This report analyzes the market for light shaping technologies used in consumer electronics and automotive applications. It provides market forecasts for optical systems and components from 2018 to 2024 for smartphones, augmented/virtual reality devices, and automotive. It also examines the supply chains and major technology trends in these industries, such as the increasing use of microtechnologies like diffractive optical elements, MEMS scanners, and liquid crystal technologies. The report traces the evolution of these technologies from their origins in technologies that enabled the compact disc in the 1980s to their current applications in smartphones, AR/VR, 3D sensing, LiDAR, and automotive lighting and sensors.
Automotive Lighting: Technology, Industry and Market Trends 2018 report by Yo...Yole Developpement
Automotive lighting is becoming the new photonic hub.
More information on https://www.i-micronews.com/category-listing/product/automotive-lighting-technology-industry-and-market-trends-2018.html
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...Yole Developpement
A closer look at the impressive, industry-first, tri-layer stacked CIS.
Sony leads the global CMOS Image Sensor (CIS) market, commanding more than a third share of the industry’s total revenue. And over the years, Sony has maintained its leadership by providing innovative CIS products for original equipment manufacturers like Samsung or Apple. In 2017, Sony as a smartphone designer decided to release in its flagship the latest and potentially the greatest innovation in the past decade of CIS manufacturing.
Inside the Sony Xperia™ XZs and the XZ Premium, the latest Motion Eye™ can be found, with the new IMX400 CIS. This three-layer stacked CIS is made with the traditional pixel array and logic circuit on the same die, but also a 1Gb DRAM memory allowing slow motion at almost 960 frames per second.
This innovative CIS is Sony’s next generation technology. The CIS includes a 22 Mpixel array, a 1Gb DRAM die and a digital signal processor (DSP) on the same die footprint. This is the first tri-layer stacked CIS on the market. In this configuration, Sony can provide a fast readout image sensor with no distortion when shooting fast-moving objects thanks to the high capacity DRAM between the pixel array circuit and the DSP circuit.
Using Sony’s Exmor-RS and Xperi’s Zibond technologies, Sony has managed to integrate the three dies in a single thin, small and cost-effective sensor die. Surprisingly, the die sensor uses a unique sort of TSV at different levels to interconnect the dies.
This report includes a complete analysis of the camera module from the Sony Xperia™ XZs, featuring camera module disassembly and die analyses, processes and cross-sections. It also includes a comparison with the Samsung Galaxy S7, Apple iPhone 7 Plus, and Huawei P9 telephoto camera modules. At the CIS level, it compares the IMX400 with the IMX260, the IMX286, and the latest custom CIS for Apple from Sony’s portfolio. Finally, it contains a complete cost analysis and a selling price estimation of the CIS die.
More information on that report at http://www.i-micronews.com/reports.html
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 µm or even 50 µm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Automotive Lighting: Technology, Industry and Market Trends 2018 report by Yo...Yole Developpement
Automotive lighting is becoming the new photonic hub.
More information on https://www.i-micronews.com/category-listing/product/automotive-lighting-technology-industry-and-market-trends-2018.html
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...Yole Developpement
A closer look at the impressive, industry-first, tri-layer stacked CIS.
Sony leads the global CMOS Image Sensor (CIS) market, commanding more than a third share of the industry’s total revenue. And over the years, Sony has maintained its leadership by providing innovative CIS products for original equipment manufacturers like Samsung or Apple. In 2017, Sony as a smartphone designer decided to release in its flagship the latest and potentially the greatest innovation in the past decade of CIS manufacturing.
Inside the Sony Xperia™ XZs and the XZ Premium, the latest Motion Eye™ can be found, with the new IMX400 CIS. This three-layer stacked CIS is made with the traditional pixel array and logic circuit on the same die, but also a 1Gb DRAM memory allowing slow motion at almost 960 frames per second.
This innovative CIS is Sony’s next generation technology. The CIS includes a 22 Mpixel array, a 1Gb DRAM die and a digital signal processor (DSP) on the same die footprint. This is the first tri-layer stacked CIS on the market. In this configuration, Sony can provide a fast readout image sensor with no distortion when shooting fast-moving objects thanks to the high capacity DRAM between the pixel array circuit and the DSP circuit.
Using Sony’s Exmor-RS and Xperi’s Zibond technologies, Sony has managed to integrate the three dies in a single thin, small and cost-effective sensor die. Surprisingly, the die sensor uses a unique sort of TSV at different levels to interconnect the dies.
This report includes a complete analysis of the camera module from the Sony Xperia™ XZs, featuring camera module disassembly and die analyses, processes and cross-sections. It also includes a comparison with the Samsung Galaxy S7, Apple iPhone 7 Plus, and Huawei P9 telephoto camera modules. At the CIS level, it compares the IMX400 with the IMX260, the IMX286, and the latest custom CIS for Apple from Sony’s portfolio. Finally, it contains a complete cost analysis and a selling price estimation of the CIS die.
More information on that report at http://www.i-micronews.com/reports.html
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 µm or even 50 µm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
LiDAR for Automotive and Industrial Applications 2019 by Yole DéveloppementYole Developpement
Is rationalization happening in the LiDAR market?
More information on: https://www.i-micronews.com/produit/lidar-for-automotive-and-industrial-applications-2019/
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...Yole Developpement
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
IR LEDS and VCSELs - Technology, Applications and Industry Trends - 2017 Repo...Yole Developpement
3D imaging, gas sensing and autofocus will fuel the IR light source market to reach US$3.8B in 2027.
INFRA-RED LIGHT SOURCES: A $1.5B OPPORTUNITY IN 2022 – AND POTENTIALLY $3.8B IN 2027 – DRIVEN BY SEVERAL NEW APPLICATIONS
The market for LED and laser infra-red (IR) light sources is not new, but has evolved rapidly with the recent development of Solid State Lighting (SSL). Initially developed for optical communication applications, these technologies, mostly IR LEDs, started to be integrated into consumer applications like remote controls in the 1980s. Next, the market was driven forward by night vision applications such as surveillance cameras. But it’s only recently, with the development of smartphones, that IR LEDs and lasers have come back to prominence. And now, the market is set for growth for the next 10 years! Today, these technologies are part of a new revolution, still driven by smartphone applications. Integration of breakthrough functionalities such as 3D imaging, autofocus, iris and face recognition is triggering a strong market pull for efficient, miniaturized and complex IR illumination. This trend will also create strong market opportunities for IR lasers, mostly VCSELs, which allow more coherent and directional light than IR LEDs. In this context, we expect the IR light source market to grow from around $450M in 2016 to around $1,550M in 2022 at a compound annual growth rate of 22.7%. In addition, there are also several other applications that are emerging and for which a market boom is likely to happen in the next 10 years. These include gas sensors, LIDARs, driver monitoring systems and remote patient monitoring sensors. We expect this second wave of new applications to propel the IR light source market to around $3,800M in 2027. This report provides an in-depth analysis of all IR light source applications, including: basic principles, technology, trends, key players, and market size. It highlights the global landscape for IR light sources, including classification of applications by wavelength, market segment and function. Detailed market forecasts are given based on these classifications and with complementary analysis by light source for LEDs, edge-emitting lasers and VCSELs. Please note that optical communication applications are not analyzed in this report.
