This 150-page report provides a full reverse costing analysis of Freescale's FXTH87 Tire Pressure Monitoring Sensor (TPMS). The report includes a detailed teardown analysis of the package, ASIC die, MEMS pressure sensor die, and MEMS accelerometer die. Manufacturing process flows are established for the ASIC front-end, MEMS pressure sensor, and MEMS accelerometer. Cost analyses are conducted for the various components and manufacturing steps. The report also provides a cost comparison with Infineon's competing SP37 TPMS solution and analyzes the evolution of Freescale's previous-generation TPMS devices.
Aerospace performance integrated into a tactical-grade 6-axis IMU for industrial applications.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/honeywell-hg4930ca51-6-axis-mems-inertial-sensor/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
Digital Signal Processing[ECEG-3171]-L00Rediet Moges
This Digital Signal Processing Lecture material is the property of the author (Rediet M.) . It is not for publication,nor is it to be solded.
#Africa#Ethiopia
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
MEMS Pressure Sensor Market and Technologies 2018 Report by Yole DeveloppementYole Developpement
Automotive and consumer applications are propelling the MEMS pressure sensor business to new heights.
More information on that report at https://www.i-micronews.com/report/product/mems-pressure-sensor-market-and-technologies-2018.html
MEMS-Application, Functionality, Fabrication process and limitations, MEMS as a switch, MEMS packaging and proposed mems switches for microwave circuit switch.
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
Aerospace performance integrated into a tactical-grade 6-axis IMU for industrial applications.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/honeywell-hg4930ca51-6-axis-mems-inertial-sensor/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
Digital Signal Processing[ECEG-3171]-L00Rediet Moges
This Digital Signal Processing Lecture material is the property of the author (Rediet M.) . It is not for publication,nor is it to be solded.
#Africa#Ethiopia
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
MEMS Pressure Sensor Market and Technologies 2018 Report by Yole DeveloppementYole Developpement
Automotive and consumer applications are propelling the MEMS pressure sensor business to new heights.
More information on that report at https://www.i-micronews.com/report/product/mems-pressure-sensor-market-and-technologies-2018.html
MEMS-Application, Functionality, Fabrication process and limitations, MEMS as a switch, MEMS packaging and proposed mems switches for microwave circuit switch.
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
Bulk GaN Substrate Market 2017 Report by Yole DeveloppementYole Developpement
Optoelectronics applications are driving the bulk GaN substrate market
Optoelectronics applications, particularly GaN-based laser diodes and GaN-on-GaN LEDs, are expected to drive the bulk GaN susbtrate market from 2016 - 2022.
Specific to the laser diode market, the Blu-ray segment, which in the past was the GaN-based laser industry’s main driver, continues to decline. In recent years, a much greater percentage of movies were viewed via streaming than on optical discs, and in many cases flash memory is replacing optical discs and magnetic storage. The current crop of mobile phones, netbooks, tablets, and even laptops lack a Blu-ray/DVD/CD drive. UHD Blu-ray’s recent development is expected to have only a novelty effect on sales - not enough to reverse the general downward trend we will see in the coming years. However, decreasing Blu-ray demand is expected to be offset by nascent, growing segments like projectors (office projector, mobile pico projector, head-up display (HUD), etc.) and automotive lighting, leading to new growth opportunities for bulk GaN substrates.
In the LED market, improvements in GaN substrate manufacturing have lowered substrate prices enough for various niche LED applications. In addition to Soraa (US) and Panasonic (JP), this seems to have revived the interest of other LED manufacturers which are beginning to seriously consider using GaN substrates for either spotlighting or automotive lighting. New GaN-on-GaN LED players are expected in the market in the coming years.
For more information, please visit our website: http://www.i-micronews.com/reports.html
This document discusses op-amp clipper circuits. It begins by introducing op-amps and their applications. It then defines a clipper as a circuit that prevents an output from exceeding a voltage level without distorting the waveform. The document discusses positive and negative clipper circuits using op-amps and diodes. It provides examples of clipped waveforms and describes applications of clipper circuits such as protecting radio transmitters and integrated circuits.
Power GaN 2018: Epitaxy, Devices, Applications and Technology Trends report b...Yole Developpement
GaN market growth is fed by Lidar, wireless charging and fast charging solutions.
More information on : https://www.i-micronews.com/category-listing/product/power-gan-2018-epitaxy-devices-applications-and-technology-trends.html
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
This document discusses the broadside array antenna. It is composed of half-wave dipoles spaced half a wavelength apart and connected to each other and a transmission line to ensure proper signal phasing. This antenna produces a highly directional radiation pattern that is perpendicular to the plane of the array. A broadside array is a linear array where the elements contribute equal amplitude and phase electromagnetic fields and the radiation pattern is bidirectional at right angles to the plane of the array. Typical broadside arrays have antenna lengths between 2 to 10 wavelengths with typical spacing of half a wavelength or one wavelength.
Applications Generated from a MEMS-based Laser Beam Scanning Technology PlatformMicroVision
At this year's MEMS Engineer Forum, MicroVision's Director of Product Engineering, Jari Honkanen, spoke on Applications Generated from a MEMS-based Laser Beam Scanning
MEMS Microphone: Market, Applications and Business Trends 2014 2014 Report by...Yole Developpement
New opportunities and emerging applications continue to boost the MEMS microphone market with strong new players
MEMS MICROPHONE MARKET GROWTH WILL CONTINUE TO SOAR OVER THE NEXT SEVERAL YEARS
MEMS microphone market has been growing since its first appearance. The huge worldwide adoption of smartphones, each using more than one MEMS microphone, creates the wide integration and rocketing growth of the MEMS microphone market. Some smartphones are now using three microphones: one for voice capture, one or two for noise cancellation and one for voice recognition improvement.
The Internet of Things (IoT) and wearable electronics applications are emerging markets for MEMS microphones: new opportunities will create new momentum in this fast growing business. Smart watch, smart glasses, smart home & building, and vehicle voice control will be promising applications in the next few years.
Yole Développement believes that the MEMS microphone will remain one of the fastest growing MEMS components due to existing and new opportunities. The market will grow from $785M in 2013 to $1.65B by 2019. Shipments are expected to grow from 2.4B in 2013 to 6.6B units in 2019 which points to a market filled with opportunities for existing and new players.
In this report, Yole Développement has completely re-examined and updated the MEMS microphone market data to provide you with a clear 2013 to 2019 market forecast.
Medical and automotive MEMS microphone markets will grow, but the current markets are still small. The Internet of Things will definitely result in new opportunities for the automotive market. MEMS microphones facilitate man-machine communication and enable voice detection and control to make devices more effective. Increased device effectiveness will lead to greater opportunity.
In this report, we will provide a complete overview of traditional applications – mobile phone, notebook, camera and tablet, other consumer electronics, medical applications, and automotive applications – as well as identify emerging applications.
KNOWLES IS STILL ALIVE AND KICKING, BUT COMPETITION IS INCREASING!
The MEMS microphone market is huge and has many opportunities. Big players compete with different approaches and new comers keep entering the market.
The market is changing: Knowles’ domination is weakening; it has about 61% of the market now down from the 83% it had in 2010. However, total market expansion has increased Knowles’ MEMS microphone revenue from $173.5M in 2010 to $477M in 2013.
Even though Knowles is still the market leader, other players are competing to take its market share. However compared to 2012, Knowles managed to regain some market share in 2013: iPhone 5S and 5C are using two microphones from Knowles and one from AAC Technologies (AAC). Other players still have a long way to go if they want to take market share from Knowles...
Market Microsystems and bioMEMS for healthcare applications: opportunities an...Yole Developpement
MEMS top players are not very involved in bioMEMS: they prefer high-volumes markets. Low production volumes in medical applications don’t allow to fill large MEMS fabs. The emergence of consumer healthcare will open high volumes opportunities for bioMEMS. The success of this new market depends on how the industry manages the challenges.
