The document provides a comprehensive reverse costing analysis of the STMicroelectronics MasterGaN1 half-bridge driver, detailing its components, manufacturing processes, and cost structures. It covers aspects such as physical analysis, supply chain evaluations, and comparisons with other GAN devices. Key findings include insights into the cost of HEMT and IC dies, packaging costs, and selling price estimations.

1. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 1
22 Bd Benoni Goullin
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
STMicroelectronics MASTERGAN1 Half-Bridge Driver
The first 600V system-in-package half bridge driver from
STMicroelectronics integrating two GaN-based HEMTs
SP20580 - Power Electronics report by Taha AYARI
Laboratory analysis by Youssef EL GMILI
November 2020 – Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

2. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 2
Table of Contents
Overview / Introduction 5
o Executive Summary
o Market
o Reverse Costing Methodology
Company Profile 13
o STMicroelectronics
Physical Analysis 17
o Summary of the Physical Analysis
o Package Analysis
✓ Package Opening
✓ Package Cross-Sections
o HEMT Die
✓ HEMT Die Views & Dimensions
✓ HEMT Die Process
✓ HEMT Die Cross-Section
✓ HEMT Die Process Characteristics
o IC Die
✓ IC Die Views & Dimensions
✓ IC Die Process
✓ IC Die Cross-Section
✓ IC Die Process Characteristics
Manufacturing Process Flow 47
o HEMT Die Front-End Process
o HEMT Die Fabrication Unit
o IC Die Front-End Process
o IC Die Fabrication Unit
o Packaging Process Flow
Cost Analysis 61
o Supply Chain and Yields
o HEMT Die
✓ HEMT Wafer Front-End Cost and Front-End Cost per Process Step
✓ HEMT Back-End0 Cost: Die Probe Test, Thinning & Dicing
✓ HEMT Die Cost
o IC Die
✓ IC Front-End Cost
✓ IC Back-End0 Cost: Die Probe Test, Thinning & Dicing
✓ IC Die Cost
o Packaging Assembly Cost
o Component Cost
✓ Back-End: Final Test Cost
✓ Component Cost
Price Analysis 79
o Definition of prices
o Estimation of selling price
Comparison 82
o Technology and Cost Comparison between GaN Devices from ST, Power
Integrations and Navitas
Feedbacks 85
System Plus Consulting Services 87

3. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 3
Overview / Introduction
o Executive Summary
o Market
o Reverse Costing
Methodology
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related reports
About System Plus
The reverse costing analysis is conducted in 3 phases:
Teardown
analysis
Package is analyzed and measured.
The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin
out, die marking.
Setup of the manufacturing process
Costing
analysis
Setup of the manufacturing environment
Cost simulation of the process steps
Selling price
analysis
Supply chain analysis
Analysis of the selling price
Reverse Costing Methodology

4. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 4
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Package
o GaN HEMT
o IC Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related reports
About System Plus
Summary of the Physical Analysis

5. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 5
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Package
o GaN HEMT
o IC Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related reports
About System Plus
Package Opening – Wire bonding

6. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 6
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Package
o GaN HEMT
o IC Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related reports
About System Plus
GaN HEMT Cross-Section - Contacts

7. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 7
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Package
o GaN HEMT
o IC Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related reports
About System Plus
GaN HEMT Cross-Section – Gate/Field plate
Consulting

8. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 8
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Package
o GaN HEMT
o IC Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related reports
About System Plus
GaN HEMT Cross-Section – Epitaxy

9. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 9
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Package
o GaN HEMT
o IC Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related reports
About System Plus
IC Die – Delayering

10. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 10
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Package
o GaN HEMT
o IC Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related reports
About System Plus
IC Die – Cross-Section

11. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 11
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
o HEMT Fab Unit
o HEMT Process Flow
o ICs Fab Unit
o ICs Process Flow
o Component Packaging
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related reports
About System Plus
GaN Transistor - Process Flow (6/6)
Drawing not to Scale

12. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 12
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
o Supply Chain and Yields
o GaN HEMT Cost
o IC Cost
o Packaging Cost
o Component Cost
Selling Price Analysis
Comparison
Feedback
Related reports
About System Plus
Component Cost

13. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 13
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related reports
About System Plus
Estimated Selling Price

14. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 14
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
o ST vs Power Integrations
o ST vs Navitas
Feedback
Related reports
About System Plus
STMicroelectronics vs PI - Component Comparison
Note:
Detailed teardown of the PI device can be found here.

15. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 15
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
o ST vs Power Integrations
o ST vs Navitas
Feedback
Related reports
About System Plus
STMicroelectronics vs Navitas - GaN HEMT Comparison

16. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 16
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related reports
About System Plus
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
POWER ELECTRONICS & COMPOUND SEMI
• Compound Semiconductor Quarterly Market Monitor
• Status of the Power Electronics Industry 2020
• Power GaN 2019: Epitaxy, Devices, Applications & Technology
Trends
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
POWER SEMICONDUCTORS & COMPOUND
• GaN Power Transistor Comparison 2020
• GaN-on-Sapphire HEMT Power IC by Power Integrations
• Innoscience’s 650 V GaN-on-Si Transistor
• Navitas 650V GaNFast Power IC Family
• Nexperia’s AEC-Q101 qualified 650 V GaN based power
device

17. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 17
COMPANY
SERVICES

18. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 18
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related reports
About System Plus
o Company services
o Contacts
Business Models Fields of Expertise
Custom Analyses
(>130 analyses per year)
Reports
(>60 reports per year)
Costing Tools
Trainings

19. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 19
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
Related reports
About System Plus
o Company services
o Contacts
Contact
www.systemplus.fr
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