For more information please visit our website: https://www.i-micronews.com/reports.html
Status of the Power Module Packaging Industry 2019 - Yole DéveloppementYole Developpement
Major evolutions in substrate, interconnection, and die-attach technologies, driven by EV/HEV, are transforming the power module packaging supply chain.
More information on: https://www.i-micronews.com/products/status-of-the-power-module-packaging-industry-2019/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
Equipment and Materials for Fan-Out Packaging 2019 report by Yole Développement Yole Developpement
Electronic packaging equipment and materials revenue growth is highly reliant on big players’ investments. A new killer application is needed to fuel robust growth.
More information on https://www.i-micronews.com/products/equipment-and-materials-for-fan-out-packaging-2019/
Automotive Packaging: Market and Technologies Trends 2019 report by Yole Déve...Yole Developpement
Automotive Packaging: Market and Technologies Trends 2019
More information on https://www.i-micronews.com/products/automotive-packaging-market-and-technologies-trends-2019/
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Power SiC 2019: Materials, Devices, and Applications by Yole DéveloppementYole Developpement
Automotive market growth is reshaping the SiC market’s dynamics and ecosystem.
More information on: https://www.i-micronews.com/products/power-sic-2019-materials-devices-and-applications/
LiDARs for Automotive and Industrial Applications 2018 Report by Yole Develop...Yole Developpement
Will automotive change the LiDAR market?
More information on that report at https://www.i-micronews.com/report/product/lidars-for-automotive-and-industrial-applications-2018.html
Jonathan Waldern (DigiLens): DigiLens Switchable Bragg Grating Waveguide Opti...AugmentedWorldExpo
A talk from the Develop Track at AWE USA 2018 - the World's #1 XR Conference & Expo in Santa Clara, California May 30- June 1, 2018.
Jonathan Waldern (DigiLens): DigiLens Switchable Bragg Grating Waveguide Optics for Augmented Reality Applications
This session will look at the key features of DigiLens waveguide technology and discusses our optical design methodology for designing and simulating the performance of DigiLens waveguides, giving examples from motorcycle, and autoHUD products.
http://AugmentedWorldExpo.com
Mems and sensors packaging technology and trends presentation held by Amandin...Yole Developpement
MEMS & sensors transitioning towards 3 main Hubs…
The inertial hub
Examples of MEMS companies with a «sensors integration» road (e.g., mCubewith iGyro, Spectral Engines with integrated spectrometer, Bosch with environmental combo sensors, AMS with optical combos, InvenSense with IMUs ….
Mainly supported today by flip-chip wafer bumping, 3D WLP, and WLCSP; the long term growth of the equipment and materials business will be supported by the expansion of 3D TSV stack platforms.
TSV integration is creating growth and significant interest in the equipment & materials industry
Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TSV interconnects, an area offering opportunities for new developments in equipment modification—equipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TSV Stacks since the memory manufacturers, such as Samsung, SK Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year....
More information on that report at: http://www.i-micronews.com/advanced-packaging-report/product/equipment-materials-for-3dic-wafer-level-packaging-applications.html#description
Status of The Advanced Packaging Industry_Yole Développement reportYole Developpement
IoT driven semiconductor industry consolidation is reflecting into a highly dynamic Advanced Packaging landscape. Demand for advanced packaging and market size is increasing. Focus is turning
to integration and wafer level packages to enable a functionality driven roadmap and revive the cost/performance curve.
Status and Prospects for the Advanced Packaging Industry in China - 2016 Repo...Yole Developpement
Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach $4.6B in 2020 at an impressive 16% CAGR.
What is driving the advanced packaging market in China?
China has the world’s largest population, and its economy will continue to grow at a high pace (more than 6%), reaching around $16T by 2020. Also, an increase in per capita income (more purchasing power) will ensure China remains a dominant market in the coming years. No business can afford to ignore China. China commands a significant market for key electronic products. In fact, over half of all key electronic products are consumed in China. In 2014, the Chinese smartphone, LCD, notebook/tablet, and wearable markets were around 81%, 63%, 71%, and 47% of the global market, respectively. The global IC market will grow by a CAGR of 4% from 2014 - 2020, while the Chinese IC market will grow by 7% over the same period. The Chinese IC market is expected to reach ~$149B by 2020, around 40% of the total IC market. There is a huge gap between China’s IC consumption and its manufacturing. In 2015, China produced only ~12.5% of the IC it consumes, and the gap between IC consumption and production is ~$91B. Currently, IC is China’s #1 import commodity, exceeding oil. China considers the IC industry to be a key strategic sector. The Chinese government is making a significant effort through funding and a national IC policy, with an aggressive growth strategy to make China an IC design and manufacturing hub. The goal by 2030 is to become the global leader in all primary IC industrial supply chain segments. This report gives an overview of China’s semiconductor ecosystem and discusses in detail the country’s advanced packaging market. This report will also describe China’s semiconductor outlook, prospects, market drivers, key players, and supply chain evolution. It will discuss at length the Chinese government’s approach to developing China’s IC industry, including details about different private funds, their objectives, and investments made to date. Overall, this report will help local and global players identify challenges and opportunities in the Chinese IC market and assist them in developing strategies to maximize their market share in China’s fast-growing IC ecosystem, particularly in advanced packaging.
3D Imaging & Sensing 2018 Reports by Yole DeveloppementYole Developpement
The iPhone X initiated a trend. What happens next?
More information here: https://www.i-micronews.com/category-listing/product/p3d-imaging-sensing-2018.html
Status of the Camera Module Industry 2019 – Focus on Wafer Level Optics repor...Yole Developpement
CMOS Camera Modules (CCM) have become a key sensor technology – what are the dynamics and strategies in this highly competitive market?
