Long term growth of the power electronics market is driving 300mm wafer-based production.
More information on: https://www.i-micronews.com/products/status-of-the-power-electronics-industry-2019/
Power SiC 2018: Materials, Devices and Applications 2018 Report by Yole Devel...Yole Developpement
Automotive is putting SiC on the road. Is the supply chain ready?
More information on that report at : https://www.i-micronews.com/category-listing/product/power-sic-2018-materials-devices-and-applications.html
Status of the Power Electronics Industry 2018 report by Yole DéveloppementYole Developpement
EV/HEV, motor drives, computing and storage propel power electronics market growth, from devices to passives, packaging and integration.
More information on https://www.i-micronews.com/report/product/status-of-the-power-electronics-industry-2018.html
Power GaN 2018: Epitaxy, Devices, Applications and Technology Trends report b...Yole Developpement
GaN market growth is fed by Lidar, wireless charging and fast charging solutions.
More information on : https://www.i-micronews.com/category-listing/product/power-gan-2018-epitaxy-devices-applications-and-technology-trends.html
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
GaN and SiC for power electronics applications 2015 Report by Yole DeveloppementYole Developpement
The SiC market is expected to treble and GaN is expected to explode - if challenges are overcome
In 2014, the SiC chip business was worth more than $133M. As in previous years, power factor correction (PFC) and photovoltaics (PV) are still the leading applications.
SiC diodes represent more than 80% of the market. In 2020, diodes will remain the main contributor across various applications, including electric and hybrid electric vehicles (EV/HEV), PV, PFC, wind, Uninterruptible Power Supplies (UPS) and motor drives.
SiC transistors will grow in parallel with diodes, driven by PV inverters. Challenges must be overcome prior to the adoption of pure SiC solutions for EV power train inverters, which is nevertheless expected by 2020.
Including the growth in both diodes and transistors we expect the total SiC market to more than treble by 2020, reaching $436M...
Status of the Power Module Packaging Industry 2019 - Yole DéveloppementYole Developpement
Major evolutions in substrate, interconnection, and die-attach technologies, driven by EV/HEV, are transforming the power module packaging supply chain.
More information on: https://www.i-micronews.com/products/status-of-the-power-module-packaging-industry-2019/
Discrete Power Device Packaging: Materials Market and Technology Trends 2019 ...Yole Developpement
Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.
More information on https://www.i-micronews.com/products/discrete-power-device-packaging-materials-market-and-technology-trends-2019/
1200V Silicon IGBT vs SiC MOSFET Comparison 2018system_plus
Technology and cost analysis of thirteen silicon IGBTs and eight SiC MOSFETs from eight different manufacturers shows their potential.
More information on that report at: http://www.systemplus.fr/fr/reverse-costing-reports/1200v-silicon-igbt-vs-sic-mosfet-comparison-2018/
Power SiC 2018: Materials, Devices and Applications 2018 Report by Yole Devel...Yole Developpement
Automotive is putting SiC on the road. Is the supply chain ready?
More information on that report at : https://www.i-micronews.com/category-listing/product/power-sic-2018-materials-devices-and-applications.html
Status of the Power Electronics Industry 2018 report by Yole DéveloppementYole Developpement
EV/HEV, motor drives, computing and storage propel power electronics market growth, from devices to passives, packaging and integration.
More information on https://www.i-micronews.com/report/product/status-of-the-power-electronics-industry-2018.html
Power GaN 2018: Epitaxy, Devices, Applications and Technology Trends report b...Yole Developpement
GaN market growth is fed by Lidar, wireless charging and fast charging solutions.
More information on : https://www.i-micronews.com/category-listing/product/power-gan-2018-epitaxy-devices-applications-and-technology-trends.html
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
GaN and SiC for power electronics applications 2015 Report by Yole DeveloppementYole Developpement
The SiC market is expected to treble and GaN is expected to explode - if challenges are overcome
In 2014, the SiC chip business was worth more than $133M. As in previous years, power factor correction (PFC) and photovoltaics (PV) are still the leading applications.
SiC diodes represent more than 80% of the market. In 2020, diodes will remain the main contributor across various applications, including electric and hybrid electric vehicles (EV/HEV), PV, PFC, wind, Uninterruptible Power Supplies (UPS) and motor drives.
SiC transistors will grow in parallel with diodes, driven by PV inverters. Challenges must be overcome prior to the adoption of pure SiC solutions for EV power train inverters, which is nevertheless expected by 2020.
Including the growth in both diodes and transistors we expect the total SiC market to more than treble by 2020, reaching $436M...
Status of the Power Module Packaging Industry 2019 - Yole DéveloppementYole Developpement
Major evolutions in substrate, interconnection, and die-attach technologies, driven by EV/HEV, are transforming the power module packaging supply chain.
More information on: https://www.i-micronews.com/products/status-of-the-power-module-packaging-industry-2019/
Discrete Power Device Packaging: Materials Market and Technology Trends 2019 ...Yole Developpement
Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.
More information on https://www.i-micronews.com/products/discrete-power-device-packaging-materials-market-and-technology-trends-2019/
1200V Silicon IGBT vs SiC MOSFET Comparison 2018system_plus
Technology and cost analysis of thirteen silicon IGBTs and eight SiC MOSFETs from eight different manufacturers shows their potential.
More information on that report at: http://www.systemplus.fr/fr/reverse-costing-reports/1200v-silicon-igbt-vs-sic-mosfet-comparison-2018/
Power Management: Technology, Industry and Trends 2019 - by Yole DéveloppementYole Developpement
China, 300mm, societal impacts, and important strategic decisions are shuffling the cards in the power
IC industry.
More on: https://www.i-micronews.com/products/power-management-technology-industry-and-trends-2019/
Power Module Packaging 2018: Material Market and Technology Trends report by ...Yole Developpement
Power packaging is continuously adapting to power application market trends.
More information on that report at : https://www.i-micronews.com/category-listing/product/power-module-packaging-2018-material-market-and-technology-trends.html
Cree-Wolfspeed Strategic and Competitive Analysis by Yole DéveloppementYole Developpement
What could happen after Cree’s strategy pivot?
CREE HAS PIVOTED!
In February 2018, Cree announced a strategic pivot on its investor day. The company decided to change its focus and invest primarily in its smallest business, Wolfspeed. This announcement comes after a series of actions:
• It decided to spin out the SiC power and radio frequency (RF) GaN business, branded Wolfspeed in 2015
• It tried to sell Wolfspeed, including the SiC power and GaN RF businesses and its SiC wafer business, to Infineon for $850M in 2016, but was blocked by the Committee on Foreign Investment in the United States.
More information on: https://www.i-micronews.com/category-listing/product/cree-wolfspeed.html
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
Power SiC 2019: Materials, Devices, and Applications by Yole DéveloppementYole Developpement
Automotive market growth is reshaping the SiC market’s dynamics and ecosystem.
More information on: https://www.i-micronews.com/products/power-sic-2019-materials-devices-and-applications/
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
Status of the Power Electronics Industry 2017 Report by Yole Developpement Yole Developpement
Power devices fuel and enable industry mega trends reaching almost US$35B in 2022.
SOLAR AND ELECTRIC VEHICLE POWER CONVERTER MARKETS GREW SPECTACULARLY – BY MORE THAN 20% – LAST YEAR, DRIVING GROWTH IN THE EXPANDING IGBT MARKET
The power electronics sectors continue to expand their presence almost everywhere. Renewable energies and e-mobility, including electric and hybrid vehicles (EV/HEVs), are especially boosting this market. Both the solar and EV/HEV converter markets grew by over 20% between 2015 and 2016. At the semiconductor level, the power semiconductor market grew by 3.8% compared to 2015. This year, Yole Développement has enlarged its power semiconductor market analysis to all types of power integrated circuits (ICs) including power management ICs, linear regulators and switching regulators, representing a total market of $28B. Among all the different types of power devices including thyristors, MOSFETs, IGBTs and power ICs, IGBTs made the greatest progress, with around 8% growth.
