Micron LPDDR5 12GB Mobile Memory

©2020 System Plus Consulting | SP20566 Micron LPDDR5 12GB Mobile Memory | Sample 1
22 Bd. Benoni Goullin
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Micron LPDDR5 12GB Mobile Memory
Physical and cost analysis of Micron’s fifth-generation low-power DRAM
memory.
SP20566 Memory report analysis made by Belinda Dube
Laboratory analysis made by Véronique Le Troadec
October 2020 – Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

Table of Contents
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o Micron
o Micron Low Power DRAM Evolution
o Micron LPDDR5
Technology and Marker 16
o DRAM Revenue & Market Share
o DRAM Mobile Market& Shipments
Physical Analysis 21
o Synthesis of the Physical Analysis
o Physical Analysis Methodology
o Motorola Edge+ Teardown
o Package
✓ Package Views & Dimensions
✓ Package Opening
o Memory Die
✓ View, Dimensions & Marking
✓ Cross-Section
✓ Contacts and Metallization
o Micron DRAM Patents
Manufacturing Process Flow 65
o Global Overview
o Wafer Fabrication Unit
o Front-End Process
Cost Analysis 72
o Synthesis of the Cost Analysis
o Yields Explanation & Hypotheses
o LPDDR5 DRAM
✓ Memory Front-End Cost
✓ Memory Front-End Cost per process steps
o Component
✓ Memory Wafer & Die Cost
✓ Back-End: Final Test Cost
✓ LPDDR5 Component Cost
Estimated Price and Gross Margin Analysis 87
Company Services 93

O V E R V I E W
METHODOLOGY

Overview / Introduction
o Executive Summary
o Reverse Costing
Methodology
o Glossary
Company Profile
Technology and market
Physical Analysis
Physical Analysis Comparison
Manufacturing Process Flow
Cost Analysis
Cost Analysis Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Executive Summary
In the past year Micron had the third largest share in DRAM market after Samsung and SK Hynix. Micron recently announced a
high FQ4-20 revenue and that was driven by high DRAM shipments in the second half of the year. This Revenue increase will
sustain Micron’s competitiveness and leadership in the DRAM Market.
Mobile computing content is steeply rising, creating a higher demand in mobile memory solutions. Manufacturers of DRAM
memories position themselves to meet the aggressive demand of high-speed processing memories, power efficient memories
with higher capacity by constant innovation in their DRAM manufacturing process. Increasing demand for memory storage
continues to be driven by trends like Artificial intelligence, 5G applications and Internet of Things.
Micron’s LPDDR5 memory is characterized by higher power efficiency and faster processing of data at peak speeds of up to
6.4Gbps compared to previous low power DRAM. This memory is expected to consume 20% less power compared to the previous
generation low power DRAM.
The increase in area occupied by transistors on the DRAM die result in a significant area reduction of capacitors on the DRAM die.
DRAM Manufacturers decrease the dimension of the capacitors including the process technology used in DRAM manufacture.
This scaling decrease aims to meet the capacity demand yet increasing the manufacturing complexity.
This report constitutes an exhaustive analysis of Micron’s LPDDR5 memory dies. It covers a full analysis of the ultra-thin DRAM
package. The report includes high resolution images of the die and focuses on the capacitor dimension and word line structures.
The physical analysis and the process are used estimate the manufacturing steps to estimate of the low power DRAM wafer cost
and die cost. Included in the report is a comparison between Microns previous generation of low power DRAM LPDDR4X and the
LPDDR5. The die size, density and physical features are compared. The comparison focuses on the physical characteristics and the
manufacturing process differences.

o Executive Summary
o Reverse Costing
Methodology
o Glossary
Company Profile
Physical Analysis
Cost Analysis
Feedbacks
Related Reports
About System Plus
The reverse costing analysis for each DRAM memory is conducted in 3 phases:
Teardown
analysis
- Identification of element to be analyzed.
- Package is analyzed and measured.
- The dies are extracted in order to get overall data: dimensions, main blocks, pad number and markings.
- Die structure and process
Costing
analysis
- Setup of the manufacturing process
- Setup of the manufacturing environment
- Cost simulation of the process steps
- Assembly and testing
Selling price
analysis
- Selling price estimation
Reverse Costing Methodology

Company Profile
Physical Analysis
o Physical Methodology
o Synthesis
o Package Analysis
o Die Overview
o Die Cross-Section
o Die Delayering
o Physical Analysis Summary
o Patents
Cost Analysis
Feedbacks
Related Reports
About System Plus
Physical Analysis Methodology
• The package of the Low Power DRAM memory is analyzed and measured.
• The package is opened, the dies are extracted to get overall die data: dimensions, main characteristics including
device markings.
o Pictures of selected area are made in order to understand the process of fabrication and material used.
• The die information is extracted: dimensions, main blocks, pad number, die marking.
o Separation of memory dies
o Delayering (removal of metal layers) is performed to view and analyse selected areas in order to identify the technology node.
o SEM photographs to measure the layers and dimensions
o SEM pictures of structures in the memory die
o Cross-section of memory to measure thickness of all feature

Company Profile
Physical Analysis
o Synthesis
o Package Analysis
o Die Overview
o Die Cross-Section
o Die Delayering
o Patents
Cost Analysis
Feedbacks
Related Reports
About System Plus
LPDDR5 12GB Micron MT62F1536M64D8CH-036
Memory Package
©2020 by System Plus Consulting
Motorola Edge+ Tear Down
• The Micron MT62F1536M64D8CH-036 12GB memory package is found in the latest Motorola Edge+ 5G mobile smartphone.