More information on: https://www.i-micronews.com/produit/status-of-the-camera-module-industry-2019-focus-on-wafer-level-optics/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
LiDAR for Automotive and Industrial Applications 2019 by Yole DéveloppementYole Developpement
Is rationalization happening in the LiDAR market?
More information on: https://www.i-micronews.com/produit/lidar-for-automotive-and-industrial-applications-2019/
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...Yole Developpement
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
IR LEDS and VCSELs - Technology, Applications and Industry Trends - 2017 Repo...Yole Developpement
3D imaging, gas sensing and autofocus will fuel the IR light source market to reach US$3.8B in 2027.
INFRA-RED LIGHT SOURCES: A $1.5B OPPORTUNITY IN 2022 – AND POTENTIALLY $3.8B IN 2027 – DRIVEN BY SEVERAL NEW APPLICATIONS
The market for LED and laser infra-red (IR) light sources is not new, but has evolved rapidly with the recent development of Solid State Lighting (SSL). Initially developed for optical communication applications, these technologies, mostly IR LEDs, started to be integrated into consumer applications like remote controls in the 1980s. Next, the market was driven forward by night vision applications such as surveillance cameras. But it’s only recently, with the development of smartphones, that IR LEDs and lasers have come back to prominence. And now, the market is set for growth for the next 10 years! Today, these technologies are part of a new revolution, still driven by smartphone applications. Integration of breakthrough functionalities such as 3D imaging, autofocus, iris and face recognition is triggering a strong market pull for efficient, miniaturized and complex IR illumination. This trend will also create strong market opportunities for IR lasers, mostly VCSELs, which allow more coherent and directional light than IR LEDs. In this context, we expect the IR light source market to grow from around $450M in 2016 to around $1,550M in 2022 at a compound annual growth rate of 22.7%. In addition, there are also several other applications that are emerging and for which a market boom is likely to happen in the next 10 years. These include gas sensors, LIDARs, driver monitoring systems and remote patient monitoring sensors. We expect this second wave of new applications to propel the IR light source market to around $3,800M in 2027. This report provides an in-depth analysis of all IR light source applications, including: basic principles, technology, trends, key players, and market size. It highlights the global landscape for IR light sources, including classification of applications by wavelength, market segment and function. Detailed market forecasts are given based on these classifications and with complementary analysis by light source for LEDs, edge-emitting lasers and VCSELs. Please note that optical communication applications are not analyzed in this report.
For more information please visit our website: https://www.i-micronews.com/reports.html
Status of the Power Module Packaging Industry 2019 - Yole DéveloppementYole Developpement
Major evolutions in substrate, interconnection, and die-attach technologies, driven by EV/HEV, are transforming the power module packaging supply chain.
More information on: https://www.i-micronews.com/products/status-of-the-power-module-packaging-industry-2019/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
Equipment and Materials for Fan-Out Packaging 2019 report by Yole Développement Yole Developpement
Electronic packaging equipment and materials revenue growth is highly reliant on big players’ investments. A new killer application is needed to fuel robust growth.
More information on https://www.i-micronews.com/products/equipment-and-materials-for-fan-out-packaging-2019/
Automotive Packaging: Market and Technologies Trends 2019 report by Yole Déve...Yole Developpement
Automotive Packaging: Market and Technologies Trends 2019
More information on https://www.i-micronews.com/products/automotive-packaging-market-and-technologies-trends-2019/
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Power SiC 2019: Materials, Devices, and Applications by Yole DéveloppementYole Developpement
Automotive market growth is reshaping the SiC market’s dynamics and ecosystem.
More information on: https://www.i-micronews.com/products/power-sic-2019-materials-devices-and-applications/
LiDARs for Automotive and Industrial Applications 2018 Report by Yole Develop...Yole Developpement
Will automotive change the LiDAR market?
More information on that report at https://www.i-micronews.com/report/product/lidars-for-automotive-and-industrial-applications-2018.html
Jonathan Waldern (DigiLens): DigiLens Switchable Bragg Grating Waveguide Opti...AugmentedWorldExpo
A talk from the Develop Track at AWE USA 2018 - the World's #1 XR Conference & Expo in Santa Clara, California May 30- June 1, 2018.
Jonathan Waldern (DigiLens): DigiLens Switchable Bragg Grating Waveguide Optics for Augmented Reality Applications
This session will look at the key features of DigiLens waveguide technology and discusses our optical design methodology for designing and simulating the performance of DigiLens waveguides, giving examples from motorcycle, and autoHUD products.
http://AugmentedWorldExpo.com
Mems and sensors packaging technology and trends presentation held by Amandin...Yole Developpement
MEMS & sensors transitioning towards 3 main Hubs…
The inertial hub
Examples of MEMS companies with a «sensors integration» road (e.g., mCubewith iGyro, Spectral Engines with integrated spectrometer, Bosch with environmental combo sensors, AMS with optical combos, InvenSense with IMUs ….
Mainly supported today by flip-chip wafer bumping, 3D WLP, and WLCSP; the long term growth of the equipment and materials business will be supported by the expansion of 3D TSV stack platforms.
TSV integration is creating growth and significant interest in the equipment & materials industry
Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TSV interconnects, an area offering opportunities for new developments in equipment modification—equipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TSV Stacks since the memory manufacturers, such as Samsung, SK Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year....
More information on that report at: http://www.i-micronews.com/advanced-packaging-report/product/equipment-materials-for-3dic-wafer-level-packaging-applications.html#description
Status of The Advanced Packaging Industry_Yole Développement reportYole Developpement
IoT driven semiconductor industry consolidation is reflecting into a highly dynamic Advanced Packaging landscape. Demand for advanced packaging and market size is increasing. Focus is turning
to integration and wafer level packages to enable a functionality driven roadmap and revive the cost/performance curve.
Status and Prospects for the Advanced Packaging Industry in China - 2016 Repo...Yole Developpement
Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach $4.6B in 2020 at an impressive 16% CAGR.
What is driving the advanced packaging market in China?
