This is a reverse engineering report of the STMicroelectronics MP34DT01 omnidirectional digital microphone. Details include a full description, tear down analysis and 3D model of the MEMS microphone with cross-sections and SEM images. The reports also includes a full review of the packaging strategy and a description of the sensor assembly process. Furthermore the report has 40 descriptive images, background on the application, performance specifications, interconnect strategies, materials used, EMC strategy description, an electrical schematic, chip attachment means, strengths and weaknesses of the design and links to the patent, data sheets and more.
The report is extremely useful for engineers and business leaders looking to better understand MEMS microphone design, packaging and assemblies processes. It is also beneficial within the MEMS microphone community as a competitive analysis tool.