Apple integrates in its smartphone the innovative Film Bulk Acoustic Resonators developed by Avago After a first introduction of Avago’s power amplifier in the iPhone 4S and an integration in iPhone 5 series, Apple integrates again Avago’s LTE Mid Band Front-End Module in the iPhone 6s series. With the acquisition of Broadcom (Apple’s Wifi FEM first suppliers), Avago becomes a top competitor in wireless communication thanks to its FBAR BAW filter knowledge. Located on the main board of the smartphone, the Front-End Module of the Apple iPhone 6s Plus for mid-band LTE application is a complete Front-End Module. The component is made with several filter dies, assembled on a coreless PCB substrate. The filters are hermetically wafer-level packaged with Avago’s Microcap bonded-wafer CSP technology allowing the assembly of all components of the Front-End Module on the same chip with an area of less than 35 mm². More information on that report at http://www.i-micronews.com/reports.html

1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not
bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The
quoted trademarks are property of their owners.
© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
www.systemplus.fr
21 rue la Nouë Bras de Fer
44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr
March 2016 – Version 1 – Written by Stéphane ELISABETH

2. Avago AFEM-8030
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Glossary
1. Overview / Introduction 4
– Executive Summary
– Reverse Costing Methodology
2. Company Profile 7
– Avago Technologies
– Mobile Data Front-End Module Details
3. Physical Analysis 12
– Synthesis of the Physical Analysis
– Apple iPhone 6s Plus Disassembly 14
– iPhone Opening
– Die Removal
– Packaging 17
– View, Dimensions & Marking
– Package Opening
– FEM Cross-Section
– Active device 22
– RF Front-End Active Components
– LNA Overview
– SPDT Switch Overview
– RFIC Overview
– Filter Die 27
– Filter Die Function
– SAW Filter die 29
– Die Dimension
– SAW Filter Cap Details
– SAW Filter Details
– SAW Filter Contact Details
– SAW Filter Die Cross-Section
– FBAR BAW Filter die 36
– Dies Dimensions
– Die Opening
– FBAR-BAW Filter Die Cross-Section
– FBAR-BAW Filter Cross-Section TSV
– FBAR-BAW Filter Cross-Section Au/Au
Bonding
– FBAR-BAW Filter Cross-Section
Membrane
– FBAR-BAW Filter Physical Data Summary
4. Manufacturing Process Flow 50
– Component Process Flow
– Component Fabrication Unit
– MEMS FBAR Filter Process Flow
– MEMS FBAR Filter Wafer Fabrication Unit
– MEMS Filter : FBAR-BAW Process Flow
– MEMS Filter : Cap Process Flow
– MEMS Filter : Bonding & TSV Process Flow
– Component Packaging
5. Cost Analysis 67
– Synthesis of the cost analysis
– Main steps of economic analysis
– Yields Hypotheses
– MEMS Wafer Front-End Cost
– MEMS Front-End Cost
– MEMS Wafer Cost
– MEMS Die Cost
6. Estimated Price Analysis 80
– Manufacturer Financial Ratios
– AFEM-8030 Estimated Selling Price
7. BAW Filter Comparison 84
Contact 90

3. Avago AFEM-8030
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• This full reverse costing study has been conducted to provide insight on technology data,
manufacturing cost and selling price of the Avago AFEM-8030.
• Avago AFEM-8030 is a front-end module LTE band device aimed at use in Apple iPhone 6s Plus.
• The AFEM-8030 features power amplifier and filtering in different LTE band manufactured with Avago
proprietary film bulk acoustic resonator (FBAR) process and microcap technology.
• The analysis is focused on FBAR BAW filter.
• Microcap corresponds to the wafer level packaging of the FBAR filters. The Microcap process uses
gold plated Through Silicon Vias (TSV) in the cap to report electrical contacts and gold-gold thermo-
compression wafer bonding to ensure an hermetic sealing.
• Based on complete physical analysis of the AFEM-8030 component, this report provides the
manufacturing cost of the BAW filter die. It will be compared to the Qorvo TQF-6405.
• The TQF-6405 have been found also in the Apple iPhone 6s Plus. The analysis of the TQF-6405 is
available in a separate report.

4. Avago AFEM-8030
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© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 4
Main Board (Top Side)
LTE FEM area
• The front-end module from Avago is located on the
main board. Two other front-end module working on
different band are close to it: SKY77812 from Skyworks
for Low band LTE Tx/Rx, and Qorvo (merged from RF
MicroDevice and Triquint) TQF6405 for High band LTE
Tx/Rx.

5. Avago AFEM-8030
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© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 5
• Package Type : 40-pin LGA
• Dimensions : 4.8 x 6.7 x 0.9 mm (32mm² x 0.9 mm)
• Pin Pitch : 0.5 mm
• Marking : AFEM-8030
KA1527
KA020
Package Top view
Package Side view
Package Bottom view

6. Avago AFEM-8030
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7. Avago AFEM-8030
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8. Avago AFEM-8030
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9. Avago AFEM-8030
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10. Avago AFEM-8030
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11. Avago AFEM-8030
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12. Avago AFEM-8030
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13. Avago AFEM-8030
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14. Avago AFEM-8030
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15. Avago AFEM-8030
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23. Avago AFEM-8030
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24. Avago AFEM-8030
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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates
completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the
manufacturing cost (if all parameters are cumulated).
These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:
o Consulting and Specific Analysis
– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.
Email: laferriere@yole.fr
– Europe: Lizzie Levenez, Europe Middle East and Africa Business Development Manager, Yole Développement
Email: levenez@yole.fr
– Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.
Email: katano@yole.fr
– RoW: Jean-Christophe Eloy, President & CEO, Yole Développement
Email: eloy@yole.fr
o Report business
– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.
Email: laferriere@yole.fr
– Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service
Email: khamassi@yole.fr
– Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.
Email: onozawa@yole.fr
– Korea: Hailey Yang, Business Development Manager, Korean Office
Email: yang@yole.fr
o Financial services
– Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr
o General: Email: info@yole.fr