering.
Photonics applications are driving the GaAs wafer and epiwafer market into a new era.
More information on: https://www.i-micronews.com/led-report/product/vcsels-technology-industry-and-market-trends.html
Status of the MEMS Industry 2018 Market and technology Report by Yole Dévelop...Yole Developpement
Megatrends are invigorating the MEMS industry.
More information on : https://www.i-micronews.com/category-listing/product/status-of-the-mems-industry-2018.html
- There is a rich roadmap of 5G technologies coming in the second half of the 5G decade with the 5G Advanced evolution
- 6G will be the future innovation platform for 2030 and beyond building on the 5G Advanced foundation
- 6G will be more than just a new radio design, expanding the role of AI, sensing and others in the connected intelligent edge
- Qualcomm is leading cutting-edge wireless research across six key technology vectors on the path to 6G
Radar and Wireless for Automotive: Market and Technology Trends 2019 report b...Yole Developpement
The radar and 5G/V2X markets will both grow – one through market pull, the other through prospective enablement.
More information on https://www.i-micronews.com/products/radar-and-v2x-for-automotive-technologies-and-market-trends-2019/
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
5G’s Impact on Telecom Infrastructure 2019 report by Yole DéveloppementYole Developpement
Network evolution and 5G implementation are driving massive structural changes.
More information on: https://www.i-micronews.com/products/5gs-impact-on-telecom-infrastructure-2019/
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
5G Impact on RF Front-end Module and Connectivity for Cell Phones Report by Y...Yole Developpement
How is 5G enabling new business opportunities despite flat mobile growth?
More information on : https://www.i-micronews.com/category-listing/product/p5g%E2%80%99s-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2018.html
GaN and SiC for power electronics applications 2015 Report by Yole DeveloppementYole Developpement
The SiC market is expected to treble and GaN is expected to explode - if challenges are overcome
In 2014, the SiC chip business was worth more than $133M. As in previous years, power factor correction (PFC) and photovoltaics (PV) are still the leading applications.
SiC diodes represent more than 80% of the market. In 2020, diodes will remain the main contributor across various applications, including electric and hybrid electric vehicles (EV/HEV), PV, PFC, wind, Uninterruptible Power Supplies (UPS) and motor drives.
SiC transistors will grow in parallel with diodes, driven by PV inverters. Challenges must be overcome prior to the adoption of pure SiC solutions for EV power train inverters, which is nevertheless expected by 2020.
Including the growth in both diodes and transistors we expect the total SiC market to more than treble by 2020, reaching $436M...
LiDAR for Automotive and Industrial Applications 2019 by Yole DéveloppementYole Developpement
Is rationalization happening in the LiDAR market?
More information on: https://www.i-micronews.com/produit/lidar-for-automotive-and-industrial-applications-2019/
Technology Manager Andreas Roessler covers 5G basics in this keynote presentation at the RF Lumination 2019 conference in February 2019.
RF Lumination 2019
"Meet 158+ years of RF design & test expertise at one event. If they can't answer your question, it must be a really good question!"
Watch all the presentations here:
https://www.rohde-schwarz-usa.com/RFLuminationContent.html
Andreas Roessler is the Rohde & Schwarz Technology Manager focused on UMTS Long Term Evolution (LTE) and LTE-Advanced. With responsibility for the strategic marketing and product portfolio development for LTE/LTE-Advanced, Andreas follows the standardization process in 3GPP very closely, particularly on core specifications as well as protocol conformance, RRM and RF conformance specifications for device and base stations testing. He graduated from Otto-von-Guericke University in Magdeburg, Germany, and received a Master's Degree in communication engineering.
Photonics applications are driving the GaAs wafer and epiwafer market into a new era.
More information on: https://www.i-micronews.com/led-report/product/vcsels-technology-industry-and-market-trends.html
Status of the MEMS Industry 2018 Market and technology Report by Yole Dévelop...Yole Developpement
Megatrends are invigorating the MEMS industry.
