Denso has developed a new monocular forward camera for improved night vision, using Sony’s high-sensitivity 1.27M-pixel image sensor and Toshiba’s new advanced image recognition processor.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/densos-monocular-forward-adas-camera-in-the-toyota-alphard/
Triple Forward Camera from Tesla Model 3system_plus
Complete analysis of the main sensing part of the Tesla‘s autopilot system.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/triple-forward-camera-from-tesla-model-3/
Sensonor STIM210
High-precision MEMS Gyro Module
World highest performance silicon MEMS gyro available without export control.
Tactical grade with bias instability of 0.5°/h in a miniature 33cm3 package.
MEMS gyroscopes for tactical grade applications made a lot of progress in the past few years in term of reliability. They are now accepted in high-reliability environments, and are even starting to replace FOGs and other technologies in tactical applications.
With a bias instability of 0.5°/h, the Sensonor STIM210 is the world highest performance silicon MEMS gyroscope. The module is available without export control (ITAR-free). The analyzed module is a complete system offering 3 axes MEMS gyros associated with a 32-bit microcontroller which provides flexibility in device configuration.
STIM210 applications are typically found within industrial, aerospace and defense markets, for various platform stabilizations, pointing and navigation systems, attitude heading reference systems (AHRSs), inertial navigation systems (INSs), smart munitions, missiles, 3D mapping systems, range finders, trains, robotics, and more. For many applications STIM210 directly replaces FOGs and improves system solutions with respect to robustness, reliability, size, weight, power and cost.
More information on that report at http://www.i-micronews.com/reports/Sensonor-STIM210High-precision-MEMS-Gyro-Module/1/436/
Yole Intel RealSense 3D camera module and STM IR laser 2015 teardown reverse ...Yole Developpement
INNOVATIVE 3D CAMERA FOR FACIAL ANALYSIS AND HAND/FINGER TRACKING, BASED ON RESONANT MICRO-MIRROR, IR LASER, VISIBLE AND NEAR INFRARED IMAGE SENSORS.
Intel RealSense is an intelligent 3D camera equipped with a system of three components: a conventional camera, a near infrared image sensor and an infrared laser projector. Infrared parts are used to calculate the distance between objects, but also to separate objects on different planes. They serve for facial recognition as well as gestures tracking.
The Intel 3D camera can scan the environment from 0.2m to 1.2m. The fixed-focal length camera will support up to 1080p @30FPS capture in RGB with a 77° FOV. Its lens has a built in IR cut filter. The 640x480 pixel VGA camera has a frame rate up to 60fps with a 90° FOV, moreover its lens has an IR Band Pass filter.
More information on that report at http://www.i-micronews.com/reports.html
Continental, Veoneer, ZF, Valeo, Bosch, Aptiv, Denso, Ainstein: Discover the technologies used in the main Radar Systems and Chipsets.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/automotive-radar-comparison-2018/
1200V CoolSiCTM MOSFET Module DF11MR12W1M1_B11, from Infineon 2018 teardown r...system_plus
Infineon expands its presence in the SiC market with a new 1200V SiC MOSFET-based boost converter for solar applications.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/1200v-coolsictm-mosfet-module-df11mr12w1m1_b11-from-infineon/
Sensonor STIM318 Inertial Measurement Unit (IMU)system_plus
Newest IMU with 9-axis detection and gyro bias instability of 0.3°/h from Sensonor.
More information: https://www.systemplus.fr/reverse-costing-reports/sensonor-stim318-inertial-measurement-unit-imu/
Triple Forward Camera from Tesla Model 3system_plus
Complete analysis of the main sensing part of the Tesla‘s autopilot system.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/triple-forward-camera-from-tesla-model-3/
Sensonor STIM210
High-precision MEMS Gyro Module
World highest performance silicon MEMS gyro available without export control.
Tactical grade with bias instability of 0.5°/h in a miniature 33cm3 package.
MEMS gyroscopes for tactical grade applications made a lot of progress in the past few years in term of reliability. They are now accepted in high-reliability environments, and are even starting to replace FOGs and other technologies in tactical applications.
With a bias instability of 0.5°/h, the Sensonor STIM210 is the world highest performance silicon MEMS gyroscope. The module is available without export control (ITAR-free). The analyzed module is a complete system offering 3 axes MEMS gyros associated with a 32-bit microcontroller which provides flexibility in device configuration.
STIM210 applications are typically found within industrial, aerospace and defense markets, for various platform stabilizations, pointing and navigation systems, attitude heading reference systems (AHRSs), inertial navigation systems (INSs), smart munitions, missiles, 3D mapping systems, range finders, trains, robotics, and more. For many applications STIM210 directly replaces FOGs and improves system solutions with respect to robustness, reliability, size, weight, power and cost.
More information on that report at http://www.i-micronews.com/reports/Sensonor-STIM210High-precision-MEMS-Gyro-Module/1/436/
Yole Intel RealSense 3D camera module and STM IR laser 2015 teardown reverse ...Yole Developpement
INNOVATIVE 3D CAMERA FOR FACIAL ANALYSIS AND HAND/FINGER TRACKING, BASED ON RESONANT MICRO-MIRROR, IR LASER, VISIBLE AND NEAR INFRARED IMAGE SENSORS.
Intel RealSense is an intelligent 3D camera equipped with a system of three components: a conventional camera, a near infrared image sensor and an infrared laser projector. Infrared parts are used to calculate the distance between objects, but also to separate objects on different planes. They serve for facial recognition as well as gestures tracking.
The Intel 3D camera can scan the environment from 0.2m to 1.2m. The fixed-focal length camera will support up to 1080p @30FPS capture in RGB with a 77° FOV. Its lens has a built in IR cut filter. The 640x480 pixel VGA camera has a frame rate up to 60fps with a 90° FOV, moreover its lens has an IR Band Pass filter.