China has the world’s largest population, and its economy will continue to grow at a high pace (more than 6%), reaching around $16T by 2020. Also, an increase in per capita income (more purchasing power) will ensure China remains a dominant market in the coming years. No business can afford to ignore China. China commands a significant market for key electronic products. In fact, over half of all key electronic products are consumed in China. In 2014, the Chinese smartphone, LCD, notebook/tablet, and wearable markets were around 81%, 63%, 71%, and 47% of the global market, respectively. The global IC market will grow by a CAGR of 4% from 2014 - 2020, while the Chinese IC market will grow by 7% over the same period. The Chinese IC market is expected to reach ~$149B by 2020, around 40% of the total IC market. There is a huge gap between China’s IC consumption and its manufacturing. In 2015, China produced only ~12.5% of the IC it consumes, and the gap between IC consumption and production is ~$91B. Currently, IC is China’s #1 import commodity, exceeding oil. China considers the IC industry to be a key strategic sector. The Chinese government is making a significant effort through funding and a national IC policy, with an aggressive growth strategy to make China an IC design and manufacturing hub. The goal by 2030 is to become the global leader in all primary IC industrial supply chain segments. This report gives an overview of China’s semiconductor ecosystem and discusses in detail the country’s advanced packaging market. This report will also describe China’s semiconductor outlook, prospects, market drivers, key players, and supply chain evolution. It will discuss at length the Chinese government’s approach to developing China’s IC industry, including details about different private funds, their objectives, and investments made to date. Overall, this report will help local and global players identify challenges and opportunities in the Chinese IC market and assist them in developing strategies to maximize their market share in China’s fast-growing IC ecosystem, particularly in advanced packaging.
3D Imaging & Sensing 2018 Reports by Yole DeveloppementYole Developpement
The iPhone X initiated a trend. What happens next?
More information here: https://www.i-micronews.com/category-listing/product/p3d-imaging-sensing-2018.html
Status of the Camera Module Industry 2019 – Focus on Wafer Level Optics repor...Yole Developpement
CMOS Camera Modules (CCM) have become a key sensor technology – what are the dynamics and strategies in this highly competitive market?
More information on: https://www.i-micronews.com/produit/status-of-the-camera-module-industry-2019-focus-on-wafer-level-optics/
Imaging Technologies for Automotive 2016 Report by Yole Developpement Yole Developpement
Imaging technology, which is currently mainly cameras, is exploding into the automotive space, and is set to grow at 20% CAGR to reach $7.3B in 2021
INFOTAINMENT AND ADVANCED DRIVER ASSISTANCE SYSTEMS (ADAS) PROPEL AUTOMOTIVE IMAGING
Since 2008, when a recession acted as a wakeup call to the whole industry, the automotive market has undergone obvious structural change. Capitalizing on technologies initially developed for smartphones, electronics have invaded, and imaging technology is now taking center stage. From less than one camera per car on average in 2015, there will be more than three cameras per car by 2021, which means 371 million automotive imaging devices.
Cameras were initially mounted for ADAS purposes on high-end vehicles, with deep learning image analysis techniques promoting early adoption. The Israeli company Mobileye has been instrumental in bringing this technology to market, along with On Semiconductor, which provided the CMOS image sensor. Copycat competition will probably pick up as the market now justifies initial investment in design and technology. It is now a well-established fact that vision-based autonomous emergency braking (AEB) is possible and saves life. Adoption of forward ADAS cameras will therefore accelerate.
Growth of imaging for automotive is also being fueled by the park assist application, and 360° surround view camera volume is skyrocketing. While it’s becoming mandatory in the US to have a rearview camera, that uptake is dwarfed by 360° surround view cameras, which enable a “bird’s eye view” perspective. This trend is most beneficial to companies like Omnivision at sensor level and Panasonic and Valeo, which have become the main manufacturers of automotive cameras.
Mirror replacement cameras are currently the big unknown and take-off will primarily depend on its appeal and car design regulation. Europe and Japan are at the forefront of this trend, which should become slightly significant by 2021.
Solid state lidar is well talked about and will start to be found in high end cars by 2021. Cost reduction will be a key driver as the push for semi-autonomous driving will be felt more strongly by car manufacturers. The report will analyse the impact of lidar for automotive vision in detail.
Night vision cameras using Long Wave Infrared (LWIR) technology were initially perceived as a status symbol. However, they’re increasingly appreciated for their ability to automatically detect pedestrians and wildlife. LWIR will therefore become integrated into ADAS systems in future.
3D cameras will be limited to in-cabin infotainment and driver monitoring. This technology will be key for luxury cars and therefore is of limited use today.
If any significant semi-autonomous trend picks up, the technology will probably become mandatory, due to safety issues.
More information on that report at http://www.i-micronews.com/reports.html
New applications drive greater shipment volumes, which drive new applications, bringing the uncooled IR sensing market into a virtuous cycle.
More information on : https://www.i-micronews.com/report/product/uncooled-infrared-imagers-and-detectors-2019.html
Radar Technologies For Automotive 2018 report by Yole Développement Yole Developpement
How will radar sensor technology shape the cars of the future? Prepare for the automotive sensor industry’s golden age, in which radar will be increasingly viewed as a key technology for autonomous vehicles.
AUTOMOTIVE IS EXPERIENCING AN EXPLOSION OF NEW HIGH-TECH APPLICATIONS
Automatic emergency braking, adaptive cruise control, and lane-change assist are some examples of these new applications. Spurred by the New Car Assessment Program, OEMs are designing cars with numerous sensors that enable applications like these. And since most of these new applications are safety-related, the sensors must be highly accurate. This means very tight specifications for object detection and classification, as well as being ultra-reliable: operable in every weather condition, in poor lighting, near or far, and with a wide field of view. Radar technology is well-suited to fulfill most of these requirements. We say “most” because object classification is not currently possible with radar, but certain companies are moving quickly to unlock this capability in imaging radar.
Radar has an impressive technology roadmap allowing for huge resolution improvement as well as device miniaturization and cost reduction. Despite small growth (~3%) in global car sales until 2022, Yole Développement expects an average growth rate of 25% for radar module sales, and an average growth rate of 22% for radar chip sales over the next five years - with autonomous driving being the next long-term driver for radar technology growth.
More information on that report at http://www.i-micronews.com/reports.html
Machine Vision for Industry and Automation 2018 Report by Yole DeveloppementYole Developpement
Machine vision is at the heart of the automation revolution.
More information on that report at https://www.i-micronews.com/report/product/machine-vision-for-industry-and-automation-2018.html
The one million robotic vehicle milestone will be reached by end of the decade: The industrial phase has been launched.
More information on: https://www.i-micronews.com/products/sensors-for-robotic-mobility-2020/
Status of the CMOS Image Sensor Industry 2016: New Dynamics in Market and Tec...Yole Developpement
New functions are pushing change in CMOS image sensors, boosting the market toward $18.8B in 2021 at 10.4% CAGR
Beyond $10B: The CMOS image sensor industry keeps growing at high pace
Driven by renewed mobile and automotive applications, the CMOS image sensor (CIS) industry is expected to expand at a compound annual growth rate (CAGR) of 10.4% from 2015 to 2021, reaching US$18.8B market value by 2021.
