Thermal Expert Infrared Camera for Smartphones and I3system I3BOL384_17A Microbolometer 2016 teardown reverse costing report published by Yole Developpement
The highest resolution thermal camera for smartphones at 384 x 288 pixels, using a microbolometer with 17µm pixels from the South Korea’s I3 System.
Based on a high definition microbolometer from I3system, the Thermal Expert infrared camera is a high-end product for smartphones. A more conservative technological choice, the microbolometer is more expensive but offers better performance. The camera also embraces the quality approach with interchangeable lenses for different uses. I3system targets the professional market and competes more in standard IR cameras than IR cameras for smartphones.
The Thermal Expert camera is very compact and compatible with Android smartphones via its micro-USB-OTG connector. The camera does not use a battery, with power being supplied by the smartphone. The camera is shutterless.
The thermal camera uses a new 17µm pixel design from I3system. The I3BOL384_17A microbolometer features 384 x 288 pixel resolution, 24 times the resolution of the FLIR Lepton. The sensor technology in the I3system component is a titanium oxide microbolometer, technology which is not covered by Honeywell patents. The I3BOL384_17A is the consumer version of a military microbolometer.
This report presents a complete teardown analysis of the Thermal Expert camera and its microbolometer. Based on this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The report’s final component is a comparison between the characteristics of the FLIR One, Seek Thermal, Therm-App and Thermal Expert cameras and Lepton, EXC001, PICO384P and I3BOL384_17A microbolometers. The comparison highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...Yole Developpement
An infrared camera with a powerful vision processor in a small package, using a new 12μm microbolometer.
Based on a high definition ISC1406L micro-bolometer, the FLIR Boson thermal camera aims at a wide range of markets: military, drones, automotive, security and firefighting. Thanks to sound technological and economic choices, the microbolometer offers very good performance in definition and frame rate at low cost. The camera core’s economical approach involves new lens technology and sophisticated vision processing from Intel/Movidius to power its infrared vision.
The FLIR Boson camera core occupies only 4.9cm3 without its lens, including a 320x256 pixel microbolometer and an advanced processor. The system is made very compact and easy for integrators to handle. It includes a new chalcogenide glass for the lens and a powerful Vision Processing Unit for the first time.
More information on that report at http://www.i-micronews.com/reports.html
FLIR One 2nd Generation & FLIR LEPTON 3 IR Camera Core_2016 Report by Yole De...Yole Developpement
Second Generation FLIR ONE for Smartphones Featuring a Completely New LEPTON Core with 160x120 Pixels Resolution and 12µm Pixel Size
After the world’s first consumer thermal camera (FLIR One) in 2014, FLIR just released the second generation of the FLIR One featuring a completely new design and an upgraded Lepton core. The major achievement for FLIR has been to propose, in the same module size, a 4x improved resolution and a better FOV without consuming more power and at a lower cost!
Based on a complete teardown analysis of the new FLIR One for Android and iOS, the report provides a complete physical analysis and manufacturing cost estimation of the infrared camera and the Lepton infrared module as well as the technical choices made for this new generation.
The new Lepton 3 LWIR camera core shares almost the same dimensions than the previous Lepton core but offers a four times improved resolution of 160x120 pixels (versus 80x60 pixel for the Lepton 2). Despite this improvement, it consumes slightly the same power with 160mW versus 150mW. This achievement has been made possible by the reduction of the pixel size, from 17µm to 12µm in the Lepton 3. This new pixel size has been accompanied by new processes for the ROIC, the microbolometer and the wafer-level window with new technology node, new pixel integration with the ROIC and a simplified window which no longer needs an SOI wafer…
On the optical module side, strong efforts have been made to improve lenses resulting in a wider field of view (FOV). The lenses are still wafer-level silicon optics but area has been enhanced thanks to hexagonal shapes compared to square shapes previously.
To finish, a unique comparison between FLIR One 1st and 2nd Generation, Seek Thermal/Raytheon and Opgal Therm-App/Ulis cameras highlights the differences in technical choices and related cost made by each company.
New applications drive greater shipment volumes, which drive new applications, bringing the uncooled IR sensing market into a virtuous cycle.
More information on : https://www.i-micronews.com/report/product/uncooled-infrared-imagers-and-detectors-2019.html
Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony teardow...Yole Developpement
Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony
All in one CMOS Image Sensor: 2 levels Copper TSVs / Stacked ISP circuit with pixel array circuit / Smaller device with better sensitivity
For the iPhone 5S iSight camera module, Apple continues to integrate a 8Mpixel resolution CMOS Image Sensor. They achieve to obtain 33% increase in light sensitivity by improving the camera aperture from f/2.4 to f/2.2 and by rising the pixel size from 1.4µm to 1.5µm.
The unique technology from Sony (Exmor-RS) allows to raise the pixel array size by 15% and thus to considerably improve the light sensitivity by keeping a similar cost compared to the pervious CIS. The technology consists in a stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit processed with a 65nm technology node. The two circuits are stacked with a wafer bonding process and connected together with copper TSVs.
The camera module, with dimensions of 8.5 x 7.8 x 5.7mm, is equipped with a 5-elements lens module and a VCM auto-focus actuator. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process.
COMPLETE TEARDOWN WITH:
- Detailed Photos
- Precise Measurements
- Material Analysis
- Manufacturing Process Flow
- Supply Chain Evaluation
- Manufacturing Cost Analysis
- Selling Price Estimation
- Comparison with previous technology choices from Sony
More information on that report at http://www.i-micronews.com/reports/Apple-iPhone-5S-Camera-Module-8Mpixel-1-5%C2%B5m-Stacked-BSI-CIS/19/434/
Apple iPhone X: MEMS Microphones from Goertek, Knowles, and AAC Technologies ...system_plus
Analysis and comparison of the design and process evolution used by Apple’s three MEMS microphone suppliers.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/apple-iphone-x-mems-microphones-from-goertek-knowles-and-aac-technologies/
Beyond all of the hype and tumult, market drivers and technological developments are converging to ensure a bright future for Si photonics.
THOUGH THE SI PHOTONICS MARKET HAS JUST KICKED OFF, VOLUME PRODUCTION IS ALREADY CLOSE
Big data is getting bigger by the second, and transporting it with existing technologies will push the limits of power consumption, density and weight. Yole Développement analysts are convinced that photons will replace electrons, and that Si photonics will be the mid-term platform to assist this transition.
Si photonics offers the advantages of silicon technology: low cost, higher integration, more embedded functionalities and higher interconnect density. It also provides two other key advantages:
1. Low power consumption: particularly when compared to copper-based solutions, which are expensive and require high electrical consumption.
2. Reliability: especially important for data centers, where a typical rack server’s lifespan is two years before replacement.
Back in 2006, VOA were the market’s first Si photonics products. Today, there are still a few Si photonics products on the market (i.e. VOA, AOC and transceivers from Luxtera, Kotura/Mellanox and Cisco/Lightwire) but big companies (i.e. Intel, HP and IBM) are close to realizing silicon photonics products. Yole Développement also sees big OEMs such as Facebook, Google and Amazon developing their own optical data center technology in partnership with chip firms (such as Facebook with Intel).
In this report Yole Développement shows that, in the short-term, silicon photonics will be the platform solution for future high-power, high-bandwidth data centers. Silicon photonics chips will be deployed in high-speed signal transmission systems, which greatly exceed copper cabling’s capabilities, i.e. for data centers and high-performance computing (HPC). As silicon photonics evolves and chips become more sophisticated, we expect the technology to be used more often in processing tasks such as interconnecting multiple cores within processor chips to boost access to shared cache and busses.
Analysts also analyzed silicon photonics’ chances of being used for telecom, consumer, medical and biosensors applications, compared with competing technologies.
More information on that report at http://www.i-micronews.com/reports/Silicon-Photonics-2014-report/1/445/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...Yole Developpement
An infrared camera with a powerful vision processor in a small package, using a new 12μm microbolometer.
