The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Status of the Memory Industry 2019 Report by Yole DeveloppementYole Developpement
A 360˚ analysis of the memory industry and its competitive landscape.
More information on that report at: https://www.i-micronews.com/products/status-of-the-memory-industry-2019/
The new storage-class memory (SCM) category will be the biggest emerging NVM market, with embedded MCU seeking emerging NVM for strategic differentiation.
PCM leads the race to storage-class memory (SCM), but RRAM will catch up soon
In 2015, the Micron/Intel alliance presented a breakthrough stand-alone memory product called 3D Xpoint, developed in secret for many years, which uses PCM material instead of RRAM as we expected. Thus, after being down and out for a while, PCM made a big comeback in the emerging NVM race. This product has an amazingly high density for an emerging NVM (128 Gb), which is close to the latest NAND thanks to high node (20nm), a 3D crosspoint structure, and a good selector. We expect PCM will have the largest emerging NVM market share by 2021, thanks to its prominent promoters (Micron/Intel), which have sufficient influence to create a new SCM category using 3D Xpoint in the memory hierarchy. Indeed, creating a new memory category is a sea-change that will require numerous hardware and software developments by all memory ecosystem players. And while there is no general agreement, many experts believe DRAM sales will decrease due to SCM’s increased use. For this reason, many incumbent players, especially DRAM ones, have postponed their SCM product introduction in order to extend their DRAM profits, which over the last several years have been very high.
Wafer starts for More than Moore applications 2018 Report by Yole Developpement Yole Developpement
Driven by megatrend markets, More than Moore devices’ overall wafer demand is expected to grow at an almost 10% CAGR from 2017 to 2023.
More information on that report at https://www.i-micronews.com/report/product/wafer-starts-for-more-than-moore-applications.html
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Status of the Memory Industry 2019 Report by Yole DeveloppementYole Developpement
A 360˚ analysis of the memory industry and its competitive landscape.
More information on that report at: https://www.i-micronews.com/products/status-of-the-memory-industry-2019/
The new storage-class memory (SCM) category will be the biggest emerging NVM market, with embedded MCU seeking emerging NVM for strategic differentiation.
PCM leads the race to storage-class memory (SCM), but RRAM will catch up soon
In 2015, the Micron/Intel alliance presented a breakthrough stand-alone memory product called 3D Xpoint, developed in secret for many years, which uses PCM material instead of RRAM as we expected. Thus, after being down and out for a while, PCM made a big comeback in the emerging NVM race. This product has an amazingly high density for an emerging NVM (128 Gb), which is close to the latest NAND thanks to high node (20nm), a 3D crosspoint structure, and a good selector. We expect PCM will have the largest emerging NVM market share by 2021, thanks to its prominent promoters (Micron/Intel), which have sufficient influence to create a new SCM category using 3D Xpoint in the memory hierarchy. Indeed, creating a new memory category is a sea-change that will require numerous hardware and software developments by all memory ecosystem players. And while there is no general agreement, many experts believe DRAM sales will decrease due to SCM’s increased use. For this reason, many incumbent players, especially DRAM ones, have postponed their SCM product introduction in order to extend their DRAM profits, which over the last several years have been very high.
Wafer starts for More than Moore applications 2018 Report by Yole Developpement Yole Developpement
Driven by megatrend markets, More than Moore devices’ overall wafer demand is expected to grow at an almost 10% CAGR from 2017 to 2023.
More information on that report at https://www.i-micronews.com/report/product/wafer-starts-for-more-than-moore-applications.html
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
5G’s Impact on RF Front-End Module and Connectivity for Cell phones 2019 by Y...Yole Developpement
The battle for 5G still rages: integration in-module or with discrete parts?
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2019/
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
The 2010 State of supply chain performance study in Semiconductor industry was conducted with 52 companies with annual turnover exceeding USD 400 million.
The study was conducted from September to November 2010 by iCognitive consultants.
