This report provides an overview of key trends in the automotive market and their impact on automotive packaging technologies. It analyzes major applications like CIS, LiDAR, radar, connectivity, sensors, memory, computing and power devices. The report also discusses the automotive supply chain and compares the market share of IDMs versus OSATs in automotive packaging. Key findings include: advanced packaging is gaining traction driven by vehicle electrification and autonomy needs, but mainstream packaging still dominates; and the automotive industry is undergoing changes to more quickly adopt new technologies like ADAS computing.
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
Status of the Power Module Packaging Industry 2019 - Yole DéveloppementYole Developpement
Major evolutions in substrate, interconnection, and die-attach technologies, driven by EV/HEV, are transforming the power module packaging supply chain.
More information on: https://www.i-micronews.com/products/status-of-the-power-module-packaging-industry-2019/
Trends in Automotive Packaging 2018 by Yole DéveloppementYole Developpement
OSATs are gaining benefits from advanced packaging in automotive.
More information on that report at : https://www.i-micronews.com/report/product/trends-in-automotive-packaging-2018.html
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Status of The Advanced Packaging Industry_Yole Développement reportYole Developpement
IoT driven semiconductor industry consolidation is reflecting into a highly dynamic Advanced Packaging landscape. Demand for advanced packaging and market size is increasing. Focus is turning
to integration and wafer level packages to enable a functionality driven roadmap and revive the cost/performance curve.
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
Status of the Power Module Packaging Industry 2019 - Yole DéveloppementYole Developpement
Major evolutions in substrate, interconnection, and die-attach technologies, driven by EV/HEV, are transforming the power module packaging supply chain.
More information on: https://www.i-micronews.com/products/status-of-the-power-module-packaging-industry-2019/
Trends in Automotive Packaging 2018 by Yole DéveloppementYole Developpement
OSATs are gaining benefits from advanced packaging in automotive.
More information on that report at : https://www.i-micronews.com/report/product/trends-in-automotive-packaging-2018.html
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Status of The Advanced Packaging Industry_Yole Développement reportYole Developpement
IoT driven semiconductor industry consolidation is reflecting into a highly dynamic Advanced Packaging landscape. Demand for advanced packaging and market size is increasing. Focus is turning
to integration and wafer level packages to enable a functionality driven roadmap and revive the cost/performance curve.
Power Management: Technology, Industry and Trends 2019 - by Yole DéveloppementYole Developpement
China, 300mm, societal impacts, and important strategic decisions are shuffling the cards in the power
IC industry.
More on: https://www.i-micronews.com/products/power-management-technology-industry-and-trends-2019/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
Automotive Lighting: Technology, Industry and Market Trends 2018 report by Yo...Yole Developpement
Automotive lighting is becoming the new photonic hub.
More information on https://www.i-micronews.com/category-listing/product/automotive-lighting-technology-industry-and-market-trends-2018.html
Polymeric Materials for Advanced Packaging at the Wafer-Level 2018 Report by...Yole Developpement
Polymeric materials market revenue will double over the next five years.
More information on that report at : https://www.i-micronews.com/report/product/polymeric-materials-for-advanced-packaging-at-the-wafer-level.html
Status of the CMOS Image Sensor Industry 2017 - Report by Yole DeveloppementYole Developpement
New applications are transforming the market and technology playing field for CMOS image sensors
It’s ten years down the line from the initial Apple iPhone that started the smartphone era. Since then, CMOS imaging has benefited from huge market demand and a technology-driven environment, resulting in an $11.6B industry in 2016. Photography and video is the main application, which is totally transformed by new use cases, new devices and new technologies.
The mobile market is key for the CMOS image sensor (CIS) industry. Despite saturation in the number of handsets, the CIS market has been able to maintain a 10.5% compound annual growth rate (CAGR) for the 2016-2022 period due to the introduction of dual and 3D cameras. These additional cameras are changing the industry’s drivers from form factor and image quality to interactivity.
Penetration into higher added value markets such as automotive, security and medical shows that CIS products are transforming use cases across the board. CIS technology adoption allows greater automation levels at low cost, while using newly available computing architectures such as deep learning. The CMOS image sensor industry is currently in a virtuous circle where a new technology is providing true customer value.
Discrete Power Device Packaging: Materials Market and Technology Trends 2019 ...Yole Developpement
Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.
More information on https://www.i-micronews.com/products/discrete-power-device-packaging-materials-market-and-technology-trends-2019/
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
Paramount to the future of safety and autonomy, the automotive imaging market is at a key crossroads.
