GaN power devices: a promising, fast-growing market
A GROWING MARKET WITH LOTS OF EXCITING NEWS IN 2015 - 2016
2015 - 2016 has been an exciting year for the gallium nitride (GaN) power business. Up until late 2014, 600V/650V GaN HEMTs’ commercial availability was still questionable, despite some announcements from different players. Fast-forward to 2016 end users can now buy not only low-voltage GaN (<200V) devices from Efficient Power Conversion (EPC), but also high-voltage (600V/650V) components from several players, including Transphorm, GaN Systems, and Panasonic.
Also, a new start-up, Navitas Semiconductor, announced their GaN power IC in March 2016, followed by Dialog Semiconductors revealing their GaN power IC in August 2016. The idea
of bringing GaN from the power semiconductor market to the much bigger analog IC market is of interest to several other players too. For example, EPC and GaN Systems are both working on a more integrated solution, and Texas Instruments, a well-established analog IC player, has also been engaged in GaN activities, releasing an 80V power stage and 600V power stage in 2015 and 2016, respectively.
Despite these exciting developments, the GaN power market remains small compared to the gigantic $335B silicon semiconductor market. In fact, according to Yole Développement (Yole) investigation the GaN power business was less than $10M in 2015. But before you think twice about GaN, remember that a small market size is not unusual for products just appearing on the market.
The first GaN devices were not commercially available until 2010, so we are talking about an industry that is only six years old. What is most important is the GaN market’s future potential – and Yole expects the GaN power business to grow, reaching a market size of around $300M in 2021 at a 2016 – 2021 CAGR of 86%.
This report provides a structured vision of the GaN power device market in terms of uses, applications, and potential trends.
GaN and SiC for power electronics applications 2015 Report by Yole DeveloppementYole Developpement
The SiC market is expected to treble and GaN is expected to explode - if challenges are overcome
In 2014, the SiC chip business was worth more than $133M. As in previous years, power factor correction (PFC) and photovoltaics (PV) are still the leading applications.
SiC diodes represent more than 80% of the market. In 2020, diodes will remain the main contributor across various applications, including electric and hybrid electric vehicles (EV/HEV), PV, PFC, wind, Uninterruptible Power Supplies (UPS) and motor drives.
SiC transistors will grow in parallel with diodes, driven by PV inverters. Challenges must be overcome prior to the adoption of pure SiC solutions for EV power train inverters, which is nevertheless expected by 2020.
Including the growth in both diodes and transistors we expect the total SiC market to more than treble by 2020, reaching $436M...
Imaging Technologies for Automotive 2016 Report by Yole Developpement Yole Developpement
Imaging technology, which is currently mainly cameras, is exploding into the automotive space, and is set to grow at 20% CAGR to reach $7.3B in 2021
INFOTAINMENT AND ADVANCED DRIVER ASSISTANCE SYSTEMS (ADAS) PROPEL AUTOMOTIVE IMAGING
Since 2008, when a recession acted as a wakeup call to the whole industry, the automotive market has undergone obvious structural change. Capitalizing on technologies initially developed for smartphones, electronics have invaded, and imaging technology is now taking center stage. From less than one camera per car on average in 2015, there will be more than three cameras per car by 2021, which means 371 million automotive imaging devices.
Cameras were initially mounted for ADAS purposes on high-end vehicles, with deep learning image analysis techniques promoting early adoption. The Israeli company Mobileye has been instrumental in bringing this technology to market, along with On Semiconductor, which provided the CMOS image sensor. Copycat competition will probably pick up as the market now justifies initial investment in design and technology. It is now a well-established fact that vision-based autonomous emergency braking (AEB) is possible and saves life. Adoption of forward ADAS cameras will therefore accelerate.
Growth of imaging for automotive is also being fueled by the park assist application, and 360° surround view camera volume is skyrocketing. While it’s becoming mandatory in the US to have a rearview camera, that uptake is dwarfed by 360° surround view cameras, which enable a “bird’s eye view” perspective. This trend is most beneficial to companies like Omnivision at sensor level and Panasonic and Valeo, which have become the main manufacturers of automotive cameras.
Mirror replacement cameras are currently the big unknown and take-off will primarily depend on its appeal and car design regulation. Europe and Japan are at the forefront of this trend, which should become slightly significant by 2021.
Solid state lidar is well talked about and will start to be found in high end cars by 2021. Cost reduction will be a key driver as the push for semi-autonomous driving will be felt more strongly by car manufacturers. The report will analyse the impact of lidar for automotive vision in detail.
Night vision cameras using Long Wave Infrared (LWIR) technology were initially perceived as a status symbol. However, they’re increasingly appreciated for their ability to automatically detect pedestrians and wildlife. LWIR will therefore become integrated into ADAS systems in future.
3D cameras will be limited to in-cabin infotainment and driver monitoring. This technology will be key for luxury cars and therefore is of limited use today.
If any significant semi-autonomous trend picks up, the technology will probably become mandatory, due to safety issues.
More information on that report at http://www.i-micronews.com/reports.html
Inverter Technology Trends and Market Expectations 2016 Report by Yole Develo...Yole Developpement
Growing at 6% per year from 2015-2021 and with increased presence from Chinese players, the inverter industry is heading towards higher power density converters.
2015 was a historic year for solar inverter and wind turbine installations.
The inverter market that Yole Développement covers in this report is continuing its growth, reaching $48B in 2015. Applications span electric and hybrid electric vehicles (EV/HEV), wind turbines, photovoltaic (PV) inverters, rail traction, uninterruptible power supplies (UPS) and industrial motor drives. The market is driven by three macroeconomic factors: electrification trends in transportation, the need for power conversion optimization for CO2 emission reduction, and the development of clean electricity sources. Governmental incentives and especially the Chinese government’s control of their local market drives an expanding inverter market, which is now largely oriented towards the Asian giant...
Gate Driver Market and Technology Trends - 2017 Report by Yole DeveloppementYole Developpement
Gate driver ICs will be challenged by greater integration demands and the arrival of GaN and SiC.
The gate driver IC market will benefit from the steady growth of the power semiconductor industry
In recent years, a much greater percentage of home appliances, electric vehicles, hybrid vehicles, including mild hybrids, and renewable energy products have implemented dedicated power semiconductors devices on-board. The majority of these applications utilize power MOSFETs and IGBTs as power switches, but the adoption rate of gate drivers and applications of IGBTs and MOSFETs are different. In 2016, more than 60% of the gate drivers used in power applications were attached to MOSFETs. Nevertheless, the revenue gap between MOSFET and IGBT gate drivers is quickly narrowing.
Yole Développement (Yole) forecasts gate driver ICs will benefit from power semiconductors delivering a 6.1% compound annual growth rate (CAGR) from 2017-2022. The gate driver IC market revenue, which was estimated to have been $1.2B in 2016, is forecast to have a 5.1% CAGR for 2017-2022.
To get more information, please visit our website: https://www.i-micronews.com/reports.html
Sensors for Home Healthcare Applications: Market & Technology Analysis 2013 R...Yole Developpement
The market for sensors in home healthcare applications will explode from $559M in 2013 to $1.2B by 2018!
Sensors for home care will explode over the next five years
From 2000 - 2050, the proportion of the world's population aged 60 and over will grow from about 16% to 25% -- an increase linked to a marked growth of chronic diseases (Alzheimer's, diabetes, cancers, etc.). Healthcare systems’ rising costs and a physicians’ shortage are paving the way for increased home care.
Sensors previously developed for non-medical applications are transitioning to home care applications, and the market for sensors dedicated to home care applications is poised to grow from $559M in 2013 to $1.2B by 2018.