Yole Développement’s decision to start analyzing the power IC market evolution closely is part of an effort to cover the whole power spectrum of this market. We now encompass the complete range from low power, low voltage, highly integrated power management ICs in mobile phones to more robust, high power IGCT modules used in trains.
The report also covers the fast-emerging wide band gap (WBG) semiconductor market, identifying today and tomorrow’s leading silicon carbide (SiC) and gallium nitride (GaN) players and the key technological details. ‘Status of Power Electronics Industry 2017 (SPEI 2017)’ describes the evolution and forecasts the future of the power inverter, power device and silicon wafer markets.
EV/HEV MARKET Development: why and how?
barriers?
EV/HEV Market Forecast
Technical Trends
Innovations at module level: power packaging and integration
Power devices:silicon and WBG
Conclusion
Aggressive European regulation in terms of CO2 reduction is helping the electric cars market to grow
Electrified vehicles market and forecasts up to 2021
Evolutions of markets relative to electrified cars between 2015
Co-integration motor + inverter:
Increase power density
Inverter mechatronic design to fit with motor aspect ratio
For PHEVs and full HEVs, a centralized power unit box might be preferred, as the synergy between their numerous converters can have a bigger impact on size reduction
More information on that report at http://www.i-micronews.com/reports.html
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
Wolfspeed (a Cree Company) has proposed the first 900V SiC MOSFET device. The device is a planar MOSFET with lower Rdson, smaller size, and higher current density respective to Cree’s previous-generation SiC MOSFET.
The SiC C3M™ Platform is the first 900V SiC MOSFET platform, designed by Wolfspeed for high-power applications like renewable energy, DC/DC converters, and telecom power supplies. Compared with previous-generation SiC MOSFETs, this third generation allows for a smaller device, higher current density, and lower on-resistance for the same current. The SiC C3M™ Platform proposes devices competitive with the latest SJ MOSFETs and GaN HEMT in terms of cost and performance.
The SiC C3M™ Platform includes three devices at different currents, assembled in two packages. This report presents a deep analysis of the C3M0280090 device and an overview of C3M0120090D and C3M0065090D assembled in a TO220 package. Moreover, this report studies the potential evolution of the device’s cost over the next five years according to technology and market trends.
Also included is a comparison with previous Cree SiC MOSFET generations and a cost comparison with Infineon’s Si SJ MOSFET and GaN Systems’ GaN HEMT.
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
Report’s Key Features
• PDF with > 270 slides
• Excel file > 9,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Patent segmentation:
– Vertical power device (vertical transistor, vertical diode),
– Normally-off (E-mode transistor, cascode topology),
– Integration (monolithic E/D-mode, SiP/SoC, power IC),
– GaN-on-Si,
– GaN-on-Sapphire,
– Selective area p-type doping (ion implantation, p-GaN regrowth),
– Current collapse,
– Thermal management,
– Stray inductance,
– EV/HEV,
– fast charging,
– wireless charging.
• Key patent identification and details
• IP profile of 40 key players: Infineon, Panasonic, Toshiba etc.
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Power Management: Technology, Industry and Trends 2019 - by Yole DéveloppementYole Developpement
China, 300mm, societal impacts, and important strategic decisions are shuffling the cards in the power
IC industry.
More on: https://www.i-micronews.com/products/power-management-technology-industry-and-trends-2019/
Power Module Packaging 2018: Material Market and Technology Trends report by ...Yole Developpement
Power packaging is continuously adapting to power application market trends.
More information on that report at : https://www.i-micronews.com/category-listing/product/power-module-packaging-2018-material-market-and-technology-trends.html
Cree-Wolfspeed Strategic and Competitive Analysis by Yole DéveloppementYole Developpement
What could happen after Cree’s strategy pivot?
CREE HAS PIVOTED!
In February 2018, Cree announced a strategic pivot on its investor day. The company decided to change its focus and invest primarily in its smallest business, Wolfspeed. This announcement comes after a series of actions:
• It decided to spin out the SiC power and radio frequency (RF) GaN business, branded Wolfspeed in 2015
• It tried to sell Wolfspeed, including the SiC power and GaN RF businesses and its SiC wafer business, to Infineon for $850M in 2016, but was blocked by the Committee on Foreign Investment in the United States.
More information on: https://www.i-micronews.com/category-listing/product/cree-wolfspeed.html
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
Power SiC 2019: Materials, Devices, and Applications by Yole DéveloppementYole Developpement
Automotive market growth is reshaping the SiC market’s dynamics and ecosystem.
More information on: https://www.i-micronews.com/products/power-sic-2019-materials-devices-and-applications/
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
Status of the Power Electronics Industry 2017 Report by Yole Developpement Yole Developpement
Power devices fuel and enable industry mega trends reaching almost US$35B in 2022.
SOLAR AND ELECTRIC VEHICLE POWER CONVERTER MARKETS GREW SPECTACULARLY – BY MORE THAN 20% – LAST YEAR, DRIVING GROWTH IN THE EXPANDING IGBT MARKET
The power electronics sectors continue to expand their presence almost everywhere. Renewable energies and e-mobility, including electric and hybrid vehicles (EV/HEVs), are especially boosting this market. Both the solar and EV/HEV converter markets grew by over 20% between 2015 and 2016. At the semiconductor level, the power semiconductor market grew by 3.8% compared to 2015. This year, Yole Développement has enlarged its power semiconductor market analysis to all types of power integrated circuits (ICs) including power management ICs, linear regulators and switching regulators, representing a total market of $28B. Among all the different types of power devices including thyristors, MOSFETs, IGBTs and power ICs, IGBTs made the greatest progress, with around 8% growth.
Yole Développement’s decision to start analyzing the power IC market evolution closely is part of an effort to cover the whole power spectrum of this market. We now encompass the complete range from low power, low voltage, highly integrated power management ICs in mobile phones to more robust, high power IGCT modules used in trains.
The report also covers the fast-emerging wide band gap (WBG) semiconductor market, identifying today and tomorrow’s leading silicon carbide (SiC) and gallium nitride (GaN) players and the key technological details. ‘Status of Power Electronics Industry 2017 (SPEI 2017)’ describes the evolution and forecasts the future of the power inverter, power device and silicon wafer markets.
EV/HEV MARKET Development: why and how?
barriers?
EV/HEV Market Forecast
Technical Trends
Innovations at module level: power packaging and integration
Power devices:silicon and WBG
Conclusion
Aggressive European regulation in terms of CO2 reduction is helping the electric cars market to grow
Electrified vehicles market and forecasts up to 2021
Evolutions of markets relative to electrified cars between 2015
Co-integration motor + inverter:
Increase power density
Inverter mechatronic design to fit with motor aspect ratio
For PHEVs and full HEVs, a centralized power unit box might be preferred, as the synergy between their numerous converters can have a bigger impact on size reduction
More information on that report at http://www.i-micronews.com/reports.html
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
Wolfspeed (a Cree Company) has proposed the first 900V SiC MOSFET device. The device is a planar MOSFET with lower Rdson, smaller size, and higher current density respective to Cree’s previous-generation SiC MOSFET.