More information on : https://www.i-micronews.com/category-listing/product/status-of-the-mems-industry-2018.html
- There is a rich roadmap of 5G technologies coming in the second half of the 5G decade with the 5G Advanced evolution
- 6G will be the future innovation platform for 2030 and beyond building on the 5G Advanced foundation
- 6G will be more than just a new radio design, expanding the role of AI, sensing and others in the connected intelligent edge
- Qualcomm is leading cutting-edge wireless research across six key technology vectors on the path to 6G
Radar and Wireless for Automotive: Market and Technology Trends 2019 report b...Yole Developpement
The radar and 5G/V2X markets will both grow – one through market pull, the other through prospective enablement.
More information on https://www.i-micronews.com/products/radar-and-v2x-for-automotive-technologies-and-market-trends-2019/
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
5G’s Impact on Telecom Infrastructure 2019 report by Yole DéveloppementYole Developpement
Network evolution and 5G implementation are driving massive structural changes.
More information on: https://www.i-micronews.com/products/5gs-impact-on-telecom-infrastructure-2019/
Technical and cost overview of the evolution of radio frequency front-end module technologies integrated in 5G mmWave and Sub-6 GHz Phones.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-2-focus-on-5g-chipset/
Recent research and the current scenario as well as future market potential of "The 5G Wireless Ecosystem: 2015 - 2025 - Technologies, Applications, Verticals, Strategies & Forecasts" globally.
Internet of Things RF Protocols and their Impacts on the Electronics IndustryYole Developpement
The challenge for Radio-Frequency (RF) electronics manufacturers to secure value in the Internet of Things (IoT) industry stays relevant today.
More information on that report at: https://www.i-micronews.com/report/product/internet-of-things-rf-protocols-and-their-impacts-on-the-electronics-industry.html
Antenna for 5G patent landscape 2019 flyerKnowmade
Report’s Key Features
• PDF >120 slides
• Excel file >3,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Patent analysis for main applications (handsets, infrastructures & networks, vehicles) and technologies (MIMO, beamforming, antenna array, mm-wave, monopole antenna, dipole antenna, microstrip antenna, etc.)
• Key patents
• Key players’ IP position, and relative strength of their patent portfolios
• Key players’ IP profile: Samsung Electronics, Oppo Mobile, Huawei, and Intel
• Excel database containing all patents analyzed in this report, including technology and application segmentations
Key points
•
From mobile voice to mobile everywhere7
1. LTE global success
•
LTE subscriptionsdistribution (Q4 2017 –Q4 2021)9
•
Breakdown of mobile customers by country and technology, end-20169
•
China Mobile LTE capexand LTE coverage10
•
Outdoor LTE coverage10
•
≥ 500 Mbps LTE-Advanced networks launched11
•
MNOs ranking by subscriber numbers, end-June 201712
•
Subscriber numbers in leading countries12
•
5G usage scenarios13
•
5G Performance Objectives14
2. 5G
•
5G timeline16
•
5G subscribers by region in 202517
•
5G subscribers forecasts17
•
5G widespread technology enablers18
•
Three scenarions for 5G monetisation, MNO’s view19
3. More spectrum for LTE upgrades and 5G
•
IMT bands, below 6 GHz22
•
IMT bands, above 6 GHz23
•
Potential5G bands worldwidein the 20-45 GHz range24
•
Price of premium licences/spectrum per MHz per pop., for 10 years25
•
Price of 700 MHz licences/spectrum per MHz per pop., for 10 years25
Antenna for 5G patent landscape 2019 sampleKnowmade
Report’s Key Features
• PDF >120 slides
• Excel file >3,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Patent analysis for main applications (handsets, infrastructures & networks, vehicles) and technologies (MIMO, beamforming, antenna array, mm-wave, monopole antenna, dipole antenna, microstrip antenna, etc.)
• Key patents
• Key players’ IP position, and relative strength of their patent portfolios
• Key players’ IP profile: Samsung Electronics, Oppo Mobile, Huawei, and Intel
• Excel database containing all patents analyzed in this report, including technology and application segmentations
While LTE and LTE-Advanced deployments are still underway, mobile operators and vendors have already embarked on R&D initiatives to develop so-called 5G technology, with a vision of commercialization by 2020.
Wafer starts for More than Moore applications 2018 Report by Yole Developpement Yole Developpement
Driven by megatrend markets, More than Moore devices’ overall wafer demand is expected to grow at an almost 10% CAGR from 2017 to 2023.
