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High-end Performance Packaging 2020
This report from Yole Développement analyzes the high-end performance packaging market. It defines high-end performance packaging as technologies that provide high IO density (≥16/mm2) and fine IO pitch (≤130μm). The report aims to identify relevant technologies, analyze market drivers and challenges, describe technology trends and roadmaps, examine the supply chain landscape, and provide market forecasts. It evaluates the market by technology, end application, and region. The report also profiles key players' technology roadmaps and analyzes intellectual property in the 3D SoC hybrid bonding space.