Healthcare is changing with social evolution and new technologies
bioMEMS are increasingly used: new components, new applications
Significant challenges along with great opportunities on niche markets
Shift towards consumer healthcare is going to change the game with much higher volumes…
But not yet! Too many barriers are still preventing consumer health care to explode
More information on that report at http://www.i-micronews.com/reports.html
Transphorm TPH3002PS 600V GaN on Silicon HEMT 2015 teardown reverse costing r...Yole Developpement
High voltage GaN HEMT developed for the high frequency operation in a low-inductance source terminal TO220 package
The TPH3002PS is a 600V EZ-GaN™ HEMT for high frequency operations from Transphorm. Manufactured by Fujitsu and assembled in a TO220 package, it features the Quiet-TabTM scheme which increases switching speed by 200%. With a 7.5ns turn-on and a 10ns turn-off, the TPH3002PS has a higher switch frequency than the best CoolMOS.
The TPH3002PS is based on a cascode configuration of a GaN on Silicon HEMT transistor to hold the high voltage and a standard low voltage MOSFET to drive high frequency and to make a normally-off transistor from a normally-on GaN HEMT.
The device is assembled in a TO220 package for an easy integration in converter electronic system. Moreover, it integrates a Quiet-Tab™ and a Gate-Source-Drain (GSD) pin-out arrangement in order to reduce the parasitic inductance and capacitance in high frequency and to allow 200% increase in switching speed compared to traditional TO-220.
The report presents a deep technology analysis of the packaging and the components with TEM images of the complex GaN epitaxy layer stack and transistor structure.
It also includes production cost analysis and overall comparison with GaN Systems GS66508P 650V HEMT.
More information on that report at http://www.i-micronews.com/reports.html
OIF's Network Operator Working Group Chair Junjie Li spoke on delivering 400ZR, FlexE, and 112Gbps electrical to the datacom/telecom industry on September 4, 2019 during CIOE(China International Optoelectronic Exposition) event?
#400ZR #FlexE #112G #datacom #telecom #interoperability
The 1st generation 1200V SiC MOSFET device from STMicroelectronics has good current density at a very competitive cost
The STC30N120 is the first generation 1200V SiC MOSFET device from STMicroelectronics. The device has a planar structure and a design that allows good electrical performance, such as high current density. Moreover, the supply chain and manufacturing choices lead to a very competitive cost.
The device is suitable for high power applications like motor drives, inverters, DC-DC converters and power supplies.
The STC30N120 integrates first generation high-voltage SiC power MOSFET dies in a dedicated discrete package.
The device is assumed to operate at very high temperature, up to 200°C, and to have an on-resistance of 90mΩ, with generally standard SiC manufacturing technology.
The report goes into depth in its analysis of the packaging and the components, with images of the complex planar SiC structure.
It also includes production cost analysis and detailed comparison with Rohm and Wolfspeed’s SiC MOSFETs and with 1200V silicon IGBTs. The comparison highlights differences in the electrical parameters, supply chain and production cost.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Status of the Power Module Packaging Industry 2019 - Yole DéveloppementYole Developpement
Major evolutions in substrate, interconnection, and die-attach technologies, driven by EV/HEV, are transforming the power module packaging supply chain.
More information on: https://www.i-micronews.com/products/status-of-the-power-module-packaging-industry-2019/
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
1200V Silicon IGBT vs SiC MOSFET Comparison 2018system_plus
Technology and cost analysis of thirteen silicon IGBTs and eight SiC MOSFETs from eight different manufacturers shows their potential.
More information on that report at: http://www.systemplus.fr/fr/reverse-costing-reports/1200v-silicon-igbt-vs-sic-mosfet-comparison-2018/
MEMS microphone Patent Infringement April 2015 report published by Yole Devel...Yole Developpement
This report provides a technology and patent infringement risk analysis of recent MEMS microphones from four suppliers: Knowles, STMicroelectronics/Omron, AAC Technologies/Infineon Technologies, and InvenSense/Analog Devices. The report analyzes the microphones' features and manufacturing processes, identifies relevant patents held by the suppliers, and evaluates the potential risks of patent infringement between the suppliers. It aims to understand the links between the suppliers' patented technologies and marketed products, and identify features that require further legal assessment regarding infringement risks.
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
Advanced RF SiP for Cellphones 2017 report from Yole Développement Yole Developpement
This document is a sample report from Yole Développement titled "Advanced RF SiP for Cell Phones 2017" that discusses packaging technologies and market forecasts for 5G radio frequency system-in-package solutions for smartphones. The report covers topics such as the methodology used, an executive summary of key findings, market drivers and trends related to 5G packaging, disruptions and opportunities in the supply chain, and technology roadmaps and forecasts through 2022 for RF SiP wafers, units, and revenue. It also profiles major players and discusses emerging packaging platforms that could be used for 5G solutions.
This report analyzes the Fairchild FIS1100 6-axis MEMS IMU through reverse costing analysis. The device contains one ASIC die and one MEMS die stacked on a 2-layer PCB package measuring 3.3x3.3x1mm. The MEMS die uses through-silicon vias for electrical connections, allowing for a larger sensing area than previous designs. Manufacturing process steps are estimated for the ASIC, MEMS dies, and packaging. Total estimated manufacturing costs are provided along with comparisons to other leading 6-axis IMUs and an estimated selling price. The analysis is intended to provide insight into the device's technology and costs.
The first MEMS IMU (3-Axis Gyro + 3-Axis Accelero on the same die) from Maxim Integrated (Maxim) in industry thinnest 3x3x0.83mm package
With the same process used for their 3-Axis gyro and acquired from the purchasing of SensorDynamics in 2011, the MAX21100 combines on only one MEMS die a 3-Axis gyroscope and a 3-Axis accelerometer.
The PSM-X2 technology platform used to build the sensor includes a proprietary surface micromachining process and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation and a dual pressure wafer-level capping of the sensors.
Assembled in a LGA 3.0x3.0x0.83mm package, the MAX21100 is a low power consumption (3.45mA) 3-Axis gyroscope plus 3-Axis accelerometer IMU with integrated 9-axis sensor fusion (6+3 DoF) targeted for consumer applications.
The report is including a detailed technical and cost comparison with state of the art 6-Axis MEMS IMUs (3-Axis gyroscope + 3-Axis accelerometer) from STMicroelectronics, Bosch Sensortec and InvenSense. Surprisingly, Maxim is able to provide a very competitive component due to an important silicon area reduction.
Discover all the details in the report!
Bulk GaN Substrate Market 2017 Report by Yole DeveloppementYole Developpement
Optoelectronics applications are driving the bulk GaN substrate market
Optoelectronics applications, particularly GaN-based laser diodes and GaN-on-GaN LEDs, are expected to drive the bulk GaN susbtrate market from 2016 - 2022.
Specific to the laser diode market, the Blu-ray segment, which in the past was the GaN-based laser industry’s main driver, continues to decline. In recent years, a much greater percentage of movies were viewed via streaming than on optical discs, and in many cases flash memory is replacing optical discs and magnetic storage. The current crop of mobile phones, netbooks, tablets, and even laptops lack a Blu-ray/DVD/CD drive. UHD Blu-ray’s recent development is expected to have only a novelty effect on sales - not enough to reverse the general downward trend we will see in the coming years. However, decreasing Blu-ray demand is expected to be offset by nascent, growing segments like projectors (office projector, mobile pico projector, head-up display (HUD), etc.) and automotive lighting, leading to new growth opportunities for bulk GaN substrates.
In the LED market, improvements in GaN substrate manufacturing have lowered substrate prices enough for various niche LED applications. In addition to Soraa (US) and Panasonic (JP), this seems to have revived the interest of other LED manufacturers which are beginning to seriously consider using GaN substrates for either spotlighting or automotive lighting. New GaN-on-GaN LED players are expected in the market in the coming years.
