Advanced RF System-in-Package for Cellphones 2019

Sample
© 2019
From Technologies to Market
Advanced RF
System-in-Package
for Cellphones 2019

2Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019
o RF SiP packaging 81
• Technology & trends
• Interconnection trends
• Challenges & requirements for 5G
• Antenna in package
• Roadmap
• EMI Shielding
o Packaging substrate materials for
5G 150
o Players and supply chain 170
• Player landscape and positioning
• Company strategies
TABLE OF CONTENTS
o Introduction 3
• Methodology
• Report synergies
• Objectives, scope, definitions
• Advanced packaging platforms
o Executive summary _______18
o Market drivers and dynamics _45
• Evolution of cellular networks
• Nature of 5G
o Disruptions and opportunities
o RF SiP in smartphones 66
o Architectures
o Trend for 5G
o Market forecasts 189
• Cellphone forecast by type & air
standards
• RF components packaging market
at wafer-level & SiP level
• RF SiP Forecasts in units & market
• By cellphones category
• By air standards
• By types of SiP modules
• Wafer starts for RF SiP
• Interconnects trend forecast
• OSATs vs IDMs packaging market
trend
o Conclusion 221
o Yole Développement presentation
225

ABOUT THE AUTHOR
Biography & contact
Santosh Kumar
Santosh Kumar is currently working as Principal Analyst and Director Packaging,Assembly & Substrates,Yole Korea. He is
involved in the market, technology and strategic analysis of the microelectronic assembly and packaging technologies. His main
interest areas are advanced IC packaging technology including equipment & materials. He is the author of several reports on fan-
out / fan-inWLP, flip chip, and 3D/2.5D packaging.
He received the bachelor and master degree in engineering from the Indian Institute ofTechnology (IIT), Roorkee and University
of Seoul respectively. He has published more than 40 papers in peer reviewed journals and has obtained 2 patents. He has
presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging.
contact:kumar@yole.fr

COMPANIES CITED IN THE REPORT
Amkor (J-Devices, Nanium),Acco,Apple,ASE Group,AT&T,Avago Technologies, Broadcom, Cavendish Kinetics, Cisco, Deca
Technologies, Ericsson, GLOBALFOUNDRIES, Google, HiSilicon, Huawei, Infineon, Intel, JCET/STATS ChipPAC, Lenovo, LG,
Marvell, Mediatek, Nepes, NXP Semiconductors (Freescale), Murata, NTT Docomo, ON Semiconductor, OPPO, Panasonic,
Peregrine Semiconductor/Murata, Powertech Technology, Qorvo (RFMD,Triquint), Qualcomm (RF360), Samsung, Skyworks
Solutions, Soitec, Spreadtrum, SPIL, Sprint,TDK-EPCOS,TSMC,Wisol, Xiaomi, ZTE and more…
(non-exhaustive list)

REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology

REPORT METHODOLOGY
Technology analysis methodology Information collection

WHO SHOULD BE INTERESTED IN THIS REPORT?
RF component manufacturers
• Evaluate market potential of future technologies and products
• Understand the differentiated value of your products and
technologies in this market
• Build a roadmap for modules: which type of modules?When?
• Identify new business opportunities
• Identify potential strategic partners or technology providers
• Monitor and benchmark your competitor’s advancements
RF foundries, material and equipment suppliers,
packaging houses
• Understand what are the components and technologies that will
drive the volumes in 2023
• Identify new business opportunities and prospects
RF and component specialists (manufacturers,
fabless), transceiver, modem, software vendors…
• Spot new opportunities and define diversification strategies linked
to RF components
Mobile phone OEMs
• Evaluate market potential of future technologies and products to
differentiate your products
• Evaluate the benefits of using these new technologies in your end
system, design architectures for the next generation of systems
• Screen potential new suppliers able to provide new functionalities,
or cost and size savings
R&D centers
• Assess market potential and trends about future technologies and
products
• Distinguish the best candidates for technology transfer
Financial & strategic investors
• Understand the structure and value chain of RF cellular
technology
• Estimate the potential of new technologies such as SOI, RF
MEMS,…
• Get the list of the main key players and emerging start-ups of this
industry worldwide