More information on https://www.i-micronews.com/products/imaging-for-automotive-2019/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 µm or even 50 µm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
For the full video of this presentation, please visit:
https://www.edge-ai-vision.com/2020/03/market-analysis-on-socs-for-imaging-vision-and-deep-learning-in-automotive-and-mobile-markets-a-presentation-from-yole-developpement/
For more information about edge AI and vision, please visit:
http://www.edge-ai-vision.com
John Lorenz, Market and Technology Analyst for Computing and Software at Yole Développement, delivers the presentation “Market Analysis on SoCs for Imaging, Vision and Deep Learning in Automotive and Mobile Markets” at the Edge AI and Vision Alliance’s March 2020 Vision Industry and Technology Forum. Lorenz presents Yole Développement’s latest analysis on the evolution of SoCs for imaging, vision and deep learning.
Growth, supply chain, new applications: inverter industry is about to redefine itself.
The inverter market is heavily application dependent. However, there are some cross-fertilization trends — companies with a good position within one inverter market segment are researching entry into other segments. Companies like Alstom, ABB, Ingeteam, Siemens, and General Electric already offer products in two or more inverter segments.
Some players have chosen vertical integration to optimize their internal cost structure to better target commodity-like markets, as well as to meet the severe cost requirements of the automotive industry. Other players have bet on horizontal integration to offer complete solutions to customers.
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
Artificial Intelligence Computing for Automotive 2019 Report by Yole Développ...Yole Developpement
Artificial Intelligence for automotive: why you should care.
More information on that report at: https://www.i-micronews.com/produit/artificial-intelligence-computing-for-automotive-2019/
Radar and Wireless for Automotive: Market and Technology Trends 2019 report b...Yole Developpement
The radar and 5G/V2X markets will both grow – one through market pull, the other through prospective enablement.
More information on https://www.i-micronews.com/products/radar-and-v2x-for-automotive-technologies-and-market-trends-2019/
Radar Technologies For Automotive 2018 report by Yole Développement Yole Developpement
How will radar sensor technology shape the cars of the future? Prepare for the automotive sensor industry’s golden age, in which radar will be increasingly viewed as a key technology for autonomous vehicles.
AUTOMOTIVE IS EXPERIENCING AN EXPLOSION OF NEW HIGH-TECH APPLICATIONS
Automatic emergency braking, adaptive cruise control, and lane-change assist are some examples of these new applications. Spurred by the New Car Assessment Program, OEMs are designing cars with numerous sensors that enable applications like these. And since most of these new applications are safety-related, the sensors must be highly accurate. This means very tight specifications for object detection and classification, as well as being ultra-reliable: operable in every weather condition, in poor lighting, near or far, and with a wide field of view. Radar technology is well-suited to fulfill most of these requirements. We say “most” because object classification is not currently possible with radar, but certain companies are moving quickly to unlock this capability in imaging radar.
Radar has an impressive technology roadmap allowing for huge resolution improvement as well as device miniaturization and cost reduction. Despite small growth (~3%) in global car sales until 2022, Yole Développement expects an average growth rate of 25% for radar module sales, and an average growth rate of 22% for radar chip sales over the next five years - with autonomous driving being the next long-term driver for radar technology growth.
More information on that report at http://www.i-micronews.com/reports.html
Power Management: Technology, Industry and Trends 2019 - by Yole DéveloppementYole Developpement
China, 300mm, societal impacts, and important strategic decisions are shuffling the cards in the power
IC industry.
More on: https://www.i-micronews.com/products/power-management-technology-industry-and-trends-2019/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
Automotive Lighting: Technology, Industry and Market Trends 2018 report by Yo...Yole Developpement
Automotive lighting is becoming the new photonic hub.
More information on https://www.i-micronews.com/category-listing/product/automotive-lighting-technology-industry-and-market-trends-2018.html
Polymeric Materials for Advanced Packaging at the Wafer-Level 2018 Report by...Yole Developpement
Polymeric materials market revenue will double over the next five years.
More information on that report at : https://www.i-micronews.com/report/product/polymeric-materials-for-advanced-packaging-at-the-wafer-level.html
Status of the CMOS Image Sensor Industry 2017 - Report by Yole DeveloppementYole Developpement
New applications are transforming the market and technology playing field for CMOS image sensors
It’s ten years down the line from the initial Apple iPhone that started the smartphone era. Since then, CMOS imaging has benefited from huge market demand and a technology-driven environment, resulting in an $11.6B industry in 2016. Photography and video is the main application, which is totally transformed by new use cases, new devices and new technologies.
