Everspin EMD3D256M STTMRAM Memory

©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 1
22 bd Benoni Goullin
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Everspin EMD3D256M Memory
256Mb Spin Transfer Torque MRAM
SP20543 - Memory report by Belinda Dube
Physical analysis done by Nicolas Radufe
June 2020 - Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile & Supply Chain 9
Physical Analysis 16
o Summary of the Physical Analysis 17
o STT MRAM Memory Package 19
✓ Module Views
✓ Module Cross-Section
✓ Module Patents
o STT MRAM Memory Die 25
✓ STT MRAM Memory Die View & Dimensions
✓ STT MRAM Memory Delayering
✓ STT MRAM Memory Die Process
✓ STT MRAM Memory Die Cross-Section
✓ STT MRAM Memory Die Process Characteristic
STT MRAM Memory Manufacturing Process 47
o STT MRAM Memory Die Front-End Process & Fabrication Unit
o Manufacturing Process Steps
o Final Test & Packaging Fabrication unit
o Summary of the main parts
Cost Analysis 56
o Summary of the cost analysis 57
o Yields Explanation & Hypotheses 59
o STT MRAM Memory 62
✓ STT MRAM Memory Front-End Cost
✓ STT MRAM Memory Probe Test, Thinning & Dicing
✓ STT MRAM Memory Wafer Cost
✓ STT MRAM Memory Die Cost
o Packaged STT MRAM Memory 66
✓ Packaging Cost
✓ Components Cost
Selling price 68
Feedbacks 73
SystemPlus Consulting services 75

Overview / Introduction
o Executive Summary
o Reverse Costing
Methodology
o Glossary
o Datasheet
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of
Everspin’s EMD3D256M STTMRAM.
Amongst multiple emerging NVM technologies, spin transfer torque magneto resistive RAM (STT-MRAM) has shown significant potential
and market growth driven by low latency storage applications. In 2018 MRAM Market recorded a Revenue of $44 million dollars.
Compound annual growth rate of MRAM market is estimated at 85% between 2018 and 2024.
Magnetoelectronic memories have been employed in numerous information devices because of their nonvolatile characteristics, high
speed and low power consumption. Their high endurance characteristic has made the STT MRAM Memory a good competitor in the
memory industry and promises to pick up significant market shares in the next few years.
Everspin’s STT MRAM component has a compact structure integrating numerous layers that include ferromagnetic material and
antiferromagnetic material forming a magnetic tunnel junction. Different resistive states created in the MRAM memory cell allow read
and write functions. A dielectric layer is coupled between two magnetic materials. A complex fabrication method is used to deposit and
pattern the thin layers that form the STT MRAM memory cell.
Everspin Technologies leads the (STT-) MRAM market. The 256Mb STT MRAM memory uses a 40 nm technology node. The memory is
manufactured along with the CMOS Transistors.
System Plus Consulting presents a deep analysis of Everspin’s EMD3256M STT MRAM Memory. The report includes an analysis of the
package and the dies, the MRAM memory cell and focusing on the layered material that make up the MRAM Cell memory. It also
features a cost analysis and a price estimation of the component; this cost analysis integrates the manufacture of the CMOS transistors
and the MRAM Memory cells. The manufacturing process steps are detailed including the supply chain. The results of manufacturing
cost are used to determine the cost per Mb for Everspin’s STT MRAM Memory.

o Executive Summary
o Reverse Costing
Methodology
o Glossary
o Datasheet
Chain
Physical Analysis
Physical Comparison
Cost Analysis
Cost Comparison
Feedbacks
Related Reports
About System Plus
The reverse costing analysis is conducted in 3 phases:
Teardown
analysis
Package is analyzed and measured
The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin
out, die marking
Setup of the manufacturing process.
Costing
analysis
Setup of the manufacturing environment
Cost simulation of the process steps
Selling price
analysis
Supply chain analysis
Analysis of the selling price
Executive Summary

PHYSICAL
ANALYSIS

Chain
Physical Analysis
o Overview
o Package Assembly
o Views & Dimensions
o Cross-Section
o Opening
o Memory Die
o Die Cross-section
o Delayering
o Die Process
Cost Analysis
Feedbacks
Related Reports
About System Plus
Package Opening- Wire Bonding

Chain
Physical Analysis
o Overview
o Package Assembly
o Cross-Section
o Opening
o Memory Die
o Die Cross-section
o Delayering
o Die Process
Cost Analysis
Feedbacks
Related Reports
About System Plus
Die Cross-Section – Substrate Thickness

Chain
Physical Analysis
o Overview
o Package Assembly
o Cross-Section
o Opening
o Memory Die
o Die Cross-section
o Delayering
o Die Process
Cost Analysis
Feedbacks
Related Reports
About System Plus
Die Cross-Section – Metal Layers