During Yole's research, the following sensors were investigated: accelerometers, barometers, electrochemical biosensors, flow sensors, gyroscopes, humidity sensors, IR temperature sensors, magnetometers, microfluidic chips, microphones, photodetectors, pressure sensors, proximity IR sensors, RF MEMS, RFID, and strain sensors. For each sensors, Yole’s Home Care Report provides market data and unit/value forecasts.
Collectively, these sensors have numerous applications in the home care market, from fall detection systems to tremor monitoring in Parkinson’s disease.
Today, the three most-used sensors are photodetectors, pressure sensors and electrochemical sensors.
A highly segmented market
Home care, also called home healthcare, refers to the at-home care provided to a person with special needs. This includes people who are ageing, chronically ill, recovering from surgery, or disabled.
Transferring a patient from a hospital to his/her home implies a relocation of care systems. In order to maintain the same level of care quality with less human involvement, home care sensors are vital replacements for specific applications ordinarily performed by nurses, such as guaranteeing the patient’s comfort, ensuring their safety, monitoring body parameters and treatments, and drug delivery.
Using a disruptive segmentation, Yole’s analysts have gathered all of the information necessary for understanding each application’s market needs.
More information on that report at http://www.i-micronews.com/reports/Sensors-Home-Healthcare-Applications-Market-Analysis/1/409/
Power SiC 2016: Materials, Devices, Modules, and Applications - 2016 Report b...Yole Developpement
More confident and more prepared, power SiC is progressing at a 2015 - 2021 CAGR of 19%!
SiC power is diffusing into multiple application segments
When the first SiC diode was launched in 2001, the industry questioned the future of the SiC power business: Will it grow? Is this a real business? 15 years later, in 2016, people don’t ask these questions anymore. The SiC power business is concrete and real, with a promising outlook. The SiC power market (diode and transistor included) is estimated to be more than $200M in 2015 and forecasted to be more than $550M in 2021, with a 2015 - 2021 CAGR of 19%. Not surprisingly, the power factor correction (PFC) power supply market is still the leading application, consuming a large volume of diodes.
Photovoltaics (PV) inverters are close behind. SiC diodes and MOSFETs are now used by various PV inverter manufacturers in their products. It has been confirmed that SiC implementation provides several performance benefits: increased efficiency, reduced size and weight. In addition, it allows to low cost at the system level in certain power range. Yole Développement has received increasingly positive feedback from the market, and we expect other manufacturers to follow in the footsteps of the early adopters, leading to a rapid expansion of the PV segment in the coming years.
Status of the Power Electronics Industry 2019 by Yole DéveloppementYole Developpement
Long term growth of the power electronics market is driving 300mm wafer-based production.
More information on: https://www.i-micronews.com/products/status-of-the-power-electronics-industry-2019/
Status of The Advanced Packaging Industry_Yole Développement reportYole Developpement
IoT driven semiconductor industry consolidation is reflecting into a highly dynamic Advanced Packaging landscape. Demand for advanced packaging and market size is increasing. Focus is turning
to integration and wafer level packages to enable a functionality driven roadmap and revive the cost/performance curve.
GaN and SiC for power electronics applications 2015 Report by Yole DeveloppementYole Developpement
The SiC market is expected to treble and GaN is expected to explode - if challenges are overcome
In 2014, the SiC chip business was worth more than $133M. As in previous years, power factor correction (PFC) and photovoltaics (PV) are still the leading applications.
SiC diodes represent more than 80% of the market. In 2020, diodes will remain the main contributor across various applications, including electric and hybrid electric vehicles (EV/HEV), PV, PFC, wind, Uninterruptible Power Supplies (UPS) and motor drives.
SiC transistors will grow in parallel with diodes, driven by PV inverters. Challenges must be overcome prior to the adoption of pure SiC solutions for EV power train inverters, which is nevertheless expected by 2020.
Including the growth in both diodes and transistors we expect the total SiC market to more than treble by 2020, reaching $436M...
Imaging Technologies for Automotive 2016 Report by Yole Developpement Yole Developpement
Imaging technology, which is currently mainly cameras, is exploding into the automotive space, and is set to grow at 20% CAGR to reach $7.3B in 2021
INFOTAINMENT AND ADVANCED DRIVER ASSISTANCE SYSTEMS (ADAS) PROPEL AUTOMOTIVE IMAGING
Since 2008, when a recession acted as a wakeup call to the whole industry, the automotive market has undergone obvious structural change. Capitalizing on technologies initially developed for smartphones, electronics have invaded, and imaging technology is now taking center stage. From less than one camera per car on average in 2015, there will be more than three cameras per car by 2021, which means 371 million automotive imaging devices.
Cameras were initially mounted for ADAS purposes on high-end vehicles, with deep learning image analysis techniques promoting early adoption. The Israeli company Mobileye has been instrumental in bringing this technology to market, along with On Semiconductor, which provided the CMOS image sensor. Copycat competition will probably pick up as the market now justifies initial investment in design and technology. It is now a well-established fact that vision-based autonomous emergency braking (AEB) is possible and saves life. Adoption of forward ADAS cameras will therefore accelerate.
Growth of imaging for automotive is also being fueled by the park assist application, and 360° surround view camera volume is skyrocketing. While it’s becoming mandatory in the US to have a rearview camera, that uptake is dwarfed by 360° surround view cameras, which enable a “bird’s eye view” perspective. This trend is most beneficial to companies like Omnivision at sensor level and Panasonic and Valeo, which have become the main manufacturers of automotive cameras.
Mirror replacement cameras are currently the big unknown and take-off will primarily depend on its appeal and car design regulation. Europe and Japan are at the forefront of this trend, which should become slightly significant by 2021.
Solid state lidar is well talked about and will start to be found in high end cars by 2021. Cost reduction will be a key driver as the push for semi-autonomous driving will be felt more strongly by car manufacturers. The report will analyse the impact of lidar for automotive vision in detail.
Night vision cameras using Long Wave Infrared (LWIR) technology were initially perceived as a status symbol. However, they’re increasingly appreciated for their ability to automatically detect pedestrians and wildlife. LWIR will therefore become integrated into ADAS systems in future.
3D cameras will be limited to in-cabin infotainment and driver monitoring. This technology will be key for luxury cars and therefore is of limited use today.
If any significant semi-autonomous trend picks up, the technology will probably become mandatory, due to safety issues.
More information on that report at http://www.i-micronews.com/reports.html
Inverter Technology Trends and Market Expectations 2016 Report by Yole Develo...Yole Developpement
Growing at 6% per year from 2015-2021 and with increased presence from Chinese players, the inverter industry is heading towards higher power density converters.
2015 was a historic year for solar inverter and wind turbine installations.
The inverter market that Yole Développement covers in this report is continuing its growth, reaching $48B in 2015. Applications span electric and hybrid electric vehicles (EV/HEV), wind turbines, photovoltaic (PV) inverters, rail traction, uninterruptible power supplies (UPS) and industrial motor drives. The market is driven by three macroeconomic factors: electrification trends in transportation, the need for power conversion optimization for CO2 emission reduction, and the development of clean electricity sources. Governmental incentives and especially the Chinese government’s control of their local market drives an expanding inverter market, which is now largely oriented towards the Asian giant...
Gate Driver Market and Technology Trends - 2017 Report by Yole DeveloppementYole Developpement
Gate driver ICs will be challenged by greater integration demands and the arrival of GaN and SiC.
The gate driver IC market will benefit from the steady growth of the power semiconductor industry
In recent years, a much greater percentage of home appliances, electric vehicles, hybrid vehicles, including mild hybrids, and renewable energy products have implemented dedicated power semiconductors devices on-board. The majority of these applications utilize power MOSFETs and IGBTs as power switches, but the adoption rate of gate drivers and applications of IGBTs and MOSFETs are different. In 2016, more than 60% of the gate drivers used in power applications were attached to MOSFETs. Nevertheless, the revenue gap between MOSFET and IGBT gate drivers is quickly narrowing.