KEY FEATURES OF THIS REPORT
Market overview
o Drivers and dynamics for 5G flavors: 5G mmWave and 5G sub 6 GHz
o Disruptions and opportunities thereof
o Focus on various SiP architectures in RF Front-End of cellphones
o Focus on both cellular and connectivity RF Front End modules
o Market forecast to include both wafer level & SiP level revenue
o RF Front End SiP forecast in Revenue,Wafers, Units by
o Cell phone category/type
o By cellular & Wi-Fi standards
o By various types of RF Front End SiPs
o Interconnects trends forecsat for RF SiP
Technology trends and forecasts
o RF Front-End multi-die System-in-Package challenges and technology
requirements for 5G sub 6 GHz and 5G mmWave (>24 GHz) bands
o 5G SiP packaging roadmaps for smartphone Front-End
o Packaging trends for both cellular & connectivity modules
o Antenna in Package (AiP) trends for 5G mmWave
o Substrate trends for 5G mmWave
o Shielding trends
o RF SiP Revenue,Wafer and Unit forecasts
Supply chain analysis
• Supply chain changes in the new 5G era
• RF SiP assembly detailed supply chain of various players
• Strategies and outlook of current RF SiP manufacturers
• New entries and supply chain disruptions for mmWave packaging
• Substrate supply chain
The “RF SiP for Cellphones 2019” is the update of the of the “Advanced RF SiP for Cellphones 2017”
report.The objectives of the report are as follows:

WHAT IS NEW COMPARED TO 2017 REPORT (1/2) ?
• In 2017 RF SiP report, only PAMiD module forecast is covered. The current report extend the RF Front End SiP
scope to include all RF Front End SiP for both cellular & connectivity function in cell phone:
• Cellular
• PAMiD (Power Amplifier Module with Integrated Duplexer)
• PAM (Power Amplifier Module)
• Rx DM (Receive Diversity Module)
• ASM (switchplexer) (Antenna Switch Module)
• Antennaplexers (multiplexer)
• LMM (Low noise amplifier - multiplexer module)
• MMMB PA (Multi-Mode, Multi-Band Power Amplifier)
• mmW FEM
• Connectivity
• WiFi FEM
• WiGig FEM

WHAT IS NEW COMPARED TO 2017 REPORT (2/2) ?
• Packaging trend covering both wafer level packaging & SiP
• Interconnect trends for various components in RF SiP
• RF Front End SiP forecast in revenue, wafers, units by
o Cell phone category/type
o By cellular &Wi-Fi standards
o By various types of RF Front End SiPs
• Antenna in Package (AiP) trends for 5G mmWave application
• Substrate trends for 5G
• RF SiP assembly detailed supply chain of various players including substrate supply chain
• Packaging roadmap and challenges for 5G sub 6Ghz & mmWave applications

SYSTEM INTEGRATION LEVELS
iPhone X
LEVEL 3:
End
Device/Equipment
LEVEL 2:
Device/Equipment
board
iPhone X PCB
Broadcom RF SiP
in the iPhone X
LEVEL 1:
Semiconductor
Packaging
LEVEL 0:
Semiconductor
Die/Wafer
Power amplifier in
Broadcom RF SiP
Semiconductor
wafer
LEVEL 1+2:
Semiconductor Package + Board
Semiconductor
package
Board (PCB)
Si dies
Package Substrate

KEY TERM DEFINITIONS
• NOTE:
• From a logical viewpoint, the following terms are highly interchangeable and their usage is unfortunately not consistent
throughout the industry
• In order to avoid confusion and enable systematic segmentation, Yole Développement uses the following definitions
• Module: A fairly general term that usually refers to separate circuit(s)/die(s) or component(s) that form a whole due to
functional purpose or special features
• MCM: Multi-Chip-Module, a module containing multiple packages as final components (often, the whole module can be again
overmolded, lided or differently encapsulated)
• MCP: Multi-Chip-Package, any package with multiple dies, with or without integrated passives
• SiP: System-in-Package, strictly speaking, needs to be a type of system, containing 2 or more dies with different functionality, with
or without integrated passives. By definition, an SiP would be a type of multi-die package
NOTE: In this report, a System-In-Package is viewed from a packaging perspective, where the main challenge is integrating multiple dies,
regardless of their functionality. Therefore, in order to simplify and keep the emphasis on packaging technologies, the decision has been taken
to treat all multi-die packages as SiP, even if they do not strictly adhere to a definition of a system. In that sense, it would be fully correct just
to use the term multi-die packages but due to the commonly rooted usage of the term SiP in the industry, in this report SiP is used instead of
multi-die package. For example multiple dies of the same functionality in one package would still be considered as SiP. Furthermore, while it’s
often the case that SiPs include also passives, lack of passives would not change the SiP definition.

