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©2017 by System Plus Consulting | STMicroelectronics SCT30N120 1
21 rue la Noue Bras de Fer
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
STMicroelectronics SCT30N120
1200V SiC MOSFET
Power Semiconductor report by Elena Barbarini
January 2017
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 2
SUMMARY
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o STMicroelectronics
Physical Analysis 11
o Synthesis of the Physical Analysis
o Package analysis
 Package opening
 Package Croos-Section
o MOSFET Die
 MOSFET Die View & Dimensions
 MOSFET Die Process
 MOSFET Die Cross-Section
 MOSFET Die Process Characteristic
MOSFET Manufacturing Process 30
o MOSFET Die Front-End Process
o MOSFET Die Fabrication Unit
o Final Test & Packaging Fabrication unit
Cost Analysis 39
o Synthesis of the cost analysis
o Yields Explanation & Hypotheses
o MOSFET die
 MOSFET Die Front-End Cost
 MOSFET Die Probe Test, Thinning & Dicing
 MOSFET Die Wafer Cost
 MOSFET Die Cost
 Wafer Cost Evolution
 Die Cost Evolution
o Complete MOSFET
 Assembled Components Cost
 Synthesis of the assembling
 Component Cost
Price Analysis 53
o Estimation of selling price
Comparison 56
o ST, Cree and Rohm 1200V SiC MOSFET
o Comparison between 1200V Si IGBT and SiC MOSFET
Company services 61
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 3
Overview / Introduction
o Executive Summary
o Reverse Costing
Methodology
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price
of the STMicroelectronics SCT30N120 1200V SiC MOSFET.
The STC30N120 is the first generation 1200V SiC MOSFET device from STMicroelectonics. The device presents a planar
structure and a design which allows good electrical performances; such as high current density. Moreover, the supply chain
and the manufacturing choices makes a very competitive cost.
The device is suitable for high power applications like motor drives, inverters, DC-DC converters and power supply.
The STC30N120 integrates the first generation high-voltage SiC power MOSFET dies in a specific discrete package.
STMicroelectronisc says that the components It offers a higher operating temperature (up to 200°C) and an On resistance of
90mohm for a very competitive cost. Il y a pas des differences des deisgn
The report goes into depth in its analysis of the packaging and the components, with images of the complex planar SiC
structure.
It also includes production cost analysis and overall comparison with Rohm and Wolfspeed SiC MOSFETs and with 1200V Si
IGBTs.
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 4
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Synthesis
o Package
o Die design
o Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Synthesis of the Physical Analysis
Package HiP247:
o Dimensions: 15mm x10.15mm x4.5mm
o Number of Pins: 3 pin
MOSFET:
o Dimension: xxxxxxx=xxxx mm2
o Electrical Connection: xxxx wire
bonding
o Placement in the package: xxxxx on
copper lead frame.
Package
SiC MOSFET
Package opening
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 5
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Synthesis
o Package
o Die design
o Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Datasheet
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 6
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Synthesis
o Package
o Die design
o Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Package characteristics
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 7
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Synthesis
o Package
o Die design
o Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Package Cross-Section
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 8
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Synthesis
o Package
o Die design
o Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
MOSFET die Dimensions
MOSFET : Optical view
xxxxµm
o Die dimensions:
xxxx mm²
o There is no marking on the die.