Based on a high definition ISC1406L micro-bolometer, the FLIR Boson thermal camera aims at a wide range of markets: military, drones, automotive, security and firefighting. Thanks to sound technological and economic choices, the microbolometer offers very good performance in definition and frame rate at low cost. The camera core’s economical approach involves new lens technology and sophisticated vision processing from Intel/Movidius to power its infrared vision.
The FLIR Boson camera core occupies only 4.9cm3 without its lens, including a 320x256 pixel microbolometer and an advanced processor. The system is made very compact and easy for integrators to handle. It includes a new chalcogenide glass for the lens and a powerful Vision Processing Unit for the first time.
More information on that report at http://www.i-micronews.com/reports.html
FLIR One 2nd Generation & FLIR LEPTON 3 IR Camera Core_2016 Report by Yole De...Yole Developpement
Second Generation FLIR ONE for Smartphones Featuring a Completely New LEPTON Core with 160x120 Pixels Resolution and 12µm Pixel Size
After the world’s first consumer thermal camera (FLIR One) in 2014, FLIR just released the second generation of the FLIR One featuring a completely new design and an upgraded Lepton core. The major achievement for FLIR has been to propose, in the same module size, a 4x improved resolution and a better FOV without consuming more power and at a lower cost!
Based on a complete teardown analysis of the new FLIR One for Android and iOS, the report provides a complete physical analysis and manufacturing cost estimation of the infrared camera and the Lepton infrared module as well as the technical choices made for this new generation.
The new Lepton 3 LWIR camera core shares almost the same dimensions than the previous Lepton core but offers a four times improved resolution of 160x120 pixels (versus 80x60 pixel for the Lepton 2). Despite this improvement, it consumes slightly the same power with 160mW versus 150mW. This achievement has been made possible by the reduction of the pixel size, from 17µm to 12µm in the Lepton 3. This new pixel size has been accompanied by new processes for the ROIC, the microbolometer and the wafer-level window with new technology node, new pixel integration with the ROIC and a simplified window which no longer needs an SOI wafer…
On the optical module side, strong efforts have been made to improve lenses resulting in a wider field of view (FOV). The lenses are still wafer-level silicon optics but area has been enhanced thanks to hexagonal shapes compared to square shapes previously.
To finish, a unique comparison between FLIR One 1st and 2nd Generation, Seek Thermal/Raytheon and Opgal Therm-App/Ulis cameras highlights the differences in technical choices and related cost made by each company.
New applications drive greater shipment volumes, which drive new applications, bringing the uncooled IR sensing market into a virtuous cycle.
More information on : https://www.i-micronews.com/report/product/uncooled-infrared-imagers-and-detectors-2019.html
Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony teardow...Yole Developpement
Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony
All in one CMOS Image Sensor: 2 levels Copper TSVs / Stacked ISP circuit with pixel array circuit / Smaller device with better sensitivity
For the iPhone 5S iSight camera module, Apple continues to integrate a 8Mpixel resolution CMOS Image Sensor. They achieve to obtain 33% increase in light sensitivity by improving the camera aperture from f/2.4 to f/2.2 and by rising the pixel size from 1.4µm to 1.5µm.
The unique technology from Sony (Exmor-RS) allows to raise the pixel array size by 15% and thus to considerably improve the light sensitivity by keeping a similar cost compared to the pervious CIS. The technology consists in a stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit processed with a 65nm technology node. The two circuits are stacked with a wafer bonding process and connected together with copper TSVs.
The camera module, with dimensions of 8.5 x 7.8 x 5.7mm, is equipped with a 5-elements lens module and a VCM auto-focus actuator. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process.
COMPLETE TEARDOWN WITH:
- Detailed Photos
- Precise Measurements
- Material Analysis
- Manufacturing Process Flow
- Supply Chain Evaluation
- Manufacturing Cost Analysis
- Selling Price Estimation
- Comparison with previous technology choices from Sony
More information on that report at http://www.i-micronews.com/reports/Apple-iPhone-5S-Camera-Module-8Mpixel-1-5%C2%B5m-Stacked-BSI-CIS/19/434/
Apple iPhone X: MEMS Microphones from Goertek, Knowles, and AAC Technologies ...system_plus
Analysis and comparison of the design and process evolution used by Apple’s three MEMS microphone suppliers.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/apple-iphone-x-mems-microphones-from-goertek-knowles-and-aac-technologies/
Beyond all of the hype and tumult, market drivers and technological developments are converging to ensure a bright future for Si photonics.
THOUGH THE SI PHOTONICS MARKET HAS JUST KICKED OFF, VOLUME PRODUCTION IS ALREADY CLOSE
Big data is getting bigger by the second, and transporting it with existing technologies will push the limits of power consumption, density and weight. Yole Développement analysts are convinced that photons will replace electrons, and that Si photonics will be the mid-term platform to assist this transition.
Si photonics offers the advantages of silicon technology: low cost, higher integration, more embedded functionalities and higher interconnect density. It also provides two other key advantages:
1. Low power consumption: particularly when compared to copper-based solutions, which are expensive and require high electrical consumption.
2. Reliability: especially important for data centers, where a typical rack server’s lifespan is two years before replacement.
Back in 2006, VOA were the market’s first Si photonics products. Today, there are still a few Si photonics products on the market (i.e. VOA, AOC and transceivers from Luxtera, Kotura/Mellanox and Cisco/Lightwire) but big companies (i.e. Intel, HP and IBM) are close to realizing silicon photonics products. Yole Développement also sees big OEMs such as Facebook, Google and Amazon developing their own optical data center technology in partnership with chip firms (such as Facebook with Intel).
In this report Yole Développement shows that, in the short-term, silicon photonics will be the platform solution for future high-power, high-bandwidth data centers. Silicon photonics chips will be deployed in high-speed signal transmission systems, which greatly exceed copper cabling’s capabilities, i.e. for data centers and high-performance computing (HPC). As silicon photonics evolves and chips become more sophisticated, we expect the technology to be used more often in processing tasks such as interconnecting multiple cores within processor chips to boost access to shared cache and busses.
Analysts also analyzed silicon photonics’ chances of being used for telecom, consumer, medical and biosensors applications, compared with competing technologies.
More information on that report at http://www.i-micronews.com/reports/Silicon-Photonics-2014-report/1/445/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
1. 제철소 제강 슬래그 검출
2. 제철소 래들 온도 모니터링 시스템
3. 제철소 제조 공정 모니터링 시스템
4. 전기로 내부 온도 모니터링 시스템
5. 각종 PCB 보드 불량 품질 검사
6. 자동차 조향 장치 부품 품질 관리 시스템
7. 자동차 실러 검사 시스템(선행 개발)
8. 한국도로공사 과열 차량 감지 시스템
9. 차량 탑재형 교면 상태 검사 시스템
10. 비파괴 검사 전자 제품 품질 검사
11. 비파괴 검사 배관 검사 시스템
12. 의료 분야 건성안검사 및 진단 솔루션
13. 식품 분야 가공 공정 감시 시스템(제조 공정 온도 모니터링)
14. 축산 분야(독일 뮌헨 인공 수정 센터)
15. 발열 감지 시스템 - 메르스 진단
16. 발열 감지 시스템 - 병원 및 공공기관
17. 발열 감지 시스템 - 인천 국제 공항
- 문의: 한컴MDS IST사업부 flir@hancommds.com
For the full video of this presentation, please visit:
https://www.embedded-vision.com/industry-analysis/video-interviews-demos/2d-and-3d-sensing-markets-applications-and-technologies-pre
For more information about embedded vision, please visit:
http://www.embedded-vision.com
Guillaume Girardin, Photonics, Sensing and Display Division Director at Yole Développement, delivers the presentation "2D and 3D Sensing: Markets, Applications, and Technologies" at the Embedded Vision Alliance's September 2019 Vision Industry and Technology Forum. Girardin details the optical depth sensor market and application trends.
FLIR Systems FLIR ONE & LEPTON Consumer Thermal Imager with Microbolometer te...Yole Developpement
Initially focused on the Military market, uncooled thermal camera sales have grown significantly due to the substantial cost reduction of microbolometers and growing adoption in commercial markets. With a vertically-integrated business model and a fabless structure, FLIR drive the commercial market’s price war.