Yole Développement (Yole) forecasts gate driver ICs will benefit from power semiconductors delivering a 6.1% compound annual growth rate (CAGR) from 2017-2022. The gate driver IC market revenue, which was estimated to have been $1.2B in 2016, is forecast to have a 5.1% CAGR for 2017-2022.
To get more information, please visit our website: https://www.i-micronews.com/reports.html
Sensors for Home Healthcare Applications: Market & Technology Analysis 2013 R...Yole Developpement
The market for sensors in home healthcare applications will explode from $559M in 2013 to $1.2B by 2018!
Sensors for home care will explode over the next five years
From 2000 - 2050, the proportion of the world's population aged 60 and over will grow from about 16% to 25% -- an increase linked to a marked growth of chronic diseases (Alzheimer's, diabetes, cancers, etc.). Healthcare systems’ rising costs and a physicians’ shortage are paving the way for increased home care.
Sensors previously developed for non-medical applications are transitioning to home care applications, and the market for sensors dedicated to home care applications is poised to grow from $559M in 2013 to $1.2B by 2018.
During Yole's research, the following sensors were investigated: accelerometers, barometers, electrochemical biosensors, flow sensors, gyroscopes, humidity sensors, IR temperature sensors, magnetometers, microfluidic chips, microphones, photodetectors, pressure sensors, proximity IR sensors, RF MEMS, RFID, and strain sensors. For each sensors, Yole’s Home Care Report provides market data and unit/value forecasts.
Collectively, these sensors have numerous applications in the home care market, from fall detection systems to tremor monitoring in Parkinson’s disease.
Today, the three most-used sensors are photodetectors, pressure sensors and electrochemical sensors.
A highly segmented market
Home care, also called home healthcare, refers to the at-home care provided to a person with special needs. This includes people who are ageing, chronically ill, recovering from surgery, or disabled.
Transferring a patient from a hospital to his/her home implies a relocation of care systems. In order to maintain the same level of care quality with less human involvement, home care sensors are vital replacements for specific applications ordinarily performed by nurses, such as guaranteeing the patient’s comfort, ensuring their safety, monitoring body parameters and treatments, and drug delivery.
Using a disruptive segmentation, Yole’s analysts have gathered all of the information necessary for understanding each application’s market needs.
More information on that report at http://www.i-micronews.com/reports/Sensors-Home-Healthcare-Applications-Market-Analysis/1/409/
Power SiC 2016: Materials, Devices, Modules, and Applications - 2016 Report b...Yole Developpement
More confident and more prepared, power SiC is progressing at a 2015 - 2021 CAGR of 19%!
SiC power is diffusing into multiple application segments
When the first SiC diode was launched in 2001, the industry questioned the future of the SiC power business: Will it grow? Is this a real business? 15 years later, in 2016, people don’t ask these questions anymore. The SiC power business is concrete and real, with a promising outlook. The SiC power market (diode and transistor included) is estimated to be more than $200M in 2015 and forecasted to be more than $550M in 2021, with a 2015 - 2021 CAGR of 19%. Not surprisingly, the power factor correction (PFC) power supply market is still the leading application, consuming a large volume of diodes.
Photovoltaics (PV) inverters are close behind. SiC diodes and MOSFETs are now used by various PV inverter manufacturers in their products. It has been confirmed that SiC implementation provides several performance benefits: increased efficiency, reduced size and weight. In addition, it allows to low cost at the system level in certain power range. Yole Développement has received increasingly positive feedback from the market, and we expect other manufacturers to follow in the footsteps of the early adopters, leading to a rapid expansion of the PV segment in the coming years.
Status of the Power Electronics Industry 2019 by Yole DéveloppementYole Developpement
Long term growth of the power electronics market is driving 300mm wafer-based production.
More information on: https://www.i-micronews.com/products/status-of-the-power-electronics-industry-2019/
Status of The Advanced Packaging Industry_Yole Développement reportYole Developpement
IoT driven semiconductor industry consolidation is reflecting into a highly dynamic Advanced Packaging landscape. Demand for advanced packaging and market size is increasing. Focus is turning
to integration and wafer level packages to enable a functionality driven roadmap and revive the cost/performance curve.
GaN-on-Silicon Substrate Patent Investigation 2014 Report by Yole DeveloppementYole Developpement
More players on the playground, business is starting: when will the IP battle begin?
GaN-ON-Si IS ENTERING PRODUCTION: WHAT IS THE PATENT SITUATION?
GaN-on-Si technology appeared naturally as an alternative to GaN-on-Sapphire—the main stream technology for LED applications. Today, despite potential cost benefits, the mass adoption of GaN-on-Si technology for LED applications remains unclear. Most major LED makers have a patenting activity related to GaN-on-Si technology, but so far, few have made it the core of their strategy and technology roadmap. Contrary to the LED industry, we expect GaN-on-Si to be widely adopted by Power Electronics and RF applications because of its lower cost and CMOS compatibility.
The growth of GaN-on-silicon substrate was first reported in the early-1970s (T. L. Chu et al., J. Electrochemical Society, Vol. 118, page 1200), since the early 1990s more and more academics and industrials have been involved in developing this technology. GaN-on-Si technology is now poised for a list of technical challenges. The high lattice mismatch between GaN and Si results in a high defect density in epitaxial layers (dislocations). The high thermal expansion coefficient (TCE) mismatch between GaN and Si leads to a large tensile stress during cooling from the growth temperature to room temperature. The tensile stress causes film cracking and a concave bending of the wafer (warpage). These factors combine to make both dislocation density and crack/warpage reduction a challenging task.
This patent investigation covers patents published worldwide up to December, 2013. The patents addressing the above mentioned challenges have been selected, and an in-depth analysis of patent holders and corresponding patented technologies is provided. This report does not include patents related to active layers or GaN-based devices.
Fundamental patents describing a gallium-nitride-based compound semiconductor grown on a silicon substrate were filed before the 1990s with the most significant assigned to TDK and Fujitsu. In the early 1990s, Toyoda Gosei and the University of Nagoya filed the first concepts of a buffer layer for improving the crystallinity of GaN. Those fundamental patents have been followed by an ever increasing number of applications since 1995 as more companies competed in GaN-on-Si technology to meet the technological challenges, the market demand and to lower manufacturing costs. Currently, the patented technologies reflect the significant improvements that have been made on key material issues such as dislocation density reduction and stress management for preventing cracks and warpage of the wafer. According to our analysis, GaN-on-Si IP is mature enough to initiate mass production.
More information on that report at http://www.i-micronews.com/reports/GaN-on-Silicon-Substrate-Patent-Investigation/3/431/
Power GaN 2018: Epitaxy, Devices, Applications and Technology Trends report b...Yole Developpement
GaN market growth is fed by Lidar, wireless charging and fast charging solutions.
More information on : https://www.i-micronews.com/category-listing/product/power-gan-2018-epitaxy-devices-applications-and-technology-trends.html
Status of the Solid-State Lighting Source Industry 2019 by Yole DéveloppementYole Developpement
From lighting to sensing: a new growth era for the solid-state lighting industry.
More information on: https://www.i-micronews.com/products/status-of-the-solid-state-lighting-source-industry-2019/
Point-of-Need Testing: Application of Microfluidic Technologies - 2016 Report...Yole Developpement
Decentralized testing for both human and non-human in-vitro diagnostics is increasingly taking advantage of innovative microfluidic technologies
PLENTY OF APPLICATIONS HAVE STARTED TO BENEFIT FROM MICROFLUIDICS FOR DECENTRALIZED TESTING, BUT HAVE NOT REALIZED THEIR FULL POTENTIAL – YET
Point-of-Care (PoC) testing is not a new concept - the first applications arose in the 1990s. Since then, microfluidic technologies have been increasingly used to solve technical problems and bring economic benefits to the healthcare industry. In the past few years, other applications have benefited from recent technological improvements: veterinary testing, environmental testing, agro-food and industrial testing are also part of the scope of the report. Decentralized testing brings significant operational benefits to various players across these applications.