The Study used the same standard online questionnaire in all countries.
In addition, telephone interviews were carried out for verification of online results and additional qualitative data.
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
The worldwide semiconductor industry: Trends and opportunities 2016 The Broker Forum
The worldwide semiconductor industry: Trends and opportunities 2016
Today, the rapid pace of innovation and ever-expending use of technologically advanced devices including smartphones, tablets, flat-screen monitors, smart connected cars and medical devices is multiplying the number of semiconductor components being used around us every day. Digitization, connectivity and the internet of things (IOT) now promise solid growth for the global semiconductor market.
Discover how you can develop your business by looking at this market infographic from The Broker Forum.
The GaN RF market enjoyed a healthy increase in 2015.
2015 was a significant year for the GaN RF industry, with a dramatic increase in wireless infrastructure market sales driven by the massive adoption of LTE networks in China. By year’s end, the total RF GaN market was close to $300M.
Sales will likely not soar as high over the next two years, but growth will continue, mainly driven by increased adoption of GaN technology in the wireless infrastructure and defense markets. A significant boost will occur around 2019 – 2020, led by the implementation of 5G networks. Market size will be multiplied by 2.5 by the end of 2022, posting a CAGR of 14%...
More information on that report at http://www.i-micronews.com/reports.html
Compound Semiconductors,RF, Power Electronics
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 µm or even 50 µm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
Status of the Power Electronics Industry 2019 by Yole DéveloppementYole Developpement
Long term growth of the power electronics market is driving 300mm wafer-based production.
More information on: https://www.i-micronews.com/products/status-of-the-power-electronics-industry-2019/
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Mainly supported today by flip-chip wafer bumping, 3D WLP, and WLCSP; the long term growth of the equipment and materials business will be supported by the expansion of 3D TSV stack platforms.
TSV integration is creating growth and significant interest in the equipment & materials industry
Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TSV interconnects, an area offering opportunities for new developments in equipment modification—equipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TSV Stacks since the memory manufacturers, such as Samsung, SK Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year....
More information on that report at: http://www.i-micronews.com/advanced-packaging-report/product/equipment-materials-for-3dic-wafer-level-packaging-applications.html#description
Emerging Non-Volatile Memory 2020 report by Yole DéveloppementYole Developpement
The stand-alone emerging NVM market keeps soaring, led by storage-class memory applications. Meanwhile, foundries are propelling the embedded business.
More info on: https://www.i-micronews.com/products/emerging-non-volatile-memory-2020/
Emerging Printing Technologies 2019 report by Yole Développement Yole Developpement
Emerging printing technologies are filling the gap for rising applications.
More information on https://www.i-micronews.com/products/emerging-printing-technologies-2019/
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
5G’s Impact on RF Front-End Module and Connectivity for Cell phones 2019 by Y...Yole Developpement
The battle for 5G still rages: integration in-module or with discrete parts?
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2019/
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
The 2010 State of supply chain performance study in Semiconductor industry was conducted with 52 companies with annual turnover exceeding USD 400 million.
The study was conducted from September to November 2010 by iCognitive consultants.
The Study used the same standard online questionnaire in all countries.
In addition, telephone interviews were carried out for verification of online results and additional qualitative data.
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
The worldwide semiconductor industry: Trends and opportunities 2016 The Broker Forum
The worldwide semiconductor industry: Trends and opportunities 2016
Today, the rapid pace of innovation and ever-expending use of technologically advanced devices including smartphones, tablets, flat-screen monitors, smart connected cars and medical devices is multiplying the number of semiconductor components being used around us every day. Digitization, connectivity and the internet of things (IOT) now promise solid growth for the global semiconductor market.
Discover how you can develop your business by looking at this market infographic from The Broker Forum.
The GaN RF market enjoyed a healthy increase in 2015.
2015 was a significant year for the GaN RF industry, with a dramatic increase in wireless infrastructure market sales driven by the massive adoption of LTE networks in China. By year’s end, the total RF GaN market was close to $300M.