More information on that report at https://www.i-micronews.com/report/product/wafer-starts-for-more-than-moore-applications.html
Status of the Power Electronics Industry 2019 by Yole DéveloppementYole Developpement
Long term growth of the power electronics market is driving 300mm wafer-based production.
More information on: https://www.i-micronews.com/products/status-of-the-power-electronics-industry-2019/
Methods provides an in-depth, 360° look at key technology areas to educate, inspire and help you drive to new levels of innovation. In this issue, 5G is coming, and big changes are coming with it. We will examine how 5G infrastructure, antenna design and security advantages will shape the engineering landscape.
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
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Major evolutions in substrate, interconnection, and die-attach technologies, driven by EV/HEV, are transforming the power module packaging supply chain.
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Smart TV Buyer Insights Survey 2024 by 91mobiles.pdf91mobiles
91mobiles recently conducted a Smart TV Buyer Insights Survey in which we asked over 3,000 respondents about the TV they own, aspects they look at on a new TV, and their TV buying preferences.
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Software Delivery At the Speed of AI: Inflectra Invests In AI-Powered QualityInflectra
In this insightful webinar, Inflectra explores how artificial intelligence (AI) is transforming software development and testing. Discover how AI-powered tools are revolutionizing every stage of the software development lifecycle (SDLC), from design and prototyping to testing, deployment, and monitoring.
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Learn about the latest enhancements to out-of-the-box document processing – with little to no training required
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👨🏫 Andras Palfi, Senior Product Manager, UiPath
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All of this illustrated with link prediction over knowledge graphs, but the argument is general.
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Have the message received by managers and peers along with a test email for review
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State of ICS and IoT Cyber Threat Landscape Report 2024 previewPrayukth K V
The IoT and OT threat landscape report has been prepared by the Threat Research Team at Sectrio using data from Sectrio, cyber threat intelligence farming facilities spread across over 85 cities around the world. In addition, Sectrio also runs AI-based advanced threat and payload engagement facilities that serve as sinks to attract and engage sophisticated threat actors, and newer malware including new variants and latent threats that are at an earlier stage of development.
The latest edition of the OT/ICS and IoT security Threat Landscape Report 2024 also covers:
State of global ICS asset and network exposure
Sectoral targets and attacks as well as the cost of ransom
Global APT activity, AI usage, actor and tactic profiles, and implications
Rise in volumes of AI-powered cyberattacks
Major cyber events in 2024
Malware and malicious payload trends
Cyberattack types and targets
Vulnerability exploit attempts on CVEs
Attacks on counties – USA
Expansion of bot farms – how, where, and why
In-depth analysis of the cyber threat landscape across North America, South America, Europe, APAC, and the Middle East
Why are attacks on smart factories rising?
Cyber risk predictions
Axis of attacks – Europe
Systemic attacks in the Middle East
Download the full report from here:
https://sectrio.com/resources/ot-threat-landscape-reports/sectrio-releases-ot-ics-and-iot-security-threat-landscape-report-2024/
Key Trends Shaping the Future of Infrastructure.pdfCheryl Hung
Keynote at DIGIT West Expo, Glasgow on 29 May 2024.
Cheryl Hung, ochery.com
Sr Director, Infrastructure Ecosystem, Arm.
The key trends across hardware, cloud and open-source; exploring how these areas are likely to mature and develop over the short and long-term, and then considering how organisations can position themselves to adapt and thrive.
18. Familiarity with the mobile phone’s RF front-end
architecture is critical to understanding this market.
Leveraging System Plus Consulting’s extensive
teardown analysis (more than 50 phone teardowns
realized), Yole Développement (Yole) has built
an overall picture of RF front-end architecture.
The main phone manufacturers differentiate from
each other in the RF field by adopting either an
integrated or a discrete approach. In the former
segment, market leaders Samsung and Apple,
along with smaller OEMs like Sony, LG, Google,
and ZTE, are moving towards integration with
complex RF modules from Broadcom, Skyworks,
Qorvo, Qualcomm, and Murata. “Integrated”
players prefer to focus on the user experience with
innovative features like “Face ID”, wireless charging,
AI camera, gesture recognition, and the human
machine interface, thus leaving most of the RF
front-end’s complexities to the RF module makers.
Meanwhile, markets challengers like Huawei,
Xiaomi, Oppo, and Vivo, which drive as much
volume as the market leaders, favor a discrete
approach whenever possible. This allows them
to keep the RF bill-of-materials (BoM) as low as
possible in order to offer aggressive selling prices
in this competitive market.