Microfluidics is part of the diagnostics revolution, with an explosion in the number of products on the market. However, with many applications but few solutions existing today, these markets have not yet reached their full potential.
In the report, Yole Développement (Yole)’s analysts explain why the human healthcare market still looks much more attractive to technology developers. However, in the near future the greatest opportunities will be in all the other markets. The report also explores which barriers still need to be taken down for decentralized, or “point-of-need” (PoN), testing to flourish.
Microfluidics-based point-of-need testing will grow from a $2.6B market in 2015 to $10.3B in 2021, which is a 26% compound annual growth rate (CAGR). This value represents more than 500 million tests in 2021, but only 61 million will be outside human diagnostics. In the report, Yole’s analysts detail the evolution of each application in terms of microfluidic technology’s use.
5G Impact on RF Front-end Module and Connectivity for Cell Phones Report by Y...Yole Developpement
How is 5G enabling new business opportunities despite flat mobile growth?
More information on : https://www.i-micronews.com/category-listing/product/p5g%E2%80%99s-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2018.html
Status of the Inverter Industry 2019 by Yole DéveloppementYole Developpement
Motor drive still powers the inverter market, with EV/HEV positively impacting overall market dynamics.
More information on: https://www.i-micronews.com/products/status-of-the-inverter-industry-2019/
Market Opportunities for Thermal Management Components in Smartphones 2017 - ...Yole Developpement
The growing smartphone market, expected to reach almost $2.1 billion smartphones annually by 2022, represents a great opportunity for suppliers of different smartphone components and technology solutions.
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, and PV ApplicationsYole Developpement
Photonics applications are driving the GaAs wafer and epiwafer market into a new era.
More information on: https://www.i-micronews.com/category-listing/product/gaas-wafer-and-epiwafer-market-rf-photonics-led-and-pv-applications.html
Status of the Power Electronics Industry 2018 report by Yole DéveloppementYole Developpement
EV/HEV, motor drives, computing and storage propel power electronics market growth, from devices to passives, packaging and integration.
More information on https://www.i-micronews.com/report/product/status-of-the-power-electronics-industry-2018.html
From almost zero to a multi-billion dollar market in three years!
Apple introduced the iPhone 5s in 2013, after acquiring Authentec a year earlier. Since then, fingerprint sensors have been massively adopted, and the volumes of sensors shipped into the consumer market have grown incredibly. At first, the sensors were a convenience and protection feature for unlocking phones. However, they are now shifting into a security feature for online identification and mobile payment in an increasing number of smartphones.
From 23 million units in 2013, 689 million fingerprint sensors for smartphones were sold in 2016. This is an incredible 210% compound annual growth rate (CAGR) between 2013 and 2016! The 2016-2022 timeframe will see a more reasonable, but still impressive, 19% CAGR.
Fingerprint sensing is becoming a mandatory feature on every smartphone, adding a lot of value. However such an increase in volume is always followed by strong cost pressure, and this is what has happened over the last three years. The average cost of a fingerprint sensor has decreased from around $5 in 2013 to $3 in 2016, and even less for low-end technologies. And the pressure hasn’t gone away. Current technologies have now reached maturity, and are threatened by new technologies, which need lower cost to gain momentum. This is the case for ultrasonic detection, for instance.
For more information please visit our website: http://www.i-micronews.com/reports.html
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
Humidity Sensors from the main players analyzed and compared!
Humidity sensors are integrated in many different consumer applications; in each of them different specifications are required. Moreover humidity sensors are integrated in environmental sensors for mobile applications; especially in harsh environment devices. An increase of humidity sensors market is forecasted by next years.
In this report, humidity sensors from different suppliers and different generations are compared in term of technology choice, manufacturing process and cost.
Single-chip and multi-chip devices are compared between suppliers and references evolution.
Size and technology is very different for every player. Nevertheless, the mainly used technology is the capacitive one. Moreover the majority of components are single-chip devices. Some devices, such as Bosch environmental sensor for example, are paving the way for the multichip integration.
The report includes a description of each humidity sensor device and a comprehensive supply chain evaluation. The cost of each device is estimated and compared.
Sensors and Sensing Modules for Smart Homes and Buildings - 2017 Report by Yo...Yole Developpement
Smart homes and buildings: The “Trojan Horse” strategy
To achieve greener and more secure homes and buildings requires a shift in sensing from today’s basic functions such as turning light switches on or off to more advanced functions. Three main drivers are currently leading the smart buildings market:
Better energy control. With 40% of the world’s energy used for buildings, mostly for heating in residential and lighting in commercial, this is a very strong driver.
Increased security with detection of intrusion, fires and seismic activity.
Better comfort for occupants with sensor modules or hubs like those manufactured by Google/Nest, Fibaro, Smarthings, Canary, and Elgato Eve. They generally include 1-10 sensors, an energy source and a wireless module.
For more information, visit our website: https://www.i-micronews.com/reports.html
Power Management: Technology, Industry and Trends 2019 - by Yole DéveloppementYole Developpement
China, 300mm, societal impacts, and important strategic decisions are shuffling the cards in the power
IC industry.
More on: https://www.i-micronews.com/products/power-management-technology-industry-and-trends-2019/
Status of Advanced Packaging - 2017 Report by Yole DeveloppementYole Developpement
How can advanced packaging decrease semiconductor market uncertainty and enable future semiconductor products?
From supporting technology to enabler of future semiconductor products
Future semiconductor drivers are expected to be fragmented and more diverse than in the mobile era. Scaling continues, but functionality and system level features are becoming increasingly important for product differentiation rather than raw computation power. An outlook into the future brings the Internet of Things (from end device to backbone infrastructure), including the Industrial Internet of Things, the semiconductorization of the automotive industry, 5G connectivity, augmented & virtual reality and artificial intelligence. In such an environment, advanced packaging is transforming from follower of scaling technology nodes to enabler of future semiconductor applications and products. Heterogeneous integration of multiple dies from the latest to legacy front-end nodes, involving a mixture of latest technology high density interconnects to lower cost mature interconnects, at high levels of customization is the future of packaging. Advanced packaging has direct impact on product success rates and semiconductor revenues.
More information on that report at: https://www.i-micronews.com/reports.html
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
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Discrete Power Device Packaging: Materials Market and Technology Trends 2019 ...Yole Developpement
Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.
More information on https://www.i-micronews.com/products/discrete-power-device-packaging-materials-market-and-technology-trends-2019/
Power Module Packaging 2018: Material Market and Technology Trends report by ...Yole Developpement
Power packaging is continuously adapting to power application market trends.
More information on that report at : https://www.i-micronews.com/category-listing/product/power-module-packaging-2018-material-market-and-technology-trends.html
Status of the Power Electronics Industry 2017 Report by Yole Developpement Yole Developpement
Power devices fuel and enable industry mega trends reaching almost US$35B in 2022.
SOLAR AND ELECTRIC VEHICLE POWER CONVERTER MARKETS GREW SPECTACULARLY – BY MORE THAN 20% – LAST YEAR, DRIVING GROWTH IN THE EXPANDING IGBT MARKET
The power electronics sectors continue to expand their presence almost everywhere. Renewable energies and e-mobility, including electric and hybrid vehicles (EV/HEVs), are especially boosting this market. Both the solar and EV/HEV converter markets grew by over 20% between 2015 and 2016. At the semiconductor level, the power semiconductor market grew by 3.8% compared to 2015. This year, Yole Développement has enlarged its power semiconductor market analysis to all types of power integrated circuits (ICs) including power management ICs, linear regulators and switching regulators, representing a total market of $28B. Among all the different types of power devices including thyristors, MOSFETs, IGBTs and power ICs, IGBTs made the greatest progress, with around 8% growth.