Chain
Physical Analysis
o Overview
o Package Assembly
o Cross-Section
o Opening
o Memory Die
o Die Cross-section
o Delayering
o Die Process
Cost Analysis
Feedbacks
Related Reports
About System Plus
Die Cross-Section - SEM View
©2020 by System Plus Consulting
Die Cross-Section – MRAM Cells

Chain
Physical Analysis
o Overview
o Package Assembly
o Cross-Section
o Opening
o Memory Die
o Die Cross-section
o Delayering
o Die Process
Cost Analysis
Feedbacks
Related Reports
About System Plus

Chain
Physical Analysis
o Overview
o Package Assembly
o Cross-Section
o Opening
o Memory Die
o Die Cross-section
o Delayering
o Die Process
Cost Analysis
Feedbacks
Related Reports
About System Plus
Die Process – Memory Cells

Chain
Physical Analysis
o Overview
o Package Assembly
o Cross-Section
o Opening
o Memory Die
o Die Cross-section
o Delayering
o Die Process
Cost Analysis
Feedbacks
Related Reports
About System Plus
Die Overview
©2020 by System Plus Consulting
Die Process – Memory Cells

Chain
Physical Analysis
o Overview
o Package Assembly
o Cross-Section
o Opening
o Memory Die
o Die Cross-section
o Delayering
o Die Process
Cost Analysis
Feedbacks
Related Reports
About System Plus
Die Delayering – Memory Cell Density

Chain
Physical Analysis
o Overview
o Package Assembly
o Cross-Section
o Opening
o Memory Die
o Die Cross-section
o Delayering
o Die Process
Cost Analysis
Feedbacks
Related Reports
About System Plus
Die Process – Memory Cell Size

Chain
Physical Analysis
o Memory Front-End Process
o Memory Fabrication Unit
o Manufacturing Steps
o Final Test & Assembly Unit
Cost Analysis
Cost Comparison
Feedbacks
Related Reports
About System Plus
STT MRAM Memory Process Steps

C O S T
ANALYSIS

Chain
Physical Analysis
Physical Comparison
Cost Analysis
o Cost Analysis Summary
o Yields Explanation &
Hypotheses
o Memory Wafer Cost
o Memory Die Cost
o Memory Package Cost
o Component Cost
Cost Comparison
Feedbacks
Related Reports
About System Plus
STT MRAM Memory- CMOS & Metal Layers Front-End Cost

Chain
Physical Analysis
Physical Comparison
Cost Analysis
Hypotheses
o Memory Wafer Cost
o Memory Die Cost
o Component Cost
Cost Comparison
Feedbacks
Related Reports
About System Plus
STT MRAM Memory Cells Front-End Cost

Chain
Physical Analysis
Physical Comparison
Cost Analysis
Hypotheses
o Memory Wafer Cost
o Memory Die Cost
o Component Cost
Cost Comparison
Feedbacks
Related Reports
About System Plus
Component Cost

SELLING
P R I C E

Chain
Physical Analysis
Physical Comparison
Cost Analysis
Cost Comparison
o Definition of Prices
o Manufacturer Financials
o Component Price
o STT MRAM Price/Mb
Feedbacks
Related Reports
About System Plus
STT MRAM Memory Component Price

Chain
Physical Analysis
Physical Comparison
Cost Analysis
Cost Comparison
Feedbacks
Related Reports
About System Plus
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
MEMORY REPORTS
• Emerging Non-Volatile Memory 2020
• MRAM Technology and Business 2019
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
MEMORY REPORTS
• Intel Optane 128GB DIMM
• 3D NAND Memory Comparison 2019
• LPDDR4 Memory Comparison 2019

COMPANY
SERVICES

Chain
Physical Analysis
Physical Comparison
Cost Analysis
Cost Comparison
Feedbacks
Related Reports
About System Plus
o Company services
o Contact
Business Models Fields of Expertise
Custom Analyses
(>130 analyses per year)
Reports
(>60 reports per year)
Costing Tools
Trainings

Chain
Physical Analysis
Physical Comparison
Cost Analysis
Cost Comparison
Feedbacks
Related Reports
About System Plus
o Company services
o Contact
Contact
Headquarters
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+33 2 40 18 09 16
sales@systemplus.fr
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Frankfurt am Main
GERMANY
+49 151 23 54 41 82
llevenez@systemplus.fr
www.systemplus.fr
NANTES
Headquarter
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JAPAN
T : +81 804 371 4887
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CN: +8613661566824
wang@yole.fr
America Sales Office
Steve LAFERRIERE
WESTERN US
T : +1 310 600 8267
laferriere@yole.fr
Chris YOUMAN
EASTERN US & CANADA
T : +1 919 607 9839
chris.youman@yole.fr

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