An ultrasonic sensor in a compact housing, with 20-450cm detection range. Ultrasonic transducers are used in vehicles as parking assistance. The ultrasonic transducer sends out short ultrasonic impulses which are reflected by barriers. The echo signals are registered by the sensor and are evaluated by a central control unit. This ultrasonic parking sensor from Bosch is very compact with its very few components meaning it is manufactured at low cost. The sensor is made with one electronic board, including a Bosch transceiver integrated circuit (IC) that drives the output of the Epcos/TDK transformer and evaluates the reflected signal. The transducer itself is made of a lead zirconate titanate (PZT) membrane and silver electrodes. More information on that report at http://www.i-micronews.com/reports.html

1. ©2017 by System Plus Consulting | Bosch Ultrasonic Sensor 1
21 rue la Noue Bras de Fer
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Bosch Ultrasonic Sensor
System report by Sylvain Hallereau
August 2017

2. ©2017 by System Plus Consulting | Bosch Ultrasonic Sensor 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
o Company Profile
Teardown Analysis 10
o Views and Dimensions
o X-Ray Views
o Cross Section
o Ultrasonic Sensor Opening
o Transducer Analysis
o Electronic Board
 Top Side – High definition photo
 Top Side – Main components identification
 Bottom Side – High definition photo
 Bottom Side – Components identification
Cost Analysis 26
o Accessing the BOM
o PCB Cost
o Estimation of the Cost of the Bosch 40087
o BOM Cost - Electronic Board
o BOM Cost - Housing
o Material Cost Breakdown by Sub-Assembly
o Material Cost Breakdown by Component Category
o Accessing the Added Value (AV) cost
o Electronic Board Manufacturing Flow
o Details of the Electronic Board AV Cost
o Details of the System Assembly AV Cost
o Added-Value Cost Breakdown
o Manufacturing Cost Breakdown
Manufacturing Price 56
o Estimation of the Manufacturing Price
Give us your Feedbacks!
Company services 61

3. ©2017 by System Plus Consulting | Bosch Ultrasonic Sensor 3
O V E R V I E W
METHODOLOGY

4. ©2017 by System Plus Consulting | Bosch Ultrasonic Sensor 4
Overview / Introduction
o Executive Summary
o Reverse Costing
Methodology
o Company Profile
Teardown Analysis
Cost Analysis
Manufacturing Price
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Ultrasonic Sensor
supplied by Bosch.

5. ©2017 by System Plus Consulting | Bosch Ultrasonic Sensor 5
Overview / Introduction
Teardown Analysis
o Views & Dimensions
o RX View
o Cross-section
o Module Opening
o Transducer Analysis
o Electronic Board
Cost Analysis
Manufacturing Price
About System Plus
Global View
Global View of the Ultrasonic Sensor.
Total Weight: 13g

6. ©2017 by System Plus Consulting | Bosch Ultrasonic Sensor 6
Overview / Introduction
Teardown Analysis
o Views & Dimensions
o RX View
o Cross-section
o Module Opening
o Transducer Analysis
o Electronic Board
Cost Analysis
Manufacturing Price
About System Plus
X-Ray View

7. ©2017 by System Plus Consulting | Bosch Ultrasonic Sensor 7
Overview / Introduction
Teardown Analysis
o Views & Dimensions
o RX View
o Cross-section
o Module Opening
o Transducer Analysis
o Electronic Board
Cost Analysis
Manufacturing Price
About System Plus
Transducer Analysis

8. ©2017 by System Plus Consulting | Bosch Ultrasonic Sensor 8
Overview / Introduction
Teardown Analysis
o Views & Dimensions
o RX View
o Cross-section
o Module Opening
o Transducer Analysis
o Electronic Board
Cost Analysis
Manufacturing Price
About System Plus
Electronic Board – Top Side

9. ©2017 by System Plus Consulting | Bosch Ultrasonic Sensor 9
Overview / Introduction
Teardown Analysis
o Views & Dimensions
o RX View
o Cross-section
o Module Opening
o Transducer Analysis
o Electronic Board
Cost Analysis
Manufacturing Price
About System Plus
Electronic Board – Top Side – Main Components Identification

10. ©2017 by System Plus Consulting | Bosch Ultrasonic Sensor 10
C O S T
ANALYSIS

11. ©2017 by System Plus Consulting | Bosch Ultrasonic Sensor 11
Overview / Introduction
Teardown Analysis
Cost Analysis
o Accessing the BOM
o PCB Cost
o Bosch IC Estimation
o BOM Cost – Electronic
Board
o BOM Cost - Housing
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturing Price
About System Plus
BOM Cost – Electronic Board

12. ©2017 by System Plus Consulting | Bosch Ultrasonic Sensor 12
Overview / Introduction
Teardown Analysis
Cost Analysis
o Accessing the BOM
o PCB Cost
o Bosch IC Estimation
o BOM Cost – Electronic
Board
o BOM Cost - Housing
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturing Price
About System Plus
BOM Cost – Housing

13. ©2017 by System Plus Consulting | Bosch Ultrasonic Sensor 13
Overview / Introduction
Teardown Analysis
Cost Analysis
o Accessing the BOM
o PCB Cost
o Bosch IC Estimation
o BOM Cost – Electronic
Board
o BOM Cost - Housing
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturing Price
About System Plus
Manufacturing Cost Breakdown