Yole Développement’s decision to start analyzing the power IC market evolution closely is part of an effort to cover the whole power spectrum of this market. We now encompass the complete range from low power, low voltage, highly integrated power management ICs in mobile phones to more robust, high power IGCT modules used in trains.
The report also covers the fast-emerging wide band gap (WBG) semiconductor market, identifying today and tomorrow’s leading silicon carbide (SiC) and gallium nitride (GaN) players and the key technological details. ‘Status of Power Electronics Industry 2017 (SPEI 2017)’ describes the evolution and forecasts the future of the power inverter, power device and silicon wafer markets.
Power SiC 2019: Materials, Devices, and Applications by Yole DéveloppementYole Developpement
Automotive market growth is reshaping the SiC market’s dynamics and ecosystem.
More information on: https://www.i-micronews.com/products/power-sic-2019-materials-devices-and-applications/
GaN-on-Silicon Substrate Patent Investigation 2014 Report by Yole DeveloppementYole Developpement
More players on the playground, business is starting: when will the IP battle begin?
GaN-ON-Si IS ENTERING PRODUCTION: WHAT IS THE PATENT SITUATION?
GaN-on-Si technology appeared naturally as an alternative to GaN-on-Sapphire—the main stream technology for LED applications. Today, despite potential cost benefits, the mass adoption of GaN-on-Si technology for LED applications remains unclear. Most major LED makers have a patenting activity related to GaN-on-Si technology, but so far, few have made it the core of their strategy and technology roadmap. Contrary to the LED industry, we expect GaN-on-Si to be widely adopted by Power Electronics and RF applications because of its lower cost and CMOS compatibility.
The growth of GaN-on-silicon substrate was first reported in the early-1970s (T. L. Chu et al., J. Electrochemical Society, Vol. 118, page 1200), since the early 1990s more and more academics and industrials have been involved in developing this technology. GaN-on-Si technology is now poised for a list of technical challenges. The high lattice mismatch between GaN and Si results in a high defect density in epitaxial layers (dislocations). The high thermal expansion coefficient (TCE) mismatch between GaN and Si leads to a large tensile stress during cooling from the growth temperature to room temperature. The tensile stress causes film cracking and a concave bending of the wafer (warpage). These factors combine to make both dislocation density and crack/warpage reduction a challenging task.
This patent investigation covers patents published worldwide up to December, 2013. The patents addressing the above mentioned challenges have been selected, and an in-depth analysis of patent holders and corresponding patented technologies is provided. This report does not include patents related to active layers or GaN-based devices.
Fundamental patents describing a gallium-nitride-based compound semiconductor grown on a silicon substrate were filed before the 1990s with the most significant assigned to TDK and Fujitsu. In the early 1990s, Toyoda Gosei and the University of Nagoya filed the first concepts of a buffer layer for improving the crystallinity of GaN. Those fundamental patents have been followed by an ever increasing number of applications since 1995 as more companies competed in GaN-on-Si technology to meet the technological challenges, the market demand and to lower manufacturing costs. Currently, the patented technologies reflect the significant improvements that have been made on key material issues such as dislocation density reduction and stress management for preventing cracks and warpage of the wafer. According to our analysis, GaN-on-Si IP is mature enough to initiate mass production.
More information on that report at http://www.i-micronews.com/reports/GaN-on-Silicon-Substrate-Patent-Investigation/3/431/
Power GaN 2018: Epitaxy, Devices, Applications and Technology Trends report b...Yole Developpement
GaN market growth is fed by Lidar, wireless charging and fast charging solutions.
More information on : https://www.i-micronews.com/category-listing/product/power-gan-2018-epitaxy-devices-applications-and-technology-trends.html
Status of the Solid-State Lighting Source Industry 2019 by Yole DéveloppementYole Developpement
From lighting to sensing: a new growth era for the solid-state lighting industry.
More information on: https://www.i-micronews.com/products/status-of-the-solid-state-lighting-source-industry-2019/
Point-of-Need Testing: Application of Microfluidic Technologies - 2016 Report...Yole Developpement
Decentralized testing for both human and non-human in-vitro diagnostics is increasingly taking advantage of innovative microfluidic technologies
PLENTY OF APPLICATIONS HAVE STARTED TO BENEFIT FROM MICROFLUIDICS FOR DECENTRALIZED TESTING, BUT HAVE NOT REALIZED THEIR FULL POTENTIAL – YET
Point-of-Care (PoC) testing is not a new concept - the first applications arose in the 1990s. Since then, microfluidic technologies have been increasingly used to solve technical problems and bring economic benefits to the healthcare industry. In the past few years, other applications have benefited from recent technological improvements: veterinary testing, environmental testing, agro-food and industrial testing are also part of the scope of the report. Decentralized testing brings significant operational benefits to various players across these applications.
Microfluidics is part of the diagnostics revolution, with an explosion in the number of products on the market. However, with many applications but few solutions existing today, these markets have not yet reached their full potential.
In the report, Yole Développement (Yole)’s analysts explain why the human healthcare market still looks much more attractive to technology developers. However, in the near future the greatest opportunities will be in all the other markets. The report also explores which barriers still need to be taken down for decentralized, or “point-of-need” (PoN), testing to flourish.
Microfluidics-based point-of-need testing will grow from a $2.6B market in 2015 to $10.3B in 2021, which is a 26% compound annual growth rate (CAGR). This value represents more than 500 million tests in 2021, but only 61 million will be outside human diagnostics. In the report, Yole’s analysts detail the evolution of each application in terms of microfluidic technology’s use.
5G Impact on RF Front-end Module and Connectivity for Cell Phones Report by Y...Yole Developpement
How is 5G enabling new business opportunities despite flat mobile growth?
More information on : https://www.i-micronews.com/category-listing/product/p5g%E2%80%99s-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2018.html
Status of the Inverter Industry 2019 by Yole DéveloppementYole Developpement
Motor drive still powers the inverter market, with EV/HEV positively impacting overall market dynamics.
More information on: https://www.i-micronews.com/products/status-of-the-inverter-industry-2019/
Market Opportunities for Thermal Management Components in Smartphones 2017 - ...Yole Developpement
The growing smartphone market, expected to reach almost $2.1 billion smartphones annually by 2022, represents a great opportunity for suppliers of different smartphone components and technology solutions.
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, and PV ApplicationsYole Developpement
Photonics applications are driving the GaAs wafer and epiwafer market into a new era.
More information on: https://www.i-micronews.com/category-listing/product/gaas-wafer-and-epiwafer-market-rf-photonics-led-and-pv-applications.html
Status of the Power Electronics Industry 2018 report by Yole DéveloppementYole Developpement
EV/HEV, motor drives, computing and storage propel power electronics market growth, from devices to passives, packaging and integration.
More information on https://www.i-micronews.com/report/product/status-of-the-power-electronics-industry-2018.html
From almost zero to a multi-billion dollar market in three years!
Apple introduced the iPhone 5s in 2013, after acquiring Authentec a year earlier. Since then, fingerprint sensors have been massively adopted, and the volumes of sensors shipped into the consumer market have grown incredibly. At first, the sensors were a convenience and protection feature for unlocking phones. However, they are now shifting into a security feature for online identification and mobile payment in an increasing number of smartphones.
From 23 million units in 2013, 689 million fingerprint sensors for smartphones were sold in 2016. This is an incredible 210% compound annual growth rate (CAGR) between 2013 and 2016! The 2016-2022 timeframe will see a more reasonable, but still impressive, 19% CAGR.
Fingerprint sensing is becoming a mandatory feature on every smartphone, adding a lot of value. However such an increase in volume is always followed by strong cost pressure, and this is what has happened over the last three years. The average cost of a fingerprint sensor has decreased from around $5 in 2013 to $3 in 2016, and even less for low-end technologies. And the pressure hasn’t gone away. Current technologies have now reached maturity, and are threatened by new technologies, which need lower cost to gain momentum. This is the case for ultrasonic detection, for instance.