The SiC C3M™ Platform is the first 900V SiC MOSFET platform, designed by Wolfspeed for high-power applications like renewable energy, DC/DC converters, and telecom power supplies. Compared with previous-generation SiC MOSFETs, this third generation allows for a smaller device, higher current density, and lower on-resistance for the same current. The SiC C3M™ Platform proposes devices competitive with the latest SJ MOSFETs and GaN HEMT in terms of cost and performance.
The SiC C3M™ Platform includes three devices at different currents, assembled in two packages. This report presents a deep analysis of the C3M0280090 device and an overview of C3M0120090D and C3M0065090D assembled in a TO220 package. Moreover, this report studies the potential evolution of the device’s cost over the next five years according to technology and market trends.
Also included is a comparison with previous Cree SiC MOSFET generations and a cost comparison with Infineon’s Si SJ MOSFET and GaN Systems’ GaN HEMT.
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
Report’s Key Features
• PDF with > 270 slides
• Excel file > 9,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Patent segmentation:
– Vertical power device (vertical transistor, vertical diode),
– Normally-off (E-mode transistor, cascode topology),
– Integration (monolithic E/D-mode, SiP/SoC, power IC),
– GaN-on-Si,
– GaN-on-Sapphire,
– Selective area p-type doping (ion implantation, p-GaN regrowth),
– Current collapse,
– Thermal management,
– Stray inductance,
– EV/HEV,
– fast charging,
– wireless charging.
• Key patent identification and details
• IP profile of 40 key players: Infineon, Panasonic, Toshiba etc.
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends 2017 Re...Yole Developpement
The GaN power device supply chain is acting to support market growth.
THE SUPPLY CHAIN FOR POWER GAN PREPARES FOR PRODUCTION
The supply chain is close to being settle for the Power GaN market and deals during 2017 show confidence that GaN will be a successful market. First of all, there have been big investments from the main foundries to increase their capacity to handle mass production. Navitas just announced the partnership with TSMC and Amkor to ramp production capacity. Moreover, BMW i Ventures has just invested in GaN Systems. The Taiwan’s Ministry of Economic Affairs is also interested in using GaN for clean and green technologies, also in collaboration with GaN Systems.
GaN manufacturers continue developing new products and provide samples to customers, as is the case with EPC and its wireless charging line. During 2017, Panasonic announced the mass production of its 650 V products and Exagan successfully produced its first high voltage devices on 8-inch wafers. Other players are in the final phase of R&D or qualification for their GaN products to be launched in 2018. In both cases, manufacturers and clients are pushing to use GaN HEMTs in emerging technologies.
Yole Développement differentiates the Power GaN supply chain into two main models: the Integrated Device Manufacturer (IDM) model and the foundry model. We think that both IDM and foundry models will co-exist while there are different needs on the market, for example in consumer and industrial applications. In addition to the existing models, China is introducing a model with an R&D research center or design center, an external epitaxial supplier and a foundry for manufacturing, to support large-scale demand in the future.
This report furnishes an overview of the GaN power industry, covering the value chain from epitaxy and device design to device processing. It updates the supply chain and there is an overview of the year’s investments.
More information on that report at http://www.i-micronews.com/reports.html
Wireless Charging Technologies and Markets 2018 report by Yole DéveloppementYole Developpement
The way consumers charge their smart devices is about to drastically change, with wireless smartphone charging systems expected to surpass 1Billion units per year by 2024.
More information on https://www.i-micronews.com/category-listing/product/wireless-charging-technologies-and-markets-2018.html
Status of the Inverter Industry 2019 by Yole DéveloppementYole Developpement
Motor drive still powers the inverter market, with EV/HEV positively impacting overall market dynamics.
More information on: https://www.i-micronews.com/products/status-of-the-inverter-industry-2019/
Status of the Power Electronics Industry - 2016 Report by Yole DeveloppementYole Developpement
With strong price pressure and a very strong leader, how will the power electronics market and landscape evolve in the future?
Vehicle hybridization is pulling the power electronics market
The 21st century is full of challenges to overcome, including population growth, reducing CO2 emissions and developing energy sources to replace liquid fuel. Power electronics will play a key part in solving these problems. Among the applications Yole Développement follows, motor drives are helping increase motor efficiency, photovoltaics and wind turbines continue expand their role in energy supply, and rail networks are moving more people. But one application stands out thanks to the huge volumes involved: electric vehicles. In the 2000s MOSFETs drove growth, and in the early 2010s it was renewable energy. The late 2010s and 2020s could be the golden era for electric vehicles, if customers adopt it and governments keep on subsidizing the field.
2015 has been a difficult year for the power electronics market, with the global value of power ICs, power modules and discrete components decreasing from $15.7 billion to $15.2 billion, a 3% drop. This fall is explained mainly by strong Average Selling Price (ASP) decreases at IGBT module level. We expect this ASP trend to continue, mainly because of price pressure from the automotive market. But overall IGBT module and global power electronics market value should increase, as volume growth outweighs this ASP fall. The automotive market will strengthen its position, as we expect electric and hybrid electric vehicles (EV/HEV) to represent a major part of the IGBT module market by 2021. Over this time the power MOSFET market is expected to grow slightly for all applications, going from $1 billion to $1.2 billion value.
Automotive Packaging: Market and Technologies Trends 2019 report by Yole Déve...Yole Developpement
Automotive Packaging: Market and Technologies Trends 2019
More information on https://www.i-micronews.com/products/automotive-packaging-market-and-technologies-trends-2019/
Power SiC 2016: Materials, Devices, Modules, and Applications - 2016 Report b...Yole Developpement
More confident and more prepared, power SiC is progressing at a 2015 - 2021 CAGR of 19%!
SiC power is diffusing into multiple application segments
When the first SiC diode was launched in 2001, the industry questioned the future of the SiC power business: Will it grow? Is this a real business? 15 years later, in 2016, people don’t ask these questions anymore. The SiC power business is concrete and real, with a promising outlook. The SiC power market (diode and transistor included) is estimated to be more than $200M in 2015 and forecasted to be more than $550M in 2021, with a 2015 - 2021 CAGR of 19%. Not surprisingly, the power factor correction (PFC) power supply market is still the leading application, consuming a large volume of diodes.
Photovoltaics (PV) inverters are close behind. SiC diodes and MOSFETs are now used by various PV inverter manufacturers in their products. It has been confirmed that SiC implementation provides several performance benefits: increased efficiency, reduced size and weight. In addition, it allows to low cost at the system level in certain power range. Yole Développement has received increasingly positive feedback from the market, and we expect other manufacturers to follow in the footsteps of the early adopters, leading to a rapid expansion of the PV segment in the coming years.
Growth, supply chain, new applications: inverter industry is about to redefine itself.
The inverter market is heavily application dependent. However, there are some cross-fertilization trends — companies with a good position within one inverter market segment are researching entry into other segments. Companies like Alstom, ABB, Ingeteam, Siemens, and General Electric already offer products in two or more inverter segments.
Some players have chosen vertical integration to optimize their internal cost structure to better target commodity-like markets, as well as to meet the severe cost requirements of the automotive industry. Other players have bet on horizontal integration to offer complete solutions to customers.
In 2019, Yole Développement has released this Discrete Power Device Packaging: Material Market and Technology Trends report to complement our year-long Power Module Packaging report edition.
This report’s main objectives are as follows:
Provide an overview of the main applications for discrete power devices, along with their drivers and future trends
Discuss the impact of application trends on package design and packaging materials
Furnish an analysis of each packaging component, along with forecasts and future technology development
Give an overview of the discrete power device supply chain
(devices and packaging components)
Analyze the shifting of business models, synergies with other industries, and opportunities for newcomers in discrete power devices
Taiwan Electric Power Equipment Market by Product Type, Distribution Channel,...IMARC Group
The Taiwan electric power equipment market size is expected to exhibit a growth rate (CAGR) of 5.13% during 2024-2032.