For more information, please visit our website: http://www.i-micronews.com/reports.html
This document discusses op-amp clipper circuits. It begins by introducing op-amps and their applications. It then defines a clipper as a circuit that prevents an output from exceeding a voltage level without distorting the waveform. The document discusses positive and negative clipper circuits using op-amps and diodes. It provides examples of clipped waveforms and describes applications of clipper circuits such as protecting radio transmitters and integrated circuits.
Power GaN 2018: Epitaxy, Devices, Applications and Technology Trends report b...Yole Developpement
GaN market growth is fed by Lidar, wireless charging and fast charging solutions.
More information on : https://www.i-micronews.com/category-listing/product/power-gan-2018-epitaxy-devices-applications-and-technology-trends.html
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
This document discusses the broadside array antenna. It is composed of half-wave dipoles spaced half a wavelength apart and connected to each other and a transmission line to ensure proper signal phasing. This antenna produces a highly directional radiation pattern that is perpendicular to the plane of the array. A broadside array is a linear array where the elements contribute equal amplitude and phase electromagnetic fields and the radiation pattern is bidirectional at right angles to the plane of the array. Typical broadside arrays have antenna lengths between 2 to 10 wavelengths with typical spacing of half a wavelength or one wavelength.
Applications Generated from a MEMS-based Laser Beam Scanning Technology PlatformMicroVision
At this year's MEMS Engineer Forum, MicroVision's Director of Product Engineering, Jari Honkanen, spoke on Applications Generated from a MEMS-based Laser Beam Scanning
MEMS Microphone: Market, Applications and Business Trends 2014 2014 Report by...Yole Developpement
New opportunities and emerging applications continue to boost the MEMS microphone market with strong new players
MEMS MICROPHONE MARKET GROWTH WILL CONTINUE TO SOAR OVER THE NEXT SEVERAL YEARS
MEMS microphone market has been growing since its first appearance. The huge worldwide adoption of smartphones, each using more than one MEMS microphone, creates the wide integration and rocketing growth of the MEMS microphone market. Some smartphones are now using three microphones: one for voice capture, one or two for noise cancellation and one for voice recognition improvement.
The Internet of Things (IoT) and wearable electronics applications are emerging markets for MEMS microphones: new opportunities will create new momentum in this fast growing business. Smart watch, smart glasses, smart home & building, and vehicle voice control will be promising applications in the next few years.
Yole Développement believes that the MEMS microphone will remain one of the fastest growing MEMS components due to existing and new opportunities. The market will grow from $785M in 2013 to $1.65B by 2019. Shipments are expected to grow from 2.4B in 2013 to 6.6B units in 2019 which points to a market filled with opportunities for existing and new players.
In this report, Yole Développement has completely re-examined and updated the MEMS microphone market data to provide you with a clear 2013 to 2019 market forecast.
Medical and automotive MEMS microphone markets will grow, but the current markets are still small. The Internet of Things will definitely result in new opportunities for the automotive market. MEMS microphones facilitate man-machine communication and enable voice detection and control to make devices more effective. Increased device effectiveness will lead to greater opportunity.
In this report, we will provide a complete overview of traditional applications – mobile phone, notebook, camera and tablet, other consumer electronics, medical applications, and automotive applications – as well as identify emerging applications.
KNOWLES IS STILL ALIVE AND KICKING, BUT COMPETITION IS INCREASING!
The MEMS microphone market is huge and has many opportunities. Big players compete with different approaches and new comers keep entering the market.
The market is changing: Knowles’ domination is weakening; it has about 61% of the market now down from the 83% it had in 2010. However, total market expansion has increased Knowles’ MEMS microphone revenue from $173.5M in 2010 to $477M in 2013.
Even though Knowles is still the market leader, other players are competing to take its market share. However compared to 2012, Knowles managed to regain some market share in 2013: iPhone 5S and 5C are using two microphones from Knowles and one from AAC Technologies (AAC). Other players still have a long way to go if they want to take market share from Knowles...
Market Microsystems and bioMEMS for healthcare applications: opportunities an...Yole Developpement
MEMS top players are not very involved in bioMEMS: they prefer high-volumes markets. Low production volumes in medical applications don’t allow to fill large MEMS fabs. The emergence of consumer healthcare will open high volumes opportunities for bioMEMS. The success of this new market depends on how the industry manages the challenges.
Healthcare is changing with social evolution and new technologies
bioMEMS are increasingly used: new components, new applications
Significant challenges along with great opportunities on niche markets
Shift towards consumer healthcare is going to change the game with much higher volumes…
But not yet! Too many barriers are still preventing consumer health care to explode
More information on that report at http://www.i-micronews.com/reports.html
Transphorm TPH3002PS 600V GaN on Silicon HEMT 2015 teardown reverse costing r...Yole Developpement
High voltage GaN HEMT developed for the high frequency operation in a low-inductance source terminal TO220 package
The TPH3002PS is a 600V EZ-GaN™ HEMT for high frequency operations from Transphorm. Manufactured by Fujitsu and assembled in a TO220 package, it features the Quiet-TabTM scheme which increases switching speed by 200%. With a 7.5ns turn-on and a 10ns turn-off, the TPH3002PS has a higher switch frequency than the best CoolMOS.
The TPH3002PS is based on a cascode configuration of a GaN on Silicon HEMT transistor to hold the high voltage and a standard low voltage MOSFET to drive high frequency and to make a normally-off transistor from a normally-on GaN HEMT.
The device is assembled in a TO220 package for an easy integration in converter electronic system. Moreover, it integrates a Quiet-Tab™ and a Gate-Source-Drain (GSD) pin-out arrangement in order to reduce the parasitic inductance and capacitance in high frequency and to allow 200% increase in switching speed compared to traditional TO-220.
The report presents a deep technology analysis of the packaging and the components with TEM images of the complex GaN epitaxy layer stack and transistor structure.
It also includes production cost analysis and overall comparison with GaN Systems GS66508P 650V HEMT.
More information on that report at http://www.i-micronews.com/reports.html
OIF's Network Operator Working Group Chair Junjie Li spoke on delivering 400ZR, FlexE, and 112Gbps electrical to the datacom/telecom industry on September 4, 2019 during CIOE(China International Optoelectronic Exposition) event?
#400ZR #FlexE #112G #datacom #telecom #interoperability
The 1st generation 1200V SiC MOSFET device from STMicroelectronics has good current density at a very competitive cost
The STC30N120 is the first generation 1200V SiC MOSFET device from STMicroelectronics. The device has a planar structure and a design that allows good electrical performance, such as high current density. Moreover, the supply chain and manufacturing choices lead to a very competitive cost.
The device is suitable for high power applications like motor drives, inverters, DC-DC converters and power supplies.
The STC30N120 integrates first generation high-voltage SiC power MOSFET dies in a dedicated discrete package.
The device is assumed to operate at very high temperature, up to 200°C, and to have an on-resistance of 90mΩ, with generally standard SiC manufacturing technology.
The report goes into depth in its analysis of the packaging and the components, with images of the complex planar SiC structure.
It also includes production cost analysis and detailed comparison with Rohm and Wolfspeed’s SiC MOSFETs and with 1200V silicon IGBTs. The comparison highlights differences in the electrical parameters, supply chain and production cost.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Status of the Power Module Packaging Industry 2019 - Yole DéveloppementYole Developpement
Major evolutions in substrate, interconnection, and die-attach technologies, driven by EV/HEV, are transforming the power module packaging supply chain.
More information on: https://www.i-micronews.com/products/status-of-the-power-module-packaging-industry-2019/
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
1200V Silicon IGBT vs SiC MOSFET Comparison 2018system_plus
Technology and cost analysis of thirteen silicon IGBTs and eight SiC MOSFETs from eight different manufacturers shows their potential.