KEY TERM DEFINITIONS
• PCB: Printed Circuit Board, abbreviation commonly used for system boards – Yole Développement makes a distinction between
PCB (boards) and semiconductor package substrates (also sometimes referred to as IC substrates)
• Substrate: While a substrate can be considered on various system levels, (i.e. a transistor Si bulk substrate), the term substrate
is here used for semiconductor package substrates (sometimes referred to also as IC substrate), which are package components
between the die and PCB built using semi-additive processing and lamination/build up technology, namely WB/FC package
substrates within FC CSP/BGA or WB CSP/BGA packages
• Thin film RDL: Particular form of redistribution layer formed by thin film technologies, refers to RDLs of Fan-In and Fan-Out
WLP/PLP
• Interposer: Technically, any kind of substrate/RDL has the function of “interposing” between the die and PCB, however for
practical purposes, the term interposer is used for additional interconnect components on top of a substrate, namely Si and
Glass interposers
• Front-End Module (FEM): A multi die package, placed between the transceiver and the antenna that typically consists of filters,
duplexers and switches, not necessarily a power amplifier
• Power-Amplifier Module (PAM): Essentially, a multi-die package of amplifiers but can integrate all components of a FEM as well
NOTE: For easier understanding and due to common usage in the industry, in this report FEM refers to a multi-die package that also contains
a power amplifiers. Therefore, the term FEM is used for multi-die packages that contain filters, switches, duplexers and power amplifiers
(FEMiD or PAMiD can be formal variations of the term FEM)

SCOPE OF THE REPORT
RF Front-
End SiP
packaging for
mobiles
Mobile phones
Mobile Infrastructure
RF front-end components (PA, LNA, filters, switches, antenna tuners)
RF Front-End packaging (FEM SiPs)
2G, 3G, 4G, 5G technologies
Modems, transceivers, baseband processors,Wi-fi & Bluetooth modules…
Antennas, IPDs, …
Topics NOT included in the report
Focus of the report
Main focus

RF PACKAGING OVERVIEW
<1W1-100W100-1000W
Ceramic lid with Cu flange
Over molded plastic with Cu flange
Power(W)
Frequency (GHz)
6 60 >100
Plastic leadframe (QFN) packages
28 39 77
>1000W
Power modules
WL CSPQFN FO WLPWB/FC CSP
2.5D interposer
Ceramic leadframe
(QFN) packages

RF PACKAGING OVERVIEW
<1W1-100W100-1000W
Ceramic lid with Cu flange
Over molded plastic with Cu flange
Power(W)
Frequency (GHz)
6 60 >100
Plastic leadframe
(QFN) packages
28 39 77
>1000W
Power modules
WL CSPQFN FO WLPWB/FC CSP
2.5D interposer
Ceramic leadframe
(QFN) packages
Focus of this report!
Advanced packages
for RF devices in
smartphone Front-
Ends

LTE-A
Pro
CELLULAR TECHNOLOGY DEVELOPMENT
From 2G to 5G: Less than a 30 years’ journey
1992 1997 2001 2007 2010 2013 2018 2020
GSM GPRS EDGE
CDMA CDMA2000 1xRTT CDMA2000
1xEV-DO
WCDMA
TD-SCDMA
TD-CDMA
All belong
to UMTS
technology
EV-DO Rev
A/B/C
HSPA HSPA+
TD-HSPA
TDD-LTE
FDD-LTE
TDD-
LTE-
Advanced
FDD-
LTE-
Advanced
5G sub-6GHz 5G mmWave
2G 2.5G 2.75G/Pre-3G 3G 3.5G 3.9G/Pre-4G 4G Pre-5G 5G4.5G
Other standards from IEEE family
includingWiMAX and iBurst
It takes around 10 years between two cellular generations, including a long transition phase with intermediate technologies.
Will be a globally
unified standard!

2025
2024
2023
2022
2021
2020
2019
2018
2017
0
0.3
0.5
1
2
3
4
5
10
15
20
Frequency(GHz)
APPLICATION MAPPING
5G use cases
extend far
beyond mobile
phone, from IoT
to autonomous
vehicle, creating
new challenges
for the network
in terms of data
rate and latency
agility. 4K video streaming
New Gaming Content
Wireless VR
AR
Port Management
Medical Robot
Industrial Automation
Smart City
Remote Surveillance
360° Video Telepresence
Drone Delivery
Autonomous Vehicle
Agriculture
Real-time Translation
Advanced AI assistant
Connected
Wearable
Cloud Computing
Connected Home
Smart Grid
Asset Tracking
Shared Utilities
Robotic Service
SUB-1
GHZ
SUB-6
GHZ
MMWAVE
(>24GHZ)

DIFFERENT PATH, DIFFERENT USE CASES
Mobile broadband
driven by down/up link
data rate race required
for video: multi Giga bit
UE devices and routers
penetrating the market.
IoT devices spread
through various market
segments (consumer,
industrial, automotive,
health, …) mostly
driven by the data
quest.
Courtesy of U-Blox
Cat 21
Mobile broadband
Mostly video driven
Mass market
IoT devices
Data centric (tracking, health, survey, …)
Plenty of different use cases
Huge market potential