More Info:- https://www.imarcgroup.com/taiwan-electric-power-equipment-market
5G’s Impact on RF Front-End Module and Connectivity for Cell phones 2019 by Y...Yole Developpement
The battle for 5G still rages: integration in-module or with discrete parts?
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2019/
Discrete Semiconductor Market by Product Type, Distribution Channel, End User...IMARC Group
The global discrete semiconductor market size reached US$ 27.3 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 37.9 Billion by 2028, exhibiting a growth rate (CAGR) of 5.2% during 2023-2028.
More Info:- https://www.imarcgroup.com/discrete-semiconductor-market
PowerSoC & PowerSiP market & trends (System in Package - System on Chip)PntPower.com
An analysis of current status and future market trends for Micro power conversion systems, including System in Package (SiP) and Ssytem on Chip (SoC). Including power converters packaging trends (DC/DC converters, LDO, Voltage regulators).
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
Power Cables, Electrical Power & Industrial Cable, Electrical Wire, PVC Wire ...Ajjay Kumar Gupta
Power Cables, Electrical Power & Industrial Cable, Electrical Wire, PVC Wire and Cables Manufacturing Plant, Detailed Project Report, Profile, Business Plan, Industry Trends, Market Research, Survey, Manufacturing Process, Machinery, Raw Materials, Feasibility Study, Investment Opportunities, Cost and Revenue, Plant Economics, Production Schedule, Working Capital Requirement, Plant Layout, Process Flow Sheet, Cost of Project, Projected Balance Sheets, Profitability Ratios, Break Even Analysis
Electrical power cables used for transmission and distribution purposes consist of conductors stranded from plain high conductively annealed copper wires insulated with oil impregnated paper tapes. Underground construction is necessitated in the more density built up portions of cities by the heavy transformers and lines required and by the multiplication of service connections to buildings. The cable may include uninsulated conductors used for the circuit neutral or for ground (earth) connection.
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For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
The one million robotic vehicle milestone will be reached by end of the decade: The industrial phase has been launched.
More information on: https://www.i-micronews.com/products/sensors-for-robotic-mobility-2020/
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...Yole Developpement
High-end inertial sensors are the backbone of systems that will enable autonomous transportation and the new space industry.
More information on: https://www.i-micronews.com/products/high-end-inertial-sensors-for-defense-aerospace-and-industrial-applications-2020/
Emerging Non-Volatile Memory 2020 report by Yole DéveloppementYole Developpement
The stand-alone emerging NVM market keeps soaring, led by storage-class memory applications. Meanwhile, foundries are propelling the embedded business.
More info on: https://www.i-micronews.com/products/emerging-non-volatile-memory-2020/
(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...Yole Developpement
High-Performance Computing and cloud gaming are setting the bar for leadership in the high-end CPU and GPU markets.
More info on: https://www.i-micronews.com/products/xpu-high-end-cpu-and-gpu-for-datacenter-applications-2020/
Nano-Imprint Technology Trends for Semiconductor Applications 2019 Report by...Yole Developpement
Nano-Imprint Lithography is revived by photonics and biochips as well as front-end memory applications.
More information on: https://www.i-micronews.com/products/nano-imprint-technology-trends-for-semiconductor-applications-2019/
Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...Jeffrey Haguewood
Sidekick Solutions uses Bonterra Impact Management (fka Social Solutions Apricot) and automation solutions to integrate data for business workflows.
We believe integration and automation are essential to user experience and the promise of efficient work through technology. Automation is the critical ingredient to realizing that full vision. We develop integration products and services for Bonterra Case Management software to support the deployment of automations for a variety of use cases.
This video focuses on the notifications, alerts, and approval requests using Slack for Bonterra Impact Management. The solutions covered in this webinar can also be deployed for Microsoft Teams.
Interested in deploying notification automations for Bonterra Impact Management? Contact us at sales@sidekicksolutionsllc.com to discuss next steps.
State of ICS and IoT Cyber Threat Landscape Report 2024 previewPrayukth K V
The IoT and OT threat landscape report has been prepared by the Threat Research Team at Sectrio using data from Sectrio, cyber threat intelligence farming facilities spread across over 85 cities around the world. In addition, Sectrio also runs AI-based advanced threat and payload engagement facilities that serve as sinks to attract and engage sophisticated threat actors, and newer malware including new variants and latent threats that are at an earlier stage of development.
The latest edition of the OT/ICS and IoT security Threat Landscape Report 2024 also covers:
State of global ICS asset and network exposure
Sectoral targets and attacks as well as the cost of ransom
Global APT activity, AI usage, actor and tactic profiles, and implications
Rise in volumes of AI-powered cyberattacks
Major cyber events in 2024
Malware and malicious payload trends
Cyberattack types and targets
Vulnerability exploit attempts on CVEs
Attacks on counties – USA
Expansion of bot farms – how, where, and why
In-depth analysis of the cyber threat landscape across North America, South America, Europe, APAC, and the Middle East
Why are attacks on smart factories rising?
Cyber risk predictions
Axis of attacks – Europe
Systemic attacks in the Middle East
Download the full report from here:
https://sectrio.com/resources/ot-threat-landscape-reports/sectrio-releases-ot-ics-and-iot-security-threat-landscape-report-2024/
Neuro-symbolic is not enough, we need neuro-*semantic*Frank van Harmelen
Neuro-symbolic (NeSy) AI is on the rise. However, simply machine learning on just any symbolic structure is not sufficient to really harvest the gains of NeSy. These will only be gained when the symbolic structures have an actual semantics. I give an operational definition of semantics as “predictable inference”.
All of this illustrated with link prediction over knowledge graphs, but the argument is general.
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...Ramesh Iyer
In today's fast-changing business world, Companies that adapt and embrace new ideas often need help to keep up with the competition. However, fostering a culture of innovation takes much work. It takes vision, leadership and willingness to take risks in the right proportion. Sachin Dev Duggal, co-founder of Builder.ai, has perfected the art of this balance, creating a company culture where creativity and growth are nurtured at each stage.
"Impact of front-end architecture on development cost", Viktor TurskyiFwdays
I have heard many times that architecture is not important for the front-end. Also, many times I have seen how developers implement features on the front-end just following the standard rules for a framework and think that this is enough to successfully launch the project, and then the project fails. How to prevent this and what approach to choose? I have launched dozens of complex projects and during the talk we will analyze which approaches have worked for me and which have not.
Search and Society: Reimagining Information Access for Radical FuturesBhaskar Mitra
The field of Information retrieval (IR) is currently undergoing a transformative shift, at least partly due to the emerging applications of generative AI to information access. In this talk, we will deliberate on the sociotechnical implications of generative AI for information access. We will argue that there is both a critical necessity and an exciting opportunity for the IR community to re-center our research agendas on societal needs while dismantling the artificial separation between the work on fairness, accountability, transparency, and ethics in IR and the rest of IR research. Instead of adopting a reactionary strategy of trying to mitigate potential social harms from emerging technologies, the community should aim to proactively set the research agenda for the kinds of systems we should build inspired by diverse explicitly stated sociotechnical imaginaries. The sociotechnical imaginaries that underpin the design and development of information access technologies needs to be explicitly articulated, and we need to develop theories of change in context of these diverse perspectives. Our guiding future imaginaries must be informed by other academic fields, such as democratic theory and critical theory, and should be co-developed with social science scholars, legal scholars, civil rights and social justice activists, and artists, among others.