More information on that report at: http://www.systemplus.fr/fr/reverse-costing-reports/1200v-silicon-igbt-vs-sic-mosfet-comparison-2018/
MEMS microphone Patent Infringement April 2015 report published by Yole Devel...Yole Developpement
This report provides a technology and patent infringement risk analysis of recent MEMS microphones from four suppliers: Knowles, STMicroelectronics/Omron, AAC Technologies/Infineon Technologies, and InvenSense/Analog Devices. The report analyzes the microphones' features and manufacturing processes, identifies relevant patents held by the suppliers, and evaluates the potential risks of patent infringement between the suppliers. It aims to understand the links between the suppliers' patented technologies and marketed products, and identify features that require further legal assessment regarding infringement risks.
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
Advanced RF SiP for Cellphones 2017 report from Yole Développement Yole Developpement
This document is a sample report from Yole Développement titled "Advanced RF SiP for Cell Phones 2017" that discusses packaging technologies and market forecasts for 5G radio frequency system-in-package solutions for smartphones. The report covers topics such as the methodology used, an executive summary of key findings, market drivers and trends related to 5G packaging, disruptions and opportunities in the supply chain, and technology roadmaps and forecasts through 2022 for RF SiP wafers, units, and revenue. It also profiles major players and discusses emerging packaging platforms that could be used for 5G solutions.
This report analyzes the Fairchild FIS1100 6-axis MEMS IMU through reverse costing analysis. The device contains one ASIC die and one MEMS die stacked on a 2-layer PCB package measuring 3.3x3.3x1mm. The MEMS die uses through-silicon vias for electrical connections, allowing for a larger sensing area than previous designs. Manufacturing process steps are estimated for the ASIC, MEMS dies, and packaging. Total estimated manufacturing costs are provided along with comparisons to other leading 6-axis IMUs and an estimated selling price. The analysis is intended to provide insight into the device's technology and costs.
The first MEMS IMU (3-Axis Gyro + 3-Axis Accelero on the same die) from Maxim Integrated (Maxim) in industry thinnest 3x3x0.83mm package
With the same process used for their 3-Axis gyro and acquired from the purchasing of SensorDynamics in 2011, the MAX21100 combines on only one MEMS die a 3-Axis gyroscope and a 3-Axis accelerometer.
The PSM-X2 technology platform used to build the sensor includes a proprietary surface micromachining process and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation and a dual pressure wafer-level capping of the sensors.
Assembled in a LGA 3.0x3.0x0.83mm package, the MAX21100 is a low power consumption (3.45mA) 3-Axis gyroscope plus 3-Axis accelerometer IMU with integrated 9-axis sensor fusion (6+3 DoF) targeted for consumer applications.
The report is including a detailed technical and cost comparison with state of the art 6-Axis MEMS IMUs (3-Axis gyroscope + 3-Axis accelerometer) from STMicroelectronics, Bosch Sensortec and InvenSense. Surprisingly, Maxim is able to provide a very competitive component due to an important silicon area reduction.
Discover all the details in the report!
The first 3-Axis MEMS Gyroscope to meet Automotive AEC-Q100 qualification
MEMS are getting broadly adopted in the automotive industry and non-safety applications like in-dash navigation are now requiring low-cost and small footprint components.
The A3G4250D is a low power consumption MEMS gyroscope which is the first 3-axis gyroscope to have met the industry-standard qualification for automotive integrated circuits (AEC-Q100).
This 3-axis gyroscope for automotive applications measures angular rates up to ±245 dps. It has been designed and produced using the same manufacturing process (THELMA) than consumer products in order to get full benefit of STMicroelectronics 10 years of consumer electronic market.
Assembled in a 4.0 x 4.0 x 1.1mm package, it embeds an 8-bit temperature sensor and operates within an extended temperature range from -40 to 85°C.
It is suitable for applications including in-dash navigation, telematics and vehicle tolling systems, motion control with MMI (man-machine interface), appliances and robotics.
Discover the first MEMS device using TSV in ASIC and WLCSP to reach the smallest size (only 1.4mm3!)
After being integrated in the latest Apple’s iPhone in 2013, Bosch is now the top MEMS supplier according to Yole’s Top 30 MEMS Ranking 2014. This strong growth is both due to the consumer and automotive businesses of Bosch.
With a size of only 1.4mm3 (1.2x1.5x0.8mm), the BMA355 is the smallest MEMS accelerometer on the market and features 60% volume reduction compared to state of the art 2x2x0.9mm MEMS accelerometers. This size reduction has been made possible by the use of Through-Silicon Vias (TSVs) in the ASIC, enabling a WLCSP package. All the manufacturing steps are realized at the wafer-level. This is the first introduction of a MEMS component with TSV Via-Middle process.
The BMA355 is a 12-bit digital resolution accelerometer well suited for applications requiring extremely small form factors.
The report is including a detailed technical and cost comparison with state of the art MEMS accelerometers from STMicroelectronics and mCube.
Discover all the details in the report: http://www.i-micronews.com/reports/Bosch-Sensortec-BMA355-3-Axis-MEMS-Accelerometer/1/452/
The first MEMS Gyroscope from Maxim Integrated in the industry smallest 3x3mm package
Following the purchase of MEMS manufacturer SensorDynamics in 2011, Maxim releases its first MEMS Gyroscope reference with a very accurate and cost effective component.
The MAX21000 continues to use the PSM-X2 process jointly developed by SensorDynamics and the Fraunhofer Institute for Silicon Technology. This technology platform includes a proprietary surface micromachining process to build the mechanical structures and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation of the gyro sensor.
Assembled in a LGA 3.0x3.0x0.9mm package, the MAX21000 is a low power consumption (5.4mA) and high accuracy 3-axis gyroscope targeted for mobile applications.
The report is including a detailed technical and cost comparison with state of the art 3x3mm MEMS gyros from STMicroelectronics, Bosch Sensortec and InvenSense. Surprisingly, Maxim is able to provide a very competitive component due to an important silicon are a reduction.
Discover all the details in the report: http://www.i-micronews.com/reports/Maxim-Integrated-MAX21000-3-Axis-MEMS-Gyroscope/1/449/
This reverse costing study analyzes the manufacturing cost and estimated selling price of the STMicroelectronics LSM9DS0 9-axis MEMS IMU component. The LSM9DS0 integrates a 3-axis gyroscope, 3-axis accelerometer, and 3-axis magnetometer. It is produced in a 4x4x1mm LGA 24-pin package. The report details the physical analysis of the device and its dies, the manufacturing processes, and provides a cost analysis that estimates the total cost to be $4.28.
Avago AFEM-8030 Mid Band FEM FBAR-BAW Filter iPhone 6s Plus 2016 teardown rev...Yole Developpement
Apple integrates in its smartphone the innovative Film Bulk Acoustic Resonators developed by Avago
After a first introduction of Avago’s power amplifier in the iPhone 4S and an integration in iPhone 5 series, Apple integrates again Avago’s LTE Mid Band Front-End Module in the iPhone 6s series.
With the acquisition of Broadcom (Apple’s Wifi FEM first suppliers), Avago becomes a top competitor in wireless communication thanks to its FBAR BAW filter knowledge.
Located on the main board of the smartphone, the Front-End Module of the Apple iPhone 6s Plus for mid-band LTE application is a complete Front-End Module. The component is made with several filter dies, assembled on a coreless PCB substrate.
The filters are hermetically wafer-level packaged with Avago’s Microcap bonded-wafer CSP technology allowing the assembly of all components of the Front-End Module on the same chip with an area of less than 35 mm².