Sales will likely not soar as high over the next two years, but growth will continue, mainly driven by increased adoption of GaN technology in the wireless infrastructure and defense markets. A significant boost will occur around 2019 – 2020, led by the implementation of 5G networks. Market size will be multiplied by 2.5 by the end of 2022, posting a CAGR of 14%...
More information on that report at http://www.i-micronews.com/reports.html
Compound Semiconductors,RF, Power Electronics
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 µm or even 50 µm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
Status of the Power Electronics Industry 2019 by Yole DéveloppementYole Developpement
Long term growth of the power electronics market is driving 300mm wafer-based production.
More information on: https://www.i-micronews.com/products/status-of-the-power-electronics-industry-2019/
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Mainly supported today by flip-chip wafer bumping, 3D WLP, and WLCSP; the long term growth of the equipment and materials business will be supported by the expansion of 3D TSV stack platforms.
TSV integration is creating growth and significant interest in the equipment & materials industry
Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TSV interconnects, an area offering opportunities for new developments in equipment modification—equipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TSV Stacks since the memory manufacturers, such as Samsung, SK Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year....
More information on that report at: http://www.i-micronews.com/advanced-packaging-report/product/equipment-materials-for-3dic-wafer-level-packaging-applications.html#description
Emerging Non-Volatile Memory 2020 report by Yole DéveloppementYole Developpement
The stand-alone emerging NVM market keeps soaring, led by storage-class memory applications. Meanwhile, foundries are propelling the embedded business.
More info on: https://www.i-micronews.com/products/emerging-non-volatile-memory-2020/
Emerging Printing Technologies 2019 report by Yole Développement Yole Developpement
Emerging printing technologies are filling the gap for rising applications.
More information on https://www.i-micronews.com/products/emerging-printing-technologies-2019/
Market & Technology Trends in Materials and Equipement for Printed and Flexib...Yole Developpement
Combined flexible & printed electronic applications could reach US$1B in 2020. Multiple applications are driving growth!
TECHNICAL CHALLENGES ARE CLOSE TO BEING OVERCOME TO REACH US$1B MARKET BY 2020
Today flexible & printed electronics create a lot of hope. And a supply chain is being created to support an industrial infrastructure. In our report, we have identified and tracked the five main functionalities of flexible & printed electronics: displaying, sensing, lighting, energy generating and substrates. The different degrees of freedom in flexibility that can be obtained can be divided into:
- Conformable substrate: the flexible substrate will be shaped in a definitive way after processing
- “Bendable” substrate: they can be rolled and bent many times (even if we consider it will not be a key feature coming from customer needs)
- “Unused” flexibility: in the end, the flexibility is not an added value to the customer
We believe some applications will be more likely than other to be successful – for example, bendable applications will undergo tough stress during use and technological challenges will be hard to overcome. Our report shows the distinction between the functions (displaying, lighting, energy conversion, sensing & substrates) and the seek flexibility “degree of freedom”. We do not make the distinction in our report between organic and inorganic substrates as semiconductors can also be used as flexible substrates.
However, we believe over the next several years, the number of applications using printing processes for flexible electronics will grow (Figure on page 2).
We estimate the printed & flexible electronics market will grow from ~ $176M in 2013 to ~$950M in 2020 with a 27% CAGR in market value. Printed OLED displays for large size (TVs) are likely to become the largest market. For OLED lighting, we believe it will grow but remain a niche market for automotive and/ or office lighting. For PV, the market demand by 2020 will remain very low compared to the demand for rigid PV, largely below 1% of the global market demand by 2020. Sensor, smart system & polytronic applications will include sensors, touchless / touch screens, RF ID applications.
A WIDE, EXCITING RANGE OF NEW APPLICATIONS
Printed & flexible electronics is a new exiting technology with large potential market expectations. Indeed, as semiconductors move to the very small with 22nm critical dimension, printed electronics moves to the other end of the spectrum with its own material, equipment, process challenges and supply chain. Printed electronics will not kill semiconductor electronics as it will not be a replacement for CMOS silicon.