Plugged into the back of an IPhone 5 or 5S, the FLIR ONE is the first consumer thermal camera featuring Long Wave Infrared (LWIR) technology. It contains a visible VGA (640x480) camera and a thermal camera which provide images blended using FLIR MSX Technology.
The thermal camera uses a new core, LEPTON, featuring a 80x60 pixels resolution with pixel size of 17µm. The sensor technology in the LEPTON core is an uncooled VOx microbolometer. Thanks to its strong integration at the core level with innovative wafer-level optics (WLO), wafer-level packaging (WLP) and custom ASIC use, this is the world's smallest microbolometer-based thermal imaging camera core.
Based on complete teardown analyses of the FLIR ONE and the LEPTON core, the reports provide the bill-of-material (BOM) and the manufacturing cost of the infrared camera as well as a complete physical analysis and manufacturing cost estimation of the infrared module.
The report also includes a comparison with FLIR i7 infrared camera and sensor, highlighting the technical choices made by FLIR to decrease by more than three the manufacturing cost at the camera level and the sensor level to made a consumer product.
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
All weather vision for automotive safety : which spectral band ?ULIS
The interministerial project AWARE a consortium of 10 renowned French industrials firms launched in 2014 for a duration of 36 months.This project aims to develop a driver-and pilot-assistance solution for improving decision-making in all types of vehicles (road or airborne). The solution offers reliable detection of vulnerable pedestrians or obstacles in all weathers conditions (fog, rain, at night).Thermal imagers developed by ULIS address to this need on the spectral range 8-14µm (LWIR) in contrast to other available technologies (visible, NIR, SWIR).
Discrete Power Device Packaging: Materials Market and Technology Trends 2019 ...Yole Developpement
Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.
More information on https://www.i-micronews.com/products/discrete-power-device-packaging-materials-market-and-technology-trends-2019/
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...Yole Developpement
Infrared camera and electronic control unit for advanced driver assistance systems based on FLIR night vision imaging technology
Based on a high definition ISC0901 microbolometer from FLIR, the Autoliv night vision infrared camera targets the high-end automotive market using two FLIR cores. Based on the solid first design from 2009, the microbolometer offers better performance in definition and frame rate. The camera also embraces the quality approach with a complex optical system and powers its night vision using sophisticated numerical processing based on an Altera field-programmable gate array (FPGA) and custom algorithm.
The Autoliv night vision camera consists of two modules, the camera and a remote processing unit. The system is made very compact and easy to integrate for car makers.
The ISC0901 thermal camera uses FLIR’s 17µm pixel design, optimized for automotive applications. Based on vanadium oxide technology, the ISC0901 microbolometer features a 336x256 resolution wafer level package, achieving an incredibly compact design.
The ISC0901 is the automotive version of a surveillance microbolometer. By using wafer level package technology to encapsulate the microbolometer FLIR offers the best price performance ratio.
This report is divided into two parts, one focused on the microbolometer and the second on the other systems. It is based on a complete teardown analysis of the night vision camera and the associated electronic control unit. Using this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The report’s final component is a comparison between the characteristics of the FLIR ISC0901, FLIR Lepton 3 and the PICO384P from ULIS. The comparison highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
Nokia Lumia 920 - Camera Module with OIS teardown Report by published Yole De...Yole Developpement
Nokia Lumia 920 Camera Module with OIS
The first smartphone's camera module integrating Optical Image Stabilization (OIS) realized with a dual-core 3-axis MEMS gyroscope and a floating lens technology
While Digital Still Cameras commonly use optical image stabilization, it was not included in smartphones. The Nokia Lumia 920 is the first smartphone featuring an OIS function.
To performs Optical Image Stabilization, the camera module includes a floating lens technology which consists in moving the 5-elements lens module in perfect synchronization with the camera movement.
More information on that report at http://www.i-micronews.com/reports/Nokia-Lumia-920-Camera-Module-OIS/19/370/
IR LEDS and VCSELs - Technology, Applications and Industry Trends - 2017 Repo...Yole Developpement
3D imaging, gas sensing and autofocus will fuel the IR light source market to reach US$3.8B in 2027.
INFRA-RED LIGHT SOURCES: A $1.5B OPPORTUNITY IN 2022 – AND POTENTIALLY $3.8B IN 2027 – DRIVEN BY SEVERAL NEW APPLICATIONS
The market for LED and laser infra-red (IR) light sources is not new, but has evolved rapidly with the recent development of Solid State Lighting (SSL). Initially developed for optical communication applications, these technologies, mostly IR LEDs, started to be integrated into consumer applications like remote controls in the 1980s. Next, the market was driven forward by night vision applications such as surveillance cameras. But it’s only recently, with the development of smartphones, that IR LEDs and lasers have come back to prominence. And now, the market is set for growth for the next 10 years! Today, these technologies are part of a new revolution, still driven by smartphone applications. Integration of breakthrough functionalities such as 3D imaging, autofocus, iris and face recognition is triggering a strong market pull for efficient, miniaturized and complex IR illumination. This trend will also create strong market opportunities for IR lasers, mostly VCSELs, which allow more coherent and directional light than IR LEDs. In this context, we expect the IR light source market to grow from around $450M in 2016 to around $1,550M in 2022 at a compound annual growth rate of 22.7%. In addition, there are also several other applications that are emerging and for which a market boom is likely to happen in the next 10 years. These include gas sensors, LIDARs, driver monitoring systems and remote patient monitoring sensors. We expect this second wave of new applications to propel the IR light source market to around $3,800M in 2027. This report provides an in-depth analysis of all IR light source applications, including: basic principles, technology, trends, key players, and market size. It highlights the global landscape for IR light sources, including classification of applications by wavelength, market segment and function. Detailed market forecasts are given based on these classifications and with complementary analysis by light source for LEDs, edge-emitting lasers and VCSELs. Please note that optical communication applications are not analyzed in this report.
For more information please visit our website: https://www.i-micronews.com/reports.html
Deep analysis of the 400Gb optical transceiver from a leading Chinese company.
More information: https://www.systemplus.fr/reverse-costing-reports/innolights-400g-qsfp-dd-optical-transceiver/
Tecnica delle costruzioni - UNIONI acciaio - Parte 1Franco Bontempi
Slide delle esercitazioni di tecnica delle costruzioni per il corso di Ingegneria Civile tenuto dal prof. Franco Bontempi alla Sapienza di Roma - Prima esercitazione sulle UNIONI
Status of the Power Electronics Industry 2018 report by Yole DéveloppementYole Developpement
EV/HEV, motor drives, computing and storage propel power electronics market growth, from devices to passives, packaging and integration.
More information on https://www.i-micronews.com/report/product/status-of-the-power-electronics-industry-2018.html
The ARS4-A is a 77 GHz radar sensor offering simultaneous long and short range detection
The Continental ARS4-A Radar is designed for forward collision warning, emergency brake assist, collision mitigation system or Adaptive Cruise Control (ACC). A special feature of the device is the simultaneous measurement of long distances, up to 250m with +/-0.2m accuracy, and short range, up to 70m, relative velocity and angle between two objects. It is thus able to detect stationary objects without any camera support.
The system integrates two electronic boards including an NXP Semiconductor microcontroller and Broadcom Ethernet transceiver. The radio-frequency (RF) board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate and is equipped with planar antennas.
The NXP Semiconductor multi-channel 77 GHz radar transceiver chipset, composed of four receivers, two transmitters and an associated voltage controlled oscillator (VCO), is used as high-frequency transmitter and receiver. The RF dies are packaged in redistributed chip package (RCP) fan-out wafer level packages initially developed and manufactured by Freescale.
Based on a complete teardown analysis of the Continental radar, the report provides the bill-of-material (BOM) and the manufacturing cost of the radar sensor.
A complete physical analysis and manufacturing cost estimation of the NXP semiconductor monolithic microwave integrated circuits (MMICs) is available in a separate report.
More information on that report at http://www.i-micronews.com/reports.html
STMicroelectronics’ Near Infrared Camera Sensor in the Apple iPhone X - 2017 ...system_plus
The first NIR camera sensor with multiple innovations based on imager-silicon-oninsulator substrate from SOITEC, supplied and produced by STMicroelectronics for the Apple True Depth Module.