A comparison of teardowns for Huawei’s P20
Pro and Samsung’s S10 illustrates these opposing
strategies. The P20 Pro RF board is made of 45
discrete components and four integrated modules
(incorporating 25 components), while the Samsung
S10 comprises 17 discrete components and eight
integrated modules (incorporating 71 components).
Consequently, the BoM for the RF front-end in the
S10 ends up being double that of the P20 Pro, even
though both devices exhibit similar downlink-speed
performance. Also, both devices support more
than 30 bands and use similar technologies, such as
carrier aggregation and 4x4 MIMO.
5G radio’s introduction in mobile phones definitely
adds more complexity to the already complicated
RF front-end, and it is likely to exacerbate the
phenomenon since price pressure on the RF front-
end will be even bigger. Indeed, 5G’s penetration rate
in smartphones will depend not only on network
availability and proposed use-cases, but also on device
affordability at the consumer level. Accordingly, we
can expect a 30% ratio of discrete components in
value to be maintained from 2018-2025.
If LTE and 5G components are cumulated in
5G mobile phones to ensure either the “non-
standalone mode’s” operation or for a 5G non-
covered area to be connected with LTE, then
the question of whether 5G sub-6 GHz and 5G
mmWave will both be integrated in the phone is
not so straightforward. The cost-over-benefit
ratio for the consumer could be too high - plus,
a spectrum-holding analysis of the world’s main
5G’S IMPACT ON RF FRONT-END MODULE
AND CONNECTIVITY FOR CELL PHONES 2019
Market & Technology Report - August 2019
RF FRONT-END MARKET IS DRIVEN BY OEM’S STRATEGY
The battle for 5G still rages: Integration in-module or with discrete parts?
WHAT’S NEW
• Mobile phone units and segmentation
• RF front-end market segmentation
(types of modules and discrete
parts, air standard, connectivity, and
front-end)
• Extensive RF front-end market
share analysis for each type of
module and discrete part
• GPS/GNSS market included in the
connectivity segment
REPORT KEY FEATURES
• RF front-end and connectivity
market forecast 2018-2025, in Mu
and $M
• Market share in $M, per player and
device type
• RF front-end technology breakdown
forecast
• Wafer-start prediction 2018-2025
for compound semiconductor,
silicon-based technologies (CMOS,
SiGe, RFSOI), and piezoelectric
material (LT, LN)
LINKED REPORTS
RF Front-End Module Technical
Comparison 2019
Structural, Process Costing Report by
System Plus Consulting – August 2019
Extensive overview of 100 RF Front-
End modules and components found
in eight leading flagship smartphones
from Apple, Samsung, Huawei, Xiaomi,
and Oppo.
Antenna for 5G and 5G-related
Applications
Patent Landscape Analysis by KnowMade
- April 2019
Players worldwide are racing to develop
and assert their next generation of
antenna devices. On the cusp of the
release of the first 5G devices, get an
insider’s view of players’ IP activities
and their related antenna technology
developments.
Bundle offer available - Contact us for
more information. (Yole Développement, August 2019)
Front-end connectivity architecture status and trends – By major OEM*
*Original Equipment Manufacturer
Discrete IntegratedIntegration scale
Confirmed
Expectation
EntrylevelMid
tier
High
end
Luxury
0% 25% 50% 75% 100%
19. RF front-end and connectivity market forecast – By component
RF front-end supply chain*
5G’S IMPACT ON RF FRONT-END MODULE AND CONNECTIVITY FOR CELL PHONES 2019
AN INTENSIFYING COMPETITIONTOWARDSAN EVOLVING MARKET SHARE
RF FRONT-END CONNECTIVITY MARKET:MORE CONTENTAND COST
PRESSURE
Leveraging System Plus Consulting’s teardown
analysis, a highly detailed market share is provided in
this report. The RF front-end leaders still share 81%
of the market, with Murata leading ahead of Skyworks
and Broadcom. Qualcomm, which is already strong in
LNA, is catching up along with Qorvo, thanks to the
aggregation of TDK Epcos’ filter business. Established
companies like Infineon, Sony, Taiyo Yuden, NXP, and
Wisol also possess a market slice. These companies
generally have manufacturing capabilities for
supplying LNA, switches, tuners, and filters, which
gives OEMs an alternative to the RF front-end market
leaders. Moreover, a variety of fabless companies are
emerging, especially in China. Unisoc RDA, Airoha,
Richwave, Smarter Micro, Huntersun, and Maxscend
are several examples of players scoring more and
more design wins amongst the Chinese OEM brands.