The mobile market is key for the CMOS image sensor (CIS) industry. Despite saturation in the number of handsets, the CIS market has been able to maintain a 10.5% compound annual growth rate (CAGR) for the 2016-2022 period due to the introduction of dual and 3D cameras. These additional cameras are changing the industry’s drivers from form factor and image quality to interactivity.
Penetration into higher added value markets such as automotive, security and medical shows that CIS products are transforming use cases across the board. CIS technology adoption allows greater automation levels at low cost, while using newly available computing architectures such as deep learning. The CMOS image sensor industry is currently in a virtuous circle where a new technology is providing true customer value.
Discrete Power Device Packaging: Materials Market and Technology Trends 2019 ...Yole Developpement
Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.
More information on https://www.i-micronews.com/products/discrete-power-device-packaging-materials-market-and-technology-trends-2019/
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
Paramount to the future of safety and autonomy, the automotive imaging market is at a key crossroads.
More information on https://www.i-micronews.com/products/imaging-for-automotive-2019/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 µm or even 50 µm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
For the full video of this presentation, please visit:
https://www.edge-ai-vision.com/2020/03/market-analysis-on-socs-for-imaging-vision-and-deep-learning-in-automotive-and-mobile-markets-a-presentation-from-yole-developpement/
For more information about edge AI and vision, please visit:
http://www.edge-ai-vision.com
John Lorenz, Market and Technology Analyst for Computing and Software at Yole Développement, delivers the presentation “Market Analysis on SoCs for Imaging, Vision and Deep Learning in Automotive and Mobile Markets” at the Edge AI and Vision Alliance’s March 2020 Vision Industry and Technology Forum. Lorenz presents Yole Développement’s latest analysis on the evolution of SoCs for imaging, vision and deep learning.
Growth, supply chain, new applications: inverter industry is about to redefine itself.
The inverter market is heavily application dependent. However, there are some cross-fertilization trends — companies with a good position within one inverter market segment are researching entry into other segments. Companies like Alstom, ABB, Ingeteam, Siemens, and General Electric already offer products in two or more inverter segments.
Some players have chosen vertical integration to optimize their internal cost structure to better target commodity-like markets, as well as to meet the severe cost requirements of the automotive industry. Other players have bet on horizontal integration to offer complete solutions to customers.
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
Artificial Intelligence Computing for Automotive 2019 Report by Yole Développ...Yole Developpement
Artificial Intelligence for automotive: why you should care.
More information on that report at: https://www.i-micronews.com/produit/artificial-intelligence-computing-for-automotive-2019/
Radar and Wireless for Automotive: Market and Technology Trends 2019 report b...Yole Developpement
The radar and 5G/V2X markets will both grow – one through market pull, the other through prospective enablement.
More information on https://www.i-micronews.com/products/radar-and-v2x-for-automotive-technologies-and-market-trends-2019/
Radar Technologies For Automotive 2018 report by Yole Développement Yole Developpement
How will radar sensor technology shape the cars of the future? Prepare for the automotive sensor industry’s golden age, in which radar will be increasingly viewed as a key technology for autonomous vehicles.
AUTOMOTIVE IS EXPERIENCING AN EXPLOSION OF NEW HIGH-TECH APPLICATIONS
Automatic emergency braking, adaptive cruise control, and lane-change assist are some examples of these new applications. Spurred by the New Car Assessment Program, OEMs are designing cars with numerous sensors that enable applications like these. And since most of these new applications are safety-related, the sensors must be highly accurate. This means very tight specifications for object detection and classification, as well as being ultra-reliable: operable in every weather condition, in poor lighting, near or far, and with a wide field of view. Radar technology is well-suited to fulfill most of these requirements. We say “most” because object classification is not currently possible with radar, but certain companies are moving quickly to unlock this capability in imaging radar.
Radar has an impressive technology roadmap allowing for huge resolution improvement as well as device miniaturization and cost reduction. Despite small growth (~3%) in global car sales until 2022, Yole Développement expects an average growth rate of 25% for radar module sales, and an average growth rate of 22% for radar chip sales over the next five years - with autonomous driving being the next long-term driver for radar technology growth.
More information on that report at http://www.i-micronews.com/reports.html
The one million robotic vehicle milestone will be reached by end of the decade: The industrial phase has been launched.
More information on: https://www.i-micronews.com/products/sensors-for-robotic-mobility-2020/
MEMS and Sensors for Automotive 2017 Report by Yole Developpement Yole Developpement
How will sensor technology shape the cars of the future? We are only at the very beginning of a bright future for sensor providers – be prepared for the golden age of the automotive sensor industry.