COMPLETE TEARDOWN WITH:
• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Estimated sales price
More information on that report at http://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-near-infrared-camera-sensor-in-the-apple-iphone-x/
Esercitazione del corso di tecnica delle Costruzioni per Ingegneria Civile della Sapienza Università di Roma, docente Prof. Franco Bontempi, assistenti Ing. Stefania Arangio e Ing. Chiara Crosti.
Esercitazione 10 - Unioni
Opgal Therm-App Infrared Camera & Ulis IR Microbolometer teardown reverse cos...Yole Developpement
Opgal Therm-App Infrared Camera & Ulis IR Microbolometer
The highest resolution thermal camera for smartphone, 384 x 288 pixels using a microbolometer with 17µm pixel from Ulis.
Based on a high definition microbolometer from Ulis, the Therm-App infrared camera is a high-end product for smartphone. More conservative in their technological choices, the microbolometer is more expensive but better performance. The choice of the quality is also in the camera with the possibility of interchangeable lenses in function of the use. Opgal and Ulis target the professional market and are more in competition with standard IR cameras than with IR cameras for mobile.
The Therm-App camera has a very compact size and is compatible with Android smartphones via its micro-USB-OTG connector. The camera is shutterless and a interchangeable lenses system allow to upgrade the camera for the near or faraway application...
The first 3-Axis MEMS Gyroscope to meet Automotive AEC-Q100 qualification
MEMS are getting broadly adopted in the automotive industry and non-safety applications like in-dash navigation are now requiring low-cost and small footprint components.
The A3G4250D is a low power consumption MEMS gyroscope which is the first 3-axis gyroscope to have met the industry-standard qualification for automotive integrated circuits (AEC-Q100).
This 3-axis gyroscope for automotive applications measures angular rates up to ±245 dps. It has been designed and produced using the same manufacturing process (THELMA) than consumer products in order to get full benefit of STMicroelectronics 10 years of consumer electronic market.
Assembled in a 4.0 x 4.0 x 1.1mm package, it embeds an 8-bit temperature sensor and operates within an extended temperature range from -40 to 85°C.
It is suitable for applications including in-dash navigation, telematics and vehicle tolling systems, motion control with MMI (man-machine interface), appliances and robotics.
1. 제철소 제강 슬래그 검출
2. 제철소 래들 온도 모니터링 시스템
3. 제철소 제조 공정 모니터링 시스템
4. 전기로 내부 온도 모니터링 시스템
5. 각종 PCB 보드 불량 품질 검사
6. 자동차 조향 장치 부품 품질 관리 시스템
7. 자동차 실러 검사 시스템(선행 개발)
8. 한국도로공사 과열 차량 감지 시스템
9. 차량 탑재형 교면 상태 검사 시스템
10. 비파괴 검사 전자 제품 품질 검사
11. 비파괴 검사 배관 검사 시스템
12. 의료 분야 건성안검사 및 진단 솔루션
13. 식품 분야 가공 공정 감시 시스템(제조 공정 온도 모니터링)
14. 축산 분야(독일 뮌헨 인공 수정 센터)
15. 발열 감지 시스템 - 메르스 진단
16. 발열 감지 시스템 - 병원 및 공공기관
17. 발열 감지 시스템 - 인천 국제 공항
- 문의: 한컴MDS IST사업부 flir@hancommds.com
For the full video of this presentation, please visit:
https://www.embedded-vision.com/industry-analysis/video-interviews-demos/2d-and-3d-sensing-markets-applications-and-technologies-pre
For more information about embedded vision, please visit:
http://www.embedded-vision.com
Guillaume Girardin, Photonics, Sensing and Display Division Director at Yole Développement, delivers the presentation "2D and 3D Sensing: Markets, Applications, and Technologies" at the Embedded Vision Alliance's September 2019 Vision Industry and Technology Forum. Girardin details the optical depth sensor market and application trends.
FLIR Systems FLIR ONE & LEPTON Consumer Thermal Imager with Microbolometer te...Yole Developpement
Initially focused on the Military market, uncooled thermal camera sales have grown significantly due to the substantial cost reduction of microbolometers and growing adoption in commercial markets. With a vertically-integrated business model and a fabless structure, FLIR drive the commercial market’s price war.
Plugged into the back of an IPhone 5 or 5S, the FLIR ONE is the first consumer thermal camera featuring Long Wave Infrared (LWIR) technology. It contains a visible VGA (640x480) camera and a thermal camera which provide images blended using FLIR MSX Technology.
The thermal camera uses a new core, LEPTON, featuring a 80x60 pixels resolution with pixel size of 17µm. The sensor technology in the LEPTON core is an uncooled VOx microbolometer. Thanks to its strong integration at the core level with innovative wafer-level optics (WLO), wafer-level packaging (WLP) and custom ASIC use, this is the world's smallest microbolometer-based thermal imaging camera core.
Based on complete teardown analyses of the FLIR ONE and the LEPTON core, the reports provide the bill-of-material (BOM) and the manufacturing cost of the infrared camera as well as a complete physical analysis and manufacturing cost estimation of the infrared module.
The report also includes a comparison with FLIR i7 infrared camera and sensor, highlighting the technical choices made by FLIR to decrease by more than three the manufacturing cost at the camera level and the sensor level to made a consumer product.
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
All weather vision for automotive safety : which spectral band ?ULIS
The interministerial project AWARE a consortium of 10 renowned French industrials firms launched in 2014 for a duration of 36 months.This project aims to develop a driver-and pilot-assistance solution for improving decision-making in all types of vehicles (road or airborne). The solution offers reliable detection of vulnerable pedestrians or obstacles in all weathers conditions (fog, rain, at night).Thermal imagers developed by ULIS address to this need on the spectral range 8-14µm (LWIR) in contrast to other available technologies (visible, NIR, SWIR).
Discrete Power Device Packaging: Materials Market and Technology Trends 2019 ...Yole Developpement
Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.
More information on https://www.i-micronews.com/products/discrete-power-device-packaging-materials-market-and-technology-trends-2019/
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...Yole Developpement
Infrared camera and electronic control unit for advanced driver assistance systems based on FLIR night vision imaging technology
Based on a high definition ISC0901 microbolometer from FLIR, the Autoliv night vision infrared camera targets the high-end automotive market using two FLIR cores. Based on the solid first design from 2009, the microbolometer offers better performance in definition and frame rate. The camera also embraces the quality approach with a complex optical system and powers its night vision using sophisticated numerical processing based on an Altera field-programmable gate array (FPGA) and custom algorithm.
The Autoliv night vision camera consists of two modules, the camera and a remote processing unit. The system is made very compact and easy to integrate for car makers.
The ISC0901 thermal camera uses FLIR’s 17µm pixel design, optimized for automotive applications. Based on vanadium oxide technology, the ISC0901 microbolometer features a 336x256 resolution wafer level package, achieving an incredibly compact design.
The ISC0901 is the automotive version of a surveillance microbolometer. By using wafer level package technology to encapsulate the microbolometer FLIR offers the best price performance ratio.
This report is divided into two parts, one focused on the microbolometer and the second on the other systems. It is based on a complete teardown analysis of the night vision camera and the associated electronic control unit. Using this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The report’s final component is a comparison between the characteristics of the FLIR ISC0901, FLIR Lepton 3 and the PICO384P from ULIS. The comparison highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
Nokia Lumia 920 - Camera Module with OIS teardown Report by published Yole De...Yole Developpement
Nokia Lumia 920 Camera Module with OIS
The first smartphone's camera module integrating Optical Image Stabilization (OIS) realized with a dual-core 3-axis MEMS gyroscope and a floating lens technology
While Digital Still Cameras commonly use optical image stabilization, it was not included in smartphones. The Nokia Lumia 920 is the first smartphone featuring an OIS function.
To performs Optical Image Stabilization, the camera module includes a floating lens technology which consists in moving the 5-elements lens module in perfect synchronization with the camera movement.
