GaN RF Market: Applications, Players, Technology and Substrates 2020

2020
Sample
From Technologies to Markets
GaN RF Market:
Applications, Players,
Technology and
Substrates 2020
Market and Technology
Report 2020

22
TABLE OF CONTENTS (1/III)
Glossaries & definitions 2
Table of Contents 3
Objective of the report 6
Methodology 7
The authors 8
Companies list 9
What we got right/what we wrong? 10
News/ What happened since last year? 13
Executive Summary 18
1) Context 41
Scope of the report
Historical perspective
Comparison of Market forecasts 2014-2025
2) Market Forecasts 47
RF GaN Devices: Market Size Forecast 2019-2025
RF GaN Devices: Bare die market Size Forecast 2019-2025
RF GaN Devices: Market Breakdown by device type: Discrete & MMIC
RF GaN Devices: Market Breakdown
• Telecom Infrastructure
• Handset applications
• Defense
• Civil Radar & Avionics
• Wired Broadband
• Satellite communications
• RF Energy
RF GaN wafer volume forecast 2019-2025: GaN on SiC vs. GaN on Si
RF GaN devices: Market forecast by technology, GaN on SiC vs. GaN on Si
3) Market trends 62
RF GaN Market segmentation
• Telecom Infrastructure: 67
• Cellular Network structure
• Passive and active antennas massive MIMO
• RF structure of RRH
• 5G frequency bands at macro sites
• Small cells
• Backhaul and last-mile connectivity
• Macrosite technology innovation2019-2025
• Small Cell technology innovation 2019-2025
• GaN implementation by application 2019-2025
• LDMOS vs. GaN technologies
• Semiconductor platform choice by 2019
• Semiconductor platform choice by 2025
• Conclusions
• Handset applications 97
• Evolution of mobile telecommunication technologies
• Global market trends: 5G Impact
• RF Front-end PA evolution
• GaN HBT vs. GaN-on-SiC vs. GaN-on-Si for RFFE PA
• Discussion for GaN-on-Si in 5G handset PA
• What possible future for GaN in 5G Handset market?
• Conclusions
GaN RF Market: Applications, Players, Technology and Substrates 2020 | Sample | www.yole.fr | ©2020

3
TABLE OF CONTENTS (II/III)
• Defense Applications 108
• Military Radar Systems:TowardsAESA architectures
• Military radars: Market Drivers for GaN technology
• Ground-borne military radars using GaN devices
• Airborne military radars using GaN devices
• Shipborne military radars using GaN devices
• Case study:GaN based Defense solution in USA
• Case study:GaN based Defense solution in Europe
• Case study:GaN based Defense solution in Asia
• Electronic Warfare:MarketTrends and drivers for GaN
• Military Communication: Market Trends
• Conclusions
• Civil radar & AvionicsApplications 126
• Commercial avionics and Air Traffic control:Market Trends
• Air traffic control : Market drivers and uses cases for
GaN devices
• Weather Forecast Radars: MarketTrends and drivers for
GaN
• Conclusions
• Wired broadbandApplications 133
• CATV Market
• CATV Market for GaN drivers
• FTTH: Market for GaN drivers
• Conclusions
• Satellite Communications 142
• Satellite Communication:At a glance
• Mobile Satellite Communications market
• Fixed Satellite Communications market
• VSAT:Market trends and drivers for GaN
• Evolution of GaN based SatCom
• GaN based SatCom Implementation: Key players
• Conclusions
• RF Energy Applications 157
• Global market trends:Towards Solid State RF
Energy
• Solid-State cooking: Market drivers for GaN
• Other ISM applications:Market drivers for GaN
• GaN-on-Si bs.GaN-on-SiC
• Conclusions
• Other Applications 168
• Technology and Economic Requirements 170
• Telecom Infrastructure and Handset market
requirements
• Military and SatCom market requirements
• Civil Radar,Wired Broadband,RF Energy market
requirements
• GaN RF applicative markets: Conclusions