More info at http://www.i-micronews.com/reports/Flexible-Based-Printed-Electronics-Technologies/6/367/
Trends in Automotive Packaging 2018 by Yole DéveloppementYole Developpement
OSATs are gaining benefits from advanced packaging in automotive.
More information on that report at : https://www.i-micronews.com/report/product/trends-in-automotive-packaging-2018.html
Global Tech M&A Annual Report - January 2013 Corum Group
Corum Group experts and a luminary panel of tech experts will share their their annual predictions for software, IT and related tech. What are the trends in SaaS, Mobile, Social, Big Data, Gaming and Verticals that will affect you? With complete valuation metrics and predictions for all 26 market sectors.
Who were the top buyers in 2012? Who will be in 2013? More importantly, what will they buy and why? How can you get your firm on their radar? Meanwhile, what are the 10 Deadly Sins of Tech M&A Advisors that you should watch out for?
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Diagnos is a publicly traded Canadian corporation with a mission of early detection of critical health issues through the use of its artificial intelligence tool, CARA (computer-assisted retina analysis). CARA is accessible securely over the Internet, is compatible with all recognized image formats and brands of fundus cameras, and is EMR (electronic medical record) compatible. CARA is a cost-effective tool for screening large numbers of patients in real time and has been cleared for commercialization by several regulatory authorities such as Health Canada, the U.S. Food and Drug Administration, and the European Union.
Artificial Intelligence Computing for Consumer 2019 report by Yole Développem...Yole Developpement
While AI is a feature expected in smartphones, this fantastic technology has spread like wildfire to the smart home ecosystem and is profoundly impacting the semiconductor industry.
More information on https://www.i-micronews.com/products/artificial-intelligence-computing-for-consumer-2019/
Consumer Biometrics: Market and Technologies Trends 2018 Yole DéveloppementYole Developpement
Over the last five years the promising, highly dynamic consumer biometric sensor market has been totally reshaped.
More information here: https://www.i-micronews.com/report/product/consumer-biometrics-market-and-technologies-trends-2018.html
New Post-Master Specialized Program :
Model Driven Engineering Diploma offered by the School of Engineering École des Mines de Nantes, France.
A presentation of the Program and the environment of study.
Emerging Non-Volatile Memory 2018 - Market and Technology Report by Yole Déve...Yole Developpement
After more than 15 years in development, PCM has finally taken off in stand-alone applications.
STT-MRAM will lead the embedded memory race.
More details here: https://www.i-micronews.com/report/product/emerging-non-volatile-memory-2018.html
How will AI impact the semiconductor market through consumer applications?
More information on that report at : https://www.i-micronews.com/report/product/hardware-and-software-for-ai-2018-consumer-focus.html
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...Yole Developpement
Exponential data growth in data centers will propel silicon photonics to take off into other applications, like lidar.
Big data is getting bigger by the second. Transporting this level of data around with existing technologies will soon reach power consumption, density and weight limits. Photons will continue to replace electrons throughout networks, including in the data center, in the rack and very soon on the board.
Silicon photonics is an exciting technology mixing optics, CMOS technology and advanced packaging. It combines silicon technology’s low cost, higher integration and interconnect density and higher number of embedded functionalities with lower power consumption and better reliability compared to legacy optics.
Massive R&D investments have been made in silicon photonics, but today there are still few products on the market. However, this technology has been strongly pushed by large Webcom companies such as Microsoft, Amazon and Facebook, with investments that will overtake the traditional service providers’ investments in a few years. These Webcom players are targeting $1/Gb prices and are principals for the development of cost-effective photonics technology for future generations of data centers.
