Semiconductor Wafer Test Technology and Trends: Lessons for MEMS Test Engineers presentation at MEMS Testing and Reliability 3rd Annual Conference (October 20, 2011) by Ira Feldman (www.hightechbizdev.com)

1. Feldman Engineering
Semiconductor Wafer Test
Technology and Trends:
Lessons for MEMS Test Engineers
Ira Feldman
October 20, 2011
MEMS Testing & Reliability Conference 2011
© 2011 Feldman Engineering Corp.

2. MEMS Testing & Reliability Conference 2011
Outline
} Market Dynamics
} Testing Semiconductors vs. MEMS
} Cost of Test
} Semiconductor Solutions
} MEMS Challenges
} MEMS @ Semiconductor Wafer Test Workshop
} Conclusion
2

3. MEMS Testing & Reliability Conference 2011
~ 5.5 B Units
“MEMS Roadmap: From Device to Function” Jean-Christophe Eloy, Semicon West 2011 3

4. DRAM
MEMS Testing & Reliability Conference 2011
~ 17.4 B
Units
in 2011
http://www.dramexchange.com/Market/market_activity.aspx 4

5. Cost of Test – Constant Pressure
MEMS Testing & Reliability Conference 2011
“Wafer Level Testing – Challenges and Opportunities” Vikas Sharma, Intel Corporation 5

6. Package Proliferation
MEMS Testing & Reliability Conference 2011
“Backend to the Front Line” William Chen, ASE Group, SWTW 2011 6

7. MEMS Testing & Reliability Conference 2011
Outline
} Market Dynamics
} Testing Semiconductors vs. MEMS
} Cost of Test
} Semiconductor Solutions
} MEMS Challenges
} MEMS @ Semiconductor Wafer Test Workshop
} Conclusion
7

8. Device Testing
MEMS Testing & Reliability Conference 2011
Device
Stimulus Under Test Response Correct?
(DUT)
8

9. Traditional Wafer Probe Test Cell
MEMS Testing & Reliability Conference 2011
Stimulus
Electrical
DUT
Response
Thermal
Verigy / Advantest 9

10. Stimulus & Response - Traditional
MEMS Testing & Reliability Conference 2011
Electrical
Device
Under Test Electrical
(DUT)
Thermal
• Semiconductors
• Oscillators
• MEMS switches
• MEMS filters
• MEMS oscillators
10

11. Stimulus & Response - Optical
MEMS Testing & Reliability Conference 2011
Electrical
Device Electrical
Thermal Under Test
(DUT) Optical
• Image Sensors
Optical • LEDs
• Micro- / Pico -
projectors (DLP,
etc.)
• Micro bolometers
11

12. Stimulus & Response – MEMS Sensors
MEMS Testing & Reliability Conference 2011
Electrical
Thermal
Electrical
Device
Under Test
Motion
(DUT)
Pressure
• Accelerometers
Magnetic • Gyroscopes
• Magnetic Compass
• Microphones
• Speakers
• Pressure sensors
Pressure …
12

13. Stimulus & Response – Life Science + ?
MEMS Testing & Reliability Conference 2011
Electrical
Electrical
Thermal Device
Under Test Mass
Mass (DUT)
• Valves
• Pumps
Optical
• Mixers
Optical • Micro reactors
• Sensors
• Micro explosives
…
Mass include movement of material in / out of DUT such as fluids & gas. 13

14. Device Testing
MEMS Testing & Reliability Conference 2011
Device
Stimulus Under Test Response Correct?
(DUT)
14

15. MEMS Testing & Reliability Conference 2011
Outline
} Market Dynamics
} Testing Semiconductors vs. MEMS
} Cost of Test
} Semiconductor Solutions
} MEMS Challenges
} MEMS @ Semiconductor Wafer Test Workshop
} Conclusion
15

16. Cost of Test Drivers
MEMS Testing & Reliability Conference 2011
Increasing Tighter
test pad
frequency pitches
Increasing Increasing
transistor probe
count Increased count
Cost
16

17. Semiconductor Cost - Test Solutions
MEMS Testing & Reliability Conference 2011
Test Increased Test Lower
Reduction Parallelism Partitioning Cost
Silicon
Velocity
17

18. www.bobsspaceracers.com
Confl
Intuit
icting
ive S
olutio
& Cou
ns
nter
18
MEMS Testing & Reliability Conference 2011

19. Semiconductor Cost - Test Solutions
MEMS Testing & Reliability Conference 2011
Test Increased Test Lower
Reduction Parallelism Partitioning Cost
Silicon
Velocity
19

20. MEMS Testing & Reliability Conference 2011
Test
Reduction
- Test Escapes
- Run time complexity
+ Statistical based sampling
+ Test elimination
20

21. MEMS Testing & Reliability Conference 2011
Increased
Parallelism
- Increased probe card cost
- Increased tester resources
+ Decreased handling time
+ Greater prober amortization
+ Reduced floor space
+ Increased Silicon Velocity
21