More information on that report at http://www.i-micronews.com/reports/Nokia-Lumia-920-Camera-Module-OIS/19/370/
IR LEDS and VCSELs - Technology, Applications and Industry Trends - 2017 Repo...Yole Developpement
3D imaging, gas sensing and autofocus will fuel the IR light source market to reach US$3.8B in 2027.
INFRA-RED LIGHT SOURCES: A $1.5B OPPORTUNITY IN 2022 – AND POTENTIALLY $3.8B IN 2027 – DRIVEN BY SEVERAL NEW APPLICATIONS
The market for LED and laser infra-red (IR) light sources is not new, but has evolved rapidly with the recent development of Solid State Lighting (SSL). Initially developed for optical communication applications, these technologies, mostly IR LEDs, started to be integrated into consumer applications like remote controls in the 1980s. Next, the market was driven forward by night vision applications such as surveillance cameras. But it’s only recently, with the development of smartphones, that IR LEDs and lasers have come back to prominence. And now, the market is set for growth for the next 10 years! Today, these technologies are part of a new revolution, still driven by smartphone applications. Integration of breakthrough functionalities such as 3D imaging, autofocus, iris and face recognition is triggering a strong market pull for efficient, miniaturized and complex IR illumination. This trend will also create strong market opportunities for IR lasers, mostly VCSELs, which allow more coherent and directional light than IR LEDs. In this context, we expect the IR light source market to grow from around $450M in 2016 to around $1,550M in 2022 at a compound annual growth rate of 22.7%. In addition, there are also several other applications that are emerging and for which a market boom is likely to happen in the next 10 years. These include gas sensors, LIDARs, driver monitoring systems and remote patient monitoring sensors. We expect this second wave of new applications to propel the IR light source market to around $3,800M in 2027. This report provides an in-depth analysis of all IR light source applications, including: basic principles, technology, trends, key players, and market size. It highlights the global landscape for IR light sources, including classification of applications by wavelength, market segment and function. Detailed market forecasts are given based on these classifications and with complementary analysis by light source for LEDs, edge-emitting lasers and VCSELs. Please note that optical communication applications are not analyzed in this report.
For more information please visit our website: https://www.i-micronews.com/reports.html
Deep analysis of the 400Gb optical transceiver from a leading Chinese company.
More information: https://www.systemplus.fr/reverse-costing-reports/innolights-400g-qsfp-dd-optical-transceiver/
Tecnica delle costruzioni - UNIONI acciaio - Parte 1Franco Bontempi
Slide delle esercitazioni di tecnica delle costruzioni per il corso di Ingegneria Civile tenuto dal prof. Franco Bontempi alla Sapienza di Roma - Prima esercitazione sulle UNIONI
Status of the Power Electronics Industry 2018 report by Yole DéveloppementYole Developpement
EV/HEV, motor drives, computing and storage propel power electronics market growth, from devices to passives, packaging and integration.
More information on https://www.i-micronews.com/report/product/status-of-the-power-electronics-industry-2018.html
The ARS4-A is a 77 GHz radar sensor offering simultaneous long and short range detection
The Continental ARS4-A Radar is designed for forward collision warning, emergency brake assist, collision mitigation system or Adaptive Cruise Control (ACC). A special feature of the device is the simultaneous measurement of long distances, up to 250m with +/-0.2m accuracy, and short range, up to 70m, relative velocity and angle between two objects. It is thus able to detect stationary objects without any camera support.
The system integrates two electronic boards including an NXP Semiconductor microcontroller and Broadcom Ethernet transceiver. The radio-frequency (RF) board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate and is equipped with planar antennas.
The NXP Semiconductor multi-channel 77 GHz radar transceiver chipset, composed of four receivers, two transmitters and an associated voltage controlled oscillator (VCO), is used as high-frequency transmitter and receiver. The RF dies are packaged in redistributed chip package (RCP) fan-out wafer level packages initially developed and manufactured by Freescale.
Based on a complete teardown analysis of the Continental radar, the report provides the bill-of-material (BOM) and the manufacturing cost of the radar sensor.
A complete physical analysis and manufacturing cost estimation of the NXP semiconductor monolithic microwave integrated circuits (MMICs) is available in a separate report.
More information on that report at http://www.i-micronews.com/reports.html
STMicroelectronics’ Near Infrared Camera Sensor in the Apple iPhone X - 2017 ...system_plus
The first NIR camera sensor with multiple innovations based on imager-silicon-oninsulator substrate from SOITEC, supplied and produced by STMicroelectronics for the Apple True Depth Module.
COMPLETE TEARDOWN WITH:
• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Estimated sales price
More information on that report at http://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-near-infrared-camera-sensor-in-the-apple-iphone-x/
Esercitazione del corso di tecnica delle Costruzioni per Ingegneria Civile della Sapienza Università di Roma, docente Prof. Franco Bontempi, assistenti Ing. Stefania Arangio e Ing. Chiara Crosti.
Esercitazione 10 - Unioni
Jorjin Technologies - AR Partnerships with Smart Glasses - 10012020
Similar to Thermal Expert Infrared Camera for Smartphones and I3system I3BOL384_17A Microbolometer 2016 teardown reverse costing report published by Yole Developpement
Opgal Therm-App Infrared Camera & Ulis IR Microbolometer teardown reverse cos...Yole Developpement
Opgal Therm-App Infrared Camera & Ulis IR Microbolometer
The highest resolution thermal camera for smartphone, 384 x 288 pixels using a microbolometer with 17µm pixel from Ulis.
Based on a high definition microbolometer from Ulis, the Therm-App infrared camera is a high-end product for smartphone. More conservative in their technological choices, the microbolometer is more expensive but better performance. The choice of the quality is also in the camera with the possibility of interchangeable lenses in function of the use. Opgal and Ulis target the professional market and are more in competition with standard IR cameras than with IR cameras for mobile.
The Therm-App camera has a very compact size and is compatible with Android smartphones via its micro-USB-OTG connector. The camera is shutterless and a interchangeable lenses system allow to upgrade the camera for the near or faraway application...
The first 3-Axis MEMS Gyroscope to meet Automotive AEC-Q100 qualification
MEMS are getting broadly adopted in the automotive industry and non-safety applications like in-dash navigation are now requiring low-cost and small footprint components.
The A3G4250D is a low power consumption MEMS gyroscope which is the first 3-axis gyroscope to have met the industry-standard qualification for automotive integrated circuits (AEC-Q100).
This 3-axis gyroscope for automotive applications measures angular rates up to ±245 dps. It has been designed and produced using the same manufacturing process (THELMA) than consumer products in order to get full benefit of STMicroelectronics 10 years of consumer electronic market.
Assembled in a 4.0 x 4.0 x 1.1mm package, it embeds an 8-bit temperature sensor and operates within an extended temperature range from -40 to 85°C.
It is suitable for applications including in-dash navigation, telematics and vehicle tolling systems, motion control with MMI (man-machine interface), appliances and robotics.
hilips integrates in its smartphone
the innovative fingerprint sensor developed by EgisTec
After a first introduction in the Aurora i966, EgisTec integrates again its fingerprint ET300 in the Philips i999, a smartphone for the Chinese market.
With very simple technical choices concerning the technical detection design and the packaging, EgisTec offers a very competitive sensor in terms of size and manufacturing cost.
Located on the back side of the smartphone, the fingerprint sensor of the Philips i999 has dimensions of 11.6 x 11.6. It is assembled on a square LGA packaging and is protected by metal support.
The sensor has a resolution of 17,920 pixels with a pixel density of 500ppi. It uses a capacitive touch technology to take an image of the fingerprint from the subepidermal layers of the skin.
The sensor die is manufactured with CMOS 0.15µm technology and it is connected by mean of wire bonding to the rigid PCB.
Thanks to its design and manufacturing process, EgisTec device is very smart and cost effective in respect to the competitors.
The report includes comparisons with the latest Huawei’s, Samsung’s and Apple’s fingerprints buttons.
More information on that report at http://www.i-micronews.com/reports.html
Sensonor STIM210
High-precision MEMS Gyro Module
World highest performance silicon MEMS gyro available without export control.
Tactical grade with bias instability of 0.5°/h in a miniature 33cm3 package.