SMARTPHONE COMPONENTS FOUND IN SiP
Application processor
(PoP)
Memory
storage
TouchscreenBattery
Front End
Module
Transceiver
Front End
Module
LNA
Antenna
Switch
Module
PA
Modem
Front
End
Module
Antenna
Switch
Module
LNA
GPS
ISP
NFC
controller
NFC
booster
WiFi/BT/FMPA
WiFi FEM
PMU
PMU
LCD
TS
controller
Display
Driver
LED Flash
driver
LED Flash
Camera
Front
Camera
Back
MEMS mic
MEMS mic
Audio
codec
3-axis
accelerometer
6-axis IMU
Compass
GyroPressure
Barometer
Heart rate
Tuner
USB/charger
Filter /
Duplexer
In SiP Not in SiP

RF FRONT-END MODULE DEFINITION
Front-End Module with Integrated Duplexer (FEMiD) and Power Amplifier Module with Integrated Duplexer (PAMiD)
An RF
FEM can
include power
amplifiers (PA)
or low noise
amplifiers
(LNA), filters,
switches and
an antenna
tuner.
Courtesy of Qualcomm, modified byYole
RF FEM in a cellular handset

RF SIP PACKAGING
Various
process
modules used
in SiP assembly
SiP
assembly
SMT
Wire
bond
Molding
Shielding
Inspection
& Test
BGA/LGA

MOBILE RF FEM PACKAGE TREND

RF FRONT END ARCHITECTURE- HIGH END PHONE (5G MM WAVE)
• RF front end has
been complexified
since integration of
new technologies
such as Carrier
Aggregation, MIMO
and later on dual
connectivity.
mmWave
connectivity will
add another RF
path to the UE.
2G PAM
3G/LTE LB PAM
Wi-Fi/BT module
3G/LTE PAM MHB
Diversity receive
Diversity receive
Diversity receiveGPS module
Multiplexer
CA
Antennaplexer
MIMO
5G PAM
Baseband
Modem
Transceiver
(integrated with PMIC)
Enveloppe
Tracker
mmWave AiP
mmWave baseband
modem
May be integrated
4x4MIMODL
LNA
FilterLNA
PA Filter
Filter
Filter
Tuner
Tuner
Tuner
Tuner
May be shared
2x2MIMODL
SiP technology Antenna+RF
transceiver+PMIC

INTERCONNECTS IN RF SIP
Different
interconnects
in SiP
Interconnects
in RF SiP
Flip-chip
( Bump)
Solder
Paste printing Ball drop Plated
Cu pillar
(plated)
Au bump
(plated/stud)
Wire-bond
TSV + RDL+
Flip-chip
TSV + Wire
bond
Power Amplifiers, BAW
Filters, Switches
BAW Filters Power AmplifiersPower Amplifiers,
Switches, Filters
SAW filters,
BAW filters
FiltersFilters

TECHNOLOGY TOOLBOX FOR RF SIP FOR 5G MOBILE
Packaging
innovations
needed at
various levels
Double side
assembly
Double side mold
Embedded active
& passives
Conformal &
compartmental
shielding
Thin substrate
Miniaturized
passive
components
Antenna in
package
integration
Low loss materials

ANTENNA KEY PARAMETERS
Antenna
parameters Antenna
key
parameters
Effective area
Gain
BandwidthEfficiency
Polarization

ANTENNA FOR 5G MM-WAVE SMARTPHONES
Considerations
for antenna for
5G mm-Wave
smartphones

Stability of Electrical
and Physical
Properties against
Temperature and
Humidity Variation
Design Rule
Capability
Multilayer Capability
Process tolerances
Electrical Properties
vs. Frequency
Panel Size, Process
Throughput and
Cost
Manufacturing
Supply Chain
Readiness
SUBSTRATE MATERIALS FOR MM WAVE APPLICATION
Key parameters for 5g substrate
Various
parameters
have to keep
in mind to
select
substrate for
5G
application

RF FRONT-END ECOSYSTEM COMPLEXITY

CELLPHONE AIR INTERFACE STANDARD DEVELOPMENT
Despite a slow
down in mobile
market growth,
RF Front-End
market is still
expected to
increase
because of
complexity
encountered in
LTE-A Pro and
5G sub 6.