Kubernetes & AI - Beauty and the Beast !?! @KCD Istanbul 2024Tobias Schneck
As AI technology is pushing into IT I was wondering myself, as an “infrastructure container kubernetes guy”, how get this fancy AI technology get managed from an infrastructure operational view? Is it possible to apply our lovely cloud native principals as well? What benefit’s both technologies could bring to each other?
Let me take this questions and provide you a short journey through existing deployment models and use cases for AI software. On practical examples, we discuss what cloud/on-premise strategy we may need for applying it to our own infrastructure to get it to work from an enterprise perspective. I want to give an overview about infrastructure requirements and technologies, what could be beneficial or limiting your AI use cases in an enterprise environment. An interactive Demo will give you some insides, what approaches I got already working for real.
Connector Corner: Automate dynamic content and events by pushing a buttonDianaGray10
Here is something new! In our next Connector Corner webinar, we will demonstrate how you can use a single workflow to:
Create a campaign using Mailchimp with merge tags/fields
Send an interactive Slack channel message (using buttons)
Have the message received by managers and peers along with a test email for review
But there’s more:
In a second workflow supporting the same use case, you’ll see:
Your campaign sent to target colleagues for approval
If the “Approve” button is clicked, a Jira/Zendesk ticket is created for the marketing design team
But—if the “Reject” button is pushed, colleagues will be alerted via Slack message
Join us to learn more about this new, human-in-the-loop capability, brought to you by Integration Service connectors.
And...
Speakers:
Akshay Agnihotri, Product Manager
Charlie Greenberg, Host
Transcript: Selling digital books in 2024: Insights from industry leaders - T...BookNet Canada
The publishing industry has been selling digital audiobooks and ebooks for over a decade and has found its groove. What’s changed? What has stayed the same? Where do we go from here? Join a group of leading sales peers from across the industry for a conversation about the lessons learned since the popularization of digital books, best practices, digital book supply chain management, and more.
Link to video recording: https://bnctechforum.ca/sessions/selling-digital-books-in-2024-insights-from-industry-leaders/
Presented by BookNet Canada on May 28, 2024, with support from the Department of Canadian Heritage.
Accelerate your Kubernetes clusters with Varnish CachingThijs Feryn
A presentation about the usage and availability of Varnish on Kubernetes. This talk explores the capabilities of Varnish caching and shows how to use the Varnish Helm chart to deploy it to Kubernetes.
This presentation was delivered at K8SUG Singapore. See https://feryn.eu/presentations/accelerate-your-kubernetes-clusters-with-varnish-caching-k8sug-singapore-28-2024 for more details.
20. The power electronics industry is experiencing
a shift in its dynamics. The shift comes from the
increase of demand predicted for coming years,
which translates into a move for 300mm wafer-
based production. In 2018 there was saturation
of 200mm wafer demand, leading to wafer
price rise instead of wafer supply. As of today,
more than seven power electronics players
have announced investments in new fabrication
capabilities, to be in production from 2021.
Infineon has invested $1.9B in Villach to build
a second fab for power devices on 300mm
wafers. STMicroelectronics has also started
the expansion of its Agrate site for 300mm
production, for Bipolar CMOS-DMOS, power
MOSFETs and IGBTs. Another example is Bosch,
which has also started building its 300mm fab in
Dresden, preparing for the imminent increase
in volumes for both automotive and Internet of
Things (IoT) applications. Chinese players have
also started the expansion to 300mm, like Silan
Microelectronics or GTA Semiconductors, the
latter having confirmed that it is working on its
automotive-grade IGBT production line.
A concern with these moves might be the
equipment delivery time. This is one of the
reasons why players such as ON Semiconductor
and Diodes Inc have acquired an existing
fab. Such acquisitions also require lower
investments. The ramp up for production for
ON Semiconductor will therefore be in 2020
with advanced CMOS technology. Once that
transfer is complete in 2022, the equipment can
be used for a possible ramp up in power devices,
depending on demand, as the equipment will
already be established. A choice must be made.
We will have to keep a close eye on the next
steps of the power electronics players as they
shape the power semiconductor industry in
coming years. An overview of the full power
supply chain and a focus on the 300mm
transition is included in this report.
STATUS OF THE POWER ELECTRONICS INDUSTRY 2019
Market & Technology Report - August 2019
POWER ELECTRONICS MANUFACTURERS ARE EXPANDING THEIR FAB
CAPABILITIES TO 300MM
Long term growth of the power electronics market is driving 300mm wafer-based production.
(Yole Développement,August 2019)
Development timeline of power electronics fabs: investments
of the main players* in 300mm/200mm
KEY FEATURES
• The power device market expanded
by 13.9% in 2018 compared to 2017,
leading to a second consecutive
high growth year in the power
electronics market after a couple of
flat years
• The power electronics
semiconductor market reached
$17.5B in 2018, not including power
ICs
• In 2018 there was a shortage of
200mm wafers arising from high
demand for power electronics
devices
• 2019 started positively, but
customer demand is falling because
major customers still have device
inventory from last year
• Main players are investing in
enlarging their manufacturing
capabilities, investing in 300mm fabs
for power devices
• The IGBT and MOSFET markets
will continue to increase but part of
the market will go to SiC, especially
when talking about modules for EV/
HEV. However, SiC remains small
compared to the Silicon market, still
accounting for less than a 10% share
by 2024
• The power module market is
expected to increase its share in
coming years compared to discrete
devices
20202019
Early 2000s
2018 2021 20232022
300mm fab in Dresden,
first for DRAM,
later stated for Power
*Non-exhaustive list
of companies
2024
ExpectedEnvisaged readiness of
the fab for volume
production
Investment
announcement
300mm fab300mm fab x2
300mm fab for BCD, which could
be used for Power in future
200mm fab
300mm fab
Power MOSFET
Power MOSFET, BCD, IGBT
300mm fab inVillach Power MOSFET/IGBT?
1,6B$
430M$
BCD-CMOS
3,6B$ 1B$
The power electronics market comprised
$53.4B for power inverters in 2018, and
$17.5B for power semiconductor devices.
Key driving factors include electrical power
conversion optimization and expansion, driven
by electrification trends in transportation, CO2
emission reduction goals, the development of
clean electricity sources, and industrialization.
We can say that the main driving application
with a huge market potential and technological
innovation is electric and hybrid electric
vehicles (EV/HEVs). But let’s not forget that
ELECTRIFICATION IS STILL THE KEY MARKET DRIVER OF THE POWER
ELECTRONICS INDUSTRY
21. STATUS OF THE POWER ELECTRONICS INDUSTRY 2019
SEMICONDUCTOR MARKET EVOLUTION TOWARDS HIGHER POWER OFFERS
MODULES A BOOST
The module market is today motivated by high
power efficiency and density requirements from
the main power applications. Still today, modules
represent 23% of the total market. But we now
see the push from end-user demand for new
applications such as energy storage, charging
infrastructure or EVs. These applications, and
conventional ones like renewable energy and
motor drives, will use modules with different
power levels and reliability requirements. This
will lead to a vast choice of power modules in the
coming years. Power modules are being developed
with new substrates, die attach materials or new
semiconductor materials. Different players are
focusing on innovation for modules and pushing
production to enter this market. On the other
hand, established players are fighting for their
position in the market through innovation and
delivering good product offerings.