MEMS gyroscopes for tactical grade applications made a lot of progress in the past few years in term of reliability. They are now accepted in high-reliability environments, and are even starting to replace FOGs and other technologies in tactical applications.
With a bias instability of 0.5°/h, the Sensonor STIM210 is the world highest performance silicon MEMS gyroscope. The module is available without export control (ITAR-free). The analyzed module is a complete system offering 3 axes MEMS gyros associated with a 32-bit microcontroller which provides flexibility in device configuration.
STIM210 applications are typically found within industrial, aerospace and defense markets, for various platform stabilizations, pointing and navigation systems, attitude heading reference systems (AHRSs), inertial navigation systems (INSs), smart munitions, missiles, 3D mapping systems, range finders, trains, robotics, and more. For many applications STIM210 directly replaces FOGs and improves system solutions with respect to robustness, reliability, size, weight, power and cost.
More information on that report at http://www.i-micronews.com/reports/Sensonor-STIM210High-precision-MEMS-Gyro-Module/1/436/
Seek Thermal Infrared Camera & Raytheon IR Microbolometer teardown reverse co...Yole Developpement
The highest resolution thermal camera for smartphone, 156 x 206 pixels, using a microbolometer with 12 µm pixel from Raytheon, compatible with Android and IOS.
Initially focused on the military market, uncooled thermal camera sales have grown significantly due to the substantial cost reduction of microbolometers and growing adoption in commercial markets. With the partnership with Seek Thermal and a fabless structure, Raytheon enters in the consumer market...
2-Axis Gyroscopes for Optical Image Stabilization: STMicroelectronics L2G2IS ...Yole Developpement
Complete reports and comparison of the latest generation products for smartphones from the leading optical image stabilization gyro players.
2-Axis Gyroscopes for Optical Image Stabilization (OIS) constitute a market where 123 million units were shipped in 2015, according to Yole Développement. This market originates only from high-end smartphones and two players share most of it: InvenSense, with 49%, and STMicroelectronics, with 39%.
The 2-axis gyroscopes are located inside the camera module of high-end smartphones. The main constraints are a small footprint and, more importantly, thinness.
Previously, thickness was the same as standard land grid array (LGA) or quad flat no-leads (QFN) package, close to 1mm. Now the standard is 0.65mm, which products from both InvenSense and STMicroelectronics attain.
InvenSense was first, with the IDG-2030, a 2.3x2.3x0.65mm gyroscope, which is still the smallest on the market. Since its introduction we found it in several smartphones from various manufacturers. The IDG-2030 uses the same Nasiri platform as other InvenSense inertial devices, with wafer-level integration of the MEMS sensor on top of the application specific integrated circuit (ASIC), thus providing only one die in the final LGA package.
Months later, STMicroelectronics released the L2G2IS, which shares the same dimensions. The device is manufactured using the same THELMA process as all STMicroelectronics inertial devices. The THELMA platform involves a two-die approach that is challenging for very thin package integration. However, both players now offer very low-cost gyros thanks to die size reduction and process optimization.
Both gyroscopes analyzed are 2-axis X, Y (Pitch, Roll). The two reports can be purchased separately or together in order to compare the technology and pricing of the main smartphone OIS gyro players, including previous generation products.
More information on that report at http://www.i-micronews.com/reports.html
Yole Intel RealSense 3D camera module and STM IR laser 2015 teardown reverse ...Yole Developpement
INNOVATIVE 3D CAMERA FOR FACIAL ANALYSIS AND HAND/FINGER TRACKING, BASED ON RESONANT MICRO-MIRROR, IR LASER, VISIBLE AND NEAR INFRARED IMAGE SENSORS.
Intel RealSense is an intelligent 3D camera equipped with a system of three components: a conventional camera, a near infrared image sensor and an infrared laser projector. Infrared parts are used to calculate the distance between objects, but also to separate objects on different planes. They serve for facial recognition as well as gestures tracking.
The Intel 3D camera can scan the environment from 0.2m to 1.2m. The fixed-focal length camera will support up to 1080p @30FPS capture in RGB with a 77° FOV. Its lens has a built in IR cut filter. The 640x480 pixel VGA camera has a frame rate up to 60fps with a 90° FOV, moreover its lens has an IR Band Pass filter.
More information on that report at http://www.i-micronews.com/reports.html
The first MEMS IMU (3-Axis Gyro + 3-Axis Accelero on the same die) from Maxim Integrated (Maxim) in industry thinnest 3x3x0.83mm package
With the same process used for their 3-Axis gyro and acquired from the purchasing of SensorDynamics in 2011, the MAX21100 combines on only one MEMS die a 3-Axis gyroscope and a 3-Axis accelerometer.
The PSM-X2 technology platform used to build the sensor includes a proprietary surface micromachining process and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation and a dual pressure wafer-level capping of the sensors.
Assembled in a LGA 3.0x3.0x0.83mm package, the MAX21100 is a low power consumption (3.45mA) 3-Axis gyroscope plus 3-Axis accelerometer IMU with integrated 9-axis sensor fusion (6+3 DoF) targeted for consumer applications.
The report is including a detailed technical and cost comparison with state of the art 6-Axis MEMS IMUs (3-Axis gyroscope + 3-Axis accelerometer) from STMicroelectronics, Bosch Sensortec and InvenSense. Surprisingly, Maxim is able to provide a very competitive component due to an important silicon area reduction.
Discover all the details in the report!
Intel® Curie™ Module High Density System-in-Package for IoT 2016 teardown rev...Yole Developpement
Ultra-small, low-power hardware module for wearables
Intel®, whose microprocessors can be found in almost every computer worldwide, has commenced the 2016 “wearables race” by introducing the Intel® Curie™ module. This tiny system-in-package (SiP) can be found in the latest Arduino® Board: the Genuino 101 for the European version and the Arduino 101 for the US version. The module includes the Intel Quark chip, Bluetooth low-energy radio, sensors, and battery charging, all in a single package of less than 150mm3.
This complete, low-power solution comes with computing, motion sensing, Bluetooth low energy, battery charging, and pattern matching capabilities for optimal sensor data analysis, enabling quick and easy identification of actions and motions. The module is packaged in a tiny form factor and runs a new software platform created especially for the Intel Curie module.
Located on the main board, the system uses non-conventional packaging developed by Intel. The main microcontroller is located at the bottom of the package, with features like Bluetooth and sensors placed on top.
More information on that report at http://www.i-micronews.com/reports.html
Heimann Sensor 32 x 32-array thermopile LWIR image sensor with silicon lens 2...system_plus
A small, easy to use, low-power, cheap non-contact temperature measurement for varying applications.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/heimann-sensor-32-x-32-array-thermopile-lwir-image-sensor-with-silicon-lens/
The first MEMS Gyroscope from Maxim Integrated in the industry smallest 3x3mm package
Following the purchase of MEMS manufacturer SensorDynamics in 2011, Maxim releases its first MEMS Gyroscope reference with a very accurate and cost effective component.
The MAX21000 continues to use the PSM-X2 process jointly developed by SensorDynamics and the Fraunhofer Institute for Silicon Technology. This technology platform includes a proprietary surface micromachining process to build the mechanical structures and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation of the gyro sensor.
Assembled in a LGA 3.0x3.0x0.9mm package, the MAX21000 is a low power consumption (5.4mA) and high accuracy 3-axis gyroscope targeted for mobile applications.
The report is including a detailed technical and cost comparison with state of the art 3x3mm MEMS gyros from STMicroelectronics, Bosch Sensortec and InvenSense. Surprisingly, Maxim is able to provide a very competitive component due to an important silicon are a reduction.
Discover all the details in the report: http://www.i-micronews.com/reports/Maxim-Integrated-MAX21000-3-Axis-MEMS-Gyroscope/1/449/
New Receiver & Transmitter components with a SiGe:C HBT technology from Infineon
The new integrated Radar and Camera (RACam) 76GHz automotive radar from Delphi integrates receiver and transmitter components from Infineon. These components use the latest SiGe:C HBT technology.