More information on that report at http://www.i-micronews.com/reports.html
THE SMALLEST MEMS OSCILLATOR ON THE MARKET ASSEMBLED IN AN INNOVATIVE WAFER LEVEL CHIP SIZE PACKAGE
SiTime presents its first MEMS oscillator assembled in Wafer Level Chip Scale package to get the word smallest (1.2mm2) ultra-low power oscillator for consumer and industrial applications.
SiTime is taking fully benefit of all semiconductor manufacturing processes and infrastructures in order to develop a really compact device and compete with quarts solutions for the same application.
This full Reverse Costing analysis has been conducted to provide insight on technology data, manufacturing cost and selling price of the SiTime SiT1552 low-power 32kHz Temperature Compensated Crystal Oscillator.
The report includes comparisons with SiT8002 Oscillator and with the Dicera DSC8002 and Silicon Lab Si504 Oscillators.
SiTime SiT1552 uses an innovative 1.55x0.85 mm Wafer Level Chip Scale Packaging containing two stacked dies: a MEMS oscillator and an ASIC for signal conditioning. The MEMS oscillator is flipped and connected to the ASIC by solder bumps. The component is protected by a polymeric coating and electrically connected by solder balls. For this new generation oscillator, SiTime has integrated many new technologies in order to be competitive to quartz devices.
The MEMS oscillator is manufactured on SOI wafer using MEMSFirstTM and EpiSealTM processes licensed by Robert Bosch GmbH.
Sensonor STIM210
High-precision MEMS Gyro Module
World highest performance silicon MEMS gyro available without export control.
Tactical grade with bias instability of 0.5°/h in a miniature 33cm3 package.
MEMS gyroscopes for tactical grade applications made a lot of progress in the past few years in term of reliability. They are now accepted in high-reliability environments, and are even starting to replace FOGs and other technologies in tactical applications.
With a bias instability of 0.5°/h, the Sensonor STIM210 is the world highest performance silicon MEMS gyroscope. The module is available without export control (ITAR-free). The analyzed module is a complete system offering 3 axes MEMS gyros associated with a 32-bit microcontroller which provides flexibility in device configuration.
STIM210 applications are typically found within industrial, aerospace and defense markets, for various platform stabilizations, pointing and navigation systems, attitude heading reference systems (AHRSs), inertial navigation systems (INSs), smart munitions, missiles, 3D mapping systems, range finders, trains, robotics, and more. For many applications STIM210 directly replaces FOGs and improves system solutions with respect to robustness, reliability, size, weight, power and cost.
More information on that report at http://www.i-micronews.com/reports/Sensonor-STIM210High-precision-MEMS-Gyro-Module/1/436/
Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer 2015 teardown r...Yole Developpement
Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer
Automotive MEMS Combo
Murata’s Second Generation Combo Sensors for Automotive & Harsh Environments
Murata SCC2000 series sensors are combined accelerometer and gyroscope devices aimed at use in tough environments such as those encountered in automotive and industrial applications. The SCC2000 series has best in class temperature dependency, shock sensitivity and bias stability characteristics and consists of a low-g 3-axis accelerometer with two angular rate sensor options of either X or Z-axis detection.
The SCC2000 series features independent acceleration and angular rate sensing elements manufactured with Murata proprietary High Aspect Ratio (HAR) 3D-MEMS process and using SOI and cavity-SOI (c-SOI) substrates. A single ASIC produced with an advanced BCD process is used.
The acceleration sensing element consists of four acceleration sensitive masses and the angular rate sensing element consists of moving masses that are purposely exited to in-plane drive motion.
The SCC2000 devices are packaged in a SOIC 24-pin premolded plastic housing measuring 15.0x8.5x4.1mm. The combo sensor is compliant to the ISO26262 automotive safety standard and the AEC-Q100 stress test qualification requirements for electronic components used in automotive applications.
SCC2000 series is targeted for applications demanding high stability with tough environmental requirements. Typical applications include: IMUs for highly demanding environments, platform stabilization and control, machine control systems, Electronic Stability Control (ESC), Hill Start Assist (HSA), roll over detection and Navigation systems.
The report includes the analysis of all combo sensors in the SCC2000 series: the SCC2230-E02, SCC2230-D08 and SCC2130-D08. Also a comparison with previous generation SCC1300 series is included.
More information on that report at http://www.i-micronews.com/reports.html
InvenSense ICS-43432 Digital MEMS Microphone teardown reverse costing report...Yole Developpement
Following the acquisition of MEMS Microphone Business Line of Analog Devices for 100M$ in October 2013, InvenSense releases a high performance digital MEMS Microphone for consumer applications.
The ICS-43432 is a digital microphone equipped with MEMS and amplification ASIC into a single chip. It is designed using CMOS process, it has I2S protocol interface and a high SNR of 65 dBA. It is assembled in a 6-pins LGA 4.0 x 3.0 x 1.0mm package with bottom port.
The MEMS transducer is a condenser microphone with a flexible poly-Si membrane and a rigid reference electrode manufactured on SOI substrate. Compared with state of the art MEMS Microphones, it presents a new design of the diaphragm with octagonal shape and central fixation.
The reverse costing report contains a detailed analysis of the device design and process, its manufacturing cost, as well as a benchmark with competitors’ MEMS microphones.
This document provides a reverse costing analysis of the Bosch SMI130 6-Axis MEMS IMU. It begins with an executive summary describing the SMI130's key characteristics. The physical analysis identifies the package and die details. Manufacturing process flow is then examined, including the ASIC front-end, MEMS front-end, and packaging back-end stages. A cost analysis is conducted to estimate production costs. Finally, estimated selling prices are provided based on manufacturer financial ratios. The analysis aims to provide technology and cost insights into this MEMS inertial sensor.
Silicon Labs CMEMS Oscillator teardown reverse costing report by published Yo...Yole Developpement
First fully integrated, monolithic CMOS+MEMS oscillator device
Innovative Poly-SiGe Surface-Micromachining Process
The frequency control market is largely dominated by quartz products, but silicon timing solutions have a strong value proposition for some sub-markets.
The Si504 is the first silicon oscillator from Silicon Labs. Manufactured with the CMEMS process (CMOS + MEMS), the crystal elements are replaced by micromachined semiconductor resonators.
CMEMS process consists in a monolithic integration of a CMOS circuit with innovative Poly-SiGe (polycrystalline silicon-germanium) MEMS resonator structures manufactured directly above CMOS metallization.
The resonator is then vacuum encapsulated with a silicon cap using an eutectic wafer bonding process.
With a die size below 1mm², the Si504 is optimized to support high-volume, low-cost applications such as consumer electronics market.
More information on that report at http://www.i-micronews.com/reports/Silicon-Labs-CMEMS-Oscillator/1/415/
This document provides a reverse costing analysis of the Bosch BMX055 9-Axis MEMS IMU. It includes a physical analysis of the package and dies, manufacturing process flows for the ASIC, MEMS, and magnetometer dies, a cost analysis, and estimated selling price. The package is a 4.5x3.0x0.95mm LGA with 3 dies - a gyro/accel ASIC, MEMS gyro/accel dies, and a magnetometer die fabricated using CMOS and MEMS processes. The analysis estimates manufacturing costs and provides a price within a +/- 10% range given available data and industry expertise.
2-Axis Gyroscopes for Optical Image Stabilization: STMicroelectronics L2G2IS ...Yole Developpement
Complete reports and comparison of the latest generation products for smartphones from the leading optical image stabilization gyro players.
2-Axis Gyroscopes for Optical Image Stabilization (OIS) constitute a market where 123 million units were shipped in 2015, according to Yole Développement. This market originates only from high-end smartphones and two players share most of it: InvenSense, with 49%, and STMicroelectronics, with 39%.
The 2-axis gyroscopes are located inside the camera module of high-end smartphones. The main constraints are a small footprint and, more importantly, thinness.