The power electronics semiconductor market
is in a growth period, which started in 2017
and continued in 2018. It is now saturated for
some segments, specifically MOSFETs in 2019,
but high demand is expected to continue. Yole
Développement (Yole) expects a 4.5% Compound
Annual Growth Rate (CAGR) from 2018-2024
for IGBT modules, while discrete IGBT parts’
CAGR will be 2.7%. These forecasts are directly
linked with investments in manufacturing lines
from different players mentioned previously. Note
also that the IGBT module market will be directly
affected by the penetration of SiC during coming
years, with a big push in the EV segment. This is
indeed a worthy market to follow!
In this report, Yole summarizes the different
markets in the power semiconductor area, from
the silicon wafer to the discrete device, module
and inverter.
there are other applications that are boosted
by electrification needs and by EV/HEVs. This is
the case in renewable energy, which is boosted
by clean driving trends and growing electricity
consumption. More grid lines also need to be
deployed to sustain greater amounts of required
energy. Similarly, more energy storage systems
need to be deployed for better distribution of
the energy to the grid. The grid must also reach
newly installed EV charging stations outside cities,
enabling many cars to be plugged in at the same
time with an acceptable charging time. Moreover,
if we take into account automated driving and long
term vehicle-to-everything (V2X) communication,
more data centers could be required, more LiDAR
systems, along with other supporting technology.
Hence, we are living an era where established
applications are boosted by electrification and
also by the EV/HEV transition, making the power
electronics market very interesting to follow.
How are these applications evolving? Which are
the main drivers? How is this translating to power
semiconductors? And to Silicon substrates? All of
these topics are discussed in this report.
Power electronics landscape: key players* and repartition of their activities
**Modules and discrete are added together in IGBT and MOSFET
IGBT** MOSFET** Others (include Thyristor, bipolar, TVS)*Non-exhaustive list of companies
0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100%
Microchip
Bosch
Nexperia
Diodes
Renesas
Fuji Electric
Vishay Intertechnology
Mitsubishi
Infineon Technologies
(Yole Développement,August 2019)
Power electronics industry: driving applications’ perspectives
Today, the automotive segment, especially
EV/HEVs, drives both technological
development and market demand
Time
Strong
synergies
with other
segments
Renewable energy, stationary battery
energy storage, charging infrastructure,
HVDC deployment…
Industrial
Automotive
Renewables
Autonomous driving, IoT...
EV/HEV inverters, boost converter,
DC-DC converter, 48V converter,
on-board charger…
LiDAR
Charging
Station
Power Supply Motor drive
EV/HEV
UPS
Wind
PV Grid
(Yole Développement,August 2019)
22. COMPANIES MONITORED IN THE PRODUCT
ABB, Alpha and Omega Semiconductor (AOS), Alstom, Amkor, Analog Devices, ASE Group,
Bosch, BYD, Continental, Cree, CRRC, Danfoss, Denso, Dialog Semiconductor, Diodes
Incorporated, Diotec semiconductor, Episil, EXAGAN, Fuji Electric, GaN Systems, General
Electric, Global Wafers, GTA semiconductor, HHGrace, Hitachi, Honda, Huawei, Infineon,
Ingeteam, LEM, Littelfuse, MACMIC, Magnachip, Maxim Integrated, Microchip, Mitsubishi
Electric, Monolithic Power Systems, Navitas, Nexperia, NXP, Okmetic, ON Semiconductor,
Panasonic, Powerex, Power Integrations, Qualcomm, Renesas, Rohm, Sanken, Semikron,
Semtech, Shindengen, ShinEtsu, Siemens, Silan Microelectronics, Silego Technology, Silterra,
Siltronic, Sino-Microelectronics, Soitec, ST Microelectronics, StarPower, Sumco, Sungrow,
Tamura, TDK, Tesla Motors, Texas Instruments, Toshiba, Toyota, Transphorm, UnitedSiC,
UTAC, Valeo, Vishay, Volkswagen, and more...
MARKET TECHNOLOGY REPORT
What we got right, what we got wrong 16
Executive summary 17
Context 56
Market forecasts 66
Overall power electronics market
Wafer market forecast
Power device market
Power MOSFET market
Power IGBT market
SiC and GaN market share
Global discrete market share
IGBT module market
Global module market and shares
Si vs SiC vs GaN
Discrete packaging materials market
Inverter market
Market trends 90
Market trends: by market
EV, rail, charging infrastructure, PV, wind,
UPS, computing, power supply, motor
drives, consumer, home appliances,
telecom, energy storage
Market trends: by product
Wafer, MOSFET, IGBT
Fab capacity focus
Market shares and supply chain 127
Key power electronics players
Overall revenue ranking
Power revenue ranking
Power electronics landscape
Supply chain analysis
Silicon wafer landscape and market shares
Power MOSFET market shares
IGBT discrete and module market shares
Packaging supply chain and players including
main material players
Passives supply chain
Li-Ion battery supply chain
Inverter and power stack supply chain
MA, collaboration, fundraising
Focus on China
Technology trends 171
Challenges, main requirements and innovation
axes
Integration
Harsh environments
Current sensors
Packaging
Discrete, module, packaging trends,
integration, SiC packaging, GaN packaging
Wide band gap
Highlights, commercial devices, SiC
inverters, passive needs for WBG,
packaging for WBG, reliability analysis
Batteries
Batteries for EV, other driving applications,
manufacturing trends
Outlooks 226
Yole corporate presentation 233
TABLE OF CONTENTS (complete content on i-Micronews.com)
• Status of the Inverter Industry 2019
• Discrete Power Device Packaging: Materials
Market and Technology Trends 2019
• Status of Rechargeable Li-ion Battery
Industry 2019
• Power SiC 2019: Materials, Devices, and
Applications
• Power Electronics for EV/HEV 2018
Find all our reports on www.i-micronews.com
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AUTHOR
Ana Villamor, PhD serves as a
Technology Market Analyst, Power
Electronics Compound Semiconductors
within the Power Wireless division at Yole
Développement (Yole). She is involved in
many custom studies and reports focused
on emerging power electronics technologies
at Yole Développement, including device
technology and reliability analysis (MOSFET,
IGBT, HEMT, etc). In addition, Ana is leading
the quarterly power management market
updates released in 2017.
Previously Ana was involved in a high-added
value collaboration related to SJ Power
MOSFETs, within the CNM research center
for the leading power electronic company
ON Semiconductor. During this partnership
and after two years as Silicon Development
Engineer, she acquired a relevant technical
expertise and a deep knowledge of the
power electronic industry.
Ana is author and co-author of several
papers as well as a patent. She holds an
Electronics Engineering degree completed
by a Master and PhD. in micro and nano
electronics from Universitat Autonoma de
Barcelona (SP).