4
TABLE OF CONTENTS (III/III)
Market Share and Supply Chain 167
• Main RF players and their target applications
• Global industrial supply chain:GaN-on-SiC
• Global industrial supply chain:GaN-on-Si capability
• Global industrial supply chain:GaN-on-Diamond
• Main Epihouses and Foundries with GaN epitaxy capabilities
• GaN RF Foundry technology comparison
• GaN RF Company Profiles
• Impact of Covid-19 on RF GaN Business
• Impact of US-China trade war on GaN RF business
• Market Share of RF GaN players
• Conclusions
Technology Trends 200
• Technology Description 202
• RF Components overview
• GaN’s added values
• Classification of GaN RF technology: Split by technology
• Classification of GaN RF technology: Split by key players
• Power density vs. Frequency vs.Gate length
• GaN discrete HEMTs
• GaN discrete MMICs
• GaN based high power modules
• GaN based high frequency modules
• GaN Front-end modules
• Commercially available GaN RF PA devices
• Evolution of GaN RF technologies
• GaN RF Packaging 220
• GaN RF device packaging trends
• Diamond Template Heat Sink
• GaN device packaging as of Q1-2020
• GaN device packaging in the future
• GaN RF packaging roadmap
• GaN RF Different substrate platforms 223
• Properties of potential substrates
• GaN-on-Diamond technology
• Evolution GaN-on-Diamond technology
• GaN-on-Diamond for BTS market
• GaN-on-XX:Competitive analysis
• GaN-on-XX:HEMT technology analysis
• Conclusions
General Conclusions 246
• GaN-on-SiC vs GaN-on-Si:What to expect?
• Applicative market overview:Take aways
• GaN RF Industry:Main challenges as of Q1-2020
• GaN-on-SiC & GaN-on-Si & GaN-on-Diamond
• Prospects
Yole Corporate Presentation

55
• Provide an overview of the RF GaN market.
• Present the different players in different markets,along with
their product ranges and technologies.
• Outline market access - market size evolution from 2019 -
2025,and technology split.
• Highlight the main technologies in the different application
markets.
• Explain the needs of different RF markets and the
corresponding impact on the needs for different technologies,
along with geographic specificities.
REPORT OBJECTIVES
Ecosystem
Market
Techno

66
METHODOLOGIES & DEFINITIONS
Market
ASP (in $)
Revenue (in $M)
Epiwafer market volume and revenue
Yole’s market forecast model is based on the matching of several sources:
Information
Aggregation
Preexisting
information

7
Biographies & Contacts
ABOUT THE AUTHORS
Ezgi DOGMUS
Dr. Ahmed Ben-Slimane is Technology & Market Analyst, Compound Semiconductors at Yole Développement (Yole). As part of the
Power & Telecom team, Ahmed is engaged in the development of a dedicated collection of market & technology reports and dedicated
monitor. Previously, he worked as an epitaxy (MBE/MOCVD) & fabrication process engineer for GaAs based photovoltaic applications at
TOTAL and IPVF (Paris-Saclay, France). Ahmed also completed his PhD in Material Engineering from KAUST (Saudi Arabia). Ahmed
obtained his Master’s in Electronics Engineering from INPG (Grenoble, France)
Contact: ahmed.ben-slimane@yole.fr
Ahmed BEN-SLIMANE
Dr. Ezgi Dogmus is Technology & Market Analyst in the Power & Telecom Division at Yole, contributing to the development of
compound semiconductor activities with a dedicated collection of market & technology reports as well as custom consulting projects.
Prior to Yole, Ezgi was involved in the development of GaN-based solutions at IEMN (Lille, France). Ezgi also participated in numerous
international conferences and has authored or co-authored more than 12 papers. After graduating from University of Augsburg
(Germany) and Grenoble Institute ofTechnology (France), Dr Dogmus received her PhD in Microelectronics at IEMN (France).
Contact: ezgi.dogmus@yole.fr

8
Wafer Epiwafer Device Module System
End
applications
REPORT SCOPE (I/II)
• Provide a clear understanding of the GaN RF industry, covering markets from wafer to discrete
HEMT and MMIC (units and revenue).
Report focus
• Analyze the GaN RF industry’s market drivers/bottlenecks by exploring
GaN adoption in different end-applications.
• Understand different technology platforms such as GaN-on-SiC,GaN-on-
Si, and GaN-on-Diamond and the commercial status of GaN power
devices.
• Describe the industry playground and understand the market’s dynamics.

99
REPORT SCOPE (II/II)
GaN RF
market
Applicative
markets
Telecom infrastructure
Handset
Military
Civil radar
Wired broadband
Satcom
RF energy
Supply chain
Technology
Discrete vs.MMIC
GaN on SiC/GaN on
Si/GaN on diamond/GaN
on GaN
Packaging
This report focuses on
GaN for RF applications.
Power applications are
not included.They are
addressed in our Power
GaN 2019 and soon to
be released 2020 report.

