First fully integrated, monolithic CMOS+MEMS oscillator device Innovative Poly-SiGe Surface-Micromachining Process The frequency control market is largely dominated by quartz products, but silicon timing solutions have a strong value proposition for some sub-markets. The Si504 is the first silicon oscillator from Silicon Labs. Manufactured with the CMEMS process (CMOS + MEMS), the crystal elements are replaced by micromachined semiconductor resonators. CMEMS process consists in a monolithic integration of a CMOS circuit with innovative Poly-SiGe (polycrystalline silicon-germanium) MEMS resonator structures manufactured directly above CMOS metallization. The resonator is then vacuum encapsulated with a silicon cap using an eutectic wafer bonding process. With a die size below 1mm², the Si504 is optimized to support high-volume, low-cost applications such as consumer electronics market. More information on that report at http://www.i-micronews.com/reports/Silicon-Labs-CMEMS-Oscillator/1/415/

1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not
bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The
quoted trademarks are property of their owners.
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
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January 2014 – Version 1 – Written by Romain Fraux

2. Silicon Labs Si504 MEMS Oscillator
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Glossary
1. Overview / Introduction 4
– Executive Summary
– Reverse Costing Methodology
2. Company Profile 7
– Silicon Labs Profile
– Si504 Specifications
3. Physical Analysis 12
– Synthesis of the Physical Analysis
– Physical Analysis Methodology
– 3.1 Package 15
– Package View, Dimensions & Pin-out
– Package X-Ray
– Package Opening
– Package Cross-Section
– 3.2 Die 27
– View & Dimensions
– Marking
– Die Overview
– MEMS Cap Removed
– MEMS Cap
– MEMS Resonator
– CMEMS Die Delayering
– IC Process
– 3.3 Die Cross-Section 50
– Die Cross-Section Overview
– Die Cross-Section: Cap (Pad Opening)
– Die Cross-Section: Cap (Cavity)
– Die Cross-Section: Cap (Sealing)
– Die Cross-Section: CMEMS Overview
– Die Cross-Section: IC Layers
– Die Cross-Section: MEMS Layers
4. Manufacturing Process Flow 66
– Global Overview
– CMOS Front-End Process
– MEMS Resonator Process Flow
– MEMS Cap & Assembly Process Flow
– Wafer Fabrication Unit
– Packaging Process Flow & Assembly Unit
5. Cost Analysis 83
– Synthesis of the cost analysis
– Main steps of economic analysis
– Yields Hypotheses
– CMOS Front-End Cost
– MEMS Resonator Front-End Cost
– MEMS Cap Front-End Cost
– CMEMS/Cap Assembly Cost
– MEMS Front-End Cost per process steps
– MEMS Front-End: Equipment Cost per Family
– MEMS Front-End: Material Cost per Family
– Total Front-end Cost & Price
– Back-End 0 : Probe Test & Dicing
– Wafer & Die Cost
– Back-End : Packaging Cost
– Back-End : Final Test Cost
– Si504 Component Cost
6. Estimated Price Analysis 106
– Silicon Labs Financial Ratios
– Si504 Estimated Price
Contact 109

3. Silicon Labs Si504 MEMS Oscillator
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• This full reverse costing study has been conducted to provide insight on technology data,
manufacturing cost and selling price of the Si504 CMEMS oscillator supplied by Silicon Labs.
• The Si504 is the first silicon oscillator of Silicon Labs.
• Manufactured with the CMEMS process (CMOS + MEMS), the crystal elements are replaced with
micromachined semiconductor resonators.
 CMEMS process consists in a monolithic integration of a CMOS circuit with innovative Poly-
SiGe (polycrystalline silicon-germanium) MEMS resonator structures manufactured directly
above CMOS metallization. The process was developed by Silicon Clocks, a University of
California, Berkeley spin-off (acquired by Silicon Labs in 2010).
 The resonator is then vacuum encapsulated with a silicon cap using an eutectic wafer bonding
process.
• With a die size below 1mm², and a manufacturing which could probably be transferred to 12-inch
wafers, the Si504 is optimized to support high-volume, low-cost applications such as consumer
electronics market.

4. Silicon Labs Si504 MEMS Oscillator
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The reverse costing analysis is conducted in 3 phases:
Teardown
analysis
• Package is analyzed and measured
• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin
out, die marking
• Setup of the manufacturing process.
Costing
analysis
• Setup of the manufacturing environment
• Cost simulation of the process steps
Selling price
analysis
• Supply chain analysis
• Analysis of the selling price

5. Silicon Labs Si504 MEMS Oscillator
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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 5
• Package: DFN 4-pin
• Dimensions: 3.2 x 2.5 x 0.9mm
• Pin Pitch: 0.4mm
• Marking:
A00WQ
1319
Package top view Package bottom view
Package Side View
2.5mm
0.9mm
3.2mm

6. Silicon Labs Si504 MEMS Oscillator
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7. Silicon Labs Si504 MEMS Oscillator
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8. Silicon Labs Si504 MEMS Oscillator
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Packaging Cost
Final Test Cost
CMEMS Oscillator
CMOS Front-End Cost
MEMS Front-End Cost
Probe Test Cost
Dicing Cost
• We perform the economic analysis of the CMOS with the IC Price+ tool.
• We perform the economic analysis of the MEMS and packaging with the MEMS CoSim+ tool.
Subcontractor(s)

9. Silicon Labs Si504 MEMS Oscillator
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10. Silicon Labs Si504 MEMS Oscillator
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11. Silicon Labs Si504 MEMS Oscillator
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12. Silicon Labs Si504 MEMS Oscillator
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13. Silicon Labs Si504 MEMS Oscillator
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Reverse costing analysis represents the best cost/price evaluation given the publically available
data, and estimates completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a
+/- 10% correction on the manufacturing cost (if all parameters are cumulated)
These results are open for discussion. We can reevaluate this circuit with your information.
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