ASSEMBLY / PACKAGING MARKET FOR RF SIP FOR MOBILE
Assembly of
various RF
components in
SiP basically
consists of 2
process:Wafer
level assembly
& SiP level
assembly
Assembly of RF
components
Wafer level
SiP level
Cap wafer
bonding
TSV
RDL/
UBM
Bumping Dicing
SMT Wire bond Molding Shielding BGA/LGA
Wafer
grinding
Wafer
dicing
Inspection
Component available as
SMT component in SiP
assembly / Flip-chip
Component available as
bare die (in wafer form) in
SiP assembly / wire-bond
process
Test
Included in
market forecast
Included in
market forecast
BAW filters SAW filters Filters / Switches / IPDs
Prior to SiP
assembly

TOTAL ASSEMBLY MARKET FORECAST FOR RF SIP IN MOBILE
Total assembly
/ packaging
market for the
RF SiP in
mobile will
grow at 11%
CAGR to
reach from
$XX B in 2017
to $XX B by
2023

RF FEM MARKET FORECAST
By cellular & connectivity air standards (in $M)
Limited
adoption of
5G mmWave,
in terms of
revenue.
RF FEM SiP
supporting
5G mmW
and 5G sub6
will grow at
CAGR of
111% & 51%
respectively

RF FEM SIP PACKAGING MARKET FORECAST
By smartphone type (in $M)
In 2023, high-end
smartphone
contributes XX
% RF FEM SiP
assembly market,
followed by low-
end smartphone
(XX %) and
luxury
smartphone (XX
%)

INTERCONNECT TREND IN RF SIP FOR MOBILE
%age in terms of interconnects units counts
XXXXX

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PHOTONIC AND OPTOELECTRONICS
• Photonic Integrated Circuit 2019 - New
• LiDARs for Automotive and Industrial Applications 2019 - Update
• Silicon Photonics 2018
o PATENT REPORT
• Silicon Photonics for Data Centers: Optical Transceiver 2019 - New
• LiDAR for Automotive 2018
RF DEVICES ANDTECHNOLOGIES
• RF GaN Market:Applications, Players,Technology,
and Substrates 2019 - Update
• 5G’s Impact on RF Front-End Module and Connectivity
for Cell Phones 2019 – Update
• 5G Impact on Wireless Infrastructure 2019
• Radar andV2X Market & Technology for Automotive 2019 - Update
• Advanced RF Antenna Market & Technology 2019 - New
• RF Standards and Technologies for Connected Objects 2018
• RF Front-End Module Comparison 2019 - Update
• Automotive Radar RF Chipset Comparison 2018
o PATENT REPORT
• Antenna for 5G Wireless Communications 2019 - New
• RF Front End Modules for Cellphones 2018
• RF Filter for 5G Wireless Communications: Materials and Technologies 2019
• RF GaN : Materials, Devices and Modules 2018
Update : 2018 version still available

IMAGING
• Status of the CIS Industry 2019:Technology
and Foundry Business - Update
• Imaging for Automotive 2019 - Update
• NeuromorphicTechnologies for Sensing 2019 - Update
• Status of the CCM and WLO Industry 2019 - Update
• MachineVision for Industry and Automation 2018
• Sensors for RoboticVehicles 2018
• Compact Camera Modules Comparison 2019
• CMOS Image Sensors Comparison 2019
o PATENT REPORT
• Facial & Gesture Recognition Technlogies in Mobile Devices 2019 - New
• Apple iPhone X Proximity Sensor & Flood Illuminator 2018
MEDICAL IMAGING AND BIOPHOTONICS
• X-Ray Detectors for Medical, Industrial
• and Security Applications 2019- New
• Microscopy Life Science Cameras: Market and Technology Analysis 2019
• Ultrasound technologies for Medical, Industrial
and Consumer Applications 2018
o PATENT REPORT
• Optical Coherence Tomography Medical Imaging 2018
MICROFLUIDICS
• Status of the Microfluidics Industry 2019 - Update
• Next Generation Sequencing & DNA Synthesis - Technology,
Consumables Manufacturing and MarketTrends 2019 - New
• Organ-on-a-Chip Market & Technology Landscape 2019 - Update
• Point-of-Need Testing Application of MicrofluidicTechnologies 2018
• Liquid Biopsy: from Isolation to Downstream Applications 2018
• Chinese Microfluidics Industry 2018
o PATENT REPORT
• Microfluidic ManufacturingTechnologies 2019 – New
INKJET AND ACCURATE DISPENSING
• Inkjet Printheads - Dispensing Technologies
& Market Landscape 2019 - Update
• Emerging Printing Technologies
for Microsystem Manufacturing 2019 - New
• Piezoelectric Materials from Bulk to Thin Film 2019 - New
• Inkjet Functional and Additive Manufacturing for Electronics 2018
• Piezoelectric Materials from Bulk to Thin Film Comparison 2019