THE REBORN AUTOMOTIVE SENSOR MARKET WILL BE WORTH MORE THAN $20B BY 2022
In a global automotive market worth than US$2.3T, the little world of automotive sensors has recently been shaken up by the emergence of electric and autonomous cars. Despite just 3% growth in the volume of cars sold expected through to 2022, Yole Développement (Yole) expects an average growth rate in sensors sales volumes above 8% over the next five years, and above 14% growth in sales value. This is thanks to the expanding integration of high value sensing modules like RADAR, imaging and LiDAR. The current automotive sensing market groups MEMS and classic active sensors such as pressure, tire pressure monitoring systems (TPMS), chemical, inertial, magnetic, ultrasonic, imaging, RADAR and LiDAR. We estimate that this market is worth US$11B in 2016 and is expected to reach US$23B by 2022. This is mainly due to the boom in imaging, RADAR and LiDAR sensors, which will respectively be worth US$7.7B, US$6.2B and US$1.4B by 2022. Among classical sensors like pressure, chemical and magnetic sensors, the impact of electric vehicles will remain small in the short term. However, the advent of electrical vehicles will greatly change the amount and the distribution of pressure and magnetic sensors within the car in the longer term. More electric cars will mean fewer pressure sensors and a surge in magnetic sensors for battery monitoring and various positioning and detection of moving pieces. Finally, we believe that the automotive world is experiencing one of the fastest-changing eras in its evolution ever. Sensor suppliers are now engaged in a race where they need to be prepared for the golden age of the automotive world.
This report describes the applications, technologies, and players associated with the automotive sensor market’s impending changes.
More information on that report at http://www.i-micronews.com/reports.html
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
Sensors and Data Management for Autonomous Vehicles report 2015 by Yole Devel...Yole Developpement
Multiple sensing technologies will ensure many market opportunities for Tier 1 players, Tier 2 players, and newcomers alike
Sensor technologies are a driving force in making fully autonomous vehicles a reality. Automakers are racing to develop safe self-driving cars, but this race is a distance run more than a sprint, where multiple automation stages will imply multiple sensors. Ultrasonic sensors, radars, and multiple cameras systems are already embedded in high-end vehicles -- and within 10 years, they could also include long-range cameras, LIDAR, micro bolometer and accurate dead reckoning. These devices will work concurrently and each technology will support another to ensure codependency and avoid concerns. Even though sensors are only part of the puzzle, their market opportunities are promising.
LiDAR for Automotive and Industrial Applications 2019 by Yole DéveloppementYole Developpement
Is rationalization happening in the LiDAR market?
More information on: https://www.i-micronews.com/produit/lidar-for-automotive-and-industrial-applications-2019/
Gate Driver Market and Technology Trends - 2017 Report by Yole DeveloppementYole Developpement
Gate driver ICs will be challenged by greater integration demands and the arrival of GaN and SiC.
The gate driver IC market will benefit from the steady growth of the power semiconductor industry
In recent years, a much greater percentage of home appliances, electric vehicles, hybrid vehicles, including mild hybrids, and renewable energy products have implemented dedicated power semiconductors devices on-board. The majority of these applications utilize power MOSFETs and IGBTs as power switches, but the adoption rate of gate drivers and applications of IGBTs and MOSFETs are different. In 2016, more than 60% of the gate drivers used in power applications were attached to MOSFETs. Nevertheless, the revenue gap between MOSFET and IGBT gate drivers is quickly narrowing.
Yole Développement (Yole) forecasts gate driver ICs will benefit from power semiconductors delivering a 6.1% compound annual growth rate (CAGR) from 2017-2022. The gate driver IC market revenue, which was estimated to have been $1.2B in 2016, is forecast to have a 5.1% CAGR for 2017-2022.
To get more information, please visit our website: https://www.i-micronews.com/reports.html
Light Shaping Technologies for Consumer and Automotive Applications 2019Yole Developpement
Legacy micro-optics are on the verge of being reshaped by the semiconductor industry and nanostructuring techniques.
More information on: https://www.i-micronews.com/products/light-shaping-technologies-for-consumer-and-automotive-applications-2019/
Driven by application diversification, IPDs (integrated passive devices) continue their promising
growth.
Today, miniaturization and integration are key drivers in electronic devices. This is even more critical in several consumer applications, where thinner devices mean higher integration levels, necessitating low-profile components.
More information on that report at http://www.i-micronews.com/reports.html
Status of the Power Electronics Industry 2019 by Yole DéveloppementYole Developpement
Long term growth of the power electronics market is driving 300mm wafer-based production.