More information on that report at http://www.i-micronews.com/reports.html
Continental, Veoneer, ZF, Valeo, Bosch, Aptiv, Denso, Ainstein: Discover the technologies used in the main Radar Systems and Chipsets.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/automotive-radar-comparison-2018/
1200V CoolSiCTM MOSFET Module DF11MR12W1M1_B11, from Infineon 2018 teardown r...system_plus
Infineon expands its presence in the SiC market with a new 1200V SiC MOSFET-based boost converter for solar applications.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/1200v-coolsictm-mosfet-module-df11mr12w1m1_b11-from-infineon/
Sensonor STIM318 Inertial Measurement Unit (IMU)system_plus
Newest IMU with 9-axis detection and gyro bias instability of 0.3°/h from Sensonor.
More information: https://www.systemplus.fr/reverse-costing-reports/sensonor-stim318-inertial-measurement-unit-imu/
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...system_plus
Fourth generation of the S-Cam family from the leading ADAS camera player.
Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/zf-s-cam-4-forward-automotive-mono-and-tri-camera-for-adas/
GaN-on-Silicon Transistor Comparison 2018 Structural, Process & Costing Repor...Yole Developpement
Dive deep into the technology and cost of GaN-on-silicon HEMTs from EPC, Transphorm, GaN Systems, Panasonic and Texas Instruments.
More information on that report at https://www.i-micronews.com/report/product/gan-on-silicon-transistor-comparison-2018.html
Bosch’s first 6-Axis IMU for Automotive Application combining 3-Axis Gyroscope and 3-Axis Accelerometer
MEMS are getting broadly adopted in the automotive industry and non-safety applications like in-dash navigation are now requiring low-cost and small footprint components.
The SMI130 combines a 12-bit 3-Axis accelerometer and a 16-bit 3-Axis gyroscope in a 4.5x3.0mm LGA packages which is AEC-Q100 qualified for automotive applications. The measurement range of the yaw rate sensor can be adjusted in up to five steps between ±125°/s and ±2000°/s; the acceleration sensor offers four different measurement ranges between ±2g and ±16g.
The gyro integrates a new process for the capping. Indeed, the classic "glass-frit" wafer bonding has been abandoned in favor of an eutectic Aluminum-Germanium bonding.
The accelerometer features a new design which uses now only one mass structure for the moving parts compared to three for the previous generations.
The SMI130 is designed for non-safety-critical applications in the automotive industry, including in-dash navigation and telematics systems such as toll, eCall, and alarm systems.
More information on that report at http://www.i-micronews.com/reports.html
Intel RealSense D435 3D Active IR Stereo Depth Camera 2018 teardown reverse c...system_plus
The 3D camera is using infrared active stereo depth and red/green/blue sensors, and a VCSEL projector.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/intel-realsense-d435-3d-active-ir-stereo-depth-camera/
For the full video of this presentation, please visit:
https://www.embedded-vision.com/platinum-members/aimotive/embedded-vision-training/videos/pages/may-2019-embedded-vision-summit-debreczeni
For more information about embedded vision, please visit:
http://www.embedded-vision.com
Gergely Debreczeni, Chief Scientist at AImotive, presents the "Distance Estimation Solutions for ADAS and Automated Driving" tutorial at the May 2019 Embedded Vision Summit.
Distance estimation is at the heart of automotive driver assistance systems (ADAS) and automated driving (AD). Simply stated, safe operation of vehicles requires robust distance estimation. Many different types of sensors (camera, radar, LiDAR, sonar) can be used for distance estimation, and different distance estimation techniques can be used with each type of sensor. Each type of sensor and technique has unique strengths and weaknesses. Debreczeni examines these techniques and their strengths and weaknesses, and shows how multiple techniques using different sensor types can be fused to enable robust distance estimation for a specific automated driving application.
GaN Systems GS61004B GaN HEMT 2018 teardown reverse costing report published ...system_plus
Discover how GaN Systems has designed its high-current, low-voltage PCB embedded GaN-on-Si transistor.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/gan-systems-gs61004b-gan-hemt/
Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...Yole Developpement
Panasonic’s first 600V GaN HEMT has an innovative structure designed to integrate a normally-off transistor in a standard package, without a cascade structure
System Plus Consulting unveils Panasonic’s first GaN HEMT, assembled in a standard TO220 package. Thanks to its specific die design, the component is normally-off without using a cascade structure or special packaging.
Panasonic’s PGA26C09DV features a medium-voltage breakdown of 600V for a current of 15A (25°C), with very low RdsOn compared to its competitors. The transistor is optimized for AC-DC power supply, photovoltaic, and motor inverters.
The GaN and AlGaN layers are deposited by epitaxy on a silicon substrate. A complex buffer and template layer structure is used to reduce stress and dislocation. This is complemented by a thick superlattice structure clearly visible in the TEM analysis.
Based on a complete teardown analysis, this report also provides a production cost estimate for the epitaxy, HEMT, and package.
Moreover, this report offers a comparison with GaN Systems’ GS66504B and Transphorm’s GaN HEMT, highlighting the huge differences in design and manufacturing process and their impact on device size and production cost.
For more information visite us at: http://www.i-micronews.com/reports.html
The ARS4-A is a 77 GHz radar sensor offering simultaneous long and short range detection
The Continental ARS4-A Radar is designed for forward collision warning, emergency brake assist, collision mitigation system or Adaptive Cruise Control (ACC). A special feature of the device is the simultaneous measurement of long distances, up to 250m with +/-0.2m accuracy, and short range, up to 70m, relative velocity and angle between two objects. It is thus able to detect stationary objects without any camera support.
The system integrates two electronic boards including an NXP Semiconductor microcontroller and Broadcom Ethernet transceiver. The radio-frequency (RF) board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate and is equipped with planar antennas.
The NXP Semiconductor multi-channel 77 GHz radar transceiver chipset, composed of four receivers, two transmitters and an associated voltage controlled oscillator (VCO), is used as high-frequency transmitter and receiver. The RF dies are packaged in redistributed chip package (RCP) fan-out wafer level packages initially developed and manufactured by Freescale.
Based on a complete teardown analysis of the Continental radar, the report provides the bill-of-material (BOM) and the manufacturing cost of the radar sensor.
A complete physical analysis and manufacturing cost estimation of the NXP semiconductor monolithic microwave integrated circuits (MMICs) is available in a separate report.
