This document provides a reverse costing analysis of the Bosch BMX055 9-Axis MEMS IMU. It includes a physical analysis of the package and dies, manufacturing process flows for the ASIC, MEMS, and magnetometer dies, a cost analysis, and estimated selling price. The package is a 4.5x3.0x0.95mm LGA with 3 dies - a gyro/accel ASIC, MEMS gyro/accel dies, and a magnetometer die fabricated using CMOS and MEMS processes. The analysis estimates manufacturing costs and provides a price within a +/- 10% range given available data and industry expertise.

1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not
bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The
quoted trademarks are property of their owners.
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
www.systemplus.fr
21 rue la Nouë Bras de Fer
44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr
December 2013 – Version 1 – Written by Romain Fraux

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Glossary
1. Overview / Introduction 4
– Executive Summary
– Reverse Costing Methodology
2. Company Profile 7
– Bosch Sensortec
– BMX055 Characteristics
3. Physical Analysis 19
– Synthesis of the Physical Analysis
– Physical Analysis Methodology
– Package
– Package Views, Dimensions & Pin Out
– Package Opening
– Wire Bonding Process
– Package Cross-Section
– ASIC Gyro & Accelero Dies
– View, Dimensions & Marking
– Delayering
– Main Blocks Identification
– Cross-Section
– Process Characteristics
– MEMS Gyro & Accelero Dies
– View, Dimensions & Marking
– Bond Pad Opening & Bond Pad
– Cap Removed & Cap Details
– Sensing Area Details
– Cross-Section (Sensor, Cap & Bonding)
– Process Characteristics
– Magnetometer Die
– View, Dimensions & Marking
– Hall sensor and fluxgate sensors
– Delayering
– Main Blocks Identification
– Cross-Section (CMOS & Sensor)
– Process Characteristics
4. Manufacturing Process Flow 137
– Global Overview
– ASIC Gyro & Accelero Front-End Process
– MEMS Gyro & Accelero Process Flow
– Magnetometer Process Flow
– Wafer Fabrication Unit
– Packaging Process Flow
– Package Assembly Unit
5. Cost Analysis 167
– Synthesis of the cost analysis
– Main steps of economic analysis
– Yields Hypotheses
– ASIC Gyro & Accelero Front-End Cost
– ASIC Gyro & Accelero Back-End 0 : Probe Test & Dicing
– ASIC Gyro & Accelero Wafer & Die Cost
– MEMS Gyro & Accelero Front-End Cost
– MEMS Gyro & Accelero Front-End Cost per process steps
– MEMS Gyro & Accelero Back-End 0 : Probe Test & Dicing
– MEMS Gyro & Accelero Wafer & Die Cost
– Magnetometer CMOS Front-End Cost
– Magnetometer Sensor Cost
– Magnetometer Sensor Cost per process steps
– Magnetometer Back-End 0 : Probe Test & Dicing
– Magnetometer Wafer & Die Cost
– Back-End : Packaging Cost
– Back-End : Packaging Cost per Process Steps
– Back-End : Final Test & Calibration Cost
– BMX055 Component Cost
6. Estimated Price Analysis 215
– Manufacturer Financial Ratios
– Estimated Selling Price
Contact 220

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The reverse costing analysis is conducted in 3 phases:
Teardown
analysis
• Package is analyzed and measured
• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin
out, die marking
• Setup of the manufacturing process.
Costing
analysis
• Setup of the manufacturing environment
• Cost simulation of the process steps
Selling price
analysis
• Supply chain analysis
• Analysis of the selling price

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• Package is analyzed and measured.
• The package is opened to get overall dies data: dimensions, main characteristics, device markings.
– Pictures of selected area are made in order to understand the connections between the MEMS and the
ASIC.
• The ASICs are separated to get overall dies data: dimensions, main blocks, pad number and pin out,
die marking.
– Removal of metal layers (step by step) to measure the minimum dimensions.
– Pictures of selected areas to identify the nature of the transistors.
– SEM photographs to measure the transistors dimensions.
• The MEMS are separated to get overall dies data: dimensions, main blocks, pad number and pin
out, die marking.
– SEM pictures of mechanical structures.
– Cross section of MEMS to measure thicknesses.

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• Package: LGA 20-pin
• Dimensions: 4.5 x 3.0 x 0.95mm
• Pin Pitch: 0.5mm
• Marking:
X55E
A1310
9D-C1
Package top view
Package back viewPackage Side View
Orientation of Axes
(from datasheet)

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• The die marking includes the logo of Bosch and:
BAG160C
BOSCH
2012
ASIC Gyro Die Marking

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• The die marking includes the logo of Bosch and:
CMG
130Q
MEMS Gyro Die Marking
MEMS bond pads

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• The die marking includes the logo of Bosch and:
BAA255CA
BOSCH
2012
ASIC Accelero Die Marking

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• The die marking includes:
BOSCH
CMA232T
MEMS Accelero Die Marking
MEMS Accelero bond pads

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• The die marking includes the logo of Bosch and:
BAM150AB
BOSCH
2012
Magnetometer Die Marking

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Si wafer
•Thinning 300µm
•Pad oxide (Oxide1)
deposit
Si wafer
•Buried Poly (Poly1)
deposition
•Ion implantation
•Pattern & etch
Si wafer
•Sacrificial Oxide 1 (Oxide
2) deposit
•Pattern & etch
Si wafer
•Seed Layer (Poly 2)
Deposition
•Ion implantation
•Pattern & Etch

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Reverse costing analysis represents the best cost/price evaluation given the publically available
data, and estimates completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a
+/- 10% correction on the manufacturing cost (if all parameters are cumulated).
These results are open for discussion. We can reevaluate this circuit with your information.
Please contact us:
USA Office
• Michael McLaughlin, Business Development Manager, Phone: (650) 931 2552 - Cell: (408) 839 7178 - Email: mclaughlin@yole.fr
• Jeff Edwards, Sales Associate, Yole Inc., Cell: (972) 333 0986- Email: edwards@yole.fr
Japan Office
• For custom research: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.
Phone: (81) 362 693 457 - Cell : (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: katano@yole.fr
• For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.
Email: onozawa@yole.fr
European Office
• Yves Devigne, Europe Business Development Manager, Cell : +33 6 75 80 08 25 - Email : devigne@yole.fr
• Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer Service, Tel: +33 472 83 01 90, Email:
jourdan@yole.fr
Korea Office
• Hailey Yang, Business Development Manager, Phone : (82) 2 2010 883 - Cell: (82) 10 4097 5810
- Fax: (82) 2 2010 8899 – Email: yang@yole.fr