Axis P1375-E Network Camera

©2021 by System Plus Consulting | Axis P1375-E Network Camera | Sample 1
22 Bd Benoni Goullin
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
Axis P1375-E Network Camera
Discover Axis’s high-end product integrating its latest ARTPEC-7 in-house system-on-chip
dedicated to network video and machine learning capabilities.
SP20573 - System report by Benjamin Pussat
Cost Analysis : Benjamin Pussat, Florian Rousseau, Audrey Lahrach
Laboratory : Youssef El Gmili, Peggy Gallois
December 2020 – Sample

Table of Contents
Overview / Introduction 4
o Executive Summary
o Main Chipset
o Supply Chain
o Specifications
o Block Diagram
o Reverse Costing Methodology
Company Profile 13
o Axis Communications
Teardown Analysis 18
o Views and Dimensions of the System
o System Opening
o Electronic Boards
✓ Top Side – High Resolution photos
✓ Top Side – PCB markings
✓ Top Side – Main components markings
✓ Top Side – Main components identification
✓ Top Side – Other components markings
✓ Top Side – Other components identification
✓ Bottom Side – High Resolution photos
✓ Bottom Side – PCB markings
✓ Bottom Side – Main components markings
✓ Bottom Side – Main components identification
✓ Bottom Side – Other components markings
✓ Bottom Side – Other components identification
o Lens Module
Cost Analysis 91
o Accessing the BOM
o PCB Cost
o ICs Cost
o Mechanicals Cost
o BOM Cost – Main Electronic Board
o BOM Cost - Mechanicals
o Material Cost Breakdown by Sub-Assembly
o Material Cost Breakdown by Component Category
o Accessing the Added Value (AV) cost
o Electronic Board Manufacturing Flow
o Details of the Main Electronic Board AV Cost
o Details of the System Assembly AV Cost
o Added-Value Cost Breakdown
o Manufacturing Cost Breakdown
Estimated Manufacturer Price Analysis 130
o Estimation of the Manufacturer Price
Feedbacks 121
System Plus Consulting Services 135

O V E R V I E W
METHODOLOGY

Overview / Introduction
o Executive Summary
o Block Diagram
o Reverse Costing
Methodology
o Glossary
Company Profile & Supply
Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the P1375-E V1 Network
Camera supplied by Axis (website).
For the calculations, for each reference, we estimate the following parameters :
Manufacturing quantity : 100,000 units
Manufacturing years: 2020
Manufacturing country : Thailand
Manufacturer Reference Description
AXIS ARTPEC-7 IC, SoC for Professional HD IP Camera, FCBGA633
SONY IMX327LQRx IC, CMOS Solid-State Image Sensor for Color Cameras, BGA110
MICRON MT53E128M32D2DS-053 IT:A IC, DRAM LPDDR4 4Gb (128Mbx32), WFBGA200 (Qty : 2)
TOSHIBA TH58NVG2S3HBAI4 IC, Flash Memory 4Gb (512Mb x 8) 25ns Parallel, BGA63
BROADCOM B50212EB1IMLG IC, 10/100/1000BASE-T Gigabit Ethernet Transceiver, QFN48
ANALOG DEVICES ADAU1361BCPZ-RL IC, 96kHz 24-Bit Audio Codec with Integrated PLL, VFQFN32
ON SEMICONDUCTOR LC89091JA-AH IC, Digital Audio Interface Receiver, SSOP16
Main Chipset
The main chipset summarizes the main integrated circuit functions found in the system.

o Executive Summary
o Block Diagram
o Reverse Costing
Methodology
o Glossary
Chain
Teardown Analysis
Cost Analysis
Related Reports
About System Plus
System Specifications
Source : Axis.com

o Executive Summary
o Block Diagram
o Reverse Costing
Methodology
o Glossary
Chain
Teardown Analysis
Cost Analysis
Related Reports
About System Plus
Source : Axis.com

o Executive Summary
o Block Diagram
o Reverse Costing
Methodology
o Glossary
Chain
Teardown Analysis
Cost Analysis
Related Reports
About System Plus
Block Diagram – Main Board (Board 1)
The block diagram of the Network Camera is estimated in the following schematics:
P-Iris/Focus CTRL
* : ARTPEC-7 Key Specifications are assumptions