More information on that report at http://www.i-micronews.com/reports.html
Texas Instruments’ LMG5200 GaN Power Stage - 2018 teardown reverse costing re...system_plus
The first 80V half-bridge GaN power stage from TI, with innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/texas-instruments-lmg5200-gan-power-stage/
The first 600V system-in-package half-bridge driver from STMicroelectronics integrating two GaN-based HEMTs.
More information: https://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-mastergan1-half-bridge-driver/
24 camera modules for consumer and automotive applications, all from the main OEMs - analyzed and compared!
Smartphone manufacturers are increasingly integrating options and powerful components into their products. 3D and dual-camera modules are now available, offering better-image quality and providing more options, i.e. iris scanners and augmented reality.
The automotive camera module market is also rising steadily and is beginning to take significant market share.
Paralleling Yole Développement’s Camera Module Industry 2017 Market Report, this comparative review was conducted to provide insights into the structure and technology of 19 CMOS camera modules (CCM) released in flagship smartphones from the major brands.
In this report, rear and front-facing compact camera modules (including standard (mono), dual, iris scanners, and 3D camera modules) are analyzed and compared in terms of structural overview, module integration, lens number and dimensions, CIS res
olution, and pixel size. Indeed, OIS (Optical Image Stabilization) and dual-cameras are the big new trends for mobile camera modules.
More information on that report at http://www.i-micronews.com/reports.html
Continental’s 3rd-generation short-range radar sensor: a simplified design improves cost-effectiveness.
The Continental SRR3-B is designed for automotive applications like blind-spot detection, lane-change assist, rear cross-traffic alert, rear pre-crash, safe exit, collision mitigation, distance warning /monitoring, and more. The SRR3-B is based on 24 GHz technology and contains a planar antenna. The sensor has a field of view of ±75° in azimuth and a maximum range of more than 90m.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/continental-srr3-b-24ghz-blind-spot-radar/
First self-made SoC for advanced driving in Tesla Driver Assist Autopilot 3.0
More : https://www.systemplus.fr/reverse-costing-reports/tesla-ubq01b0-fsd-chip/
Artificial intelligence for cctv cameras, video surveillanceHIGHMARK SECURITY
Artificial intelligence for cctv cameras, video surveillance
This era is called to be Artificial intelligence (AI) and Internet of Things (IoT), it is operated by robots and they are replaced the human. This article we mention the Artificial Intelligence for CCTV Cameras, Video Surveillance, it applies for this industry.
What is Artificial Intelligence ?
Artificial intelligence technology for CCTV Cameras
Artificial intelligence solutions for CCTV Cameras Companies
There has never been a better time to protect your property with CCTV; modern innovations have allowed security camera companies to create high-definition, fully manoeuvrable, internet-connecting cameras that provide their operators with an even wider range of flexibility than ever before. So where next for the CCTV camera industry?
Regardless of the industry in mind, automation seems to be the next step in their evolution – and CCTV is no different. Machine learning techniques are being tested in the hope that they’ll provide CCTV cameras with the ability to spot ‘troubling behaviour’ without the need for a human operator.
Thermal Expert Infrared Camera for Smartphones and I3system I3BOL384_17A Micr...Yole Developpement
The highest resolution thermal camera for smartphones at 384 x 288 pixels, using a microbolometer with 17µm pixels from the South Korea’s I3 System.
Based on a high definition microbolometer from I3system, the Thermal Expert infrared camera is a high-end product for smartphones. A more conservative technological choice, the microbolometer is more expensive but offers better performance. The camera also embraces the quality approach with interchangeable lenses for different uses. I3system targets the professional market and competes more in standard IR cameras than IR cameras for smartphones.
The Thermal Expert camera is very compact and compatible with Android smartphones via its micro-USB-OTG connector. The camera does not use a battery, with power being supplied by the smartphone. The camera is shutterless.
The thermal camera uses a new 17µm pixel design from I3system. The I3BOL384_17A microbolometer features 384 x 288 pixel resolution, 24 times the resolution of the FLIR Lepton. The sensor technology in the I3system component is a titanium oxide microbolometer, technology which is not covered by Honeywell patents. The I3BOL384_17A is the consumer version of a military microbolometer.
This report presents a complete teardown analysis of the Thermal Expert camera and its microbolometer. Based on this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The report’s final component is a comparison between the characteristics of the FLIR One, Seek Thermal, Therm-App and Thermal Expert cameras and Lepton, EXC001, PICO384P and I3BOL384_17A microbolometers. The comparison highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
Aerospace performance integrated into a tactical-grade 6-axis IMU for industrial applications.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/honeywell-hg4930ca51-6-axis-mems-inertial-sensor/
Tesla Model 3 Inverter with SiC Power Module from STMicroelectronicssystem_plus
The first SiC power module in commercialized electric vehicles.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/tesla-model-3-inverter-with-sic-power-module-from-stmicroelectronics/
NVIDIA’s new generation Graphics Processing Unit (GPU) with TSMC CoWoS, 40GB Samsung HBM2, 2.5D and 3D packaging.
More information: https://www.systemplus.fr/reverse-costing-reports/nvidia-a100-ampere-gpu/
Latest Audi Q3 instrument cluster with immobilizer: Structural and cost analysis
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/audi-bosch-fpk-generation-2-instrument-cluster/
The Audi A8 zFAS ADAS Platform by Aptivsystem_plus
The first level 3 autonomous driving system, designed by Audi and manufactured by Aptiv (Delphi), integrates high-performance processors from Nvidia (Tegra K1), Altera (Cyclon V), Infineon (Aurix), and Mobileye (EyeQ3 image processor)
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/the-audi-a8-zfas-adas-platform-by-aptiv/
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...system_plus
Fourth generation of the S-Cam family from the leading ADAS camera player.
Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/zf-s-cam-4-forward-automotive-mono-and-tri-camera-for-adas/
GaN-on-Silicon Transistor Comparison 2018 Structural, Process & Costing Repor...Yole Developpement
Dive deep into the technology and cost of GaN-on-silicon HEMTs from EPC, Transphorm, GaN Systems, Panasonic and Texas Instruments.
More information on that report at https://www.i-micronews.com/report/product/gan-on-silicon-transistor-comparison-2018.html
Bosch’s first 6-Axis IMU for Automotive Application combining 3-Axis Gyroscope and 3-Axis Accelerometer
MEMS are getting broadly adopted in the automotive industry and non-safety applications like in-dash navigation are now requiring low-cost and small footprint components.