xxxx µm
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 9
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Synthesis
o Package
o Die design
o Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Die process
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 10
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Synthesis
o Package
o Die design
o Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Die cross section
o Die thickness: xxxx µm
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 11
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Synthesis
o Package
o Die design
o Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Die cross section
o Epitaxy thickness: xxx µm
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 12
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Synthesis
o Package
o Die design
o Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Die cross section
o Transistor pitch: xxxx µm
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 13
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Synthesis
o Package
o Die design
o Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Die cross section
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 14
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
MOSFET Process Flow (1/4)
Epitaxy
•Epitaxy
Implantation
•SiO2 deposition
•Pattern SiO2
•P well implantation
Implantation
•SiO2 deposition
•Pattern SiO2
•N+ source implantation
N- Drift region Epitaxy
SiC Substrate N+
00 00 000
00 00 000
Drawing not to Scale
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 15
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
MOSFET Process Flow (4/4)
Drawing not to Scale
Backside
• Thinning
• Backside contact
Passivation
and
Polyimide
• Polyimide
deposition and
pattern
00 00 000
00 00
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 16
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
o Synthesis
o Die Cost
o Packaging Cost
o Component Cost
o Cost Evolution
Selling Price Analysis
Comparison
About System Plus
Main steps of economic analysis
Probe Test Cost
Assembly Cost
Final Test Cost
MOSFET
Front-End Cost
xxxxx
xxxxx
xxxx
xxxxx
We perform the economic analysis of the component with the Power CoSim+
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 17
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
o Synthesis
o Die Cost
o Packaging Cost
o Component Cost
o Cost Evolution
Selling Price Analysis
Comparison
About System Plus
MOSFET Front-End Cost
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 18
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
o Synthesis
o Die Cost
o Packaging Cost
o Component Cost
o Cost Evolution
Selling Price Analysis
Comparison
About System Plus
MOSFET Die Cost
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 19
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
o Synthesis
o Die Cost
o Packaging Cost
o Component Cost
o Cost Evolution
Selling Price Analysis
Comparison
About System Plus
Component Cost
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 20
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
o Synthesis
o Die Cost
o Packaging Cost
o Component Cost
o Cost Evolution
Selling Price Analysis
Comparison
About System Plus
Wafer Cost Evolution
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 21
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Estimated Manufacturer Price
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 22
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
o ST, Cree and Rohm
1200V SiC MOSFET
o 1200V Si IGBT Vs SiC
MOSFET
About System Plus
Comparison between ST, Cree and Rohm 1200V SiC MOSFET
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 23
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
o ST, Cree and Rohm
1200V SiC MOSFET
o 1200V Si IGBT Vs SiC
MOSFET
About System Plus
Comparison between 1200V Si IGBT and SiC MOSFET
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 24
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
o Company services
o Related reports
o Feedbacks
o Contact
o Legal
Business Models Fields of Expertise
Custom Analyses
(>130 analyses per year)
Reports
(>40 reports per year)
Costing Tools
Trainings
©2017 by System Plus Consulting | STMicroelectronics SCT30N120 25
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
o Company services
o Related reports
o Feedbacks
o Contact
o Legal
Contact
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STMicroelectronics 1200V SiC MOSFET STC30N120 - teardown reverse costing report published by Yole Developpement

  • 1. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 1 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr STMicroelectronics SCT30N120 1200V SiC MOSFET Power Semiconductor report by Elena Barbarini January 2017
  • 2. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 2 SUMMARY Overview / Introduction 3 o Executive Summary o Reverse Costing Methodology Company Profile 8 o STMicroelectronics Physical Analysis 11 o Synthesis of the Physical Analysis o Package analysis  Package opening  Package Croos-Section o MOSFET Die  MOSFET Die View & Dimensions  MOSFET Die Process  MOSFET Die Cross-Section  MOSFET Die Process Characteristic MOSFET Manufacturing Process 30 o MOSFET Die Front-End Process o MOSFET Die Fabrication Unit o Final Test & Packaging Fabrication unit Cost Analysis 39 o Synthesis of the cost analysis o Yields Explanation & Hypotheses o MOSFET die  MOSFET Die Front-End Cost  MOSFET Die Probe Test, Thinning & Dicing  MOSFET Die Wafer Cost  MOSFET Die Cost  Wafer Cost Evolution  Die Cost Evolution o Complete MOSFET  Assembled Components Cost  Synthesis of the assembling  Component Cost Price Analysis 53 o Estimation of selling price Comparison 56 o ST, Cree and Rohm 1200V SiC MOSFET o Comparison between 1200V Si IGBT and SiC MOSFET Company services 61
  • 3. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 3 Overview / Introduction o Executive Summary o Reverse Costing Methodology Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison About System Plus Executive Summary This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the STMicroelectronics SCT30N120 1200V SiC MOSFET. The STC30N120 is the first generation 1200V SiC MOSFET device from STMicroelectonics. The device presents a planar structure and a design which allows good electrical performances; such as high current density. Moreover, the supply chain and the manufacturing choices makes a very competitive cost. The device is suitable for high power applications like motor drives, inverters, DC-DC converters and power supply. The STC30N120 integrates the first generation high-voltage SiC power MOSFET dies in a specific discrete package. STMicroelectronisc says that the components It offers a higher operating temperature (up to 200°C) and an On resistance of 90mohm for a very competitive cost. Il y a pas des differences des deisgn The report goes into depth in its analysis of the packaging and the components, with images of the complex planar SiC structure. It also includes production cost analysis and overall comparison with Rohm and Wolfspeed SiC MOSFETs and with 1200V Si IGBTs.