The two bare dies RF component are developed and manufactured by Infineon. The two chips are integrated in the RF board with specific thermal management. The dies have wire bonding and are directly connected to microstrip line transmission which lead the signal to antenna via a specific way through the PCB.
The RF transistors are the newest generation SiGe:C HBT dies from Infineon. The circuits use advanced insulation structure and modern copper metal layers.
The report includes a complete physical analysis of the dies, with details on technical choices regarding the design and the manufacturing process. The SiGe HBT are equally analyzed.
Magnetometers are widely integrated in consumer applications. More and more devices will require a positioning system and magnetometers are essential for such a purpose. A CAGR of +8% in units is forecasted by Yole Developpement from 2015 to 2020.
In this report, 3-Axis & 6-Axis eCompasses from different suppliers and different generations are compared in term of technology choice, manufacturing process and cost. The main eCompass references have been extracted from a wide selection of smartphones and analyzed. Size and technology quickly evolve but the main players remain AKM and Yamaha, representing more than 80% of the market. Nevertheless, several products from other players have been analyzed as well. These players, like Aichi Steel, ALPS, Bosch, Everspin, Honeywell or MEMSIC use different technologies and could disrupt the market within the next years.
More information on that report at http://www.i-micronews.com/reports.html
Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer 2015 teardown r...Yole Developpement
Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer
Automotive MEMS Combo
Murata’s Second Generation Combo Sensors for Automotive & Harsh Environments
Murata SCC2000 series sensors are combined accelerometer and gyroscope devices aimed at use in tough environments such as those encountered in automotive and industrial applications. The SCC2000 series has best in class temperature dependency, shock sensitivity and bias stability characteristics and consists of a low-g 3-axis accelerometer with two angular rate sensor options of either X or Z-axis detection.
The SCC2000 series features independent acceleration and angular rate sensing elements manufactured with Murata proprietary High Aspect Ratio (HAR) 3D-MEMS process and using SOI and cavity-SOI (c-SOI) substrates. A single ASIC produced with an advanced BCD process is used.
The acceleration sensing element consists of four acceleration sensitive masses and the angular rate sensing element consists of moving masses that are purposely exited to in-plane drive motion.
The SCC2000 devices are packaged in a SOIC 24-pin premolded plastic housing measuring 15.0x8.5x4.1mm. The combo sensor is compliant to the ISO26262 automotive safety standard and the AEC-Q100 stress test qualification requirements for electronic components used in automotive applications.
SCC2000 series is targeted for applications demanding high stability with tough environmental requirements. Typical applications include: IMUs for highly demanding environments, platform stabilization and control, machine control systems, Electronic Stability Control (ESC), Hill Start Assist (HSA), roll over detection and Navigation systems.
The report includes the analysis of all combo sensors in the SCC2000 series: the SCC2230-E02, SCC2230-D08 and SCC2130-D08. Also a comparison with previous generation SCC1300 series is included.
More information on that report at http://www.i-micronews.com/reports.html
Heart-Rate Monitor and Pulse Oximeter Sensor in LED Reflective Solution in the Samsung Galaxy S7
Maxim Integrated is a respected supplier for Samsung’s mobile phone flagships. From the 5th generation Galaxy S5 to the latest Galaxy S7, Maxim’s heart-rate sensor has always been found in the back of the smartphone. The Galaxy S7 uses the latest version of the heart-rate sensor, designed for both smartphone and wearables but very different to previous versions: the MAX30102.
The Samsung Galaxy S7 heart-rate sensor is located on the main board of the smartphone under the camera. The sensor is an optical heart-rate module and a pulse oximeter sensor in an LED reflective solution.
The main die features a photodiode area and an analysis part, with an integrated ambient light cancellation system comprising a photodetector and a wavelength cut-off filter based on Maxim’s proprietary technology. The component features two LEDs: one infra-red (IR) and one red. The LEDs are bonded on silicon substrates, the IR led is manufactured from AlInGaP material and the red LED from GaAs material.
The component is assembled with multiple devices in the package. Compared to the previous generation the design footprint and packaging are totally different. This has made the component more reliable.
Thanks to all these innovations, the MAX30102 is very cost effective, enforcing Maxim’s leadership in this domain.
Complete chip fabrication processes and cost estimation are presented in the report. It also includes comparison with the previous generation of the sensor that can be found in the Samsung Galaxy S6, highlighting and measuring all the differences.
More information on that report at http://www.i-micronews.com/reports.html
Delphi Integrated Radar and Camera System (RACam) 2016 teardown reverse costi...Yole Developpement
Delphi is the first to provide a single system combining 76Ghz Radar and Vision Sensing. With a compact design the system can be integrated behind the windshield and enables a broad array of active safety features, as lane tracking, collision avoidance or adaptive cruise control.
The visual detection is performed by a 1/3” CMOS Image Sensor supplied by a leader in the CIS automotive industry. The sensor is surmounted by a specific 7-lens module and the Mobileye EyeQ3 SoC is used for video processing. Concerning the radar function, Receiver and Transmitter chips from Infineon using SiGe HBT technology are assembled by wire bonding on the RF Board. The Antenna board uses a PTFE-based substrate and is equipped with planar antennas for transmission and reception of the RF signals.
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MEMS are getting broadly adopted in the automotive industry and non-safety applications like in-dash navigation are now requiring low-cost and small footprint components.
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The gyro integrates a new process for the capping. Indeed, the classic "glass-frit" wafer bonding has been abandoned in favor of an eutectic Aluminum-Germanium bonding.
The accelerometer features a new design which uses now only one mass structure for the moving parts compared to three for the previous generations.
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SiTime is taking fully benefit of all semiconductor manufacturing processes and infrastructures in order to develop a really compact device and compete with quarts solutions for the same application.
This full Reverse Costing analysis has been conducted to provide insight on technology data, manufacturing cost and selling price of the SiTime SiT1552 low-power 32kHz Temperature Compensated Crystal Oscillator.
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Thermal Expert Infrared Camera for Smartphones and I3system I3BOL384_17A Microbolometer 2016 teardown reverse costing report published by Yole Developpement
18. COMPLETE TEARDOWN WITH:
• Detailed photos
• Precise measurements
• Material analysis
• Comparison between FLIR,
Seek Thermal, Therm-App
and Thermal Expert
cameras
• Module manufacturing
process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Selling price estimation
• Comparison with previous
generation
Thermal Expert Infrared Camera for Smartphones
and i3system I3BOL384_17A Microbolometer
Title: Thermal Expert
Infrared camera for
Smartphones
Pages: 170 pages in 2 files
Date: August 2016
Format: PDF & Excel file
Price: Full report: EUR 3,490
Based on a high definition microbolometer
from i3system, the Thermal Expert infrared
camera is a high-end product for
smartphones. A more conservative
technological choice, the microbolometer is
more expensive but offers better
performance. The camera also embraces the
quality approach with interchangeable
The highest resolution thermal camera for smartphones at 384 x 288 pixels,
using a microbolometer with 17µm pixels from the South Korea’s i3system.
lenses for different uses. I3system targets the professional market and
competes more in standard IR cameras than IR cameras for smartphones.
The Thermal Expert camera is very compact and compatible with Android
smartphones via its micro-USB-OTG connector. The camera does not use a
battery, with power being supplied by the smartphone. The camera is
shutterless.
The thermal camera uses a new 17µm pixel design from i3system. The
I3BOL384_17A microbolometer features 384 x 288 pixel resolution, 6 times
the resolution of the FLIR Lepton 2G. The sensor technology in the i3system
component is a titanium oxide microbolometer, technology which is not
covered by Honeywell patents. The I3BOL384_17A is the consumer version of
a military microbolometer.
This report presents a complete teardown analysis of the Thermal Expert
camera and its microbolometer. Based on this, it provides the bill-of-material
(BOM) and manufacturing cost of the infrared camera. The report also offers a
complete physical analysis and manufacturing cost estimate of the infrared
module, including the lens module and the microbolometer itself.
The report’s final component is a comparison between the characteristics of
the FLIR One, Seek Thermal, Therm-App and Thermal Expert cameras and
Lepton, EXC001, PICO384P and I3BOL384_17A microbolometers. The
comparison highlights differences in technical choices made by the companies.