For more information please visit our website: http://www.i-micronews.com/reports.html
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
Humidity Sensors from the main players analyzed and compared!
Humidity sensors are integrated in many different consumer applications; in each of them different specifications are required. Moreover humidity sensors are integrated in environmental sensors for mobile applications; especially in harsh environment devices. An increase of humidity sensors market is forecasted by next years.
In this report, humidity sensors from different suppliers and different generations are compared in term of technology choice, manufacturing process and cost.
Single-chip and multi-chip devices are compared between suppliers and references evolution.
Size and technology is very different for every player. Nevertheless, the mainly used technology is the capacitive one. Moreover the majority of components are single-chip devices. Some devices, such as Bosch environmental sensor for example, are paving the way for the multichip integration.
The report includes a description of each humidity sensor device and a comprehensive supply chain evaluation. The cost of each device is estimated and compared.
Sensors and Sensing Modules for Smart Homes and Buildings - 2017 Report by Yo...Yole Developpement
Smart homes and buildings: The “Trojan Horse” strategy
To achieve greener and more secure homes and buildings requires a shift in sensing from today’s basic functions such as turning light switches on or off to more advanced functions. Three main drivers are currently leading the smart buildings market:
Better energy control. With 40% of the world’s energy used for buildings, mostly for heating in residential and lighting in commercial, this is a very strong driver.
Increased security with detection of intrusion, fires and seismic activity.
Better comfort for occupants with sensor modules or hubs like those manufactured by Google/Nest, Fibaro, Smarthings, Canary, and Elgato Eve. They generally include 1-10 sensors, an energy source and a wireless module.
For more information, visit our website: https://www.i-micronews.com/reports.html
Power Management: Technology, Industry and Trends 2019 - by Yole DéveloppementYole Developpement
China, 300mm, societal impacts, and important strategic decisions are shuffling the cards in the power
IC industry.
More on: https://www.i-micronews.com/products/power-management-technology-industry-and-trends-2019/
Status of Advanced Packaging - 2017 Report by Yole DeveloppementYole Developpement
How can advanced packaging decrease semiconductor market uncertainty and enable future semiconductor products?
From supporting technology to enabler of future semiconductor products
Future semiconductor drivers are expected to be fragmented and more diverse than in the mobile era. Scaling continues, but functionality and system level features are becoming increasingly important for product differentiation rather than raw computation power. An outlook into the future brings the Internet of Things (from end device to backbone infrastructure), including the Industrial Internet of Things, the semiconductorization of the automotive industry, 5G connectivity, augmented & virtual reality and artificial intelligence. In such an environment, advanced packaging is transforming from follower of scaling technology nodes to enabler of future semiconductor applications and products. Heterogeneous integration of multiple dies from the latest to legacy front-end nodes, involving a mixture of latest technology high density interconnects to lower cost mature interconnects, at high levels of customization is the future of packaging. Advanced packaging has direct impact on product success rates and semiconductor revenues.
More information on that report at: https://www.i-micronews.com/reports.html
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Discrete Power Device Packaging: Materials Market and Technology Trends 2019 ...Yole Developpement
Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.
More information on https://www.i-micronews.com/products/discrete-power-device-packaging-materials-market-and-technology-trends-2019/
Power Module Packaging 2018: Material Market and Technology Trends report by ...Yole Developpement
Power packaging is continuously adapting to power application market trends.
More information on that report at : https://www.i-micronews.com/category-listing/product/power-module-packaging-2018-material-market-and-technology-trends.html
Status of the Power Electronics Industry 2017 Report by Yole Developpement Yole Developpement
Power devices fuel and enable industry mega trends reaching almost US$35B in 2022.
SOLAR AND ELECTRIC VEHICLE POWER CONVERTER MARKETS GREW SPECTACULARLY – BY MORE THAN 20% – LAST YEAR, DRIVING GROWTH IN THE EXPANDING IGBT MARKET
The power electronics sectors continue to expand their presence almost everywhere. Renewable energies and e-mobility, including electric and hybrid vehicles (EV/HEVs), are especially boosting this market. Both the solar and EV/HEV converter markets grew by over 20% between 2015 and 2016. At the semiconductor level, the power semiconductor market grew by 3.8% compared to 2015. This year, Yole Développement has enlarged its power semiconductor market analysis to all types of power integrated circuits (ICs) including power management ICs, linear regulators and switching regulators, representing a total market of $28B. Among all the different types of power devices including thyristors, MOSFETs, IGBTs and power ICs, IGBTs made the greatest progress, with around 8% growth.
Yole Développement’s decision to start analyzing the power IC market evolution closely is part of an effort to cover the whole power spectrum of this market. We now encompass the complete range from low power, low voltage, highly integrated power management ICs in mobile phones to more robust, high power IGCT modules used in trains.
The report also covers the fast-emerging wide band gap (WBG) semiconductor market, identifying today and tomorrow’s leading silicon carbide (SiC) and gallium nitride (GaN) players and the key technological details. ‘Status of Power Electronics Industry 2017 (SPEI 2017)’ describes the evolution and forecasts the future of the power inverter, power device and silicon wafer markets.
Power SiC 2019: Materials, Devices, and Applications by Yole DéveloppementYole Developpement
Automotive market growth is reshaping the SiC market’s dynamics and ecosystem.
More information on: https://www.i-micronews.com/products/power-sic-2019-materials-devices-and-applications/
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
Market & Technology Trends in Materials and Equipement for Printed and Flexib...Yole Developpement
Combined flexible & printed electronic applications could reach US$1B in 2020. Multiple applications are driving growth!
TECHNICAL CHALLENGES ARE CLOSE TO BEING OVERCOME TO REACH US$1B MARKET BY 2020
Today flexible & printed electronics create a lot of hope. And a supply chain is being created to support an industrial infrastructure. In our report, we have identified and tracked the five main functionalities of flexible & printed electronics: displaying, sensing, lighting, energy generating and substrates. The different degrees of freedom in flexibility that can be obtained can be divided into:
- Conformable substrate: the flexible substrate will be shaped in a definitive way after processing
- “Bendable” substrate: they can be rolled and bent many times (even if we consider it will not be a key feature coming from customer needs)
- “Unused” flexibility: in the end, the flexibility is not an added value to the customer
We believe some applications will be more likely than other to be successful – for example, bendable applications will undergo tough stress during use and technological challenges will be hard to overcome. Our report shows the distinction between the functions (displaying, lighting, energy conversion, sensing & substrates) and the seek flexibility “degree of freedom”. We do not make the distinction in our report between organic and inorganic substrates as semiconductors can also be used as flexible substrates.
However, we believe over the next several years, the number of applications using printing processes for flexible electronics will grow (Figure on page 2).
We estimate the printed & flexible electronics market will grow from ~ $176M in 2013 to ~$950M in 2020 with a 27% CAGR in market value. Printed OLED displays for large size (TVs) are likely to become the largest market. For OLED lighting, we believe it will grow but remain a niche market for automotive and/ or office lighting. For PV, the market demand by 2020 will remain very low compared to the demand for rigid PV, largely below 1% of the global market demand by 2020. Sensor, smart system & polytronic applications will include sensors, touchless / touch screens, RF ID applications.
A WIDE, EXCITING RANGE OF NEW APPLICATIONS
Printed & flexible electronics is a new exiting technology with large potential market expectations. Indeed, as semiconductors move to the very small with 22nm critical dimension, printed electronics moves to the other end of the spectrum with its own material, equipment, process challenges and supply chain. Printed electronics will not kill semiconductor electronics as it will not be a replacement for CMOS silicon.