Yole Développement expects sustained growth of the CMOS image sensor industry for the next five years. Increasing camera content in smartphones will more than offset slower smartphone volume growth. The trend for dual and 3D cameras will have a major impact on CIS volumes. While it is too early to fully describe the strategy of the main actors yet, some products are already on the market. The 2016 report comprehensively covers key market and technology choices.
One big story this year is the consumer market, which is recovering from the total collapse of digital photography. While action cameras seem to have reached a ceiling, new applications such as drones, robots, virtual reality and augmented reality are ready to rejuvenate this emblematic market. The Automotive camera market has established itself as a key growth market for CIS. The Advanced Driver Assistance (ADAS) trend is further increasing pressure on vendors to provide sensors beyond their current technical capabilities. Image analysis is the new frontier and early usage of artificial intelligence is catching people’s imagination. We are therefore in the middle of an explosive growth pattern that will not slow down before 2021. An exceptionally high 23% CAGR is predicted in automotive for the 2015-2021 period.
Radar and Wireless for Automotive: Market and Technology Trends 2019 report b...Yole Developpement
The radar and 5G/V2X markets will both grow – one through market pull, the other through prospective enablement.
More information on https://www.i-micronews.com/products/radar-and-v2x-for-automotive-technologies-and-market-trends-2019/
Proliferation of cameras for imaging and sensing is driving CMOS image sensor (CIS) growth.
More information on that report at : https://www.i-micronews.com/report/product/status-of-the-cis-industry-2018.html
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
Microphones, Microspeakers and Audio Solutions Market and Technology Trends 2019Yole Developpement
The voice-based world is shaking up the audio industry, making it worth $20.8B in 2024.
More information on https://www.i-micronews.com/products/microphones-microspeakers-and-audio-solutions-market-and-technology-trends-2019/
Paramount to the future of safety and autonomy, the automotive imaging market is at a key crossroads.
More information on https://www.i-micronews.com/products/imaging-for-automotive-2019/
How the MEMS Industry Can Extract More Value From its Customers? by JC. Eloy ...Yole Developpement
How the MEMS Industry Can Extract More Value From its Customers ?
Presentation at MEMS Industry Group by JC. Eloy (eloy@yole.fr)
TOP 5 remains unchanged in 2014 (and certainly in 2015) but Bosch now accounts for one-third of the $3.8B MEMS revenues shared by the top 5 MEMS companies (accounting for about one third of the total MEMS business).
The ability to deliver a function!
• The sensor is the way to understand what is happening.Selling sensors without the brain is putting the MEMS industry in a low cost,commoditazation corner where the Moore’s Law is not helping you compared to the semiconductor business.
Technology is almost ready
Players are working on the killer applications
WHAT WILL HAPPEN?
• MEMS is growing as a market, both in volume and total value
• But the value is moving from devices to functions and few MEMS players are taking benefit of this value flow
• Very limited number of companies are entering the field, the last success has been Invensense
• The last really new device was Knowles silicon microphone in 2003
• So it is now important to change the MEMS mind set and to move to functions development…
Camera Module Industry 2017 Report by Yole Developpement Yole Developpement
New technologies and applications have restructured the Compact Camera Module industry
AT 12.2% CAGR FOR THE NEXT FIVE YEARS, THE COMPACT CAMERA MODULE INDUSTRY (CCM) IS A GROWTH POWERHOUSE WITH NUMEROUS LARGE COMPANIES THRIVING IN A DYNAMIC MARKET
In 2015, Yole Développement published its first report on the camera module industry and mentioned the immaturity of the ecosystem with numerous small players especially for module assembly. Now the dust has settled and giant camera module players have emerged such as LG Innotek, Semco, Foxconn Sharp, O-Film and Sunny Optical. This 2017 edition is giving you the insights into the trajectory of the industry and of more than 30 players serving mobile and other applications such as automotive and security.
Historically one could differentiate the faith of camera module market from the sub parts such as the image sensor, the lens and the autofocus or optical image stabilization system (Voice Coil Motors - VCM). It seems that differentiated growth has now ended and every sub segment is enjoying almost equal benefit from the rising market tide. This convergence is in part due to the end of quasi-monopoly from Sony in the image sensor sub-segment now joined by Samsung and Omnivision. The story is very similar for Largan Precision in the lens set sub-segment which is now facing renewed competition from Sunny Optical, Kantatsu and Genious Optical.
The last sub-domain of our interest in this report is VCMs. The growth of VCM companies has been undercut by dire structuration efforts. We had mentioned the inability of the VCM to serve the demand in the mobile market. Price pressures have changed the face of competition with competitors such as Mitsumi and Shicoh which were forced out and new players such as New Shicoh and Jawha to take center stage.
More information on that report at http://www.i-micronews.com/reports.html
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...Yole Developpement
High-end inertial sensors are the backbone of systems that will enable autonomous transportation and the new space industry.
More information on: https://www.i-micronews.com/products/high-end-inertial-sensors-for-defense-aerospace-and-industrial-applications-2020/
Trends in Automotive Packaging 2018 by Yole DéveloppementYole Developpement
OSATs are gaining benefits from advanced packaging in automotive.
More information on that report at : https://www.i-micronews.com/report/product/trends-in-automotive-packaging-2018.html
Silicon Photonics 2018 - Report by Yole Developpement Yole Developpement
Fueled by increasing internet traffic thanks to social networks, video and gaming content, increasing bandwidth will be required for inter- and intra-data center communications. As a short term answer to this possible bandwidth congestion, new photonics technology for transceivers is still pulled onto the market by Google, Apple, Facebook, Amazon and Microsoft (GAFAM) and now by Baidu, Alibaba and Tencent (BAT) in China.
More information on that report at http://www.i-micronews.com/reports.html
Similar to Light Shaping Technologies for Consumer and Automotive Applications 2019 (20)
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
Emerging Non-Volatile Memory 2020 report by Yole DéveloppementYole Developpement
The stand-alone emerging NVM market keeps soaring, led by storage-class memory applications. Meanwhile, foundries are propelling the embedded business.
More info on: https://www.i-micronews.com/products/emerging-non-volatile-memory-2020/
(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...Yole Developpement
High-Performance Computing and cloud gaming are setting the bar for leadership in the high-end CPU and GPU markets.