More information on: https://www.i-micronews.com/products/status-of-the-power-electronics-industry-2019/
Machine Vision for Industry and Automation 2018 Report by Yole DeveloppementYole Developpement
Machine vision is at the heart of the automation revolution.
More information on that report at https://www.i-micronews.com/report/product/machine-vision-for-industry-and-automation-2018.html
Status of the Camera Module Industry 2019 – Focus on Wafer Level Optics repor...Yole Developpement
CMOS Camera Modules (CCM) have become a key sensor technology – what are the dynamics and strategies in this highly competitive market?
More information on: https://www.i-micronews.com/produit/status-of-the-camera-module-industry-2019-focus-on-wafer-level-optics/
Wafer starts for More than Moore applications 2018 Report by Yole Developpement Yole Developpement
Driven by megatrend markets, More than Moore devices’ overall wafer demand is expected to grow at an almost 10% CAGR from 2017 to 2023.
More information on that report at https://www.i-micronews.com/report/product/wafer-starts-for-more-than-moore-applications.html
New applications drive greater shipment volumes, which drive new applications, bringing the uncooled IR sensing market into a virtuous cycle.
More information on : https://www.i-micronews.com/report/product/uncooled-infrared-imagers-and-detectors-2019.html
Imaging Technologies for Automotive 2016 Report by Yole Developpement Yole Developpement
Imaging technology, which is currently mainly cameras, is exploding into the automotive space, and is set to grow at 20% CAGR to reach $7.3B in 2021
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Since 2008, when a recession acted as a wakeup call to the whole industry, the automotive market has undergone obvious structural change. Capitalizing on technologies initially developed for smartphones, electronics have invaded, and imaging technology is now taking center stage. From less than one camera per car on average in 2015, there will be more than three cameras per car by 2021, which means 371 million automotive imaging devices.
Cameras were initially mounted for ADAS purposes on high-end vehicles, with deep learning image analysis techniques promoting early adoption. The Israeli company Mobileye has been instrumental in bringing this technology to market, along with On Semiconductor, which provided the CMOS image sensor. Copycat competition will probably pick up as the market now justifies initial investment in design and technology. It is now a well-established fact that vision-based autonomous emergency braking (AEB) is possible and saves life. Adoption of forward ADAS cameras will therefore accelerate.
Growth of imaging for automotive is also being fueled by the park assist application, and 360° surround view camera volume is skyrocketing. While it’s becoming mandatory in the US to have a rearview camera, that uptake is dwarfed by 360° surround view cameras, which enable a “bird’s eye view” perspective. This trend is most beneficial to companies like Omnivision at sensor level and Panasonic and Valeo, which have become the main manufacturers of automotive cameras.
Mirror replacement cameras are currently the big unknown and take-off will primarily depend on its appeal and car design regulation. Europe and Japan are at the forefront of this trend, which should become slightly significant by 2021.
Solid state lidar is well talked about and will start to be found in high end cars by 2021. Cost reduction will be a key driver as the push for semi-autonomous driving will be felt more strongly by car manufacturers. The report will analyse the impact of lidar for automotive vision in detail.
Night vision cameras using Long Wave Infrared (LWIR) technology were initially perceived as a status symbol. However, they’re increasingly appreciated for their ability to automatically detect pedestrians and wildlife. LWIR will therefore become integrated into ADAS systems in future.
3D cameras will be limited to in-cabin infotainment and driver monitoring. This technology will be key for luxury cars and therefore is of limited use today.
If any significant semi-autonomous trend picks up, the technology will probably become mandatory, due to safety issues.
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55. Today’s automotive industry is transforming in
preparation for the vehicles of tomorrow. Vehicle
autonomy and electrification trends, along with
comfort and safety, are driving these changes,
which are occurring on every front: supply chain,
business models, players, and technologies, down
to packaging and materials, etc.
This report focuses on automotive packaging,
presenting the different packages used by in-
car applications. The total calculated packaging
market will exhibit a +10% CAGR2018-2024
, growing
from $5.1B in 2018 to around $9B in 2024.
Traditionally a conservative industry, automotive
players have begun adapting their approach to
today’s quickened technology pace. Packaging is
one of the fields where changes are manifesting,
and affirming the growth of advanced packaging
usage. In 2018, advanced packages accounted for
only 3% of automotive packaging revenue: the
other 97% was attributed to legacy packaging.
But in 2024 advanced packaging will double its
share, reaching 6% of the total accessible market
and accounting for $550M (4x its 2018 revenue).