Tech M&A Monthly: Ten Steps to Successfully Sell Now - May 2013Corum Group
Record cash, strong public markets and disruptive technology are all helping make this the best time to sell a software or related tech firm since 1999. But how do you take advantage? In this special webcast, Corum CEO Bruce Milne will present "10 Steps To Successfully Sell Now" drawing on his three decades of experience selling technology companies to help you translate your hard work and technical genius into real personal wealth, at one of the most opportune times in recent history.
Similar to Status of the Memory Industry 2020 (20)
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
The one million robotic vehicle milestone will be reached by end of the decade: The industrial phase has been launched.
More information on: https://www.i-micronews.com/products/sensors-for-robotic-mobility-2020/
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...Yole Developpement
High-end inertial sensors are the backbone of systems that will enable autonomous transportation and the new space industry.
More information on: https://www.i-micronews.com/products/high-end-inertial-sensors-for-defense-aerospace-and-industrial-applications-2020/
(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...Yole Developpement
High-Performance Computing and cloud gaming are setting the bar for leadership in the high-end CPU and GPU markets.
More info on: https://www.i-micronews.com/products/xpu-high-end-cpu-and-gpu-for-datacenter-applications-2020/
Nano-Imprint Technology Trends for Semiconductor Applications 2019 Report by...Yole Developpement
Nano-Imprint Lithography is revived by photonics and biochips as well as front-end memory applications.
More information on: https://www.i-micronews.com/products/nano-imprint-technology-trends-for-semiconductor-applications-2019/
Status of the Power Module Packaging Industry 2019 - Yole DéveloppementYole Developpement
Major evolutions in substrate, interconnection, and die-attach technologies, driven by EV/HEV, are transforming the power module packaging supply chain.
More information on: https://www.i-micronews.com/products/status-of-the-power-module-packaging-industry-2019/
Transcript: Selling digital books in 2024: Insights from industry leaders - T...BookNet Canada
The publishing industry has been selling digital audiobooks and ebooks for over a decade and has found its groove. What’s changed? What has stayed the same? Where do we go from here? Join a group of leading sales peers from across the industry for a conversation about the lessons learned since the popularization of digital books, best practices, digital book supply chain management, and more.
Link to video recording: https://bnctechforum.ca/sessions/selling-digital-books-in-2024-insights-from-industry-leaders/
Presented by BookNet Canada on May 28, 2024, with support from the Department of Canadian Heritage.
Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...Jeffrey Haguewood
Sidekick Solutions uses Bonterra Impact Management (fka Social Solutions Apricot) and automation solutions to integrate data for business workflows.
We believe integration and automation are essential to user experience and the promise of efficient work through technology. Automation is the critical ingredient to realizing that full vision. We develop integration products and services for Bonterra Case Management software to support the deployment of automations for a variety of use cases.
This video focuses on the notifications, alerts, and approval requests using Slack for Bonterra Impact Management. The solutions covered in this webinar can also be deployed for Microsoft Teams.
Interested in deploying notification automations for Bonterra Impact Management? Contact us at sales@sidekicksolutionsllc.com to discuss next steps.
UiPath Test Automation using UiPath Test Suite series, part 3DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 3. In this session, we will cover desktop automation along with UI automation.
Topics covered:
UI automation Introduction,
UI automation Sample
Desktop automation flow
Pradeep Chinnala, Senior Consultant Automation Developer @WonderBotz and UiPath MVP
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
State of ICS and IoT Cyber Threat Landscape Report 2024 previewPrayukth K V
The IoT and OT threat landscape report has been prepared by the Threat Research Team at Sectrio using data from Sectrio, cyber threat intelligence farming facilities spread across over 85 cities around the world. In addition, Sectrio also runs AI-based advanced threat and payload engagement facilities that serve as sinks to attract and engage sophisticated threat actors, and newer malware including new variants and latent threats that are at an earlier stage of development.