More info on: https://www.i-micronews.com/products/xpu-high-end-cpu-and-gpu-for-datacenter-applications-2020/
Nano-Imprint Technology Trends for Semiconductor Applications 2019 Report by...Yole Developpement
Nano-Imprint Lithography is revived by photonics and biochips as well as front-end memory applications.
More information on: https://www.i-micronews.com/products/nano-imprint-technology-trends-for-semiconductor-applications-2019/
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
Smart TV Buyer Insights Survey 2024 by 91mobiles.pdf91mobiles
91mobiles recently conducted a Smart TV Buyer Insights Survey in which we asked over 3,000 respondents about the TV they own, aspects they look at on a new TV, and their TV buying preferences.
SAP Sapphire 2024 - ASUG301 building better apps with SAP Fiori.pdfPeter Spielvogel
Building better applications for business users with SAP Fiori.
• What is SAP Fiori and why it matters to you
• How a better user experience drives measurable business benefits
• How to get started with SAP Fiori today
• How SAP Fiori elements accelerates application development
• How SAP Build Code includes SAP Fiori tools and other generative artificial intelligence capabilities
• How SAP Fiori paves the way for using AI in SAP apps
Enhancing Performance with Globus and the Science DMZGlobus
ESnet has led the way in helping national facilities—and many other institutions in the research community—configure Science DMZs and troubleshoot network issues to maximize data transfer performance. In this talk we will present a summary of approaches and tips for getting the most out of your network infrastructure using Globus Connect Server.
Encryption in Microsoft 365 - ExpertsLive Netherlands 2024Albert Hoitingh
In this session I delve into the encryption technology used in Microsoft 365 and Microsoft Purview. Including the concepts of Customer Key and Double Key Encryption.
Elevating Tactical DDD Patterns Through Object CalisthenicsDorra BARTAGUIZ
After immersing yourself in the blue book and its red counterpart, attending DDD-focused conferences, and applying tactical patterns, you're left with a crucial question: How do I ensure my design is effective? Tactical patterns within Domain-Driven Design (DDD) serve as guiding principles for creating clear and manageable domain models. However, achieving success with these patterns requires additional guidance. Interestingly, we've observed that a set of constraints initially designed for training purposes remarkably aligns with effective pattern implementation, offering a more ‘mechanical’ approach. Let's explore together how Object Calisthenics can elevate the design of your tactical DDD patterns, offering concrete help for those venturing into DDD for the first time!
Welcome to the first live UiPath Community Day Dubai! Join us for this unique occasion to meet our local and global UiPath Community and leaders. You will get a full view of the MEA region's automation landscape and the AI Powered automation technology capabilities of UiPath. Also, hosted by our local partners Marc Ellis, you will enjoy a half-day packed with industry insights and automation peers networking.
📕 Curious on our agenda? Wait no more!
10:00 Welcome note - UiPath Community in Dubai
Lovely Sinha, UiPath Community Chapter Leader, UiPath MVPx3, Hyper-automation Consultant, First Abu Dhabi Bank
10:20 A UiPath cross-region MEA overview
Ashraf El Zarka, VP and Managing Director MEA, UiPath
10:35: Customer Success Journey
Deepthi Deepak, Head of Intelligent Automation CoE, First Abu Dhabi Bank
11:15 The UiPath approach to GenAI with our three principles: improve accuracy, supercharge productivity, and automate more
Boris Krumrey, Global VP, Automation Innovation, UiPath
12:15 To discover how Marc Ellis leverages tech-driven solutions in recruitment and managed services.
Brendan Lingam, Director of Sales and Business Development, Marc Ellis
GraphRAG is All You need? LLM & Knowledge GraphGuy Korland
Guy Korland, CEO and Co-founder of FalkorDB, will review two articles on the integration of language models with knowledge graphs.
1. Unifying Large Language Models and Knowledge Graphs: A Roadmap.
https://arxiv.org/abs/2306.08302
2. Microsoft Research's GraphRAG paper and a review paper on various uses of knowledge graphs:
https://www.microsoft.com/en-us/research/blog/graphrag-unlocking-llm-discovery-on-narrative-private-data/
zkStudyClub - Reef: Fast Succinct Non-Interactive Zero-Knowledge Regex ProofsAlex Pruden
This paper presents Reef, a system for generating publicly verifiable succinct non-interactive zero-knowledge proofs that a committed document matches or does not match a regular expression. We describe applications such as proving the strength of passwords, the provenance of email despite redactions, the validity of oblivious DNS queries, and the existence of mutations in DNA. Reef supports the Perl Compatible Regular Expression syntax, including wildcards, alternation, ranges, capture groups, Kleene star, negations, and lookarounds. Reef introduces a new type of automata, Skipping Alternating Finite Automata (SAFA), that skips irrelevant parts of a document when producing proofs without undermining soundness, and instantiates SAFA with a lookup argument. Our experimental evaluation confirms that Reef can generate proofs for documents with 32M characters; the proofs are small and cheap to verify (under a second).
Paper: https://eprint.iacr.org/2023/1886
PHP Frameworks: I want to break free (IPC Berlin 2024)Ralf Eggert
In this presentation, we examine the challenges and limitations of relying too heavily on PHP frameworks in web development. We discuss the history of PHP and its frameworks to understand how this dependence has evolved. The focus will be on providing concrete tips and strategies to reduce reliance on these frameworks, based on real-world examples and practical considerations. The goal is to equip developers with the skills and knowledge to create more flexible and future-proof web applications. We'll explore the importance of maintaining autonomy in a rapidly changing tech landscape and how to make informed decisions in PHP development.
This talk is aimed at encouraging a more independent approach to using PHP frameworks, moving towards a more flexible and future-proof approach to PHP development.
Alt. GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using ...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
In his public lecture, Christian Timmerer provides insights into the fascinating history of video streaming, starting from its humble beginnings before YouTube to the groundbreaking technologies that now dominate platforms like Netflix and ORF ON. Timmerer also presents provocative contributions of his own that have significantly influenced the industry. He concludes by looking at future challenges and invites the audience to join in a discussion.
The Metaverse and AI: how can decision-makers harness the Metaverse for their...Jen Stirrup
The Metaverse is popularized in science fiction, and now it is becoming closer to being a part of our daily lives through the use of social media and shopping companies. How can businesses survive in a world where Artificial Intelligence is becoming the present as well as the future of technology, and how does the Metaverse fit into business strategy when futurist ideas are developing into reality at accelerated rates? How do we do this when our data isn't up to scratch? How can we move towards success with our data so we are set up for the Metaverse when it arrives?