Previously, thickness was the same as standard land grid array (LGA) or quad flat no-leads (QFN) package, close to 1mm. Now the standard is 0.65mm, which products from both InvenSense and STMicroelectronics attain.
InvenSense was first, with the IDG-2030, a 2.3x2.3x0.65mm gyroscope, which is still the smallest on the market. Since its introduction we found it in several smartphones from various manufacturers. The IDG-2030 uses the same Nasiri platform as other InvenSense inertial devices, with wafer-level integration of the MEMS sensor on top of the application specific integrated circuit (ASIC), thus providing only one die in the final LGA package.
Months later, STMicroelectronics released the L2G2IS, which shares the same dimensions. The device is manufactured using the same THELMA process as all STMicroelectronics inertial devices. The THELMA platform involves a two-die approach that is challenging for very thin package integration. However, both players now offer very low-cost gyros thanks to die size reduction and process optimization.
Both gyroscopes analyzed are 2-axis X, Y (Pitch, Roll). The two reports can be purchased separately or together in order to compare the technology and pricing of the main smartphone OIS gyro players, including previous generation products.
More information on that report at http://www.i-micronews.com/reports.html
The world’s smallest MEMS barometer for smartphone and smartwatch, with a lot of innovation
The LPS22HB Nano Pressure Sensor is the world’s smallest barometric sensor, incorporating the VENSENS process and the new BASTILLE process, featuring abundant design innovation. Targeting altitude and weather forecasting applications in portable devices, this MEMS sensor positions STMicroelectronics for double-digit growth in the pressure sensor market.
STMicroelectronics LPS22HB pressure- sensing device is manufactured using a proprietary MEMS technology called “VENSENS”, which allows the pressure sensor to be fabricated on a monolithic silicon chip. The LPS22HB’s sensing element is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is tiny compared to traditional silicon micro-machined membranes. The device is allowing some waterproof functionalities, detailed in the report.
For the LPS22HB, STMicroelectronics has introduced two significant innovations. The first one is a holed cap in silicon, bonded on the sensor to integrate the pressure sensor into a small molded package of 2x2x0.76mm HLGA. This package resembles the one used for the HTS221 humidity sensor. The second one is a spring structure to increase the sensor’s sensitivity and reliability. These two innovations are the core of the new “Bastille” MEMS technology.
This report presents a detailed analysis of the sensor structure and cost, as well as a characteristics comparison with the 1st-generation STMicroelectronics LPS331AP pressure sensor and the Bosch Sensortec BMP280, highlighting differences in each company’s technical choices.
More information on that report at http://www.i-micronews.com/reports.html
InvenSense MP67B 6-Axis MEMS IMU in iPhone 6 & 6 Plus 2015 teardown reverse c...Yole Developpement
InvenSense MP67B
6-Axis MEMS IMU in iPhone 6 & 6 Plus
InvenSense's first design win in Apple iPhone
InvenSense's Second Generation 6-Axis Devices for Consumer Applications
With 74.5 million units of iPhone sold during the last quarter 2014, InvenSense made a very good deal by replacing STMicroelectronics as the supplier of the gyroscope for the iPhone 6 and 6 Plus.
The MP67B is a custom version of InvenSense 6-Axis device (3-Axis gyroscope + 3-Axis accelerometer) made for Apple. Compared to InvenSense’s standard 6-Axis device MPU-6500, specific modifications have been realized. The main ones consist in the package modification with the use of a LGA substrate compared to a QFN leadframe, and in the ASIC which has been redesigned.
The MP67B uses a different design than InvenSense’s first generation 6-axis device with a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefit of this new design is that Nasiri process has been changed: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction.
The report includes a complete comparison with InvenSense standard 6-Axis (MPU-6500) and with InvenSense first generation 6-Axis device.
More information on that report at http://www.i-micronews.com/reports.html
Qorvo TQF6405 High Band FEM SMR-BAW Filter iPhone 6s Plus 2016 teardown reve...Yole Developpement
The document provides a reverse costing analysis of the Qorvo TQF-6405 front-end module used in the Apple iPhone 6s Plus. It includes a physical analysis of the component and its packaging. The report focuses on the manufacturing cost analysis of the SMR BAW filter die. It estimates the cost of materials and manufacturing steps to determine the total cost of the MEMS wafer and die. This cost is then used to estimate the potential selling price based on the company's financial ratios.
Rohm SCH2080KE SiC Transistor teardown reverse costing report by published Yo...Yole Developpement
Rohm SCH2080KE SiC Transistor
2nd Generation SiC MOSFET with SiC-SBD
In 3 years, the performance/cost ratio of SiC MOSFET has been multiplied by 3.
The SCH2080KE from ROHM Semiconductor is a 2nd generation high-voltage SiC (Silicon Carbide) power MOSFET. With a breakdown voltage of 1200V for a current of 28A (100°C), the SCH2080KE offers a very low on-resistance (80mΩ), a fast switching speed and a fast reverse recovery.
This MOSFET is already integrated in power modules by Danfoss for PV inverters and in train engine modules co-developed with Alstom. Rohm SiC MOSFET offers a second source to the CREE SiC MOSFET.
System Plus Consulting is publishing a reverse costing report on the SCH2080KE. Based on a complete teardown analysis, the report provides an estimation of the production cost of the SCH2080KE package, SiC MOSFET Transistor and Schottky Barrier Diode.
More information on that report at http://www.i-micronews.com/reports/Rohm-SCH2080KE-SiC-Transistor-2nd-Generation-SiC-MOSFET-SiC/12/432/
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Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
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Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
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This report from Yole Développement analyzes the high-end performance packaging market. It defines high-end performance packaging as technologies that provide high IO density (≥16/mm2) and fine IO pitch (≤130μm). The report aims to identify relevant technologies, analyze market drivers and challenges, describe technology trends and roadmaps, examine the supply chain landscape, and provide market forecasts. It evaluates the market by technology, end application, and region. The report also profiles key players' technology roadmaps and analyzes intellectual property in the 3D SoC hybrid bonding space.
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
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GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
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Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
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GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
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High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...Yole Developpement
High-end inertial sensors are the backbone of systems that will enable autonomous transportation and the new space industry.
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GraphSummit Singapore | The Future of Agility: Supercharging Digital Transfor...Neo4j
Leonard Jayamohan, Partner & Generative AI Lead, Deloitte
This keynote will reveal how Deloitte leverages Neo4j’s graph power for groundbreaking digital twin solutions, achieving a staggering 100x performance boost. Discover the essential role knowledge graphs play in successful generative AI implementations. Plus, get an exclusive look at an innovative Neo4j + Generative AI solution Deloitte is developing in-house.
HCL Notes und Domino Lizenzkostenreduzierung in der Welt von DLAUpanagenda
Webinar Recording: https://www.panagenda.com/webinars/hcl-notes-und-domino-lizenzkostenreduzierung-in-der-welt-von-dlau/
DLAU und die Lizenzen nach dem CCB- und CCX-Modell sind für viele in der HCL-Community seit letztem Jahr ein heißes Thema. Als Notes- oder Domino-Kunde haben Sie vielleicht mit unerwartet hohen Benutzerzahlen und Lizenzgebühren zu kämpfen. Sie fragen sich vielleicht, wie diese neue Art der Lizenzierung funktioniert und welchen Nutzen sie Ihnen bringt. Vor allem wollen Sie sicherlich Ihr Budget einhalten und Kosten sparen, wo immer möglich. Das verstehen wir und wir möchten Ihnen dabei helfen!
Wir erklären Ihnen, wie Sie häufige Konfigurationsprobleme lösen können, die dazu führen können, dass mehr Benutzer gezählt werden als nötig, und wie Sie überflüssige oder ungenutzte Konten identifizieren und entfernen können, um Geld zu sparen. Es gibt auch einige Ansätze, die zu unnötigen Ausgaben führen können, z. B. wenn ein Personendokument anstelle eines Mail-Ins für geteilte Mailboxen verwendet wird. Wir zeigen Ihnen solche Fälle und deren Lösungen. Und natürlich erklären wir Ihnen das neue Lizenzmodell.