The SMI130 combines a 12-bit 3-Axis accelerometer and a 16-bit 3-Axis gyroscope in a 4.5x3.0mm LGA packages which is AEC-Q100 qualified for automotive applications. The measurement range of the yaw rate sensor can be adjusted in up to five steps between ±125°/s and ±2000°/s; the acceleration sensor offers four different measurement ranges between ±2g and ±16g.
The gyro integrates a new process for the capping. Indeed, the classic "glass-frit" wafer bonding has been abandoned in favor of an eutectic Aluminum-Germanium bonding.
The accelerometer features a new design which uses now only one mass structure for the moving parts compared to three for the previous generations.
The SMI130 is designed for non-safety-critical applications in the automotive industry, including in-dash navigation and telematics systems such as toll, eCall, and alarm systems.
More information on that report at http://www.i-micronews.com/reports.html
Intel RealSense D435 3D Active IR Stereo Depth Camera 2018 teardown reverse c...system_plus
The 3D camera is using infrared active stereo depth and red/green/blue sensors, and a VCSEL projector.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/intel-realsense-d435-3d-active-ir-stereo-depth-camera/
For the full video of this presentation, please visit:
https://www.embedded-vision.com/platinum-members/aimotive/embedded-vision-training/videos/pages/may-2019-embedded-vision-summit-debreczeni
For more information about embedded vision, please visit:
http://www.embedded-vision.com
Gergely Debreczeni, Chief Scientist at AImotive, presents the "Distance Estimation Solutions for ADAS and Automated Driving" tutorial at the May 2019 Embedded Vision Summit.
Distance estimation is at the heart of automotive driver assistance systems (ADAS) and automated driving (AD). Simply stated, safe operation of vehicles requires robust distance estimation. Many different types of sensors (camera, radar, LiDAR, sonar) can be used for distance estimation, and different distance estimation techniques can be used with each type of sensor. Each type of sensor and technique has unique strengths and weaknesses. Debreczeni examines these techniques and their strengths and weaknesses, and shows how multiple techniques using different sensor types can be fused to enable robust distance estimation for a specific automated driving application.
GaN Systems GS61004B GaN HEMT 2018 teardown reverse costing report published ...system_plus
Discover how GaN Systems has designed its high-current, low-voltage PCB embedded GaN-on-Si transistor.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/gan-systems-gs61004b-gan-hemt/
Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...Yole Developpement
Panasonic’s first 600V GaN HEMT has an innovative structure designed to integrate a normally-off transistor in a standard package, without a cascade structure
System Plus Consulting unveils Panasonic’s first GaN HEMT, assembled in a standard TO220 package. Thanks to its specific die design, the component is normally-off without using a cascade structure or special packaging.
Panasonic’s PGA26C09DV features a medium-voltage breakdown of 600V for a current of 15A (25°C), with very low RdsOn compared to its competitors. The transistor is optimized for AC-DC power supply, photovoltaic, and motor inverters.
The GaN and AlGaN layers are deposited by epitaxy on a silicon substrate. A complex buffer and template layer structure is used to reduce stress and dislocation. This is complemented by a thick superlattice structure clearly visible in the TEM analysis.
Based on a complete teardown analysis, this report also provides a production cost estimate for the epitaxy, HEMT, and package.
Moreover, this report offers a comparison with GaN Systems’ GS66504B and Transphorm’s GaN HEMT, highlighting the huge differences in design and manufacturing process and their impact on device size and production cost.
For more information visite us at: http://www.i-micronews.com/reports.html
The ARS4-A is a 77 GHz radar sensor offering simultaneous long and short range detection
The Continental ARS4-A Radar is designed for forward collision warning, emergency brake assist, collision mitigation system or Adaptive Cruise Control (ACC). A special feature of the device is the simultaneous measurement of long distances, up to 250m with +/-0.2m accuracy, and short range, up to 70m, relative velocity and angle between two objects. It is thus able to detect stationary objects without any camera support.
The system integrates two electronic boards including an NXP Semiconductor microcontroller and Broadcom Ethernet transceiver. The radio-frequency (RF) board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate and is equipped with planar antennas.
The NXP Semiconductor multi-channel 77 GHz radar transceiver chipset, composed of four receivers, two transmitters and an associated voltage controlled oscillator (VCO), is used as high-frequency transmitter and receiver. The RF dies are packaged in redistributed chip package (RCP) fan-out wafer level packages initially developed and manufactured by Freescale.
Based on a complete teardown analysis of the Continental radar, the report provides the bill-of-material (BOM) and the manufacturing cost of the radar sensor.
A complete physical analysis and manufacturing cost estimation of the NXP semiconductor monolithic microwave integrated circuits (MMICs) is available in a separate report.
More information on that report at http://www.i-micronews.com/reports.html
Texas Instruments’ LMG5200 GaN Power Stage - 2018 teardown reverse costing re...system_plus
The first 80V half-bridge GaN power stage from TI, with innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/texas-instruments-lmg5200-gan-power-stage/
The first 600V system-in-package half-bridge driver from STMicroelectronics integrating two GaN-based HEMTs.
More information: https://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-mastergan1-half-bridge-driver/
24 camera modules for consumer and automotive applications, all from the main OEMs - analyzed and compared!
Smartphone manufacturers are increasingly integrating options and powerful components into their products. 3D and dual-camera modules are now available, offering better-image quality and providing more options, i.e. iris scanners and augmented reality.
The automotive camera module market is also rising steadily and is beginning to take significant market share.
Paralleling Yole Développement’s Camera Module Industry 2017 Market Report, this comparative review was conducted to provide insights into the structure and technology of 19 CMOS camera modules (CCM) released in flagship smartphones from the major brands.
In this report, rear and front-facing compact camera modules (including standard (mono), dual, iris scanners, and 3D camera modules) are analyzed and compared in terms of structural overview, module integration, lens number and dimensions, CIS res
olution, and pixel size. Indeed, OIS (Optical Image Stabilization) and dual-cameras are the big new trends for mobile camera modules.
More information on that report at http://www.i-micronews.com/reports.html
Continental’s 3rd-generation short-range radar sensor: a simplified design improves cost-effectiveness.