o Executive Summary
o Block Diagram
o Reverse Costing
Methodology
o Glossary
Chain
Teardown Analysis
Cost Analysis
Related Reports
About System Plus
The reverse costing analysis is conducted in several phases:
Reverse Costing Methodology
• The initialization of the analysis
Pictures of the elements to be studied.
Identification of the components.
• Description of the material in the “SYScost+” software
Creation of an “estimation project” of the studied board with SYScost+ software.
Construction of the Bill of Material (BOM).
• Assessing the material
Searching for the price of each reference among distributors and manufacturers.
Assessing the cost of the PCB and of the unaccounted references (unknown by distributors)
The BOM is valued with SYScost+ : price simulation according to the requested quantities.
• Assessing the assembling and test phases
Assembly and test lines are modelized with the SYScost+ software.
The assembly and tests costs are estimated.
• Manufacturing cost & manufacturer price
Estimation of the manufacturing cost & manufacturer price.
• Report
A report is edited.
SYS.cost+©, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More information on the
software can be found at www.systemplus.fr.

o Executive Summary
o Block Diagram
o Reverse Costing
Methodology
o Glossary
Chain
Teardown Analysis
Cost Analysis
Related Reports
About System Plus
Glossary
Acronym Definition
Al Aluminum
FPGA Field-Programmable Gate Array
ASIC Application Specific Integrated Circuit
IC Integrated Circuit
CMOS Complementary Metal–Oxide–Semiconductor
EDX Energy Dispersive X-ray spectroscopy
G&A General & Administrative
R&D Research & Development
BGA Ball Grid Array
LGA Land Grid Array
Ge Germanium
MEMS MicroElectroMechanical Systems
OEM Original Equipment Manufacturer
PCB Printed Circuit Board
ENIG Electroless Nickel Immersion Gold
HASL LF Hot Air Solder Leveling Lead-Free
Se Selenium
Si Silicon
As Arsenic
IR Infrared

COMPANY
P R O F I L E

Chain
Teardown Analysis
Cost Analysis
Related Reports
About System Plus
COMPANY PROFILE – AXIS COMMUNICATIONS
• 2019 Axis Financial Highlights (source):
o Sales revenues : 1 298 649 000 USD
o Gross margin : 630 201 000 USD (48.53%)
o Operating Profit : 176 836 000 USD (13.62%)
1 SEK = 0.11 USD

Chain
Teardown Analysis
Cost Analysis
Related Reports
About System Plus
Source : Axis.com
List of articles : https://www.axis.com/newsroom/press-release/axis-releases-new-network-video-chip-to-boost-security-solutions
https://www.eit.lth.se/fileadmin/eit/courses/eitf35/slides/vlsi_lth_speakernotes_2017_for_distribution.pdf
Source : eit.lth.se

Chain
Teardown Analysis
Cost Analysis
Related Reports
About System Plus
Source : Axis.com

Chain
Teardown Analysis
Cost Analysis
Related Reports
About System Plus
Electronic components (ASIC/ASSP)
Supplier : AXIS
Foundry : TSMC (Taiwan)
PCBs
Manufacturing Country : China
PCBs manufacturer(s) : SUNTAK CCTC
Mechanicals (Plastics/Metal)
Manuf. country : Thailand
Mechanicals manufacturer: N/A
PCB assembly & tests
Assembly country : Thailand
Product assembler : N/A
Final product assembly
Product assembler : N/A
Final product functional test
Product tester : N/A
- In order to deliver a manufacturing price, we propose a simplified supply chain as below. For each section, assumptions about manufacturer or
manufacturing country can be made if no information about manufacturing is founded (PCB, mechanicals, etc).
Supply chain
Electronic components (General)
Suppliers : Broadcom / Micron /
Nexperia / Analog Devices / Texas
Instruments / Hirose / Epson / Etc - Confirmed information (S+C)
- Not confirmed information (S+C)
- No information
COLOR LEGEND :
N/A - Not Applicable
M13VP288IR
Manuf. country : Japan
Lens Module manufacturer: TAMRON
Sensors (CIS)
Manuf. country : Japan
Sensor manufacturer: Sony

TEARDOWN
A N A LY S I S

Chain
Teardown Analysis
o Views & Dimensions
o System Opening
o Electronic Board
o Lenses
Cost Analysis
Related Reports
About System Plus
Global View
Global views of the Network Camera
Total Weight: 2235 g

Chain
Teardown Analysis
o System Opening
o Electronic Board
o Lenses
Cost Analysis
Related Reports
About System Plus
System Opening – Optical Part Removing
Board Cover
130x105x38mm (1.5mm Av. Thick)
PC+ABS, 33.6g
IK10 Tool
64x31.4x3mm (3mm Av. Thick)
ABS (estimated), 1.85g