Nehmen Sie an diesem Webinar teil, bei dem HCL-Ambassador Marc Thomas und Gastredner Franz Walder Ihnen diese neue Welt näherbringen. Es vermittelt Ihnen die Tools und das Know-how, um den Überblick zu bewahren. Sie werden in der Lage sein, Ihre Kosten durch eine optimierte Domino-Konfiguration zu reduzieren und auch in Zukunft gering zu halten.
Diese Themen werden behandelt
- Reduzierung der Lizenzkosten durch Auffinden und Beheben von Fehlkonfigurationen und überflüssigen Konten
- Wie funktionieren CCB- und CCX-Lizenzen wirklich?
- Verstehen des DLAU-Tools und wie man es am besten nutzt
- Tipps für häufige Problembereiche, wie z. B. Team-Postfächer, Funktions-/Testbenutzer usw.
- Praxisbeispiele und Best Practices zum sofortigen Umsetzen
Unlock the Future of Search with MongoDB Atlas_ Vector Search Unleashed.pdfMalak Abu Hammad
Discover how MongoDB Atlas and vector search technology can revolutionize your application's search capabilities. This comprehensive presentation covers:
* What is Vector Search?
* Importance and benefits of vector search
* Practical use cases across various industries
* Step-by-step implementation guide
* Live demos with code snippets
* Enhancing LLM capabilities with vector search
* Best practices and optimization strategies
Perfect for developers, AI enthusiasts, and tech leaders. Learn how to leverage MongoDB Atlas to deliver highly relevant, context-aware search results, transforming your data retrieval process. Stay ahead in tech innovation and maximize the potential of your applications.
#MongoDB #VectorSearch #AI #SemanticSearch #TechInnovation #DataScience #LLM #MachineLearning #SearchTechnology
Communications Mining Series - Zero to Hero - Session 1DianaGray10
This session provides introduction to UiPath Communication Mining, importance and platform overview. You will acquire a good understand of the phases in Communication Mining as we go over the platform with you. Topics covered:
• Communication Mining Overview
• Why is it important?
• How can it help today’s business and the benefits
• Phases in Communication Mining
• Demo on Platform overview
• Q/A
Infrastructure Challenges in Scaling RAG with Custom AI modelsZilliz
Building Retrieval-Augmented Generation (RAG) systems with open-source and custom AI models is a complex task. This talk explores the challenges in productionizing RAG systems, including retrieval performance, response synthesis, and evaluation. We’ll discuss how to leverage open-source models like text embeddings, language models, and custom fine-tuned models to enhance RAG performance. Additionally, we’ll cover how BentoML can help orchestrate and scale these AI components efficiently, ensuring seamless deployment and management of RAG systems in the cloud.
14. The TPMS solution featuring the smallest footprint and lowest RF power consumption
Distributed by Performed by
Overview/Introduction , Freescale Company Profile
Physical Analysis
• Package
Package Views & Dimensions
Package Opening & Wire Bonding Process
Package Cross-Section
• ASIC Die
View, Dimensions & Marking
Delayering & Main Blocks Identification
Cross-Section & Process Characteristics
• MEMS Pressure Sensor Die
View, Dimensions & Marking
Sensing Area Details
Cross-Section & Process Characteristics
• MEMS Accelerometer Die
View, Dimensions & Marking
Cap Opening & Cap Details
Sensing Area Details
Cross-Section & Process Characteristics
• Freescale TPMS Evolution (Gen 2, Gen 3, Gen 4)
• Comparison with Infineon SP37
Manufacturing Process Flow
• ASIC Front-End Process
• ASIC Wafer Fabrication Unit
• MEMS Pressure Sensor Process Flow
• MEMS Accelerometer Process Flow
• MEMS Wafer Fabrication Unit
• Packaging Process Flow & Assembly Unit
Cost Analysis
• Yields Hypotheses
• ASIC Front-End Cost
• ASIC Back-End 0 : Probe Test & Dicing
• ASIC Wafer & Die Cost
• MEMS Pressure Sensor Front-End Cost
• MEMS Pressure Sensor Cost per process steps
• MEMS Pressure Sensor Wafer & Die Cost
• MEMS Accelerometer Front-End Cost
• MEMS Accelerometer Cost per process steps
• MEMS Accelerometer Wafer & Die Cost
• Back-End : Packaging & Final Test Cost
• FXTH87 TPMS Component Cost & Price
• Cost Comparison with Infineon SP37
TABLE OF CONTENTS
Freescale FXTH87
Tire Pressure Monitoring Sensor (TPMS)
REVERSE COSTING ANALYSIS
REPORT BY
COMPLETE TEARDOWN WITH:
• Detailed Photos
• Precise Measurements
• Material Analysis
• Manufacturing Process Flow
• Supply Chain Evaluation
• Manufacturing Cost Analysis
• Selling Price Estimation
• Comparison with Infineon SP37
• Analysis of generation evolution
of Freescale TPMS devices
MEMS TPMS
150 pages
January 2015
Pdf file
Xls file
PRICE :
Full report: EUR 2,990
Pressure sensor market growth is mainly driven by TPMS due to legislation and
quick adoption around the world. Freescale is competing head to head with
Infineon on this application.
The FXTH87 is the 4th generation TPMS from Freescale. It features the smallest
footprint with 7x7mm², the smallest RF power consumption with 7mA Idd and the
largest customer memory size with 8kB flash. In the report we make a
comparison with Infineon SP37 device in order to understand the technologies
differences and highlight each cost structures.
This system in package includes a dual-axis accelerometer (XZ), pressure and
temperature sensors, an integrated MCU, a RF transmitter and a low frequency
receiver. It is 40% smaller than Freescale’s previous-generation QFN 9x9mm
package and 50% smaller than Infineon SP37 TPMS solution .
The pressure sensor is based on Freescale’s MEMS capacitive pressure cell
without signal conditioning. The accelerometer included in the FXTH87 can be a
single axis (Z) or a dual axis (XZ) and is manufactured with Freescale’s surface
micromachining poly-Si MEMS process.
Assembled in a Film-Assisted Molding (FAM) 7x7mm QFN package with gel fill,
the FXTH87 is certified AEC-Q100 and qualified for operating temperature range
from -40°C to +125°C.
15. ORDER FORM
PAYMENT
ABOUT SYSTEM PLUS CONSULTING
Please process my order for “Freescale FXTH87 MEMS TPMS” Reverse Costing Analysis:
Distributed by Performed by
Full Reverse Costing report: EUR 2,990*
BILLING CONTACT
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ABOUT YOLE DEVELOPPEMENT
On line on Yole website:
http://www.i-micronews.com/reports/
Credit Card:
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By bank transfer:
BANK INFO: HSBC, 1 place de la Bourse, F-69002 Lyon, France,
Bank code : 30056, Branch code : 00170
Account No : 0170 200 1565 87,
SWIFT or BIC code : CCFRFRPP,
IBAN : FR76 3005 6001 7001 7020 0156 587
Return order by:
• FAX: +33 (0)472 83 01 83
• MAIL: YOLE DEVELOPPEMENT,
75 Cours Emile Zola, F - 69100 Lyon - Villeurbanne
Contact:
David Jourdan, jourdan@yole.fr, Tel: +33 (0)472 83 01 90
(1) Our Terms and Conditions of Sale are available www.yole.fr/Terms_and_Conditions_of_Sale.aspx
The present document is valid 12 months after its publishing date: 1th February 2015.
.