The Continental SRR3-B is designed for automotive applications like blind-spot detection, lane-change assist, rear cross-traffic alert, rear pre-crash, safe exit, collision mitigation, distance warning /monitoring, and more. The SRR3-B is based on 24 GHz technology and contains a planar antenna. The sensor has a field of view of ±75° in azimuth and a maximum range of more than 90m.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/continental-srr3-b-24ghz-blind-spot-radar/
First self-made SoC for advanced driving in Tesla Driver Assist Autopilot 3.0
More : https://www.systemplus.fr/reverse-costing-reports/tesla-ubq01b0-fsd-chip/
Artificial intelligence for cctv cameras, video surveillanceHIGHMARK SECURITY
Artificial intelligence for cctv cameras, video surveillance
This era is called to be Artificial intelligence (AI) and Internet of Things (IoT), it is operated by robots and they are replaced the human. This article we mention the Artificial Intelligence for CCTV Cameras, Video Surveillance, it applies for this industry.
What is Artificial Intelligence ?
Artificial intelligence technology for CCTV Cameras
Artificial intelligence solutions for CCTV Cameras Companies
There has never been a better time to protect your property with CCTV; modern innovations have allowed security camera companies to create high-definition, fully manoeuvrable, internet-connecting cameras that provide their operators with an even wider range of flexibility than ever before. So where next for the CCTV camera industry?
Regardless of the industry in mind, automation seems to be the next step in their evolution – and CCTV is no different. Machine learning techniques are being tested in the hope that they’ll provide CCTV cameras with the ability to spot ‘troubling behaviour’ without the need for a human operator.
Thermal Expert Infrared Camera for Smartphones and I3system I3BOL384_17A Micr...Yole Developpement
The highest resolution thermal camera for smartphones at 384 x 288 pixels, using a microbolometer with 17µm pixels from the South Korea’s I3 System.
Based on a high definition microbolometer from I3system, the Thermal Expert infrared camera is a high-end product for smartphones. A more conservative technological choice, the microbolometer is more expensive but offers better performance. The camera also embraces the quality approach with interchangeable lenses for different uses. I3system targets the professional market and competes more in standard IR cameras than IR cameras for smartphones.
The Thermal Expert camera is very compact and compatible with Android smartphones via its micro-USB-OTG connector. The camera does not use a battery, with power being supplied by the smartphone. The camera is shutterless.
The thermal camera uses a new 17µm pixel design from I3system. The I3BOL384_17A microbolometer features 384 x 288 pixel resolution, 24 times the resolution of the FLIR Lepton. The sensor technology in the I3system component is a titanium oxide microbolometer, technology which is not covered by Honeywell patents. The I3BOL384_17A is the consumer version of a military microbolometer.
This report presents a complete teardown analysis of the Thermal Expert camera and its microbolometer. Based on this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The report’s final component is a comparison between the characteristics of the FLIR One, Seek Thermal, Therm-App and Thermal Expert cameras and Lepton, EXC001, PICO384P and I3BOL384_17A microbolometers. The comparison highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
Aerospace performance integrated into a tactical-grade 6-axis IMU for industrial applications.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/honeywell-hg4930ca51-6-axis-mems-inertial-sensor/
Tesla Model 3 Inverter with SiC Power Module from STMicroelectronicssystem_plus
The first SiC power module in commercialized electric vehicles.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/tesla-model-3-inverter-with-sic-power-module-from-stmicroelectronics/
NVIDIA’s new generation Graphics Processing Unit (GPU) with TSMC CoWoS, 40GB Samsung HBM2, 2.5D and 3D packaging.
More information: https://www.systemplus.fr/reverse-costing-reports/nvidia-a100-ampere-gpu/
Latest Audi Q3 instrument cluster with immobilizer: Structural and cost analysis
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/audi-bosch-fpk-generation-2-instrument-cluster/
The Audi A8 zFAS ADAS Platform by Aptivsystem_plus
The first level 3 autonomous driving system, designed by Audi and manufactured by Aptiv (Delphi), integrates high-performance processors from Nvidia (Tegra K1), Altera (Cyclon V), Infineon (Aurix), and Mobileye (EyeQ3 image processor)
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/the-audi-a8-zfas-adas-platform-by-aptiv/
Denso DNMWR009 Cruise Control Radar Distance Sensorsystem_plus
A cruise control radar distance sensor with Infineon SiGe CMOS Technology for Advanced Driver Assistance Systems (ADAS).
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/denso-dnmwr009-cruise-control-radar-distance-sensor/
SP20569 - IRay T3S Thermal Camera for Smartphonesystem_plus
Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/iray-t3s-thermal-camera-for-smartphone/
LG Display Medianav ECU Available in the Dacia Dustersystem_plus
A competitive high resolution, high luminance and wide viewing angle automotive display.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/lg-display-medianav-ecu-available-in-the-dacia-duster/
Ainstein T-79: Automotive 79GHz Short Range Radarsystem_plus
A next-generation short-range, wideband and high-resolution radar sensor for Advanced Driver Assistance Systems (ADAS).
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/ainstein-t-79-automotive-79ghz-short-range-radar/
Physical and cost analysis of the Ford SYNC 3 Silverbox extracted from the latest Ford Focus.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/ford-focus-sync-3-silverbox/
A PTFE-free radar, with single receive-transmit MMIC based on TowerJazz’s SiGe CMOS technology, for the first time associated with a phased array antenna.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/denso-dnsrr004-short-range-radar/
Tesla Model 3 Driver-Assist Autopilot Control Module Unitsystem_plus
Complete analysis of the module, which integrates Nvidia for the GPUs and Intel for the processor.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/tesla-model-3-driver-assist-autopilot-control-module-unit/
LeddarVu8: The first off-the-shelf solid state high-definition LiDAR module f...Yole Developpement
LeddarTech’s new LiDAR has no moving parts, giving it the smallest form factor while integrating the latest innovations in LiDAR technology
The light detection and ranging principle and technology, also known as LiDAR, is used in a wide spectrum of applications. With upcoming autonomous or “self-driving” cars, LiDAR technology is being considered for one option for the “eyes” of such vehicles. However, existing systems do not match the challenging reliability, compactness and cost-efficiency specifications of the automotive world.