BIOTECHNOLOGIES
• CRISPR-Cas9 Technology: From Lab to Industries 2018
o PATENT REPORT
• Personalized Medicine 2019 – New
BIOMEMS & MEDICAL MICROSYSTEMS
• Medical Wearables: Market & Technology Analysis 2019 - New
• Neurotechnologies and Brain Computer Interface 2018
• BioMEMS & Non-Invasive Sensors: Microsystems for Life Sciences
& Healthcare 2018
o PATENT REPORT
• 3D Cell Printing 2019 - New
• CirculatingTumor Cells Isolation 2019 - New
• Nanopore Sequencing 2019 - New
SOFTWARE AND COMPUTING
• Artificial Intelligence Computing For Automotive 2019 - New
• Hardware and Software for Artificial Intelligence (AI)
in Consumer Applications 2019 - Update
• From Image Processing to Deep Learning 2019 - Update
• xPU (Processing Units) for Cryptocurrency, Blockchain, HPC
and Gaming 2019 – New
MEMORY
• Status of the Memory Business 2019 - New
• MRAM Technology and Business 2019 - New
• Emerging NonVolatile Memory 2018
• Memory Comparison 2019
o PATENT REPORT
• Magnetoresistive Random-Access Memory (MRAM) 2019 - New
• 3D Non-Volatile Memory 2018
ADVANCED PACKAGING
• Fan Out PackagingTechnologies and MarketTrends 2019 - Update
• 3D TSV Integration and Monolithic Business Update 2019 - Update
• Advanced RF SiP for Cellphones 2019 - Update
• Status of Advanced Packaging 2019 - Update
• Status of Advanced Substrates 2019 - Update
• Panel Level PackagingTrends 2019 - Update
• System in Package (SiP) Technology and Market Trends 2019 - New
• Trends in Automotive Packaging 2018
• Thin-Film Integrated Passive Devices 2018
• Advanced RF SiP for Cellphones Comparison 2019

SEMICONDUCTOR MANUFACTURING
• Nano Imprint Lithography 2019 - New
• Equipment and Materials for Fan Out Packaging 2019 - Update
• Equipment for More than Moore:Thin Film Deposition
& Etching 2019 - New
• Wafer Starts for More Than Moore Applications 2018
• Polymeric Materials atWafer-Level
for Advanced Packaging 2018
• Bonding and Lithography Equipment Market
for More than Moore Devices 2018
• Wafer Bonding Comparison 2018
o PATENT REPORT
• Hybrid Bonding for 3D Stack 2019 – New
SOLID STATE LIGHTING
• Status of the Solid State Light Source Industry 2019 - New
• Edge Emitting Lasers (EELS) 2019 - New
• Light Shaping Technologies 2019 - New
• Automotive Advanced Front Lighting Systems 2019 - New
• VCSELs - Technology, Industry and MarketTrends 2019 - Update
• IR LEDs and Laser Diodes – Technology,Applications,
and Industry Trends 2018
• Automotive Lighting 2018:Technology, Industry and MarketTrends
• UV LEDs - Technology, Manufacturing and ApplicationTrends 2018
• LiFi:Technology, Industry and MarketTrends 2018
• VCSEL Comparison 2019
o PATENT REPORT
• VCSELs 2018
DISPLAY
• Next Generation 3D Display 2019 - New
• Next Generation Human Machine Interaction (HMI)in Displays 2019 - New
• Micro-and Mini-LED Displays 2019 - Update
• QD and Wide Color gamut (WCG)
Display Technologies 2019 - Update
• Displays & OpticalVision Systems forVR,AR & MR 2018
o PATENT REPORT
• MicroLED Displays : Intellectual Property Landscape 2018

POWER ELECTRONICS
• Power SiC: Materials, Devices and Applications 2019 - Update
• Power Electronics for EV/HEV and e-mobility:
Market, Innovations and Trends 2019 - Update
• Status of the Power Electronics Industry 2019 - Update
• Discrete Power Packaging : Material Market
and Technology Trends 2019 - New
• Status of the Power ICs Industry 2019 - Update
• Status of the Passive Components for the Power Electronics
Industry 2019 - Update
• Status of the Inverter Industry 2019 - Update
• Status of the Power Module Packaging Industry 2019 - Update
• Wireless Charging Market Expectations
and Technology Trends 2018
• Power GaN 2018: Epitaxy, Devices,Applications
and Technology Trends
• Automotive Power Module Packaging Comparison 2018
• GaN-on-Silicon Transistor Comparison 2019
• SiC Transistor Comparison 2019
o PATENT REPORT
• Power SiC : Materials, Devices and Modules 2019 - New
• Power GaN : Materials, Devices and Modules 2019 – Update
BATTERY & ENERGY MANAGEMENT
• Status of the Rechargeable Li-ion Battery Industry 2019 - New
• Li-ion Battery Packs for Automotive and Stationary Storage
Applications 2019 - Update
o PATENT REPORT
• Battery Energy Density Increase: Materials
and EmergingTechnologies 2019 - New
• Solid-State Batteries 2019 - New
• Status of the Battery Patents 2018
COMPOUND SEMI.
• Emerging Compound Semiconductor
Market & Technology Trends 2019 - New
• Status of the Compound Semiconductor Industry 2019 - New
• InP Materials, Devices and Applications 2019 - New
• GaAsWafer and Epiwafer Market: RF, Photonics,
LED and PV Applications 2018
o PATENT REPORT
• GaN-on-Silicon Substrate: Materials, Devices
and Applications 2019 - Update