Beginning in 1998 with Yole Développement, we have grown to become a group of companies providing market research, technology
analysis, strategy consulting, media in addition to finance services. With a solid focus on emerging applications using silicon and/or
micro manufacturing Yole Développement group has expanded to include more than 40 associates worldwide covering MEMS,
Microfluidics & Medical, Advanced Packaging, Compound Semiconductors, Power Electronics, LED, and Photovoltaic. The group
supports companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to
develop their business.
CUSTOM STUDIES
• Market data, market research &
marketing analysis
• Technology analysis
• Reverse engineering & reverse
costing
• Strategy consulting
• Corporate Finance Advisory (M&A
and fund raising)
MEDIA
• Critical news, Bi-weekly: Micronews, the
magazine
• In-depth analysis & Quarterly Technology
Magazines: MEMS Trends– 3D Packaging – PV
Manufacturing – iLED – Power Dev'
• Online disruptive technologies website: www.i-
micronews.com
• Exclusive Webcasts
• Live event with Market Briefings
TECHNOLOGY & MARKET
REPORTS
• Collection of reports
• Players & market databases
• Manufacturing cost simulation tools
• Component reverse engineering &
costing analysis
More information on www.yole.fr
*For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format *For French customer, add 19,6 % for VAT
SHIP TO
16. TERMS AND CONDITIONS OF SALES
Definitions: “Acceptance”: Action by which the Buyer accepts the terms and conditions of sale in their entirety. It is done by ticking the box “I accept the conditions”.
“Buyer”: Any business user (i.e. any person acting in the course of its business activities, for its business needs) entering into the following general conditions to the exclusion of consumers acting in their
personal interests.
“Contracting Parties” or “Parties”: The Seller on the one hand and the Buyer on the other hand.
“Intellectual Property Rights” (“IPR”) means any rights held by the Seller in its Products, including any patents, trademarks, registered models, designs, copyrights, inventions, commercial secrets and know-
how, technical information, company or trading names and any other intellectual property rights or similar in any part of the world, notwithstanding the fact that they have been registered or not and including
any pending registration of one of the above mentioned rights.
“License”: For the reports and databases, 3 different licenses are proposed. The buyer has to choose one license: 1. Single user license: the purchaser is the sole authorized user of the report 2. Multi-user,
single site license: the report can be used by various users provided that the report is only use within the same company at same post address 3. Multi-user, multi-site license: the report can be used by
various users within the same company or group and its subsidiaries (more than 50% share) at a global scale.
“Products”: Depending on the purchase order, reports or database on MEMS, CSC, Optics/MOEMS, Nano, bio… to be bought either on a unit basis or as an annual subscription. (i.e. subscription for a period
of 12 calendar months). The annual subscription to a package (i.e. a global discount based on the number of reports that the Buyer orders or accesses via the service, a global search service on line on I-
micronews and a consulting approach), is defined in the order. Reports are established in PowerPoint and delivered on a PDF format and the database may include Excel files.
“Seller”: Based in Lyon (France headquarters), Yole Développement is a market research and business development consultancy company, facilitating market access for advanced technology industrial
projects. With more than 18 consultants, Yole works worldwide with the key industrial companies, R&D institutes and investors to help them understand the markets and technology trends.
1. Scope
1.1 The Contracting Parties undertake to observe the following general conditions when agreed by the Buyer and the Seller. ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS AND CONDITIONS
IN ANY OTHER DOCUMENTS ISSUED BY THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE MADE HEREUNDER AND
SHALL NOT BE BINDING IN ANY WAY ON THE SELLER.
1.2 This agreement becomes valid and enforceable between the Contracting Parties after clear and non-equivocal consent by any duly authorised person representing the Buyer. For these purposes,
the Buyer accepts these conditions of sales when ticking the box “I accept the conditions”. This results in acceptance by the Buyer.
1.3 Orders are deemed to be accepted only upon written acceptance and confirmation by the Seller, within [7 days] from the date of order, to be sent either by email or to the Buyer’s address. In the absence
of any confirmation in writing, orders shall be deemed to have been accepted.
2. Mailing of the Products
2.1 Products are sent by email to the Buyer:
- within [1] month from the order for Products already released; or
- within a reasonable time for Products ordered prior to their effective release. In this case, the Seller shall use its best endeavours to inform the Buyer of an indicative release date and the evolution of the
work in progress.
2.2 Some weeks prior to the release date the Seller can propose a pre-release discount to the Buyer
The Seller shall by no means be responsible for any delay in respect of article 2.2 above, and including incases where a new event or access to new contradictory information would require for the analyst
extra time to compute or compare the data in order to enable the Seller to deliver a high quality Products.
2.3 The mailing of the Product will occur only upon payment by the Buyer, in accordance with the conditions contained in article 3.
2.4. The mailing is operated through electronic meanseither by email via the sales department or automatically online via an email/password. If the Product’s electronic delivery format is defective, the Seller
undertakes to replace it at no charge to the Buyer provided that it is informed of the defective formatting within 90 days from the date of the original download or receipt of the Product.
2.4 The person receiving the Products on behalf of the Buyer shall immediately verify the quality of the Products and their conformity to the order. Any claim for apparent defects or for non-conformity
shall be sent in writing to the Seller within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects. .
2.5 No return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. Any Product returned to the Seller without providing prior information to the Seller as
required under article 2.5 shall remain at the Buyer’s risk.
3. Price, invoicing and payment
3.1 Prices are given in the orders corresponding to each Product sold on a unit basis or corresponding to annual subscriptions. They are expressed to be inclusive of all taxes. The prices may be reevaluated
from time to time. The effective price is deemed to be the one applicable at the time of the order.
3.2 Yole may offer a pre release discount for the companies willing to acquire in the future the specific report and agreeing on the fact that the report may be release later than the anticipated release date. In
exchange to this uncertainty, the company will get a discount that can vary from 15% to 10%.
3.3 Payments due by the Buyer shall be sent by cheque payable to Yole Développement, credit card or by electronic transfer to the following account:
HSBC, 1 place de la Bourse 69002 Lyon France Bank code: 30056 Branch code: 200 1565 87BIC or SWIFT c00170 Account n°: 0170 ode: CCFRFRPP IBAN: FR76 3005 6001 7001 7020 0156 587
To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order.
3.3 Payment is due by the Buyer to the Seller within 30 days from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the
latter shall be entitled to invoice interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L. 441-6 of the French Commercial Code.
3.4 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages.
4. Liabilities
4.1The Buyer or any other individual or legal person acting on its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the
use and interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement
4.3 In no event shall the Seller be liable for:
a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or information)
arising out of the use of or inability to use the Seller’s website or the Products, or any information provided on the website, or in the Products;
b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof.
4.4All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information,
which cannot be guaranteed to be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not
lead to the liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or
compensation of any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded
for any event as set out in article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages
or cancellation of the orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller.In such case only, the Buyer shall be entitled to ask for a
reimbursement of its first down payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of saleability and fitness for a particular purpose, with respect to the Products. Although the Seller shall
take reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller
cannot guarantee that any Product will be free from infection.
5. Force majeure
The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor
difficulties, equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller.
6. Protection of the Seller’s IPR
6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use
the Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as:
- Information storage and retrieval systems; - Recordings and re-transmittals over any network (including any local area network); - Use in any timesharing, service bureau, bulletin board or similar
arrangement or public display; - Posting any Product to any other online service (including bulletin boards or the Internet);- Licensing, leasing, selling, offering for sale or assigning the Product.
6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products
and shall personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect
of the copyrights and will guaranty that the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the
Buyer a maximum of 10 password, unless the multiple sites organisation of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password.
6.6 In the case of a multisite, multilicence, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a
company, the joint venture done with a third party etc… can not access the report and should pay a full licence price.
7. Termination
7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer
of such delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30)
days without solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.
8. Miscellaneous
All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against
the Buyer.
Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated
to him in due time.
9.Governing law and jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of
Lyon, which shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and conditions.