22. MEMS Testing & Reliability Conference 2011
Test
Partitioning
- Increased process steps
- Increased process complexity
+ Optimized high-cost ATE
22

23. MEMS Testing & Reliability Conference 2011
23
“Bemo – Nemo – Remo, The Trifurcation of the ATE Industry”, Jim Healy, Sony LSI Design, ATE Vision July 2011

24. MEMS Testing & Reliability Conference 2011
Outline
} Market Dynamics
} Testing Semiconductors vs. MEMS
} Cost of Test
} Semiconductor Solutions
} MEMS Challenges
} MEMS @ Semiconductor Wafer Test Workshop
} Conclusion
24

25. Manual Alignment
MEMS Testing & Reliability Conference 2011
www.vortexcontrolsystems.com 25
Electroglas 2001 ca. 1982-5

26. Technoprobe
Cantilever & Blade
SV Probe
26
MEMS Testing & Reliability Conference 2011

27. MEMS Testing & Reliability Conference 2011
ole
eH
cop
ic ros ulus?
l M rical stim
igia n-elect
est r no
V fo
path
Verigy V5400 Testhead 27

28. MEMS Testing & Reliability Conference 2011
Vertical - Buckling Beam
FormFactor: “MEMS for ProbeCard Applications”
Chong Chan Pin – Semicon Singapore 2010
Mann: SWTW Tutorial 2004
SV Probe “Trio”
JEM “VC” 28

29. MEMS Testing & Reliability Conference 2011
Vertical - Buckling Beam
MicroProbe: Apollo Vertical
JEM:VC
SV Probe: Trio
29

30. MEMS Testing & Reliability Conference 2011
MEMS - Vertical
Microfabrica MicroProbe
FormFactor (T1)
MicroProbe (Vx-MP)
30

31. MEMS Testing & Reliability Conference 2011
MEMS - Micro Cantilever
Microfabrica
FormFactor (T3)
MJC (U Probe)
http://www.mjc.co.jp/eng/ir/pdf/MJC070226-s.pdf
JEM
31

32. Vertical Probe Head
MEMS Testing & Reliability Conference 2011
Printed Circuit Board
BGA (Solder Attach)
Space Transformer
Upper Guide
Plate
Spacer
Lower Guide
Plate
MicroProbe Apollo Probes
32

33. FormFactor CMOS Imaging Solution
MEMS Testing & Reliability Conference 2011
Stiffener
PCB
Probe Head
33

34. MEMS Testing & Reliability Conference 2011
Outline
} Market Dynamics
} Testing Semiconductors vs. MEMS
} Cost of Test
} Semiconductor Solutions
} MEMS Challenges
} MEMS @ Semiconductor Wafer Test Workshop
} Conclusion
34

35. SWTW 2011
MEMS Testing & Reliability Conference 2011
"MSO - Multi-Site Optimizer"
Kevin Fredriken
(SPA GmbH - Germany)
• MEMS device alternating
rotation across wafer à
required two probe passes.
• No probe of cap or wafer
exclusion zone
• Developed four site probe card
and stepping algorithm using
MSO. Inclusive probing with
multi-probes on some die. 35

36. SWTW 2011
MEMS Testing & Reliability Conference 2011
"Probe to Pad Placement Error
Correction for Wafer Level S-
Parameter Measurements"
Steven Ortiz
(Avago Technologies - USA)
• FBAR structure – resonator plus
cap wafer.Vias through cap wafer
to resonator.
• Due to very high frequency and
tight specification tolerance, very
sensitive to location of probes
on pad. à Implemented
“calibration” structures to de-
embed the measurements.
36

37. SWTW 2011
MEMS Testing & Reliability Conference 2011
"Ghosting - Touchdown Reduction Using Alternate Site Sharing"
Doron Avidar and Yossi Dadi (Micron - Israel)
When using large multisite arrays that need > 3 touchdowns / wafer, “ghosting” may save
several touchdowns. Examples showed12 to 20% savings. 37

38. MEMS Testing & Reliability Conference 2011
Summary
} Proven semiconductor cost reduction techniques
} Not always intuitive
} Require test engineering
} Can be applied to MEMS
} MEMS wafer test challenge
} Multi-site stimulus and response
} Proper probe card architectures required
} Solution integration support
38

39. MEMS Testing & Reliability Conference 2011
Resources
} IEEE Semiconductor Wafer Test Workshop (SWTW)
} http://www.swtest.org
} International SEMATECH Manufacturing Initiative (ISMI)
Probe Card Cost Model
} http://ismi.sematech.org/modeling/probeCOO.htm
} SEMI E35-0307
} Guide to Calculate Cost of Ownership (COO) Metrics for
Semiconductor Manufacturing Equipment
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40. MEMS Testing & Reliability Conference 2011
Thank You!
Ira Feldman
ira@feldmanengineering.com
Visit my blog
www.hightechbizdev.com
for additional test resources.
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