Chain
Teardown Analysis
o System Opening
o Electronic Board
o Lenses
Cost Analysis
Related Reports
About System Plus
Electronic Board 1 – Top Side – Angled View – High Resolution Photo

Chain
Teardown Analysis
o System Opening
o Electronic Board
o Lenses
Cost Analysis
Related Reports
About System Plus
Electronic Board 1 – Top Side – Main Components Identification

Chain
Teardown Analysis
o System Opening
o Electronic Board
o Lenses
Cost Analysis
Related Reports
About System Plus
Electronic Board 1 – Bottom Side – PCB Markings

Chain
Teardown Analysis
o System Opening
o Electronic Board
o Lenses
Cost Analysis
Related Reports
About System Plus
Lens Module 1 - Dimensions
23.3 mm 15.3 mm
Lens material : Glass
Housing Material : PC-GF30

Chain
Teardown Analysis
o System Opening
o Electronic Board
o Lenses
Cost Analysis
Related Reports
About System Plus
Lens Module 1 – Cross-Section
xx mm
xx mm
xx mm
xxmmxxmmxxmm
Lens material : Glass
Housing Material : PC-GF30

C O S T
ANALYSIS

Chain
Teardown Analysis
Cost Analysis
o Assessing the BOM
o PCB Cost
o IC Cost
o BOM Cost – Electronics
o Material Cost Breakdown
o Added-Value Cost
Related Reports
About System Plus
Assessing the BOM
The material cost corresponds to the purchasing price of the components (either electronic or not), as well as
the mechanical parts, composing the electronic system.
The price search of each reference is realized on the basis of catalogues and web sites of electronic
components distributors and manufacturers. It is often necessary to ask for specific quotations for some
targeted references.
Prices found during our researches among distributors and manufacturers are associated to quantities which
may vary from a few units to several thousands or millions of pieces.
It is therefore mandatory to have reliable simulation rules that can be used for this type of extrapolation. The
simulation rules used in this study come from previous analyses that have been conducted by System Plus
Consulting and take into account parameters such as quantities, different types of distributors and
manufacturers, average profit margin on several types of products. These simulation rules have been
integrated in the SYScost+ software to conduct the calculations.
The report details BOM cost for 100,000 units.
Note : All the prices of components can be modified using the Excel file associated to this report to see their
influences on results.

Chain
Teardown Analysis
Cost Analysis
o Assessing the BOM
o PCB Cost
o IC Cost
o Added-Value Cost
Related Reports
About System Plus
Copper foils 0.0078$ 14.6%
Prepregs 0.0090$ 16.8%
Cores 0.0340$ 63.6%
Material overheads 0.0027$ 5.0%
Total substrate cost 0.0534$ 22.7%
Lamination 0.0046$ 3.8%
Mechanical drilling 0.0212$ 17.7%
Desmear 0.0010$ 0.8%
V-Scoring 0.0004$ 0.4%
Routing 0.0046$ 3.8%
Imaging 0.0228$ 19.1%
PTH metalization 0.0151$ 12.6%
Soldermask 0.0076$ 6.4%
Finishing 0.0312$ 26.1%
Electrical tests 0.0061$ 5.1%
AVI 0.0022$ 1.8%
Visual inspections 0.0013$ 1.1%
Final Quality Control 0.0011$ 0.9%
Packing 0.0005$ 0.4%
Total Process Costs 0.1196$ 50.9%
IPC Class 3 overcosts -$ #DIV/0!
Non-recurring expenses #DIV/0!
Total Other Costs -$
Quantity factor x 1.18
Total Manufacturing Cost 0.2042$ 87.0%
Warranty -$
Indirect OH 0.0041$ 1.7%
Direct OH -$
SG&A 0.0061$ 2.6%
Profit 0.0204$ 8.7%
Estimated Price 0.2348$ per board
Cost
2020
Cost
Substrate costs
Process costs
Other manufacturing costs
Selling price
2020
Cost
2020
Cost
2020
PCB Cost – Electronic Board 2