Despite the obvious domination of legacy
packaging, advanced platforms will continue
their breakthrough into automotive - driven by
autonomy applications like ADAS computing,
along with vehicle electrification’s need for new
advanced packages, i.e. embedded die.
Automotive packaging is application-
dependent. In areas like MEMS, low-power,
and most CIS, legacy packaging is sufficient -
whereas other applications, i.e. computing,
require advanced packaging. In fact, advanced
packaging’s growth in automotive is directly
linked to advancements in autonomy levels,
vehicle electrification, and their adoption.
This report details the packages used for various
applications: CIS, LiDAR, radar, connectivity,
MEMS and sensors, LED lighting, computing,
memory, and power devices.
AUTOMOTIVE PACKAGING: MARKET AND TECHNOLOGIES
TRENDS 2019
Market & Technology Report - November 2019
THE AUTOMOTIVE INDUSTRY’S EVOLUTION, AND ITS IMPACT ON
PACKAGING
Vehicle autonomy and electrification are encouraging advanced packaging’s growth in this industry.
(Yole Développement, November 2019)
2018-2024 automotive packaging market revenue forecast:
legacy vs. advanced packaging
WHAT’S NEW
• Detailed packaging forecast, by
application; detailing the package by
device for each application
• CIS packaging forecast, by CIS type
• LiDAR packaging forecast, by device
type (laser, photodetector, µmirror)
• Radar and connectivity packaging
forecast, by device type
• Automotive computing application
(ADAS computing and AI for
infotainment)
• Automotive memory (DRAM,
NAND) applications
• IDMs and OSATs - 2018 packaging
market share, and vision for 2024
• Supply chain changes - three
different scenarios
KEY FEATURES
• Automotive market overview and
trends
• Automotive packaging, trends,
changes, challenges
• Multiple automotive applications:
CIS / LiDAR / radar / connectivity
/ MEMS and sensors / memory /
computing / power / LED
• Forecast (units and revenue) by
packaging type for each application
• Supply chain and ecosystem by
application
• IDMs and OSATs automotive
packaging market share
THE AUTOMOTIVE PACKAGING LANDSCAPE: AN “IDM VS. OSAT”
BUSINESS
The automotive industry of the future will
require more in-vehicle electronics systems,
implying higher packaging volumes. Historically,
automotive packaging was mostly done in-house
by IDMs. Today however, with higher volumes
and OSATs’ extensive packaging expertise,
IDMs are more frequently subcontracting
packaging to OSATs, or at the very least
producing part of their legacy package needs
in-house and subcontracting the rest.
Most IDMs are not willing to invest in new
packaging lines - especially not for automotive
advanced packaging, which requires a substantial
investment in terms of tools, qualification,
and workforce. In 2018, 65% of the $5.1B
total calculated for automotive packaging was
generated by IDMs, led by NXP and followed
by Infineon and Renesas. In the future, Infineon,
due to its acquisition of Cypress, may challenge
NXP’s leading position.
Legacy packages
97%
$5 114M
Legacy packages
94%
Advanced
packages
6%
Advanced
packages
3%
$8 988M
2018 2024
CAGR2018-2024: 10%
56. AUTOMOTIVE PACKAGING: MARKET AND TECHNOLOGIES TRENDS 2019
AUTOMOTIVE SUPPLY CHAIN CHANGES
Automotive trends, the introduction of new systems
like high-performance computing units and the need
for higher in-car cyber security, are few reasons
behind potential supply chain changes in the future.
Conventional car makers like Audi, Toyota, and
Volkswagen will lead the consumer automotive
business, while so-called “service providers” like
Uber, Lyft, Waymo, and Baidu will spearhead the
robotic vehicle supply chain.
Besides car makers, if we descend the supply chain
pyramid we find system makers that can also be
module makers - for example, Denso and Delphi.
Component and module makers, which include
companies like Infineon, NXP, Bosch, and others, are
the next link in the supply chain, following companies
offering manufacturing and packaging services:
TSMC, Amkor, ASE, and UTAC.
Different supply chain scenarios are possible.
Manufacturing and service companies will be less
impacted, since car makers will continue relying
on them. One possible mid-term scenario calls for
expanded involvement of car makers in the supply
chain, bypassing system makers and working directly
with component and module makers. This scenario
is supported by the need for a smaller supply chain,
with higher engagement in developing the hardware
for specific applications directly linked to vehicle
security. This is similar to what Toyota is doing with
Denso, and what Audi is researching.
Another approach is one where the car maker
integrates the entire supply chain in-house, with the
exception of manufacturing and packaging. Tesla is
trying to create this scenario by internally developing
some of the hardware and software for its cars. This
path is risky and costly, and should only be attempted
either through very close partnerships and/or MA.