More info at http://www.i-micronews.com/reports/Flexible-Based-Printed-Electronics-Technologies/6/367/
Status of the Chinese Power Electronics Industry 2015 Report by Yole Developp...Yole Developpement
Government initiatives and private companies are boosting power electronics market opportunities, enabling Chinese players to compete internationally.
Driven by government policy and private companies, Chinese power electronics are promising.
In 2014, almost 40% of power semiconductor devices, including FETs, IGBT, Thyristors, Rectifiers and Diodes, were shipped in China, representing a $6B market. There is no doubt that today’s China represents one of the most important markets for power electronics.
As for its macro-economy, the Chinese government plays an important role in directing the power electronics market. For example, because of serious pollution problems the Chinese government has established a comprehensive policy framework in terms of research, technology innovation, finance, and tax incentives to support the development of a New Energy Vehicle (NEV) industry. Many white papers have been released and different subsidies and tax cuts are available to promote the market...
Power Electronics in Electric and Hybrid Vehicles 2014 Report by Yole Develo...Yole Developpement
A $16B market by 2023, a change of business model, and significant technical changes: how will electric and hybrid vehicles change the power electronics industry?
EV/HEV MARKET: A BURGEONING MARKET FULL OF PROMISES AND UNCERTAINTIES
Electric and hybrid vehicles have been presented as a huge market over the last few years, but in 2013 only 100K 100% electric vehicles were sold, and only 2M EV/HEV cars in total. For 2014, technological and architectural upgrades have been made and are ready to deploy, but the most important need is still to convince the end-user to change their habits and transition to an EV/HEV.
Charging infrastructure development, battery cost reduction and power density increase are pushing the EV/HEV market forward. Moreover, as the market grows and the technology develops, the price difference between EV/HEV vehicles and gas-powered vehicles will progressively shrink, thus further accelerating EV/HEV market advancement. Also, governmental restrictions on CO2 output are becoming increasingly aggressive worldwide (58mpg for the United States in 2025, and in 2020 for Europe). For all of these reasons, we expect end-users to be swayed by electric energy’s low cost and governmental incentives, making the EV/HEV market very attractive. In this report you will find a detailed analysis of markets by type, as well as an analysis of the positive and negative trends impacting the EV/HEV market.
More information on that report at http://www.i-micronews.com/power-electronics-report/product/power-electronics-in-electric-and-hybrid-vehicles-launch-offer.html
Trends in Automotive Packaging 2018 by Yole DéveloppementYole Developpement
OSATs are gaining benefits from advanced packaging in automotive.
More information on that report at : https://www.i-micronews.com/report/product/trends-in-automotive-packaging-2018.html
Photonics market data on sensors, date centers, detectors, lighting (LED and ...Carlos Lee
Yole report abstract for EPIC 2016 International Optoelectronics Association presented by Carlos Lee, on 23 April 2016 in Zurich, Switzerland. For more information contact carlos.lee@epic-assoc.com
TOPICS: Sensors for Drones and robots, Gas sensor market and technology trends, Technology challenges for data center: the photonic case, Infrared detector market, LED modules technology and market trends, OLED for lighting, Medical imaging, Microbolometers.
Status of the Power Electronics Industry - 2016 Report by Yole DeveloppementYole Developpement
With strong price pressure and a very strong leader, how will the power electronics market and landscape evolve in the future?
Vehicle hybridization is pulling the power electronics market
The 21st century is full of challenges to overcome, including population growth, reducing CO2 emissions and developing energy sources to replace liquid fuel. Power electronics will play a key part in solving these problems. Among the applications Yole Développement follows, motor drives are helping increase motor efficiency, photovoltaics and wind turbines continue expand their role in energy supply, and rail networks are moving more people. But one application stands out thanks to the huge volumes involved: electric vehicles. In the 2000s MOSFETs drove growth, and in the early 2010s it was renewable energy. The late 2010s and 2020s could be the golden era for electric vehicles, if customers adopt it and governments keep on subsidizing the field.
2015 has been a difficult year for the power electronics market, with the global value of power ICs, power modules and discrete components decreasing from $15.7 billion to $15.2 billion, a 3% drop. This fall is explained mainly by strong Average Selling Price (ASP) decreases at IGBT module level. We expect this ASP trend to continue, mainly because of price pressure from the automotive market. But overall IGBT module and global power electronics market value should increase, as volume growth outweighs this ASP fall. The automotive market will strengthen its position, as we expect electric and hybrid electric vehicles (EV/HEV) to represent a major part of the IGBT module market by 2021. Over this time the power MOSFET market is expected to grow slightly for all applications, going from $1 billion to $1.2 billion value.
Fan-In Packaging: Business update 2016 Report by Yole DeveloppementYole Developpement
Fan-In: A steady growth platform awaiting disruption
The Fan-In Packaging platform has been a successful and steadily growing platform for over a decade. It remains appealing as an inherently unmatched combination of smallest package form factor and low cost. Due to these features, historically it found penetration in form driven handsets and tablets and has maintained growth within these devices. It is estimated that more than 90% of Fan-In packages today are found in the mobile segment. With respect to Fan-In adoption, in today’s high end smartphones already more than 30% of all packages are Fan-In packages. Therefore, Fan-In packaging spread in the sweet spot mobile segment continues.
While the Fan-In packaging growth pace until now could be described as steady and stable, the global semiconductor market shifts and rising uncertainty over future applications will inevitably impact the outlook of Fan-In packaging as well. The smartphone market leading Fan-In adoption is maturing, with smartphone unit growth dropping from 35% in 2013 to 8% in 2016 and forecasted at 6% by 2020. While the trend is not favourable in terms of high growth expectations, smartphones are still expected to be the leading semiconductor driver with more than 2 billion units in 2020.
Primary Fan-In devices are WiFi/BT combos, transceivers, PMIC and DC/DC converters (~50% of total production) followed by a variety of analog/digital/mixed signal devices including MEMS and image sensors. The biggest challenge the Fan-In platform will be facing in the future is functional integration of devices into SiP form. Figure below indicates the impact of SiP growth on Fan-In unit production, decreasing the overall CAGR from 9% to 6%. A detailed analysis of SiP growth is performed in the report.
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
Wafer starts for More than Moore applications 2018 Report by Yole Developpement Yole Developpement
Driven by megatrend markets, More than Moore devices’ overall wafer demand is expected to grow at an almost 10% CAGR from 2017 to 2023.
More information on that report at https://www.i-micronews.com/report/product/wafer-starts-for-more-than-moore-applications.html
MEMS Microphone: Market, Applications and Business Trends 2014 2014 Report by...Yole Developpement
New opportunities and emerging applications continue to boost the MEMS microphone market with strong new players
MEMS MICROPHONE MARKET GROWTH WILL CONTINUE TO SOAR OVER THE NEXT SEVERAL YEARS
MEMS microphone market has been growing since its first appearance. The huge worldwide adoption of smartphones, each using more than one MEMS microphone, creates the wide integration and rocketing growth of the MEMS microphone market. Some smartphones are now using three microphones: one for voice capture, one or two for noise cancellation and one for voice recognition improvement.
The Internet of Things (IoT) and wearable electronics applications are emerging markets for MEMS microphones: new opportunities will create new momentum in this fast growing business. Smart watch, smart glasses, smart home & building, and vehicle voice control will be promising applications in the next few years.
Yole Développement believes that the MEMS microphone will remain one of the fastest growing MEMS components due to existing and new opportunities. The market will grow from $785M in 2013 to $1.65B by 2019. Shipments are expected to grow from 2.4B in 2013 to 6.6B units in 2019 which points to a market filled with opportunities for existing and new players.
In this report, Yole Développement has completely re-examined and updated the MEMS microphone market data to provide you with a clear 2013 to 2019 market forecast.