OUR 2019 MONITORS COLLECTION (1/2)
Get the most updated overview of your market to monitor your strategy
Yole Développement, System Plus Consulting and KnowMade, all part of the Yole Group of Companies, are launching a collection of 10 monitors in 2019. The monitors aim to
provide updated market, technology and patent data as well dedicated quarterly analyses of the evolution in your industry over the previous 12 months. Furthermore, you can
benefit from direct access to the analyst for an on-demand Q&A and discussion session regarding trend analyses, forecasts and breaking news.
Topics covered will be compact camera modules (CCMs), advanced packaging, compound semiconductors, microfluidics, batteries, RF and memory.
MARKET MONITOR byYole Développement
A FULL PACKAGE:
The monitors will provide the evolution of the market in units, wafer area and revenues.
They will also offer insights into what is driving the business and a close look at what is
happening will also be covered in it.
The following deliverables will be included in the monitors:
• An Excel database with all historical and forecast data
• A PDF slide deck with graphs and comments/analyses covering the expected
evolutions
o ADVANCED PACKAGING – NEW
This monitor will provide the evolution of the advanced packaging platforms. It will
cover Fan-Out Wafer Level Packaging (WLP), Fan-Out Panel Level Packaging (PLP),
Wafer-Level Chip Scale Packaging (WLCSP), Flip Chip packaging platforms, and 2.5D
and 3D Through Silicon Via (TSV) integration. Frequency: Quarterly, starting from Q3
2019
o COMPOUND SEMI. – NEW
This monitor will describe how the compound semiconductor industry is evolving. It
will offer a close look at GaAs, InP, SiC, GaN and other compounds of interest
providing wafer volumes, revenues, application breakdowns and momentum.
Frequency: Quarterly, starting from Q3 2019
o CAMERA MODULE – NEW
This monitor will provide the evolution of the imaging industry, with a close look at
image sensor, camera module, lens and VCM. Volumes, revenues and momentum of
companies like Sony, Samsung, Omnivision and OnSemi will thus be analysed.
Frequency: Quarterly, starting from Q3 2019
o MEMORY – UPDATE
For the memory industry you can have access to a quaterly monitor, as well as an
additional service, a monthly pricing. Both services can be bought seprately:
• DRAM Service: Including a quarterly monitor and monthly pricing.
• NAND Service: Including a quarterly monitor and monthly pricing.
REVERSETECHNOLOGY MONITOR by System Plus Consulting
o SMARTPHONES – NEW
To stay updated on the latest components, packaging and silicon chip choices of the smartphone makers, System Plus Consulting has created its first Smartphone Reverse
Technology monitor. This year, get access to the packaging and silicon content database of at least 20 different flagship smartphones – more than five per quarter. Starting at the
beginning of 2019, the monitor will include an Excel database report for each phone and a quarterly comparison.