Chain
Teardown Analysis
Cost Analysis
o Assessing the BOM
o PCB Cost
o IC Cost
o Added-Value Cost
Related Reports
About System Plus
Note : a specific and complete analysis of the technology of the dies should confirm these hypothesis but a such analysis is not included in this report.
Die Structure :
Technology : CMOS active pixel solid-state
Die dimensions : 8.23mm x 5.33mm
Diagonal : 6.46mm
Pad number : 117
Wire bonding number : 116
Pixels Structure :
Pixel area : 5.74mm x 3.34mm
Pixel Pitch : 2.9µm
Total Number : 1979(H)x1115(V) approx. 2.20M pixels
Estimation of the cost of the SONY IMX327LQRx

Chain
Teardown Analysis
Cost Analysis
o Assessing the BOM
o PCB Cost
o IC Cost
o Added-Value Cost
Related Reports
About System Plus
Estimation of the cost of the SONY IMX327LQRx
Cost Breakdown
CIS Die cost $1.45 43.7%
Packaging cost (WB BGA) $0.43 12.9%
Ceramic Cost $0.80 24.1%
Glass substrate $0.15 4.6%
Final test & Calibration cost $0.42 12.7%
Yield losses cost $0.07 2.0%
Component Cost $3.3 100%
Sony Gross Profit $2.72 +45%
Component price $6.03
Final Test Yield 98.00%
Gross Margin 45.0%
2020
Sony
• The component price of the xxxx xxxxxxxxxxx is estimated at $xx.xx for 100K units in 2020.

Chain
Teardown Analysis
Cost Analysis
o Assessing the BOM
o PCB Cost
o IC Cost
o Added-Value Cost
Related Reports
About System Plus
The circuit includes 1 Silicon die assembled into the package.
Die + parts of the substrate.
(X-Ray top view)
Component opening
(Top view)
Die + parts of the substrate.
(X-Ray side view)
Estimation of the cost of the AXIS ARTPEC-7

Chain
Teardown Analysis
Cost Analysis
o Assessing the BOM
o PCB Cost
o IC Cost
o Added-Value Cost
Related Reports
About System Plus
Estimation of the Main blocks: Digital, Analog, SRAM, Flash.
Estimation of the Technology: CMOS 22nm, 11 Metal layers, 2 Polysilicon layers.
Lithography steps : 55
Wafer fab unit: TSMC Fab 15 – wafers 300mm, located in Taichung, Taiwan.
Die dimensions: 6.05mm x6.05mm = 36.6mm²
Pad number : 1507
Estimation of the cost of the AXIS ARTPEC-7

Chain
Teardown Analysis
Cost Analysis
o Assessing the BOM
o PCB Cost
o IC Cost
o Added-Value Cost
Related Reports
About System Plus
BOM Cost – Electronic Board 1 (1/4)

Chain
Teardown Analysis
Cost Analysis
o Assessing the BOM
o PCB Cost
o IC Cost
o Added-Value Cost
Related Reports
About System Plus
Material Cost Breakdown by Component Categories (Details)
M à J

MANUFACTURING
PROCESS FLOW

Chain
Teardown Analysis
Cost Analysis
o Assessing the BOM
o PCB Cost
o IC Cost
o Added-Value Cost
Related Reports
About System Plus
Assessing the Added-Value (AV) Cost
Assessing hypothesis :
The AV Cost, or Added Value Cost, corresponds to the assembly and test costs of sub-systems as well as electronic cards, with their
components, by taking into account :
• The depreciation cost of the machines used in the production line,
• The cost of the operators, technicians and of the production line manager directly linked to the production line of the studied
system,
• The cost of consumables, energy expenses, ground occupation and of the machines maintenance.
Note : The added-value cost calculation of oneBoard and the Final are detailed in the next pages. For details about the added- value of
the other electronic boards, please see the Excel spreadsheet associated to this report.