Medical and automotive MEMS microphone markets will grow, but the current markets are still small. The Internet of Things will definitely result in new opportunities for the automotive market. MEMS microphones facilitate man-machine communication and enable voice detection and control to make devices more effective. Increased device effectiveness will lead to greater opportunity.
In this report, we will provide a complete overview of traditional applications – mobile phone, notebook, camera and tablet, other consumer electronics, medical applications, and automotive applications – as well as identify emerging applications.
KNOWLES IS STILL ALIVE AND KICKING, BUT COMPETITION IS INCREASING!
The MEMS microphone market is huge and has many opportunities. Big players compete with different approaches and new comers keep entering the market.
The market is changing: Knowles’ domination is weakening; it has about 61% of the market now down from the 83% it had in 2010. However, total market expansion has increased Knowles’ MEMS microphone revenue from $173.5M in 2010 to $477M in 2013.
Even though Knowles is still the market leader, other players are competing to take its market share. However compared to 2012, Knowles managed to regain some market share in 2013: iPhone 5S and 5C are using two microphones from Knowles and one from AAC Technologies (AAC). Other players still have a long way to go if they want to take market share from Knowles...
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
White certificates in Italy: lessons learnt over 12 years of evaluationDario Di Santo
Energy efficiency obligation schemes (EEOs) are used in many EU countries as a policy measure to reach energy efficiency targets. Some of the first EEO (UK, Italy, France, Denmark) have been capable to reach positive results over the years, as shown by the ENSPOL and EPATEE projects.
The Italian mechanism, in particular, is an interesting example of white certificate scheme (WhC), since it is one of the most long-lasting schemes (operatively started in 2005), has ambitious targets, covers all sectors and energy efficiency solutions, and has many flexibility options in place (e.g. non-obliged parties, tradable market, bankability, etc.).
Another point of interest is WhC development over the years. In the first phase, most of the projects were related to buildings with deemed savings as energy savings assessment method. Then the industrial sector rose constantly, till covering 80% of the savings in 2014, mostly assessed through metered savings procedures. In the last three years deemed savings procedures have started to recover, while metered savings have remained the most used energy savings evaluation procedure. This last development was not expected and is mainly due to some regulatory decision and to the modification of the assessment of additionality for many industrial projects categories, due to the diffusion of certain energy efficiency solutions and to changes in the methodological approach.
The presentation, based on a paper presented at the IEPPEC conference in Vienna, illustrates the issues that have arisen over the recent years, and the decisions taken to address them through a major redesign of the Italian scheme that has been introduced with new ministerial guidelines in 2017: many aspects – such as targets, baseline and additionality, saving assessment, and measurement, verification and control procedures – has been deeply affected. The presentation will cover such themes under an evaluation point of view, highlighting the savings achieved with respect to the national targets, how indicators like additional energy savings, costs, and employment have evolved over time, the role of the involved stakeholders (utilities, ESCOs, end-users, etc.), and the effects of tight verification and control procedures.
Next generation power modules - patent landscape 2021- flyerKnowmade
The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents since 2010. Who are the main IP players? How do they address the new challenges? Who are the new players and IP challengers taking the big opportunities arising from the emerging EV/HEV market?
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Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends - 2016 Report by Yole Developpement
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OUR 2016 REPORTS PLANNING (1/2)
MARKET ANDTECHNOLOGY REPORTS
byYole Développement
o MEMS SENSORS
− Gas Sensor Technology and Market 2016
− Status of the MEMS Industry 2016*
− Sensors for Cellphones and Tablets 2016
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Opportunities 2016…
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o IMAGING OPTOELECTRONICS
− Sensors for Drones and Robots: Market Opportunities and Technology Revolution
2016
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− Imaging Technologies for Automotive 2016
− 3D Imaging Sensing 2016**
− Silicon Photonics 2016
o MEDTECH
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− Point of Need Testing 2016: Application of Microfluidic Technologies
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CMOS 2016
**To be confirmed
24. 23
OUR 2016 REPORTS PLANNING (2/2)
o COMPOUND SEMICONDUCTORS
− GaN RF Devices Market: Applications, Players, Technology, and Substrates 2016 – 2022
− SiC Modules, Devices and Substrates for Power Electronics 2016*
− GaN Modules, Devices and Substrates for Power Electronics 2016*
− Sapphire Applications Market 2016: from LED to Consumer Electronics*
o LED
− Automotive Lighting: Technology, Industry, and Market Trends 2016
− OLED for Lighting - Technology, Industry and Market Trends 2016
− Sapphire Applications and Market 2016: From LED to Consumer Electronics*
− LED Packaging 2016
− Microdisplays and MicroLEDs
− UV LED Technology, Manufacturing and Applications Trends 2016*
o POWER ELECTRONICS
− Power Electronics for EV/HEV 2016: Market, Innovations and Trends
− GaN RF Devices Market: Applications, Players, Technology, and Substrates 2016 – 2022
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
− Status of Power Electronics Industry 2016*
− Passive Components Technologies and Market Trends for Power Electronics 2016
− SiC Modules, Devices and Substrates for Power Electronics 2016*
− GaN Modules, Devices and Substrates for Power Electronics 2016*
− Inverter Technologies Trends Market Expectations 2016
− Thermal Management for LED and Power 2016
o BATTERY
− Market Trends and Technologies in Battery Pack and Assembly 2016
− Innovative and Emerging Technologies in Energy Storage Market 2016
**To be confirmed
PATENT ANALYSIS by Knowmade
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TEARDOWN REVERSE COSTING by System Plus Consulting
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published in 2016.
25. 24
OUR 2015 PUBLISHED REPORTS LIST
o MEMS SENSORS
− Sensors and Data Management for Autonomous Vehicles
− Sensors for Wearable Electronics And Mobile Healthcare
− Status of the MEMS Industry
− Uncooled Infrared Imaging Technology Market Trends
− Infrared Detector Technology Market Trends
− High-End Gyroscopes, Accelerometers and IMUs for Defense, Aerospace Industrial
− Emerging Non Volatile Memory (NVM) Technology Market Trends
o IMAGING OPTOELECTRONICS
− Camera Module Industry
− Uncooled Infrared Imaging Technology Market Trends
− Status of the CMOS Image Sensors
− Infrared Detector Technology Market Trends
o MEDTECH
− Sample Preparation Automation Through Emerging Microfluidic Technologies
− 2015 Microfluidic Applications in the Pharmaceutical, Life Sciences, In-Vitro Diagnostic, and
Medical Device Markets
− Sensors for Wearable Electronics And Mobile Healthcare
o COMPOUND SEMICONDUCTORS
− Sapphire Applications Market 2015: from LED to Consumer Electronics
− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications
− GaN and SiC Devices for Power Electronics Applications
o LED
− LED Lighting Module Technology, Industry and Market Trends 2015
− UV LED - Technology, Manufacturing and Application Trends
− Phosphors Quantum Dots 2015: LED Downconverters for Lighting Displays
− Sapphire Applications Market 2015: from LED to Consumer Electronics
o POWER ELECTRONICS
− Power Packaging Technology Trends and Market Expectations
− Energy Management for Smart Grid, Cities and Buildings: Opportunities for Battery
Electricity Storage Solutions
− Status of Chinese Power Electronics Industry
− New Technologies and Architectures for Efficient Data Center
− IGBT Market and Technology Trends
− Status of Power Electronics Industry
− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications
− GaN and SiC Devices for Power Electronics Applications
o ADVANCED PACKAGING
− Status of the Advanced Packaging Industry
− Supply Chain Readiness for Panel Manufacturing in Packaging
− Fan-in Wafer Level Packaging: Market and Technology Trends
− Flip Chip: Technologies and Markets Trends
− Fan-Out and Embedded Die: Technologies Market Trends
o MANUFACTURING
− Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED
Applications
− Emerging Non Volatile Memory (NVM) Technology Market Trends
26. 25
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