OUR 2019 MONITORS COLLECTION (2/2)
Get the most updated overview of your market to monitor your strategy
PATENT MONITOR by KnowMade
A FULL PACKAGE:
Starting at the beginning of the year, the KnowMade monitors include the following
deliverables:
• An Excel file including the monthly IP database of:
• New patent applications
• Newly granted patents
• Expired or abandoned patents
• Transfer of IP rights through re-assignment and licensing
• Patent litigation and opposition
• Quarterly report including a PDF slide deck with the key facts & figures of the
quarter: IP trends over the three last months, with a close look to key IP players and
key patented technologies.
o GaN for Power & RF Electronics
Wafers and epiwafers, GaN-on-SiC, silicon, sapphire or diamond, semiconductor
devices such as transistors, and diodes, devices and applications including converters,
rectifiers, switches, amplifiers, filters, and Monolothic Microwave Integrated Circuits
(MMICs), packaging, modules and systems.
o GaN for Optoelectronics & Photonics
Wafers and epiwafers, GaN-on-sapphire, SiC or silicon; semiconductor devices such
as LEDs and lasers; and applications including lighting, display, visible communication,
photonics, packaging, modules and systems.
o Li-ion Batteries
Anodes made of lithium metal, silicon, and lithium titanate (LTO); cathodes made of
Lithium Iron Phosphate (LFP), Nickel-Manganese-Cobalt (NMC), Lithium Nickel
Cobalt Aluminium Oxide (NCA), Lithium Nickel Metal Dioxide (LiNiMO2), Lithium
Metal Phosphate (LiMPO4), and Lithium Metal Tetroxide (LiMO4); electrolytes
including liquid, polymer/gel, and solid inorganics; ceramic and other separators;
battery cells including thin film/microbattery, flexible, cylindrical and prismatic; and
battery packs and systems.
o Post Li-ion Batteries
Battery technologies including redox-flow batteries, sodium-ion, lithiumsulfur, lithium-
air, and magnesium-ion, and their supply chains, including electrodes, electrolytes,
battery cells and battery packs/systems.
o Solid-State Batteries
Supply chain including electrodes, battery cells, battery packs/systems and
electrolytes, including polymer, inorganic and inorganic/polymer, inorganic materials,
including argyrodites, LIthium Super Ionic CONductor, (LISICONs), Thio-LISICONs,
sulfide glasses, oxide glasses, perovskites, anti-perovskites and garnets.
o RF Acoustic Wave Filters
Including Surface Acoustic Wave (SAW), Temperature Compensated (TC)- SAW, Bulk
Acoustic Wave- Free-standing Bulk Acoustic Resonator (BAWFBAR), BAW-Solidly-
Mounted Resonator (BAW-SMR), and Packaging.
o RF Power Amplifiers
Including Low Noise Amplifiers, Doherty Amplifiers, Packaging, and Millimeter-Wave
technology.
o RF Front-End Modules
o Microfluidics
From components to chips and systems, including all applications.

MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ONLINE ONSITE INPERSON
@Micronews e-newsletter
i-Micronews.com
i-Micronewsjp.com
FreeFullPDF.com
Events Webcasts
Unique, cost-effective ways
to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility.They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility, networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly, and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person. Events
are the best way to exchange
ideas with your customers,
partners, prospects while
increasing your brand/product
visibility.
Targeted audience
involvement equals clear,
concise perception of your
company’s message.
Webcasts are a smart,
innovative way of
communicating to a wider
targeted audience.Webcasts
create very useful, dynamic
reference material for
attendees and also for
absentees, thanks to the
recording technology.
Benefit from the i-Micronews.com
traffic generated by the 11,200+
monthly unique visitors, the
10,500+ weekly readers of
@Micronews e-newsletter
Several key events planned for
2018 on different topics to
attract 120 attendees on average
Gain new leads for your business
from an average of 340
registrants per webcast
Contact: CamilleVeyrier (veyrier@yole.fr), Marketing & Communication Director

CONTACT INFORMATION
o CONSULTING AND SPECIFICANALYSIS, REPORT
BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director forWestern US &
Canada
Email: laferriere@yole.fr – + 1 310 600-8267
• Troy Blanchette, Senior Sales Director for Eastern US &
Canada
Email: troy.blanchette@yole.fr – +1 704 859-0453
• Japan & Rest of Asia:
• Takashi Onozawa, General Manager,Asia Business
Development (India & ROA)
Email: onozawa@yole.fr - +81 34405-9204
• Miho Othake, Account Manager (Japan)
Email: ohtake@yole.fr - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Korea & Singapore)
Email: oshiba@yole.fr - +81-80-3577-3042
• Greater China: Mavis Wang, Director of Greater China Business
Development
Email: wang@yole.fr - +886 979 336 809
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• RoW: Jean-Christophe Eloy, CEO & President,Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o FINANCIAL SERVICES (in partnership withWoodside
Capital Partners)
• Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr - +33 4 72 83 01 80
• Ivan Donaldson,VP of Financial Market Development
Email: ivan.donaldson@yole.fr - +1 208 850 3914
o CUSTOM PROJECT SERVICES
• Jérome Azémar,Technical Project Development Director
Email: azemar@yole.fr - +33 6 27 68 69 33
o GENERAL
• CamilleVeyrier, Director, Marketing & Communication
Email: veyrier@yole.fr - +33 472 83 01 01
• Sandrine Leroy, Director, Public Relations
Email: leroy@yole.fr - +33 4 72 83 01 89 / +33 6 33 11 61 55
• Email: info@yole.fr - +33 4 72 83 01 80
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