Chain
Teardown Analysis
Cost Analysis
o Assessing the BOM
o PCB Cost
o IC Cost
o Added-Value Cost
Related Reports
About System Plus
Step n° Step name Step Code Inline step? Side Auto/Manual Step Time (s) Equipment number Equip. Price (USD) Remark
1 Material preparation MP No - M 30s / reference 1 5,000
2 Storage buffer SB Yes - - 5s / board 1 20,000
3 PCB Cleaning C Yes - A 7s / panel 1 20,000
4 Stencil printing SP Yes 1 A 14.9s / panel 1 75,000
5 Solder paste inspection SPI Yes 1 A 10.25s / panel 1 110,000
6 Pick and place SMT x4 P&P Yes 1 A 45k SMT/hour 4 450,000 x4
7 Automated optical inspection AOI Yes 1 A 12s / panel 1 170,000
8 Reflow RF Yes 1 A 240s Cycle 1 125,000
9 Automated optical inspection AOI Yes 1 A 12s / panel 1 170,000
10 Storage buffer SB Yes - - 5s / board - 20,000
11 Automated X-Ray Inspection AXI No 1 A 29s / panel 1 400,000
12 Storage buffer SB Yes - - 5s / board 1 - Same machine as step n°2
13 PCB Cleaning C Yes - A 7s / panel 1 - Same machine as step n°3
14 Stencil printing SP Yes 2 A 14.9s / panel - - Same machine as step n°4
15 Solder paste inspection SPI Yes 2 A 10.25s / panel 1 - Same machine as step n°5
16 Pick and place SMT x4 P&P Yes 2 A 45k SMThour 4 - Same machines as step n°6
17 Automated optical inspection AOI Yes 2 A 12s / panel - - Same machine as step n°7
18 Reflow RF Yes 2 A 240s Cycle - - Same machine as step n°8
19 Automated optical inspection AOI Yes 2 A 12s / panel - - Same machine as step n°9
20 Storage buffer SB Yes - - 5s / board 1 - Same machine as step n°10
21 Automated X-Ray Inspection AXI No 2 A 14s / panel 1 - Same machine as step n°11
22 In-situ test ICT No 1+2 A 43.46s / panel 1 200,000
23/27 Storage buffer SB Yes - - 5s / board 1 20,000
24/28 Automatic THT Insertion ATI Yes 1+2 A 40s / panel 1 200,000
25/29 Selective Wave Soldering SWS Yes 1+2 A 240s Cycle 1 180,000
26/30 Automated optical inspection AOI Yes 1+2 A 21 / panel 1 170,000
31 Storage buffer SB Yes - - 5s / board 1 20,000
32 Depaneling DP No 1+2 A 20s / panel 1 120,000
33 Functional test FCT No 1+2 A 25s / board 1 300,000
34 Board conditioning BC No - M 5s / board 1 3,000
Panel size : 3 Boards Total equipment price : $ 4,128,000
Details of Electronic Board 1 Added-Value (AV) Cost
Details of the Electronic Board assembly process.

Chain
Teardown Analysis
Cost Analysis
o Assessing the BOM
o PCB Cost
o IC Cost
o Added-Value Cost
Related Reports
About System Plus
Added-Value Cost Breakdown

MANUFACTURER
P R I C E

Chain
Teardown Analysis
Cost Analysis
o Manufacturer Price
Related Reports
About System Plus
Estimation of the Manufacturer Price

Chain
Teardown Analysis
Cost Analysis
Related Reports
About System Plus
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
IMAGING
• Cameras and Computing for Surveillance and Security 2020
• Status of CMOS Image Sensor Industry 2020
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
IMAGING
• SP20574 - Hikvision Intelligent Thermal Network Camera
(DS-2TD2166-15 V1)
• IRay Technology 12µm and 17µm Thermal Sensors

COMPANY
SERVICES

Chain
Teardown Analysis
Cost Analysis
Related Reports
About System Plus
o Company services
o Contact
Business Models Fields of Expertise
Custom Analyses
(>130 analyses per year)
Reports
(>60 reports per year)
Costing Tools
Trainings

Chain
Teardown Analysis
Cost Analysis
Related Reports
About System Plus
o Company services
o Contact
Contact
www.systemplus.fr
NANTES
Headquarter
FRANKFURT/MAIN
Europe Sales Office
LYON
YOLE HQ
TOKYO
YOLE KK
GREATER CHINA
YOLE
PHOENIX
YOLE Inc.
KOREA
YOLE
Headquarters
22 bd Benoni Goullin
44200 Nantes
FRANCE
+33 2 40 18 09 16
sales@systemplus.fr
Europe Sales Office
Lizzie LEVENEZ
Frankfurt am Main
GERMANY
+49 151 23 54 41 82
llevenez@systemplus.fr
Asia Sales Office
Takashi ONOZAWA
Tokyo
JAPAN
T : +81 804 371 4887
onozawa@yole.fr
Mavis WANG
TAIWAN
T :+886 979 336 809
wang@yole.fr
America Sales Office
Steve LAFERRIERE
Phoenix, AZ
WESTERN US
T : +1 310 600 8267
laferriere@yole.fr
Chris YOUMAN
EASTERN US & CANADA
T : +1 919 607 9839
chris.youman@yole.fr

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