In the short-term, the automotive supply chain will
not change drastically - but we should become more
aware of some business models than others, based
on future activities.
More details are provided in this report, along with
an analysis of ecosystems, by application.
OSATs accounted for $1.79B (or 35%) of the
automotive packaging market. The unquestioned
leader is AMKOR with 47% market share, with
ASE far behind at 21%. AMKOR reached the
summit in part because of its 2015 acquisition of
J-Devices. If AMKOR’s competitors are willing to
mount a challenge, the fastest way to do so is by
imitating AMKOR’s approach to MA. Without
such an effort, AMKOR’s domination will only
grow stronger: a scenario in which there is one
major player and then “the rest”.
Yole Développement expects OSAT market share
to increase in the next five years. A potential
scenario by 2024 is one where both business models
have similar automotive packaging market share.
Automotive packaging market share 2018 – 2024: IDMs vs. OSATs
(Yole Développement, November 2019)
Automotive indsutry supply chain
(Yole Développement, November 2019)
Amkor
$842M
ASE
$380M
STATS ChipPAC $100M
UTAC $142M
Carsem $112M
KYEC $61M
Kingpak $53M
Others $100M
NXP
$616M
Infineon
$527M
Renesas
$504M
Texas Instruments
$442M
STMicroelectronics
$403M
Bosch $288M
ON Semiconductor $249M
Others $295M
OSATs
35%
IDMs
65%
2018
OSAT
47%
IDM
53%
$8 988M
2024
CAGR2018-2024: 10%
$5 114M
Car makers
System makers
(tier 1)
Module makers
Component makers
Manufacturing services and OSATs
*Non-exhaustive list of companies
Car
services
57. COMPANIES CITED IN THE REPORT (non exhaustive list)
ASE, Amkor, ams, Analog Devices, Apple, ATS, Audi, Autoliv, BAIC, Baidu, Benewake, Build
Your Dreams, BMW, Bosch, Brightek, Brillance Auto Group, Broad-Ocean, CammSys, Cepton,
Cheng-Tech, Chery Automotive, CHJ Automotive, Citroën, Continental, Daihatsu, Daimler, Dajun
Technologies, Delphi, DeNA, Denso, DEPO, Didi Chuxing, Discovery Semiconductor, Dongfeng
Motor Corporation, Dynex Semiconductors, Edison Automotive, EM Microelectronics, Everlight
Electronics, Excelitas Technologies, Finisar, FAW Group, Ford, Fuji Electric, Galaxycore, Geely,
General Motors, Genesis Photonics, Gentex, Google, Hamamatsu, Heller Automotive, Hesai,
Himax, Hitachi, Honda, Hongli Zhihui, Honeywell, Huayu Automotive System, Hynix, Hyundai,
Ichikoh Industries, II-VI Incorporated, IMI, Insemi Technology Services, Infineon, Innoviz, Inovance,
INVT, Jabil Circuit, Jaguar, JCET, JEE Automation Equipment, JJE Automotive, Kingpak Technology,
Koito Manufacturing, KOSTAL, LeddarTech, LeiShen Intelligent System, LG Innotek, Lumentum,
Lingsen, Lumileds, Lyft, Magna International, Mando, Mazda, Mercedes-Benz, Mitsubishi Electric,
nepes, Nichia, Nidec, NIO, Nissan, NXP, OLSA, OmniVision Technologies, ON Semiconductor,
Optotech, Orsam, Ouster, Panasonic, Philips, Pixelplus, Powertech Technology, Renault, Robosense,
Samsung Electro-Mechanics, Samsung, Semikron, SensL, Seoul Semiconductor, SAIC Motor, Sony,
Spectrolab, SPIL, Stanley, STATS ChipPAC, STMicroelectronics, Sure Start, Texas Instruments,
Tesla, Thorlabs, Tong Hsing Electronics, Toshiba, TowerJazz, Toyota, Transdev, TriLumina, TRW
Automotive, United Automotive Electronic Systems, Uber, Ushio, Valeo, Velodyne LiDAR,
Volkswagen, Waymo, Wuhu sensortech Intelligent Technology, xFab, and more…
MARKET TECHNOLOGY REPORT
Table of contents 3
Report scope and objectives 5
What we got right, what we got wrong 9
What electronic devices are considered
in the report 10
Executive summary 14
Introduction 67
The major news since 2018
Automotive market, trends and changes
Automotive packaging, trends, changes and
challenges
Vehicle electrification 87
Trends, market challenges
Vehicle autonomy 97
Trends, market challenges
Automotive packaging 104
Automotive packages analysed in this report
Automotive packaging landscape and global
market
Automotive electronic chips in a car, 2019
vs 2024 comparison
Automotive electronic chips packaging ASP,
2018 vs 2024 comparison
Automotive packaging, mainstream vs
advanced packaging
Automotive packaging market repartition
by application
Automotive packaging per application 117
Trends and markets: CIS, LiDAR, radar
and connectivity, MEMS and sensors, LED
lighting, computing, memory, power devices
Automotive ecosystem and supply chain 229
Ecosystem by application
Automotive industry mutation
Automotive supply chain possible change