Based on “LeddarCore” components, Leddartech has developed LeddarVu8, a compact solid-state LiDAR without mechanical movement that provides highly accurate multi-target detection over eight independent segments. It detects targets at up to 215 m range despite its tiny size of 70 mm x 35 mm x 46 mm and weighing only 75 grams. The LeddarVu8 delivers nearly twice the range for half the volume compared to the previous version.
These qualities qualify the LeddarVu8 as a candidate for advanced driver assistance, replacing the radar. With its adjustable and interchangeable optics module, the LeddarVu8 can also be interesting for other applications, such as traffic management, speed enforcement, heavy-duty equipment collision warning, navigation, liquid level sensing and bulk volume measurements.
The light is emitted by Excelitas’ tri-stacked emitting edge laser diode of 75W and received by a photodiode array. The two components are designed for large volume markets and some innovations reduce their usually high cost. This first automotive version of the LeddarVu8 shows the full potential of this technology to go under the $100 barrier.
This report presents the full system manufacturing and packaging processes for the LeddarVu8 as well as the physical analysis of the two main optical components, the laser diode and the photodiode. An estimation of the manufacturing cost and selling price is included.
More information on that report at http://www.i-micronews.com/reports.html
Aptiv’s Third Generation of 77 GHz-Based Short-Range Radar (SRR3)system_plus
The first highly integrated 77 GHz short range radar sensor for advanced driver assistance systems with a single receive-transmit MMIC bare die from Infineon found on the market.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/aptivs-third-generation-of-77-ghz-based-short-range-radar-srr3/
Physical and cost analysis of the Ford SYNC 3 Display ECU extracted from the latest Ford Focus.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/ford-focus-sync-3-display-ecu/
The MRR20 is a 77GHz radar sensor offering mid-range detection for Advanced Driver Assistance Systems (ADAS).
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/mando-mrr20-77ghz-mid-range-radar/
Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Syste...Yole Developpement
Continental consolidates its successful role in ADAS-related equipment with this cost-effective solution for emergency brake assist.
Light detection and ranging (LiDAR) sensing has a wide spectrum of applications, one of which is in autonomous or “self-driving” cars. LiDAR is therefore attracting attention from the automotive industry, as well as other fields. However, until now, systems haven’t matched challenging automotive specifications for reliability, compact-ness, and cost-efficiency.
Based on rugged design and components, the SRL-1 from Continental provides a reliable and efficient solid-state LiDAR for frontal impact detection without any mechanical movement. Detecting collisions in an urban environment at speeds up to 50km/h, including an emergency braking assist (EBA) function, makes this product a great asset for today’s autonomous and assisted driving needs.
More information on that report at http://www.i-micronews.com/reports.html
Discover Axis’s high-end product integrating its latest ARTPEC-7 in-house system-on-chip dedicated to network video and machine learning capabilities.
More information : https://www.systemplus.fr/reverse-costing-reports/axis-p1375-e-network-camera/
The first high reliability and highly rugged 9-axis IMU for industrial applications from Honeywell.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/honeywell-hg1120ca50-9-axis-mems-inertial-sensor/
LG LA080WV3 –8-inch Display with Touch Panel for Car Navigation 2017 teardown...Yole Developpement
An inside look at the reasons why LG Display is one of the top players in the automotive display market
Automotive displays are increasingly replacing mechanical meters and buttons, and the display market is therefore forecasted to grow rapidly over the next few years.
However, it is still unclear which suppliers will emerge as long-term winners. To fulfill the requirements of the market and its users, it is important to consider various conditions and specifications.
Display characteristics like luminance, contrast ratio, greyscale, and color, and their maintenance under automotive conditions of varying temperature and ambient light must continually improve.
LG Display provides smart infotainment to drivers and passengers. Its advanced high performance in-plane switching (AH-IPS) enables high resolution, high luminance and wide viewing angle, which is the display standard in smart cars.
LG Display stays competitive by combining low-cost manufacturing at its Nanjing site and the experience it has acquired in the automotive market.
This report presents a complete teardown analysis of LG’s LA080WV3 8-inch display and the associated touchscreen extracted from the Hyundai Tucson.
Based on this, it provides the bill-of-material (BOM) and manufacturing cost of the display module. The report also offers a complete physical analysis and manufacturing cost estimate for every part, including the backlight module and the different mechanical frames.
The latest Freebox Delta Server, supplied by Freebox, the French internet service provider, is the first modem/router compatible with the 10 Gbit/s FTTH 10G-EPON standard for general public use.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/freebox-delta-server/
World’s first 76-81 GHz automotive single-chip radar in a System-on-Chip device with integrated Antenna-in-Package using Fan-Out packaging technology.
Reverse Costing - Structure, process and cost report by System Plus Consulting - find more here: https://www.systemplus.fr/reverse-costing-reports/mediatek-autus-r10-mt2706-77-79-ghz-ewlbaip-radar-chipset/
Physical and cost analysis of the Bose Audio Amplifier found in the Renault Talisman.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/bose-automotive-audio-amplifier/
Similar to Denso’s Monocular Forward ADAS Camera in the Toyota Alphard (20)
SPR21610 - Vitesco Technologies Power Module in Jaguar I-PACE Invertersystem_plus
Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/vitesco-technologies-power-module-in-jaguar-i-pace-inverter/
Technical and cost overview of the evolution of radio frequency front-end module technologies integrated in 5G mmWave and Sub-6 GHz Phones.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-2-focus-on-5g-chipset/
Technical and cost overview of the evolution of the radio frequency front-end module technologies integrated in the Apple iPhone series from 2016 - 2020.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-1-focus-on-apple/
Deep dive analysis of the fourth generation of mid/high band front-end module for 4G and 5G from Broadcom.
More information : https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8200-pamid-in-the-apple-iphone-12-series/
Apple iPhone 12 series mmWave 5G Chipset and Antennasystem_plus
A study of the complete first generation of the 5G millimeter-wave chipset for Apple’s phones including custom antenna, front-end module and antenna-on-package.
More information : https://www.systemplus.fr/reverse-costing-reports/apple-iphone-12-series-mmwave-5g-chipset-and-antenna/
Deep analysis of the 400Gb optical transceiver from a leading Chinese company.