The latest edition of the OT/ICS and IoT security Threat Landscape Report 2024 also covers:
State of global ICS asset and network exposure
Sectoral targets and attacks as well as the cost of ransom
Global APT activity, AI usage, actor and tactic profiles, and implications
Rise in volumes of AI-powered cyberattacks
Major cyber events in 2024
Malware and malicious payload trends
Cyberattack types and targets
Vulnerability exploit attempts on CVEs
Attacks on counties – USA
Expansion of bot farms – how, where, and why
In-depth analysis of the cyber threat landscape across North America, South America, Europe, APAC, and the Middle East
Why are attacks on smart factories rising?
Cyber risk predictions
Axis of attacks – Europe
Systemic attacks in the Middle East
Download the full report from here:
https://sectrio.com/resources/ot-threat-landscape-reports/sectrio-releases-ot-ics-and-iot-security-threat-landscape-report-2024/
Essentials of Automations: Optimizing FME Workflows with ParametersSafe Software
Are you looking to streamline your workflows and boost your projects’ efficiency? Do you find yourself searching for ways to add flexibility and control over your FME workflows? If so, you’re in the right place.
Join us for an insightful dive into the world of FME parameters, a critical element in optimizing workflow efficiency. This webinar marks the beginning of our three-part “Essentials of Automation” series. This first webinar is designed to equip you with the knowledge and skills to utilize parameters effectively: enhancing the flexibility, maintainability, and user control of your FME projects.
Here’s what you’ll gain:
- Essentials of FME Parameters: Understand the pivotal role of parameters, including Reader/Writer, Transformer, User, and FME Flow categories. Discover how they are the key to unlocking automation and optimization within your workflows.
- Practical Applications in FME Form: Delve into key user parameter types including choice, connections, and file URLs. Allow users to control how a workflow runs, making your workflows more reusable. Learn to import values and deliver the best user experience for your workflows while enhancing accuracy.
- Optimization Strategies in FME Flow: Explore the creation and strategic deployment of parameters in FME Flow, including the use of deployment and geometry parameters, to maximize workflow efficiency.
- Pro Tips for Success: Gain insights on parameterizing connections and leveraging new features like Conditional Visibility for clarity and simplicity.
We’ll wrap up with a glimpse into future webinars, followed by a Q&A session to address your specific questions surrounding this topic.
Don’t miss this opportunity to elevate your FME expertise and drive your projects to new heights of efficiency.
Securing your Kubernetes cluster_ a step-by-step guide to success !KatiaHIMEUR1
Today, after several years of existence, an extremely active community and an ultra-dynamic ecosystem, Kubernetes has established itself as the de facto standard in container orchestration. Thanks to a wide range of managed services, it has never been so easy to set up a ready-to-use Kubernetes cluster.
However, this ease of use means that the subject of security in Kubernetes is often left for later, or even neglected. This exposes companies to significant risks.
In this talk, I'll show you step-by-step how to secure your Kubernetes cluster for greater peace of mind and reliability.
UiPath Test Automation using UiPath Test Suite series, part 4DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 4. In this session, we will cover Test Manager overview along with SAP heatmap.
The UiPath Test Manager overview with SAP heatmap webinar offers a concise yet comprehensive exploration of the role of a Test Manager within SAP environments, coupled with the utilization of heatmaps for effective testing strategies.
Participants will gain insights into the responsibilities, challenges, and best practices associated with test management in SAP projects. Additionally, the webinar delves into the significance of heatmaps as a visual aid for identifying testing priorities, areas of risk, and resource allocation within SAP landscapes. Through this session, attendees can expect to enhance their understanding of test management principles while learning practical approaches to optimize testing processes in SAP environments using heatmap visualization techniques
What will you get from this session?