REPORT OBJECTIVES
• Assess the market for wafers, devices, modules and inverters
• Understand the market dynamics for the whole power electronics industry
• Identify the key drivers that will shape the market in the future
• Have an overview on the different components used in power electronics and its integration
• Understand the main technological challenges to overcome and the solutions developed so far
• Provide a clear overview of the different applications driving the power electronics business
• Present data ranking the power electronics industry leaders, describing supply chain consolidation,
the latest MA activity and future trends in the power player landscape
WHAT’S NEW
• Update on power electronics wafer
level market from 2018 to 2024
• Update on power electronics’ major
discrete and module segments,
specifically IGBT and MOSFET, from
2018 to 2024
• Updated global SiC and GaN
markets
• Forecast comparison for discretes
and modules by type of device and
material
• Update of power electronics
inverter market from 2018 to 2024
• Market and technology trends for
each power electronics application
• Company revenues in 2018
• Power electronics player ranking and
landscape analysis for 2018
• Analysis of the latest MA activity
• Overview of technology status for
power electronics
• Focus on packaging trends
• Wide band gap update
23. ORDER FORM
Status of the Power Electronics Industry 2019
SHIPPING CONTACT
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BANK INFO: HSBC, 1 place de la Bourse,
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Bank code: 30056, Branch code: 00170
Account No: 0170 200 1565 87,
SWIFT or BIC code: CCFRFRPP,
IBAN: FR76 3005 6001 7001 7020 0156 587
RETURN ORDER BY
• MAIL: YOLE DÉVELOPPEMENT, Le Quartz,
75 Cours Emile Zola, 69100 Villeurbanne/Lyon - France
SALES CONTACTS
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+ 1 310 600-8267 – laferriere@yole.fr
• Eastern US Canada - Chris Youman:
+1 919 607 9839 – chris.youman@yole.fr
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+ 49 15 123 544 182 – levenez@yole.fr
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+81-80-4371-4887 – onozawa@yole.fr
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+886 979 336 809 – wang@yole.fr
• Korea - Peter OK:
+82 10 4089 0233 – peter.ok@yole.fr
• Specific inquiries: +33 472 830 180 – info@yole.fr
(1)
Our Terms and Conditions of Sale are available at
www.yole.fr/Terms_and_Conditions_of_Sale.aspx
The present document is valid 24 months after its publishing date:
August 6, 2019
/
ABOUT YOLE DEVELOPPEMENT
BILL TO
Name (Mr/Ms/Dr/Pr):
Job Title:
Company:
Address:
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PRODUCT ORDER - Ref YD19036
Please enter my order for above named report:
One user license*: Euro 5,990
Multi user license: Euro 6,490
- The report will be ready for delivery from September 9, 2019
- For price in dollars, please use the day’s exchange rate. All reports are
delivered electronically at payment reception. For French customers,
add 20% for VAT
I hereby accept Yole Développement’s Terms and Conditions of Sale(1)
Signature:
*One user license means only one person at the company can use the report.
Founded in 1998, Yole Développement (Yole) has grown to become a group of companies providing marketing, technology and strategy consulting, media and
corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using
silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 120 collaborators worldwide covering MEMS and image
sensors, Compound semiconductors, RF Electronics, Solid-state lighting, Displays, Software, Optoelectronics, Microfluidics Medical, Advanced Packaging,
Manufacturing, Power Electronics, Batteries Energy Management and Memory.
The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting,
PISEO, KnowMade and Blumorpho, supports industrial companies, investors and RD organizations worldwide to help them understand markets and follow
technology trends to grow their business.
CONSULTING AND ANALYSIS
• Market data research, marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering costing
• Patent analysis
• Design and characterization of innovative optical systems
• Financial services (due diligence, MA with our partner)
More information on www.yole.fr
MEDIA EVENTS
• i-Micronews.com website, application related e-newsletter
• Communication webcast services
• Events: TechDays, forums…
More information on www.i-Micronews.com
REPORTS
• Market technology reports
• Patent investigation and patent infringement risk analysis
• Structure, process and cost analysis and teardowns
• Cost simulation tool
More information on www.i-micronews.com/reports
CONTACTS
For more information about :
• Consulting Financial Services: Jean-Christophe Eloy (eloy@yole.fr)
• Reports Monitors: David Jourdan (jourdan@yole.fr) Fayçal Khamassi
(khamassi@yole.fr)
• Marketing Communication: Camille Veyrier (veyrier@yole.fr)
• Public Relations: Sandrine Leroy (leroy@yole.fr)
24. Definitions: “Acceptance”: Action by which the Buyer accepts
the terms and conditions of sale in their entirety. It is done by
signing the purchase order which mentions “I hereby accept Yole
Développement’s Terms and Conditions of Sale”.
“Buyer”: Any business user (i.e. any person acting in the course
of its business activities, for its business needs) entering into the
following general conditions to the exclusion of consumers acting in
their personal interests.
“Contracting Parties” or “Parties”: The Seller on one hand
and the Buyer on the other hand.
“Intellectual Property Rights” (“IPR”) means any rights
held by the Seller in its Products, including any patents, trademarks,
registered models, designs, copyrights, inventions, commercial
secrets and know-how, technical information, company or trading
names and any other intellectual property rights or similar in any part
of the world, notwithstanding the fact that they have been registered
or not and including any pending registration of one of the above
mentioned rights.
“Products”: Depending on the purchase order, reports or
monitors on MEMS, Imaging, SSL, Advanced Packaging, MedTech,
Power Electronics and more, can be bought either on a unit basis
or as a bundled offer (i.e. subscription for a period of 12 calendar
months).
“Report”: Reports are established in PowerPoint and delivered in
a PDF format with an additional Excel file. 30 min of QA session
with an analyst/author can be included for all purchased reports
(except the ones bought in one user license). More time can be
allocated on a fee basis.
“License”: For the reports 3 different licenses are proposed. The
buyer has to choose one license type:
• Single user license: one person at the company can use the report.
Sharing is strictly forbidden.
• Multi-user license: the report can be accessed by an unlimited
number of users within the company, but only in the country of the
primary user. Subsidiaries and Joint-Ventures are excluded.
• Corporate license: the report can be used by an unlimited number
of users within the company, but only in the country of the primary
user. Subsidiaries are included, while Joint-Ventures are excluded.
“Monitor”: Monitors are established and delivered in Excel. An
additional PDF can also join it. QA with an Analyst is possible for
each monitor with a maximum limit of 100h/year. Frequency of the
release varies according to the monitor or service.
“Seller”: Based in Villeurbanne (France, headquarters) Yole
Développement provides marketing, technology and strategy
consulting,mediaandcorporatefinanceservices,reverseengineering/
costing services as well as IP and patent analysis. With more than 70
market analysts, Yole Développement works worldwide with the
key industrial companies, RD institutes and investors to help them
understand the market and technology trends.
1. SCOPE
1.1 The Contracting Parties undertake to observe the following
general conditions when agreed by the Buyer and the Seller.
ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS
AND CONDITIONS IN ANY OTHER DOCUMENTS ISSUED
BY THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO
BY THE SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY
SALE MADE HEREUNDER AND SHALL NOT BE BINDING IN
ANY WAY ON THE SELLER.
1.2 This agreement becomes valid and enforceable between the
Contracting Parties after clear and non-equivocal consent by
any duly authorized person representing the Buyer. For these
purposes, the Buyer accepts these conditions of sales when
signing the purchase order which mentions “I hereby accept Yole
Développement’s Terms and Conditions of Sale”. This results in
acceptance by the Buyer.
1.3 Orders are deemed to be accepted only upon written acceptance
and confirmation by the Seller, within [7 days] from the date of
order, to be sent either by email or to the Buyer’s address. In the
absence of any confirmation in writing, orders shall be deemed to
have been accepted.
2. MAILING OF THE PRODUCTS
2.1 Products are sent by email to the Buyer:
• Within a few days from the order for Products already released
and paid; or
• Within a reasonable time for Products ordered prior to their
effective release. In this case, the Seller shall use its best
endeavours to inform the Buyer of an indicative release date
and the evolution of the work in progress.
2.2 The Seller shall by no means be responsible for any delay in
respect of article 2.1 above, and including in cases where a new
event or access to new contradictory information would require
for the analyst extra time to compute or compare the data in
order to enable the Seller to deliver a high quality Products.
2.3 The mailing of the Product will occur only upon payment by the
Buyer, in accordance with the conditions contained in article 3.
2.4. The mailing is operated through electronic means either by
email via the sales department or automatically online via an
email/password. If the Product’s electronic delivery format is
defective, the Seller undertakes to replace it at no charge to the
Buyer provided that it is informed of the defective formatting
within 90 days from the date of the original download or receipt
of the Product.