10
PACKAGED GAN RF DEVICE MARKET FORECAST
Split by application
The overall
GaN RF device
market will
increase from
$740M in 2019
to around $2B
by 2025,driven
mainly by
military radar
applications.

1111
RF GaN WAFERVOLUME FORECAST
Split by substrate technology, device technology
And
more!

12
TECHNOLOGY CHOICE FOR MACROSITES
Competitive analysis between GaN and LDMOS
GaN or
LDMOS?
Pros for
GaN
Cons for
GaN
Low maturity
(memory effects,
linearization issues)
Limited number of
qualified GaN device
suppliers
High Cost
Limited substrate
size (GaN-on-SiC)
High Bandwidth
(>150MHz)
High thermal
conductivity
High power
output
High PAE, broad-
band PA
Pros for
LDMOS
Cons for
LDMOS
Lower PAE
Low thermal
conductivity
Lower power
output
Limited bandwidth
(<150MHz)
High number of
suppliers
Low cost
Mature technology
Continuous
performance
improvement
Key parameters forAAS systems
Key parameters for RRH systems
GaN LDMOS

13
What impact on
RF GaN
business?
What impact on RF GaN business?
COVID-19 OUTBREAK

1515
RF GAN DEVICE TECHNOLOGYAND SUPPLY CHAIN
And more!

16
Contact our
SalesTeam
for more
information
5G’s Impact on Telecom
Infrastructure 2019
5G’s Impact on RF Front-End
Module and Connectivity for
Cell phones 2019
Active and Passive Antenna
Systems for Telecom
Infrastructure 2019
Compound Semiconductor
Quarterly Market Monitor
YOLE GROUP OF COMPANIES RELATED REPORTS
Yole Développement

17
Contact our
SalesTeam
for more
information
17
Contact our
SalesTeam
for more
information
Qorvo QPF4006 39GHz GaN
MMIC Front End Module
MACOM NPA1008 RF Power
Amplifier with GaN-on-Si
HEMT
YOLE GROUP OF COMPANIES RELATED REPORTS
System Plus Consulting

CONTACT INFORMATION
oCONSULTINGANDSPECIFICANALYSIS,REPORT BUSINESS
o North America:
• Steve LaFerriere, Senior Sales Director for Western US & Canada
Email: steve.laferriere@yole.fr – + 1 310 600-8267
• Chris Youman, Senior Sales Director for Eastern US & Canada
Email: chris.youman@yole.fr – +1 919 607 9839
o Japan & Rest ofAsia:
• Takashi Onozawa, General Manager,Asia Business Development
(India & ROA)
Email: takashi.onozawa@yole.fr - +81 34405-9204
• Miho Ohtake, Account Manager (Japan)
Email: miho.ohtake@yole.fr - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Japan & Singapore)
Email: itsuyo.oshiba@yole.fr - +81-80-3577-3042
o Korea: Peter Ok, Business Development Director
Email: peter.ok@yole.fr - +82 10 4089 0233
o Greater China: MavisWang, Director of Greater China Business
Development
Email: mavis.wang@yole.fr - +886 979 336 809
o Europe: Lizzie Levenez,EMEA Business Development Manager
Email: lizzie.levenez@yole.fr - +49 15 123 544 182
o RoW: Jean-Christophe Eloy,CEO & President,Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
oFINANCIAL SERVICES (in partnershipwithWoodsideCapital
Partners)
o Jean-Christophe Eloy,CEO & President
Email: eloy@yole.fr - +33 4 72 83 01 80
o Ivan Donaldson,VP of Financial Market Development
Email: ivan.donaldson@yole.fr - +1 208 850 3914
oCUSTOM PROJECT SERVICES
o Jérome Azémar,Technical Project Development Director
Email: jerome.azemar@yole.fr - +33 6 27 68 69 33
oGENERAL
o CamilleVeyrier, Director, Marketing & Communication
Email: camille.veyrier@yole.fr - +33 472 83 01 01
o Sandrine Leroy, Director, Public Relations
Email: sandrine.leroy@yole.fr - +33 4 72 83 01 89 / +33 6 33 11 61 55
o Email: info@yole.fr - +33 4 72 83 01 80
Follow us on
About Yole Développement | www.yole.fr | ©2020

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