1. Insights into SAP testing best practices
2. Heatmap utilization for testing
3. Optimization of testing processes
4. Demo
Topics covered:
Execution from the test manager
Orchestrator execution result
Defect reporting
SAP heatmap example with demo
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...UiPathCommunity
💥 Speed, accuracy, and scaling – discover the superpowers of GenAI in action with UiPath Document Understanding and Communications Mining™:
See how to accelerate model training and optimize model performance with active learning
Learn about the latest enhancements to out-of-the-box document processing – with little to no training required
Get an exclusive demo of the new family of UiPath LLMs – GenAI models specialized for processing different types of documents and messages
This is a hands-on session specifically designed for automation developers and AI enthusiasts seeking to enhance their knowledge in leveraging the latest intelligent document processing capabilities offered by UiPath.
Speakers:
👨🏫 Andras Palfi, Senior Product Manager, UiPath
👩🏫 Lenka Dulovicova, Product Program Manager, UiPath
DevOps and Testing slides at DASA ConnectKari Kakkonen
My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
LF Energy Webinar: Electrical Grid Modelling and Simulation Through PowSyBl -...DanBrown980551
Do you want to learn how to model and simulate an electrical network from scratch in under an hour?
Then welcome to this PowSyBl workshop, hosted by Rte, the French Transmission System Operator (TSO)!
During the webinar, you will discover the PowSyBl ecosystem as well as handle and study an electrical network through an interactive Python notebook.
PowSyBl is an open source project hosted by LF Energy, which offers a comprehensive set of features for electrical grid modelling and simulation. Among other advanced features, PowSyBl provides:
- A fully editable and extendable library for grid component modelling;
- Visualization tools to display your network;
- Grid simulation tools, such as power flows, security analyses (with or without remedial actions) and sensitivity analyses;
The framework is mostly written in Java, with a Python binding so that Python developers can access PowSyBl functionalities as well.
What you will learn during the webinar:
- For beginners: discover PowSyBl's functionalities through a quick general presentation and the notebook, without needing any expert coding skills;
- For advanced developers: master the skills to efficiently apply PowSyBl functionalities to your real-world scenarios.
GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using Deplo...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...Ramesh Iyer
In today's fast-changing business world, Companies that adapt and embrace new ideas often need help to keep up with the competition. However, fostering a culture of innovation takes much work. It takes vision, leadership and willingness to take risks in the right proportion. Sachin Dev Duggal, co-founder of Builder.ai, has perfected the art of this balance, creating a company culture where creativity and growth are nurtured at each stage.
Key Trends Shaping the Future of Infrastructure.pdfCheryl Hung
Keynote at DIGIT West Expo, Glasgow on 29 May 2024.
Cheryl Hung, ochery.com
Sr Director, Infrastructure Ecosystem, Arm.
The key trends across hardware, cloud and open-source; exploring how these areas are likely to mature and develop over the short and long-term, and then considering how organisations can position themselves to adapt and thrive.
Connector Corner: Automate dynamic content and events by pushing a buttonDianaGray10
Here is something new! In our next Connector Corner webinar, we will demonstrate how you can use a single workflow to:
Create a campaign using Mailchimp with merge tags/fields
Send an interactive Slack channel message (using buttons)
Have the message received by managers and peers along with a test email for review
But there’s more:
In a second workflow supporting the same use case, you’ll see:
Your campaign sent to target colleagues for approval
If the “Approve” button is clicked, a Jira/Zendesk ticket is created for the marketing design team
But—if the “Reject” button is pushed, colleagues will be alerted via Slack message
Join us to learn more about this new, human-in-the-loop capability, brought to you by Integration Service connectors.
And...
Speakers:
Akshay Agnihotri, Product Manager
Charlie Greenberg, Host
GraphRAG is All You need? LLM & Knowledge GraphGuy Korland
Guy Korland, CEO and Co-founder of FalkorDB, will review two articles on the integration of language models with knowledge graphs.
1. Unifying Large Language Models and Knowledge Graphs: A Roadmap.
https://arxiv.org/abs/2306.08302
2. Microsoft Research's GraphRAG paper and a review paper on various uses of knowledge graphs:
https://www.microsoft.com/en-us/research/blog/graphrag-unlocking-llm-discovery-on-narrative-private-data/