19. Performed by
TABLE OF CONTENTS
Overview / Introduction
Company Profile and Supply
Chain
Technology and Cost
Comparison with Competitor
Products (FLIR, Seek
Thermal/Raytheon, Opgal
Therm-App/Ulis)
Physical Analysis
• Synthesis of the Physical Analysis
• Physical Analysis Methodology
• Ceramic Package
Silicon window
• IR Sensor
View, dimensions & marking
Pixel area overview
Contact
Pixel details (active,
compensation pixels)
• ROIC Die
ROIC delayering and process
• IR Sensor Cross-Section
Cross-section : ROIC
Cross-section : arm
Cross-section: microbolometer
Manufacturing Process Flow
• Global Overview
• IR Sensor Wafer Fabrication Unit
• ROIC
• Microbolometer Process Flows
• Package Process Flows
Cost Analysis
• Main Steps of Economic Analysis
• Yield Hypotheses
• ROIC Front-End Cost
• Microbolometer Front-End Cost
• IR Sensor Wafer and Die Cost
• I3BOL384_17A Cost
Estimated Price Analysis
• Main Steps of Economic Analysis
• Yield Hypotheses
Thermal Expert IR Camera
• Camera Disassembly
• Lens Module Analysis
• Electronic Board and Camera - Bill
Of Material and Material Cost
• Electronic Board and Camera -
Assembly Cost
• Manufacturing Cost and Selling
Price
ANALYSIS PERFORMED WITH OUR COSTING TOOLS IC PRICE+ AND MEMS COSIM+
IC Price+
MEMS CoSim+
System Plus Consulting offers
powerful costing tools to
evaluate the production cost &
selling price from single chip to
complex structures.
IC Price+
The tool performs the
necessary cost simulation of
any Integrated Circuit: ASICs,
microcontrollers, memories,
DSP, smartpower…
MEMS Cosim+
It evaluates the cost of any
MEMS process or device.
MEMS CoSim+ is a process-
based costing tool where it is
possible to enter any MEMS
process flow.
than 10 years of experience in
the Power Device manufacturing
costs analysis.
Sylvain Hallereau
Sylvain is in charge
of costing analyses
for IC, Power and
LED. He has more
systems. He worked for Lacroix
Electronics where he was in
charge of components
database.
David Le Gac
David is in charge
of reverse costing
with a focus on
b o a r d s a n d
in chemical & physical technical
analyses. He previously worked
for 25 years in Atmel Nantes
Laboratory.
Yvon Le Goff
Yvon is the
laboratory
manager. He has
deep knowledge
AUTHORS:
20. FLIR One 2nd
Generation & FLIR
LEPTON 3 LWIR Core
Opgal Therm-App Infrared
Camera & Ulis IR
Microbolometer
Uncooled Infrared Imaging
Technology and Market
Trends 2016
Second generation FLIR ONE for
Android and iOS platforms
featuring a completely new
LEPTON Core with 160 x 120 pixels
resolution and 12µm pixel size.
The highest resolution thermal
camera for smartphone, 384 x
288 pixels using a
microbolometer with 17µm pixel
from Ulis.
In a dynamic IR imaging market
with ever more competitors,
technologies and products,
uncooled IR imager shipments are
expected to grow at 15.8% CAGR
from 2016-2021.
Pages: 260
Date: February 2016
Full report: EUR 3,990*
Pages: 160
Date: July 2015
Full report: EUR 3,490*
Pages: 200+
Date: August 2016
Full report: EUR 6,490*
RELATED REPORTS
ANNUAL SUBSCRIPTION OFFER
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months a set of 3, 4, 5, 7, 10 or
15 Reverse Costing® reports.
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More than 40 reports released each year on the following topics (considered for 2016):
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• Power Electronics & Systems (12 reports):
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• Inverters & modules
• Automotive radars
• Head Up displays, Displays
Each year System Plus Consulting releases a comprehensive collection of new reverse engineering &
costing analyses in various domains.
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• Ethernet for car IC, etc.
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sensors & cameras
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About Yole Développement – www.yole.fr / www.i-micronews.com
Founded in 1998, Yole Développement (Yole) has grown to become a group of companies providing marketing, technology and strategy
consulting, media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro
manufacturing, Yole has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semi., LED, Image
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1.3 Orders are deemed to be accepted only upon written acceptance and confirmation by the Seller, within [7 days] from the date of order, to be sent either by email or to the Buyer’s address. In the absence of any
confirmation in writing, orders shall be deemed to have been accepted.
2. Mailing of the Products
2.1 Products are sent by email to the Buyer:
- within [1] month from the order for Products already released; or
- within a reasonable time for Products ordered prior to their effective release. In this case, the Seller shall use its best endeavours to inform the Buyer of an indicative release date and the evolution of the work in
progress.
2.2 Some weeks prior to the release date the Seller can propose a pre-release discount to the Buyer
The Seller shall by no means be responsible for any delay in respect of article 2.2 above, and including incases where a new event or access to new contradictory information would require for the analyst extra time to
compute or compare the data in order to enable the Seller to deliver a high quality Products.
2.3 The mailing of the Product will occur only upon payment by the Buyer, in accordance with the conditions contained in article 3.
2.4. The mailing is operated through electronic means either by email via the sales department or automatically online via an email/password. If the Product’s electronic delivery format is defective, the Seller undertakes to
replace it at no charge to the Buyer provided that it is informed of the defective formatting within 90 days from the date of the original download or receipt of the Product.
2.5 The person receiving the Products on behalf of the Buyer shall immediately verify the quality of the Products and their conformity to the order. Any claim for apparent defects or for non-conformity shall be sent in
writing to the Seller within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects. .
2.6 No return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. Any Product returned to the Seller without providing prior information to the Seller as required under
article 2.5 shall remain at the Buyer’s risk.
3. Price, invoicing and payment
3.1 Prices are given in the orders corresponding to each Product sold on a unit basis or corresponding to annual subscriptions. They are expressed to be inclusive of all taxes. The prices may be reevaluated from time
to time. The effective price is deemed to be the one applicable at the time of the order.
3.2 Yole may offer a pre release discount for the companies willing to acquire in the future the specific report and agreeing on the fact that the report may be release later than the anticipated release date. In exchange
to this uncertainty, the company will get a discount that can vary from 15% to 10%.
3.3 Payments due by the Buyer shall be sent by cheque payable to Yole Développement, credit card or by electronic transfer to the following account:
HSBC, 1 place de la Bourse 69002 Lyon France
Bank code: 30056
Branch code: 00170
Account n°: 0170 200 1565 87
BIC or SWIFT code: CCFRFRPP
IBAN: FR76 3005 6001 7001 7020 0156 587
To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order.
3.4 Payment is due by the Buyer to the Seller within 30 days from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the latter shall be
entitled to invoice interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L. 441-6 of the French Commercial Code. Our publications (report, database, tool...) are delivered
only after reception of the payment.
3.5 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages.
4. Liabilities
4.1 The Buyer or any other individual or legal person acting on its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the use and
interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement
4.3 In no event shall the Seller be liable for:
a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or information) arising out of
the use of or inability to use the Seller’s website or the Products, or any information provided on the website, or in the Products;
b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof.
4.4All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot
be guaranteed to be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the
liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of
any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in
article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the
orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down
payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take
reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that
any Product will be free from infection.
5. Force majeure
The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties,
equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller.
6. Protection of the Seller’s IPR
6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the
Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as:
- Information storage and retrieval systems;
- Recordings and re-transmittals over any network (including any local area network);
- Use in any timesharing, service bureau, bulletin board or similar arrangement or public display;
- Posting any Product to any other online service (including bulletin boards or the Internet);
- Licensing, leasing, selling, offering for sale or assigning the Product.
6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall
personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the
copyrights and will guaranty that the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a
maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company,
the joint venture done with a third party etc..cannot access the report and should pay a full license price.
7. Termination
7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such
delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without
solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.
8. Miscellaneous
All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due
time.
9. Governing law and jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which
shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.
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