How can you help your company evolve, adapt, and succeed using Artificial Intelligence and the Metaverse to stay ahead of the competition? What are the potential issues, complications, and benefits that these technologies could bring to us and our organizations? In this session, Jen Stirrup will explain how to start thinking about these technologies as an organisation.
Accelerate your Kubernetes clusters with Varnish CachingThijs Feryn
A presentation about the usage and availability of Varnish on Kubernetes. This talk explores the capabilities of Varnish caching and shows how to use the Varnish Helm chart to deploy it to Kubernetes.
This presentation was delivered at K8SUG Singapore. See https://feryn.eu/presentations/accelerate-your-kubernetes-clusters-with-varnish-caching-k8sug-singapore-28-2024 for more details.
16. The introduction of the Compact Disc (CD) in
1982 relied on a double revolution: Using light
to read music, and switching music from analog
to digital. It transformed music expression as
well, giving a sound clarity typical of the 1980s
pop music and recognized today as a musical
genre of its own.
The advent of the CD relied on numerous
technologies, including three hardware
innovations. CDs had to be patterned with
sub-micrometer scale features: 500nm wide,
150nm deep and sometimes 830nm long.
With throughput of 900 discs per hour per
line, new methods had to be developed.
Another key technology was the millimeter-
size lens elements used to optically read
the digital music information written on the
discs. A last key technology was the tracking
system of the laser on the disc, which included
autofocus (AF) technologies. This last part used
mechatronics elements which were developed
in the Walkman by Sony.
In 1999 and 2000, Kyocera, Samsung, and
Sharp released the first mobile phones with
cameras. The cameras needed millimeter-
size lens elements and small actuators for AF.
They relied on technologies developed for the
CD. After nearly two decades of development
and the popularization of photography in
smartphones, these industries have become
huge. Lens elements for mobile phones,
produced mainly by injection molding, are a
$2.1B market. Similarly, AF and optical image
stabilization (OIS), operated by voice-coil
motors (VCM), are worth $2.3B.
The report investigates the market of optical
elements in mobile phones as well as the impact
of micro technologies for optical elements.
LIGHT SHAPING TECHNOLOGIES FOR CONSUMER AND
AUTOMOTIVE APPLICATIONS 2019
Market & Technology Report - October 2019
FROM SOUND TO PHOTONS
Legacy micro-optics are on the verge of being reshaped by the semiconductor industry and nanostructuring
techniques.
(Yole Développement, October 2019)
Microtechnologies entering optical applications
KEY FEATURES
• Market forecasts for optical systems
and elements for smartphones, AR/
VR, and automotive through 2024
• Market trends for optical systems
and elements for smartphones, AR/
VR, and automotive
• Supply chain for optical systems and
elements for smartphones, AR/VR,
and automotive
• Technology description of
optical systems and elements
for smartphones, AR/VR, and
automotive
REPORT OBJECTIVES
• Provide market data on optical
systems and elements for
smartphones, AR/VR, and
automotive
• Key market metrics and dynamics
• Offer an application-related focus
on key existing markets and the
most promising emerging ones
• Furnish an analysis of the major
technology trends
• Deliver a deep understanding
of the optical business value
chain, infrastructure, and players,
especially for smartphones
The Compact Disc
Late 1970s
Micromachining
Late 1980s
Optical MEMS
Late 1990s
MEMS scanner
DMD
Digital Micromirror Device
Nanometer
scale
diffractive
gratings
Microlens
array
AR HMD
Augmented Reality
Head-mounted Display
Starting 2016
Mobile phone camera module
Starting 2000
Smartphone 3D sensing
Late 2010
Lens made by
injection
molding
Autofocus and optical
image stabilization
using mechatronics
GROWTH ENABLED BY MICROTECHNOLOGIES
Simultaneously to the growth of injection
molding for lens elements and mechatronics for
VCMs, semiconductor technologies ventured
outside of microelectronics applications. MEMS
were officially invented in 1987, with their first
applications in mechanics. The year 2000 was
probably the start of the optical MEMS boom,
with applications envisioned in the datacom
industry among others, and devices such as
micro-optical scanners, and optical switches.
However, a few years later, following the burst
of the dot-com bubble, the boom of optical
MEMS was over.
Yet optical applications of semiconductor
manufacturing technologies have not
disappeared. High growth is even expected.
However, as often happens, the growth is not
in the areas envisioned when the technologies
emerged. Imaging has become central to the
smartphone domain. First used for photography,
17. LIGHT SHAPING TECHNOLOGIES FOR CONSUMER AND AUTOMOTIVE APPLICATIONS 2019
AUTOMOTIVE APPLICATIONS ONTHETECHNOLOGY ROADMAP
Consumer products are not the only area that
benefits from optical microtechnologies. The
automotive segment also benefits, even if the
landscape is a bit more complex. Two applications
are envisioned. One is autonomous driving with
LiDAR. However, the technology is not expected
to appear before 2021, resulting in a market for
automotive LiDAR MEMS scanners of $1.2M in
2024. Another application is adaptive front lighting
systems (AFLS) in which the front lighting system
of a car is expected to adapt to the shape of the
road and oncoming vehicles. As in LiDAR, various
imaging is moving further with its usage in 3D
sensing. The release of the iPhone X by Apple in
2017 meant the popularization of face recognition
based on 3D sensing. And 3D sensing is also
expanding to the rear side of smartphones with
applications in imaging and augmented reality. As
a result, the market for diffractive elements and
diffusers for 3D sensing in smartphones is expected
to grow from $3M in 2018 to $35M in 2024 with a
51% Compound Annual Growth Rate (CAGR).
Another important application of optical
microtechnologies is augmented reality head-
mounted displays (AR HMD). Not only do they
require complex optical systems, but they also
find numerous applications in gaming, training,
industry, and the military. The active part of
the display, which relies on Digital Micromirror
Devices (DMD) or Liquid Crystal on Silicon
(LCOS), is expected to grow from $3.6M in 2018
to $120M in 2024 with a CAGR of 80%. Similarly,
the market for the waveguide elements, which
rely on diffractive optical elements (DOE) or
holographic optical elements (HOE), is expected
to grow from $24M in 2018 to $1.3B in 2024 with
a CAGR of 93%.