scenarios (short - mid - long-term scenarii)
IDM vs OSAT automotive packaging battle
IDM vs OSAT packaging market share
Top automotive OSAT packaging revenue
market share
Report conclusions 253
Yole Développement presentation 269
TABLE OF CONTENTS (complete content on i-Micronews.com)
• Status of the Advanced Packaging Industry 2019
• Status of Advanced Substrates 2019
• Imaging for Automotive 2019
• LiDAR for Automotive and Industrial
Applications 2019
• Artificial Intelligence Computing for
Automotive 2019
• Radar and Wireless for Automotive: Market
and Technology Trends 2019
Find all our reports on www.i-micronews.com
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AUTHOR
Mario Ibrahim is a Technology Market
Analyst - Advanced Packaging, and a member
of the Semiconductor Software division at
Yole Développement (Yole). Mario engages
in the development of technology market
reports and the production of custom
consulting studies. He is also deeply involved
in test activities business development
within the division. Prior to Yole, Mario
was engaged in test activities development
for LEDs at Aledia, and oversaw several
advanced packaging RD programs. During
his five-year stay, he developed strong
technical and managerial expertise in
different semiconductor fields. Mario also
spent three years at STMicroelectronics
(Grenoble) within the Imaging division,
where he contributed to test benches park
automation within the Test Validation
team. Mario holds an Electronics Engineering
degree from Polytech Grenoble (France).
REPORT OBJECTIVES
• Offer a global overview of the automotive market and trends
• Show the impact of automotive mega-trends, and trends in the automotive semiconductor ecosystem
• Provide an overview of automotive electronics and packaging
• Furnish updated market data forecasts for different automotive applications, and their
packaging (units and revenue): CIS / LiDAR / radar / connectivity / MEMS and sensors / memory /
computing / power / LED
• Identify the key players and their automotive ecosystems
• Discuss the possible scenarios for the automotive supply chain’s future evolution
• Compare the packaging market share of IDMs vs. OSATs
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+81-80-4371-4887 – onozawa@yole.fr
• Greater China - Mavis Wang:
+886 979 336 809 – wang@yole.fr
• Korea - Peter OK:
+82 10 4089 0233 – peter.ok@yole.fr
• Specific inquiries: +33 472 830 180 – info@yole.fr
(1)
Our Terms and Conditions of Sale are available at
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The present document is valid 24 months after its publishing date:
November 7, 2019
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Founded in 1998, Yole Développement (Yole) has grown to become a group of companies providing marketing, technology and strategy consulting, media and
corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using
silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 120 collaborators worldwide covering MEMS and image
sensors, Compound semiconductors, RF Electronics, Solid-state lighting, Displays, Software, Optoelectronics, Microfluidics Medical, Advanced Packaging,
Manufacturing, Power Electronics, Batteries Energy Management and Memory.
The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting,
PISEO, KnowMade and Blumorpho, supports industrial companies, investors and RD organizations worldwide to help them understand markets and follow
technology trends to grow their business.
CONSULTING AND ANALYSIS
• Market data research, marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering costing
• Patent analysis
• Design and characterization of innovative optical systems
• Financial services (due diligence, MA with our partner)
More information on www.yole.fr
MEDIA EVENTS
• i-Micronews.com website, application related e-newsletter
• Communication webcast services
• Events: TechDays, forums…
More information on www.i-Micronews.com
REPORTS
• Market technology reports
• Patent investigation and patent infringement risk analysis
• Structure, process and cost analysis and teardowns
• Cost simulation tool
More information on www.i-micronews.com/reports
CONTACTS
For more information about :
• Consulting Financial Services: Jean-Christophe Eloy (eloy@yole.fr)
• Reports Monitors: David Jourdan (jourdan@yole.fr) Fayçal Khamassi
(khamassi@yole.fr)
• Marketing Communication: Camille Veyrier (veyrier@yole.fr)
• Public Relations: Sandrine Leroy (leroy@yole.fr)