2.5 The person receiving the Products on behalf of the Buyer
shall immediately verify the quality of the Products and their
conformity to the order. Any claim for apparent defects or for
non-conformity shall be sent in writing to the Seller within 8
days of receipt of the Products. For this purpose, the Buyer
agrees to produce sufficient evidence of such defects.
2.6 No return of Products shall be accepted without prior
information to the Seller, even in case of delayed delivery.
Any Product returned to the Seller without providing prior
information to the Seller as required under article 2.5 shall
remain at the Buyer’s risk.
3. PRICE, INVOICING AND PAYMENT
3.1 Prices are given in the orders corresponding to each Product
sold on a unit basis or corresponding to annual subscriptions.
They are expressed to be inclusive of all taxes (except for France
where VAT will be added). The prices are re-evaluated from time
to time. The effective price is deemed to be the one applicable at
the time of the order.
3.2 Payments due by the Buyer shall be sent by cheque payable to
Yole Développement, credit card or by electronic transfer to the
following account:
HSBC, 1 place de la Bourse 69002 Lyon France
Bank code: 30056
Branch code: 00170
Account n°: 0170 200 1565 87
BIC or SWIFT code: CCFRFRPP
IBAN: FR76 3005 6001 7001 7020 0156 587
To ensure the payments, the Seller reserves the right to request
down payments from the Buyer. In this case, the need of down
payments will be mentioned on the order.
3.3 Payment is due by the Buyer to the Seller within 30 days
from invoice date, except in the case of a particular written
agreement. If the Buyer fails to pay within this time and fails to
contact the Seller, the latter shall be entitled to invoice interest
in arrears based on the annual rate Refi of the “BCE” + 7 points,
in accordance with article L. 441-6 of the French Commercial
Code. Our publications (report, database, tool...) are delivered
only after reception of the payment.
3.4 In the event of termination of the contract, or of misconduct,
during the contract, the Seller will have the right to invoice at the
stage in progress, and to take legal action for damages.
4. LIABILITIES
4.1 The Buyer or any other individual or legal person acting on its
behalf, being a business user buying the Products for its business
activities, shall be solely responsible for choosing the Products
and for the use and interpretations he makes of the documents
it purchases, of the results he obtains, and of the advice and acts
it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable
pecuniary loss, caused by the Products or arising from a material
breach of this agreement.
4.3 In no event shall the Seller be liable for:
a) Damages of any kind, including without limitation, incidental
or consequential damages (including, but not limited to, damages
for loss of profits, business interruption and loss of programs
or information) arising out of the use of or inability to use the
Seller’s website or the Products, or any information provided on
the website, or in the Products;
b) Any claim attributable to errors, omissions or other
inaccuracies in the Product or interpretations thereof.
4.4 All the information contained in the Products has been obtained
from sources believed to be reliable. The Seller does not warrant
the accuracy, completeness adequacy or reliability of such
information, which cannot be guaranteed to be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice
to the Buyer from time to time be modified by or substituted
with similar Products meeting the needs of the Buyer. This
modification shall not lead to the liability of the Seller, provided
that the Seller ensures the substituted Product is similar to the
Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that
the Products contain defects, the Seller undertakes to replace
the defective products as far as the supplies allow and without
indemnities or compensation of any kind for labour costs, delays,
loss caused or any other reason. The replacement is guaranteed
for a maximum of two months starting from the delivery date.
Any replacement is excluded for any event as set out in article
5 below.
4.7 The deadlines that the Seller is asked to state for the mailing
of the Products are given for information only and are not
guaranteed. If such deadlines are not met, it shall not lead to any
damages or cancellation of the orders, except for non-acceptable
delays exceeding [3] months from the stated deadline, without
information from the Seller. In such case only, the Buyer shall be
entitled to ask for a reimbursement of its first down payment to
the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied,
including, without limitation, those of sale ability and fitness for
a particular purpose, with respect to the Products. Although the
Seller shall take reasonable steps to screen Products for infection
of viruses, worms, Trojan horses or other codes containing
contaminating or destructive properties before making the
Products available, the Seller cannot guarantee that any Product
will be free from infection.
5. FORCE MAJEURE
The Seller shall not be liable for any delay in performance directly
or indirectly caused by or resulting from acts of nature, fire, flood,
accident, riot, war, government intervention, embargoes, strikes,
labour difficulties, equipment failure, late deliveries by suppliers or other
difficulties which are beyond the control, and not the fault of the Seller.
6. PROTECTION OF THE SELLER’S IPR
6.1 All the IPR attached to the Products are and remain the property
of the Seller and are protected under French and international
copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute,
resell or publish the Product, or any part of it to any other party
other than employees of its company (only in the country of the
primary user). The Buyer shall have the right to use the Products
solely for its own internal information purposes. In particular, the
Buyer shall therefore not use the Product for purposes such as:
• Information storage and retrieval systems;
• Recordings and re-transmittals over any network (including any
local area network);
• Use in any timesharing, service bureau, bulletin board or similar
arrangement or public display;
• Posting any Product to any other online service (including
bulletin boards or the Internet);
• Licensing, leasing, selling, offering for sale or assigning the
Product.
6.3 If the Buyer would like to use data coming from the Products for
presentations, press announcements and any other projects, the
Buyer needs to contact Yole Développement’s Public Relations
Director (info@yole.fr) to get an official authorization and verify
data are up to date. In return the Seller will make sure to provide
up-to-date data under a suitable public format.
6.4 The Buyer shall be solely responsible towards the Seller of all
infringements of this obligation, whether this infringement comes
from its employees or any person to whom the Buyer has sent the
Products and shall personally take care of any related proceedings, and
the Buyer shall bear related financial consequences in their entirety.
6.5 The Buyer shall define within its company a contact point for the
needs of the contract. This person will be the recipient of each
new report. This person shall also be responsible for respect
of the copyrights and will guaranty that the Products are not
disseminated out of the company. In the context of Bundle and
Annual Subscriptions, the contact person shall decide who within
the Buyer, shall be entitled to receive the protected link that will
allow the Buyer to access the Products.
6.6 Please note that whether in Bundles or Annual Subscription, all
unselected reports will be cancelled and lost after the 12 month
validity period of the contract.
6.7 As a matter of fact the investor of a company, external
consultants, the joint venture done with a third party, and so
on cannot access the report and should pay a full license price.
7. TERMINATION
7.1 If the Buyer cancels the order in whole or in part or postpones
the date of mailing, the Buyer shall indemnify the Seller for the
entire costs that have been incurred as at the date of notification
by the Buyer of such delay or cancellation. This may also apply for
any other direct or indirect consequential loss that may be borne
by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions or
the order, the non-breaching Party may send a notification to the
other by recorded delivery letter upon which, after a period of
thirty (30) days without solving the problem, the non-breaching
Party shall be entitled to terminate all the pending orders,
without being liable for any compensation.
8. MISCELLANEOUS
All the provisions of these Terms and Conditions are for the benefit
of the Seller itself, but also for its licensors, employees and agents.
Each of them is entitled to assert and enforce those provisions
against the Buyer.
Any notices under these Terms and Conditions shall be given in writing.
They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and Conditions
and the Buyer, is deemed to have accepted the latest version of these
terms and conditions, provided they have been communicated to him
in due time.
9. GOVERNING LAW AND JURISDICTION
9.1 Any dispute arising out or linked to these Terms and Conditions or
to any contract/orders entered into in application of these Terms
and Conditions shall be settled by the French Commercial Courts
of Lyon, which shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the
Seller, in accordance with these Terms and Conditions.
TERMS AND CONDITIONS OF SALES