More information: https://www.systemplus.fr/reverse-costing-reports/innolights-400g-qsfp-dd-optical-transceiver/
EPC’s 70 V ePower stage with separate and independent high and low side control inputs.
More information: https://www.systemplus.fr/reverse-costing-reports/epc2152-half-bridge-monolithic-gan-ic/
Microsoft - Holographic Lens from Hololens 2system_plus
See-through holographic display for mixed reality smartglasses.
More on : https://www.systemplus.fr/reverse-costing-reports/microsoft-holographic-lens-from-hololens-2/
Cost-effective 1 mm2 miniature camera with customizable wafer-level optics for endoscopy and novel medical imaging devices.
More information : https://www.systemplus.fr/reverse-costing-reports/ams-naneye-mini-camera/
Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1)system_plus
Dig deep into Hikvision’s AI-powered thermal network camera for security applications.
More information: https://www.systemplus.fr/reverse-costing-reports/hikvision-intelligent-thermal-network-camera-ds-2td2166-15-v1/
Physical and cost analysis of Micron’s fifth-generation low-power DRAM memory.
More information: https://www.systemplus.fr/reverse-costing-reports/micron-lpddr5-12gb-mobile-memory/
In-depth physical and cost analysis of Samsung’s ‘1y-nm’ low power DRAM.
More information: https://www.systemplus.fr/reverse-costing-reports/samsung-lpddr5-12gb-mobile-memory/
Safran Colibrys MS1010 and MEMSIC MXA2500M High-End Accelerometerssystem_plus
Detailed technology and cost analysis of the high-end single-axis and dual-axis accelerometers integrated in the STIM318 IMU.
More information: https://www.systemplus.fr/reverse-costing-reports/safran-colibrys-ms1010-and-memsic-mxa2500m-high-end-accelerometers/
Hamamatsu Photodiode and Laser in Livox’s Horizon LiDARsystem_plus
Analysis of the six channels and 905nm pulsed laser and photodiode from Hamamatsu, in Livox’s LiDAR for automotive ADAS.
More information: https://www.systemplus.fr/reverse-costing-reports/hamamatsu-photodiode-and-laser-in-livox-horizon-lidar/
Everspin’s Spin Transfer Torque MRAM with perpendicular magnetic tunnel junction.
More information: https://www.systemplus.fr/reverse-costing-reports/everspin-emd3d256m-sttmram-memory/
MEMS Fabry-Perot interferometer in a very tiny NIR spectrometer.
More information: https://www.systemplus.fr/reverse-costing-reports/spectral-engines-nirone-sensor-x/
Deep analysis of the latest generation of under-display optical fingerprint sensors using micro-optics.
Reverse Costing - Structure, process and cost report by System Plus Consulting - find more here: https://www.systemplus.fr/reverse-costing-reports/goodixs-ultra-thin-optical-in-display-fingerprint/
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Seriessystem_plus
Cost effective third generation of mid/high band Front-End Module with advanced and innovative packaging.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8100-system-in-package-in-the-apple-iphone-11-series/
Advanced System-in-Package Technology in Apple’s AirPods Prosystem_plus
Analysis of Apple’s first SiP found in the latest AirPods, featuring a fully integrated SiP for audio codec and Bluetooth connectivity.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/advanced-system-in-package-technology-in-apples-airpods-pro/
Compare the technology and cost of 19 microphones from Knowles, Goertek, AAC Technologies, STMicroelectronics, TDK-InvenSense, TDK-Epcos, Cirrus Logic and Vesper.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/consumer-mems-microphones-comparison-2020/
Epistemic Interaction - tuning interfaces to provide information for AI supportAlan Dix
Paper presented at SYNERGY workshop at AVI 2024, Genoa, Italy. 3rd June 2024
https://alandix.com/academic/papers/synergy2024-epistemic/
As machine learning integrates deeper into human-computer interactions, the concept of epistemic interaction emerges, aiming to refine these interactions to enhance system adaptability. This approach encourages minor, intentional adjustments in user behaviour to enrich the data available for system learning. This paper introduces epistemic interaction within the context of human-system communication, illustrating how deliberate interaction design can improve system understanding and adaptation. Through concrete examples, we demonstrate the potential of epistemic interaction to significantly advance human-computer interaction by leveraging intuitive human communication strategies to inform system design and functionality, offering a novel pathway for enriching user-system engagements.
Accelerate your Kubernetes clusters with Varnish CachingThijs Feryn
A presentation about the usage and availability of Varnish on Kubernetes. This talk explores the capabilities of Varnish caching and shows how to use the Varnish Helm chart to deploy it to Kubernetes.
This presentation was delivered at K8SUG Singapore. See https://feryn.eu/presentations/accelerate-your-kubernetes-clusters-with-varnish-caching-k8sug-singapore-28-2024 for more details.
"Impact of front-end architecture on development cost", Viktor TurskyiFwdays
I have heard many times that architecture is not important for the front-end. Also, many times I have seen how developers implement features on the front-end just following the standard rules for a framework and think that this is enough to successfully launch the project, and then the project fails. How to prevent this and what approach to choose? I have launched dozens of complex projects and during the talk we will analyze which approaches have worked for me and which have not.
Key Trends Shaping the Future of Infrastructure.pdfCheryl Hung
Keynote at DIGIT West Expo, Glasgow on 29 May 2024.
Cheryl Hung, ochery.com
Sr Director, Infrastructure Ecosystem, Arm.
The key trends across hardware, cloud and open-source; exploring how these areas are likely to mature and develop over the short and long-term, and then considering how organisations can position themselves to adapt and thrive.
LF Energy Webinar: Electrical Grid Modelling and Simulation Through PowSyBl -...DanBrown980551
Do you want to learn how to model and simulate an electrical network from scratch in under an hour?
Then welcome to this PowSyBl workshop, hosted by Rte, the French Transmission System Operator (TSO)!
During the webinar, you will discover the PowSyBl ecosystem as well as handle and study an electrical network through an interactive Python notebook.