Obviously, foundries and design houses support this
business model for compound semiconductor, silicon,
and even acoustic wave filter.
For each player in the RF front-end, a market share
breakdown by component is included in this report,
along with a company outlook describing each player’s
development strategy for 5G and beyond.
Consumer demand for mobile phones weakened in
2018, resulting in a market decline. In this context,
the competition has intensified, creating an emulation
to push 5G forward. With LTE, RF front-end market
growth came from carrier aggregation and MIMO
technologies. 5G will augment RF front-end market
growth with additional frequency bands, dual-
connectivity implementation, and the transition to
4x4 MIMO in the downlink direction, plus a trend
towards 2x2 MIMO for the uplink. As a result, the
overall RF front-end market (which was $15B in 2018)
will grow at an 8% CAGR, reaching $25.8B by 2025.
Integrated module growth is forecast at an 8% CAGR
from 2018 - 2025, while discrete parts will grow 9%
over the same period. Among discrete parts, antenna
tuner will grow the most (13% CAGR) because of the
combined implementation of higher-frequency bands
and 4x4 MIMO, leading to an increasing number of
antennae and/or antenna tuners.
The fact that 4x4 MIMO will be mandatory for 5G
(at 3.5 GHz and above) will positively impact LNA
component growth for either a discrete approach or
in-module implementation. And on the mmWave side
of 5G, antenna-in-package (AiP) devices have started
generating revenue in 2019, with the U.S. being its first
target. Yole anticipates this market will reach $1.3B
by 2025.
Given the integration of LNA with switches, the
industry is moving to 12” RFSOI, thereby limiting
growth opportunities for silicon germanium. In the
filter domain, the legacy SAW technology will remain
stable, while thin-film SAW, BAW, FBAR, IPD, and
MLC technologies will see growth opportunities.
This report provides a technology breakdown for
each forecasted component, as well as a wafer-start
prediction (by technology platform) up to 2025, thus
highlighting the technology transition associated with
5G.
carriers suggests a divided approach. For example, the
first 5G devices were released with different SKUs,
depending on whether the carrier integrated a sub-6
GHz radio link or an mmWave radio link. Ultimately,
5G could lead to a regionalization phenomenon instead
of being globalized, as was the case earlier for LTE.
(Yole Développement, August 2019)
(Yole Développement, August 2019)
CAGR 2018-2025
+8%
TAM modules RF components for front-end and connectivity
PA module
Receive module
Wi-Fi connectivity module
AiP module
Discrete filter, duplexer,…
Discrete switch LNA
Tuner
$10.4B
CAGR +8%
$5.1B
CAGR 8%
$3.1B
CAGR +6%
$6B
2018
$15B
2025
$25.8B
$2.9B
CAGR 2%
$0.9B
$1.7B
CAGR +9%
$2.5B
$0.5B$3.1B
$1.2B
CAGR +13%
$2B
$1.3B
CAGR +68%
*OEMs (Original Equipment Manufacturer) **Non-exhaustive list of companies
Others
DiscretepartReceive
module
PAmoduleOEM*
None
…
20. MARKET TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)
Active Semi, Airoha, Akoustis, AMKOR, Apple, ASE, Asus, ATT, AwinIC, Broadcom, CanaanTek,
Cavendish Kinetics, China Mobile, China Telecom, China Unicom, Chip Bond, CoolPad, CSMC,
Cypress Semiconductor, EE, Elisa, Etisalat, GlobalFoundries, Google, HH Grace, HiSilicon, HMD
Global, HTC, Huatian, Huawei, Huntersun, Inari Technology, Infineon, Intel, IQE, Itel, JCET,
Jio, JRC, KDDI, KT, Kyocera, Lansus, Lenovo, LG, LG U+, Maxscend, MediaTek, Meizu, Monaco
Telecom, Murata, NationZ, NTT Docomo, NXP, ON Semiconductor, OnePlus, Ooredoo, Oppo,
Orange, Psemi, Qorvo, Qualcomm, Quantenna, RDA, Resonant, Richwave, Samsung, Samsung
Electro Mechanical, SAWNICS, Shoulder, ShunSin technology, SK Telecom, Skyworks, Smarter
Micro, SMIC, SoftBank, Soitec, Sony, SPIL, Spreadtrum, Sprint, ST Microecletronics, STC, Sunrise,
Swisscom, Taiyo Yuden, TCL, TDK EPCOS, Tecno Mobile, Telefonica, Telia, Telstra, TIM, T-Mobile,
Toshiba, TowerJazz, Tpsco, TSMC, UMC, Unisem, USI Vanchip, Verizon, VIVA, Vivo, Vodafone,
WillSemi, WIN Semiconductors, WIPAM, Wisol, Xiaomi, Xpeedic, Yuzhen IC, ZTE, and more.