Company Profile
Physical Analysis
o Synthesis
o Package Analysis
o Die Overview
o Die Cross-Section
o Die Delayering
o Patents
Cost Analysis
Feedbacks
Related Reports
About System Plus
Micron Package Opening
• The 8 dies are packaged in an ultra thin BGA package.
• This package is integrated in the thin Motorola Edge+ smartphone.

Company Profile
Physical Analysis
o Synthesis
o Package Analysis
o Die Overview
o Die Cross-Section
o Die Delayering
o Patents
Cost Analysis
Feedbacks
Related Reports
About System Plus
Micron - Die Cross-Section
Die Cross-Section- Optical View

Company Profile
Physical Analysis
o Synthesis
o Package Analysis
o Die Overview
o Die Cross-Section
o Die Delayering
o Patents
Cost Analysis
Feedbacks
Related Reports
About System Plus
Micron Die Cross-Section

Company Profile
Physical Analysis
o Synthesis
o Package Analysis
o Die Overview
o Die Cross-Section
o Die Delayering
o Patents
Cost Analysis
Feedbacks
Related Reports
About System Plus
Die Cross-Section- SEM View

Company Profile
Physical Analysis
o Synthesis
o Package Analysis
o Die Overview
o Die Cross-Section
o Die Delayering
o Patents
Cost Analysis
Feedbacks
Related Reports
About System Plus

Company Profile
Physical Analysis
o Synthesis
o Package Analysis
o Die Overview
o Die Cross-Section
o Die Delayering
o Patents
Cost Analysis
Feedbacks
Related Reports
About System Plus
Micron Die Delayering
Die delayering – capacitors top view

Company Profile
Physical Analysis
o Synthesis
o Package Analysis
o Die Overview
o Die Cross-Section
o Die Delayering
o Patents
Cost Analysis
Feedbacks
Related Reports
About System Plus
Micron Die Delayering

Company Profile
Physical Analysis
o Synthesis
o Package Analysis
o Die Overview
o Die Cross-Section
o Die Delayering
o Patents
Cost Analysis
Feedbacks
Related Reports
About System Plus
Micron Die Delayering – CMOS Transistors

Company Profile
Physical Analysis
o Synthesis
o Package Analysis
o Die Overview
o Die Cross-Section
o Die Delayering
o Patents
Cost Analysis
Feedbacks
Related Reports
About System Plus
Micron Patent - Capacitor electrodes

Company Profile
Physical Analysis
Cost Analysis
Feedbacks
Related Reports
About System Plus
LPDDR4 vs LPDDR5 Comparison
LPDDR5LPDDR4X tungsten layer

Company Profile
Physical Analysis
o Micron Overview
o Front End Process
o Fab Unit
o Manufacturing Process
Steps
o Final Test & Packaging
Cost Analysis
Feedbacks
Related Reports
About System Plus
Micron – Main Process Steps
Process flow methodology requires analysis of images and material used in order create the fabrication process of the memory.

Company Profile
Physical Analysis
o Micron Overview
o Front End Process
o Fab Unit
o Manufacturing Process
Steps
o Final Test & Packaging
Cost Analysis
Feedbacks
Related Reports
About System Plus
Drawing not to Scale
Micron LPDDR5 Process (2/3)

Company Profile
Physical Analysis
Cost Analysis
o Synthesis
o Micron Supply Chain
o Yield
o Wafer Front End Cost
o Step Cost
o Die Cost
o Package Cost
o Wafer Back End Cost
o Component Cost
Feedbacks
Related Reports
About System Plus
Micron Memory - CMOS and Top Metal Layers Front-End Cost

Company Profile
Physical Analysis
Cost Analysis
o Synthesis
o Yield
o Step Cost
o Die Cost
o Package Cost
o Component Cost
Feedbacks
Related Reports
About System Plus
Micron LPDDR5 - Cost per Process Step

Company Profile
Physical Analysis
Cost Analysis
o Synthesis
o Yield
o Step Cost
o Die Cost
o Package Cost
o Component Cost
Feedbacks
Related Reports
About System Plus
Micron Memory Wafer & Die Cost

Company Profile
Physical Analysis
Cost Analysis
o Micron Component Price
Feedbacks
Related Reports
About System Plus
Micron Manufacturing Cost/Gb

Company Profile
Physical Analysis
Cost Analysis
Feedbacks
Related Reports
About System Plus
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
ADVANCED PACKAGING
• DRAM Quarterly Market Monitor
• Status of the Memory Industry 2020
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
PACKAGING
• Samsung LPDDR5 12GB Mobile Memory
• YMTC’s 3D-NAND Flash Memory
• LPDDR4 Memory Comparison 2019

COMPANY
SERVICES

Company Profile
Physical Analysis
Cost Analysis
Feedbacks
Related Reports
About System Plus
o Company Services
o Contacts
Business Models Fields of Expertise
Custom Analyses
(>130 analyses per year)
Reports
(>60 reports per year)
Costing Tools
Trainings

Company Profile
Physical Analysis
Cost Analysis
Feedbacks
Related Reports
About System Plus
o Company Services
o Contacts
Contact
Headquarters
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+33 2 40 18 09 16
sales@systemplus.fr
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GERMANY
+49 151 23 54 41 82
llevenez@systemplus.fr
www.systemplus.fr
NANTES
Headquarter
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JAPAN
T : +81 804 371 4887
onozawa@yole.fr
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CN: +8613661566824
wang@yole.fr
America Sales Office
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WESTERN US
T : +1 310 600 8267
laferriere@yole.fr
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EASTERN US & CANADA
T : +1 919 607 9839
chris.youman@yole.fr

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