PowSyBl is an open source project hosted by LF Energy, which offers a comprehensive set of features for electrical grid modelling and simulation. Among other advanced features, PowSyBl provides:
- A fully editable and extendable library for grid component modelling;
- Visualization tools to display your network;
- Grid simulation tools, such as power flows, security analyses (with or without remedial actions) and sensitivity analyses;
The framework is mostly written in Java, with a Python binding so that Python developers can access PowSyBl functionalities as well.
What you will learn during the webinar:
- For beginners: discover PowSyBl's functionalities through a quick general presentation and the notebook, without needing any expert coding skills;
- For advanced developers: master the skills to efficiently apply PowSyBl functionalities to your real-world scenarios.
Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...Jeffrey Haguewood
Sidekick Solutions uses Bonterra Impact Management (fka Social Solutions Apricot) and automation solutions to integrate data for business workflows.
We believe integration and automation are essential to user experience and the promise of efficient work through technology. Automation is the critical ingredient to realizing that full vision. We develop integration products and services for Bonterra Case Management software to support the deployment of automations for a variety of use cases.
This video focuses on the notifications, alerts, and approval requests using Slack for Bonterra Impact Management. The solutions covered in this webinar can also be deployed for Microsoft Teams.
Interested in deploying notification automations for Bonterra Impact Management? Contact us at sales@sidekicksolutionsllc.com to discuss next steps.
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...Ramesh Iyer
In today's fast-changing business world, Companies that adapt and embrace new ideas often need help to keep up with the competition. However, fostering a culture of innovation takes much work. It takes vision, leadership and willingness to take risks in the right proportion. Sachin Dev Duggal, co-founder of Builder.ai, has perfected the art of this balance, creating a company culture where creativity and growth are nurtured at each stage.
GraphRAG is All You need? LLM & Knowledge GraphGuy Korland
Guy Korland, CEO and Co-founder of FalkorDB, will review two articles on the integration of language models with knowledge graphs.
1. Unifying Large Language Models and Knowledge Graphs: A Roadmap.
https://arxiv.org/abs/2306.08302
2. Microsoft Research's GraphRAG paper and a review paper on various uses of knowledge graphs:
https://www.microsoft.com/en-us/research/blog/graphrag-unlocking-llm-discovery-on-narrative-private-data/
DevOps and Testing slides at DASA ConnectKari Kakkonen
My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
Search and Society: Reimagining Information Access for Radical FuturesBhaskar Mitra
The field of Information retrieval (IR) is currently undergoing a transformative shift, at least partly due to the emerging applications of generative AI to information access. In this talk, we will deliberate on the sociotechnical implications of generative AI for information access. We will argue that there is both a critical necessity and an exciting opportunity for the IR community to re-center our research agendas on societal needs while dismantling the artificial separation between the work on fairness, accountability, transparency, and ethics in IR and the rest of IR research. Instead of adopting a reactionary strategy of trying to mitigate potential social harms from emerging technologies, the community should aim to proactively set the research agenda for the kinds of systems we should build inspired by diverse explicitly stated sociotechnical imaginaries. The sociotechnical imaginaries that underpin the design and development of information access technologies needs to be explicitly articulated, and we need to develop theories of change in context of these diverse perspectives. Our guiding future imaginaries must be informed by other academic fields, such as democratic theory and critical theory, and should be co-developed with social science scholars, legal scholars, civil rights and social justice activists, and artists, among others.
PHP Frameworks: I want to break free (IPC Berlin 2024)Ralf Eggert
In this presentation, we examine the challenges and limitations of relying too heavily on PHP frameworks in web development. We discuss the history of PHP and its frameworks to understand how this dependence has evolved. The focus will be on providing concrete tips and strategies to reduce reliance on these frameworks, based on real-world examples and practical considerations. The goal is to equip developers with the skills and knowledge to create more flexible and future-proof web applications. We'll explore the importance of maintaining autonomy in a rapidly changing tech landscape and how to make informed decisions in PHP development.
This talk is aimed at encouraging a more independent approach to using PHP frameworks, moving towards a more flexible and future-proof approach to PHP development.
UiPath Test Automation using UiPath Test Suite series, part 3DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 3. In this session, we will cover desktop automation along with UI automation.
Topics covered:
UI automation Introduction,
UI automation Sample
Desktop automation flow
Pradeep Chinnala, Senior Consultant Automation Developer @WonderBotz and UiPath MVP
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
Smart TV Buyer Insights Survey 2024 by 91mobiles.pdf91mobiles
91mobiles recently conducted a Smart TV Buyer Insights Survey in which we asked over 3,000 respondents about the TV they own, aspects they look at on a new TV, and their TV buying preferences.
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DENSO’S MONOCULAR FORWARD ADAS CAMERA INTHE TOYOTA ALPHARD
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Consequently any reasonable delay in the delivery of services will not allow the buyer to claim for damages or to
cancel the order.
7.ENTRUSTED GOODS SHIPMENT
The transport costs and risks are fully born by the Buyer. Should the customer wish to ensure the goods against lost or
damage on the base of their real value, he must imperatively point it out to System Plus Consulting when the
shipment takes place. Without any specific requirement, insurance terms for the return of goods will be the carrier
current ones (reimbursement based on good weight instead of the real value).
8.FORCE MAJEURE
System Plus Consulting responsibility will not be involved in non execution or late delivery of one of its duties
described in the current terms and conditions if these are the result of a force majeure case. Therefore, the force
majeure includes all external event unpredictable and irresistible as defined by the article 1148 of the French Code
Civil?
9.CONFIDENTIALITY
As a rule, all information handed by customers to system Plus Consulting are considered as strictly confidential.
A non-disclosure agreement can be signed on demand.
10.RESPONSABILITY LIMITATION
The Buyer is responsible for the use and interpretations he makes of the reports delivered by System Plus Consulting.
Consequently, System Plus Consulting responsibility can in no case be called into question for any direct or indirect
damage, financial or otherwise, that may result from the use of the results of our analysis or results obtained using
one of our costing tools.
11.APPLICABLE LAW
Any dispute that may arise about the interpretation or execution of the current terms and conditions shall be resolved
applying the French law.
It the dispute cannot be settled out-of-court, the competent Court will be the Tribunal de Commerce de Nantes.
TERMS AND CONDITIONS OF SALES