Glossary and definition 2
Table of contents 4
Report scope 5
What we got right, What we got wrong 9
Executive summary 10
Market forecasts 46
Market forecast in $M by RF component air standard
Component forecast in Mu
Technology breakdown by component in Mu
Wafer start per technology in kw
Market trends 92
5G mobile market dynamics
5G use cases review
Status of network rollout
Current and future 5G spectrum
Market shares and supply chain 121
Smartphone and feature phone market share
Overall RF front end market share
Component per component market share
Players ranking with financial analysis
Company outlook
Status on MA
Ecosystem and business model analysis
Supply chain analysis (IDM, foundry and OSAT)
Technology trends 172
Radio access technology trend
PA technology status
Switch roadmap overview
Filter technology review (BAW vs emerging thin film SAW, IPD)
Antenna tuning technology status
Outlooks212
Conclusions
Related reports
TABLE OF CONTENTS (complete content on i-Micronews.com)
RELATED REPORTS
AUTHORS
Antoine Bonnabel works as a Technology
Market Analyst for the Power Wireless
team of Yole Développement (Yole). He
carries out technical, marketing and strategic
analyses focused on RF devices, related
technologies and markets.
Prior to Yole, Antoine was RD Program
Manager for DelfMEMS (FR), a company
specializing in RF switches and supervised
Intellectual Property and Business Intelligence
activities of this company. In addition, he also
has co-authored several market reports and
is co-inventor of three patents in RF MEMS
design.
Antoine holds a M.Sc. in Microelectronics
from Grenoble Institute of Technologies
(France) and a M.Sc. in Management from
Grenoble Graduate School of Business
(France).
As a Technology Market Analyst, specialized
in RF devices technologies within the Power
Wireless division at Yole Développement
(Yole), Cédric Malaquin is involved in
the development of technology market
reports as well as the production of custom
consulting projects.
Prior his mission at Yole, Cédric first served
Soitecasaprocessintegrationengineerduring
9 years, then as an electrical characterization
engineer during 6 years. He deeply
contributed to FDSOI and RFSOI products
characterization. He has also authored or co-
authored three patents and five international
publications in the semiconductor field.
Cédric graduated from Polytech Lille in
France with an engineering degree in
microelectronics and material sciences.
Benefit from our Bundle Annual Subscription offers and access our analyses at the best available
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Find all our reports on www.i-micronews.com
• 5G’s Impact on Telecom Infrastructure 2019
• RF Front-End Module Technical Comparison 2019
• Advanced RF System-in-Package for Cellphones 2019
• Broadcom AFEM-8092 System-in-Package in the
Apple iPhone Xs/Xr Series
• Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset
World’s First Smartphone Edition
• Antenna for 5G and 5G-related Applications –
Patent Landscape Analysis
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Founded in 1998, Yole Développement (Yole) has grown to become a group of companies providing marketing, technology and strategy consulting, media and
corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using
silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 120 collaborators worldwide covering MEMS and image
sensors, Compound semiconductors, RF Electronics, Solid-state lighting, Displays, Software, Optoelectronics, Microfluidics Medical, Advanced Packaging,
Manufacturing, Power Electronics, Batteries Energy Management and Memory.
The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting,
PISEO, KnowMade and Blumorpho, supports industrial companies, investors and RD organizations worldwide to help them understand markets and follow
technology trends to grow their business.
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