Optical element: 2018-2024 market forecast
(Yole Développement, October 2019)
$2.1B
Mobile phone lens elements
Mobile phone Autofocus and Optical
Image Stabilization
Digital Micromirror Device (DMD) and
LCOS for AR Head Mounted Display (HMD)
Diffractive Optical Element and Holographic
Optical Element for AR HMD
$2.3B $120M
CAGR 80%
$24M $3.6M
$3M
Diffusers and diffractive elements for
3D sensing in smartphones
$2.5B
CAGR 2% $4.4B
CAGR 11%
$1.3B
CAGR 93%
$35M
CAGR 51%
$254M
$517M
CAGR 13%
Automotive optical elements, including
DMD for headlamps, MEMS scanner for
LiDAR, LiDAR lens elements, headlamps
lens, reflector and Micro Lens Array.
2018
$4.7B
2024
$8.8B
CAGR2018-2024: 11%
Optical microtechnologies - Technology roadmap
(Yole Développement, October 2019)
Diffuser for
3D sensing
(ToF)
Diffractive
Optical
Elements
2016 2017 2018 2021 2025
Smartphone
Automotive
AR HMD
LCOS
Diffractive
gratings for 3D
sensing (SL)
HOE on
glass
DMD
DMD for
Headlamps
MEMS Scanner
for LiDAR
MEMS Scanner
for Headlamps
OPA for
LiDAR
LCOS for
LiDAR
MEMS or Liquid Crystals
challenge in autofocus?
??
Phase modulated
LCOS
(Holography)
HOE on
plastic
Micro LED
display
Retinal projection
display
Random MLA for
3D sensing (ToF)
18. COMPANIES CITED IN THE REPORT
AAC Technologies, AGC, Alps, ams, Anteyron, Apple, Audi , BMW, Bosch, Canon, CDA,
Corning, Cowell, Delo, Digilens, EVG, Foxconn, Google, GSEO, Haesung Optics, Hella, Himax,
Hoya, Huawei, Hysonic, Infineon, Innoviz, Intel, Invenios, IQE, Jahwa, Kantatsu, Kolen, Konica
Minolta, Largan, Lenovo, LG, LG Innotek, LiteOn, Lumentum, Lumotive, Magicleap, Mercedes-
Benz, Microsoft, Mitsumi, Nidec, Nokia, Ofilm, Ohara, OmniVision, Oppo, OQmented,
Osram, Panasonic, poLight, Primax, Q Tech, Quanergy, Realview, RPC Photonics, Samsung,
Samsung Electro-Mechanics, Schott, Sekonix, SiLC, Sony, ST microelectronics, Sunny Optical,
TDK, Texas Instruments, Tong Hsing, Toshiba, TrueLifeOptics, Valeo, Velodyne, Viavi, Vivo,
Vuzix, Waveoptics, WioTech, WLCSP, Xiaomi, Xperi, YNG, Zeon, Zhejiang Crystal-Optech,
ZhiSensor, ZKW and more.
MARKET TECHNOLOGY REPORT
Glossary and definition 2
Table of contents 3
Yole Développement’s approach 5
Report scope 6
Report methodology 10
About the authors 11
Companies cited in this report 13
Executive summary 14
Context 45
Light
Today’s innovation
Optical element application matrix
Key parameters for optical elements
Market forecasts 57
Mobile phone modules forecast
AR/VR HMD forecast
Automotive headlamps forecast
Mobile phone passive optical elements
forecast
VR and AR HMD passive optical elements
forecast
Automotive passive optical elements
forecast
Active optical elements forecast
Market trends 75
Consumer market trends
Automotive market trends
Market shares and supply chain 116
Merger and acquisition activity
Mobile phone camera module
Lens set for camera module
Microlens array
3D sensing optics
Wafer-level camera module
DOE for AR HMD
Holographic element combiners
VCM for camera module
MEMS scanners
Automotive LiDAR
Digital micromirror devices
LCOS technology
Optical phased array
Technology trends 150
Modules
Passive elements
Passive elements manufacturing
Active elements
Reverse costing®
- structure, process and
cost analyses 240
Teardowns
Cost analyses
Outlook 249
Related reports 252
How to use our data 254
About Yole Développement 255
TABLE OF CONTENTS (complete content on i-Micronews.com)
• Status of the Camera Module Industry 2019 –
Focus on Wafer Level Optics
• Automotive Lighting: Technology, Industry
and Market Trends 2018
• Displays Optical Vision Systems for VR,
AR MR 2018
• 3D Imaging Sensing 2018
• Mobile Camera Module Comparison 2019
Find all our reports on www.i-micronews.com
RELATED REPORTS
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AUTHORS
Alexis Debray, PhD is a Technology
Market Analyst, Optoelectronics at Yole
Développement (Yole). As a member of the
Photonics, Sensing Display division, he is
engaged in the development of reports as
well as custom consulting projects dedicated
to the imaging industry.
Author of various scientific publications and
patents, Alexis graduated from ENSICAEN
and holds a PhD in applied acoustics.
technologies are competing, the choice of which
is not only based on performances but also on
aesthetic considerations. As a result, the market
for digital mirror devices (DMD) for automotive
lighting is expected to reach $2.3M in 2024, while
MEMS scanners for automotive lighting are not
expected to enter the market before 2025. All
things considered, the optical element market
for automotive will grow from $254M in 2018 to
$521M in 2024 with a 13% CAGR.
The story is not over yet. Although we have seen
emerging markets for optical microtechnologies
with 3D sensing in smartphones and AR HMD,
as well as opportunities in automotive with
LiDAR and adaptive front lighting systems,
one obvious opportunity remains. The large
market for smartphone lens elements, AF
and OIS, which is today relying on legacy
technologies, is difficult to challenge because
of its size. Nevertheless, several technologies
are challenging this situation. Wafer level optics
challenge optical elements made by injection
molding. MEMS actuators, piezo motors, and
liquid crystal challenge VCMs. At some point,
new technologies could diffuse into these
applications.
Martin Vallo, PhD is serves as a
Technology Market Analyst specialized
in solid-state lighting technologies, within
the Photonics, Sensing Display division at
Yole Développement (Yole). Martin is today
involved in the development of reports as
well as custom consulting projects at Yole.
Martin graduated from Academy of Sciences,
Institute of Electrical Engineering (Slovakia)
with an engineering degree in III-nitride
semiconductors.
As a Technology Market Analyst, Displays,
Zine Bouhamri, PhD is a member of
the Photonics, Sensing Display division at
Yole Développement (Yole). Zine manages
the production of reports, as well as custom
consulting projects. He is also deeply involved
in the business development activities. Zine
Bouhamri holds an Electronics Engineering
Degree from the National Polytechnic
Institute of Grenoble (France), one from
the Politecnico di Torino (Italy), and a Ph.D.
in RF Optoelectronics from Grenoble
University (France).
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