14. ©2017 by System Plus Consulting | Bosch Ultrasonic Sensor 14
Overview / Introduction
Teardown Analysis
Cost Analysis
Manufacturing Price
o Financial Ratios
o Manufacturing Price
About System Plus
Estimation of the Manufacturing Price

15. ©2017 by System Plus Consulting | Bosch Ultrasonic Sensor 15
Overview / Introduction
Teardown Analysis
Cost Analysis
Manufacturing Price
About System Plus
o Company services
o Feedbacks
o Contact
o Legal
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
IMAGING
- 3D Imaging and Sensing 2017
- Sensors and Data Management for Autonomous Vehicles
report 2015
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16. COMPLETE TEARDOWN WITH:
• Detailed photos, including
X-Ray and cross-sections
• Complete teardown
• PCB cross-sections
• MCU physical analysis and
cost estimate
• Complete and priced bill-
of-materials
• Manufacturing process
flow
• Manufacturing cost analysis
• Estimated manufacturing
price
Bosch Mobility Ultrasonic Sensor
Title: Bosch Ultrasonic Sensor
Pages: 64
Date: August 2017
Format: PDF & Excel file
Price: Full report: EUR 2,490
An ultrasonic sensor in a compact housing,
with 20-450cm detection range
This ultrasonic parking sensor from Bosch is very compact with its very
few components meaning it is manufactured at low cost. The sensor is
made with one electronic board, including a Bosch transceiver
integrated circuit (IC) that drives the output of the Epcos/TDK
transformer and evaluates the reflected signal. The transducer itself is
made of a lead zirconate titanate (PZT) membrane and silver
electrodes.
Based on a complete teardown analysis of the Bosch ultrasonic sensor,
the report provides the bill-of-material (BOM) and manufacturing cost.
A physical analysis and a manufacturing cost estimation of the Bosch
transceiver IC are also available in this report.
Ultrasonic transducers are
used in vehicles as
parking assistance. The
ultrasonic transducer
sends out short ultrasonic
impulses which are
reflected by barriers. The
echo signals are
registered by the sensor
and are evaluated by a
central control unit.

17. TABLE OF CONTENTS
Overview / Introduction
• Executive Summary
• Company Profile and Main
Features
• Reverse Costing
Methodology
Physical Analysis
• Views and Dimensions of the
Sensor
• X-Ray View and Cross Section
• Sensor Opening
• Transducer Analysis
• Electronic Board
• High Definition Photos
• Components Markings and
Identification
Cost Analysis
• PCB Cost
• Estimation of the Cost of the
Bosch IC
System Plus Consulting offers
powerful costing tools to evaluate
the production cost and selling price
from single chip to complex
structures.
SYSCost+
It provides all component costs
estimation including PCB, housing
and connectors, and a simulation of
the assembly cost and test process
at the board and system level, in
order to help you defining the cost
of an electronic system.
IC Price+
This tool performs the necessary
cost simulation of any Integrated
Circuit: ASICs, microcontrollers,
memories, DSP, smartpower…
ANALYSIS PERFORMED WITH OUR COSTING TOOLS SYSCOST+ AND IC PRICE+
IC Price+
SYSCost+
AUTHORS:
Sylvain Hallereau
Sylvain is in charge of
costing analyses for IC,
power and MEMS. He
has more than 10
years of experience in power device
manufacturing cost analysis and has
studied a wide range of
technologies.
for 25 years at Atmel Nantes
Technological Analysis Laboratory
and for three years at Hirex
Engineering.
Yvon Le Goff (Lab)
Yvon joined System
Plus Consulting in 2011
to set up its laboratory.
He previously worked
• BOM Cost – Electronic
Board
• BOM Cost – Housing
• Material Cost Breakdown
• Accessing the Added
Value (AV) Cost
• Electronic Board
Manufacturing Flow
• Details of the Housing
Assembly and Functional
Test Costs
• Added Value Cost
Breakdown
• Manufacturing Cost
Breakdown
Estimated Price Analysis
• Estimation of the
Manufacturer Price
reverse costing with a focus on
boards and systems. He previously
worked for Lacroix Electronics
where he was in charge of its
components database.
David Le Gac
David joined System
Plus Consulting as a
cost engineer in 2013.
He is in charge of
Distributed by

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The fourth generation of Bosch long
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standards for a more elegant,
compact and cost effective module.
Bosch confirms its will to catch up on
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camera.
First piezoelectric MEMS
microphone could disrupt
consumer applications.
Pages: 88
Date: April 2017
Full report: EUR 2,990*
Pages: 72
Date: April 2017
Full report: EUR 2,990*
Pages: 115
Date: February 2017
Full report: EUR 3,490*
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20. ©2017 by System Plus Consulting | Bosch Ultrasonic Sensor 16
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21. ©2017 by System Plus Consulting | Bosch Ultrasonic Sensor 17
Overview / Introduction
Teardown Analysis
Cost Analysis
Manufacturing Price
About System Plus
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22. ©2017 by System Plus Consulting | Bosch Ultrasonic Sensor 18
Overview / Introduction
Teardown Analysis
Cost Analysis
Manufacturing Price
About System Plus
o Company services
o Feedbacks
o Contact
o Legal
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