  • 4. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 4 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o Die design o Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison About System Plus Synthesis of the Physical Analysis Package HiP247: o Dimensions: 15mm x10.15mm x4.5mm o Number of Pins: 3 pin MOSFET: o Dimension: xxxxxxx=xxxx mm2 o Electrical Connection: xxxx wire bonding o Placement in the package: xxxxx on copper lead frame. Package SiC MOSFET Package opening
  • 5. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 5 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o Die design o Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison About System Plus Datasheet
  • 6. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 6 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o Die design o Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison About System Plus Package characteristics
  • 7. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 7 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o Die design o Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison About System Plus Package Cross-Section
  • 8. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 8 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o Die design o Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison About System Plus MOSFET die Dimensions MOSFET : Optical view xxxxµm o Die dimensions: xxxx mm² o There is no marking on the die. xxxx µm
  • 9. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 9 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o Die design o Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison About System Plus Die process
  • 10. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 10 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o Die design o Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison About System Plus Die cross section o Die thickness: xxxx µm
  • 11. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 11 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o Die design o Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison About System Plus Die cross section o Epitaxy thickness: xxx µm
  • 12. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 12 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o Die design o Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison About System Plus Die cross section o Transistor pitch: xxxx µm
  • 13. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 13 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o Die design o Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison About System Plus Die cross section
  • 14. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 14 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison About System Plus MOSFET Process Flow (1/4) Epitaxy •Epitaxy Implantation •SiO2 deposition •Pattern SiO2 •P well implantation Implantation •SiO2 deposition •Pattern SiO2 •N+ source implantation N- Drift region Epitaxy SiC Substrate N+ 00 00 000 00 00 000 Drawing not to Scale
  • 15. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 15 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison About System Plus MOSFET Process Flow (4/4) Drawing not to Scale Backside • Thinning • Backside contact Passivation and Polyimide • Polyimide deposition and pattern 00 00 000 00 00
  • 16. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 16 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis o Synthesis o Die Cost o Packaging Cost o Component Cost o Cost Evolution Selling Price Analysis Comparison About System Plus Main steps of economic analysis Probe Test Cost Assembly Cost Final Test Cost MOSFET Front-End Cost xxxxx xxxxx xxxx xxxxx We perform the economic analysis of the component with the Power CoSim+
  • 17. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 17 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis o Synthesis o Die Cost o Packaging Cost o Component Cost o Cost Evolution Selling Price Analysis Comparison About System Plus MOSFET Front-End Cost
  • 18. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 18 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis o Synthesis o Die Cost o Packaging Cost o Component Cost o Cost Evolution Selling Price Analysis Comparison About System Plus MOSFET Die Cost
  • 19. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 19 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis o Synthesis o Die Cost o Packaging Cost o Component Cost o Cost Evolution Selling Price Analysis Comparison About System Plus Component Cost
  • 20. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 20 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis o Synthesis o Die Cost o Packaging Cost o Component Cost o Cost Evolution Selling Price Analysis Comparison About System Plus Wafer Cost Evolution
  • 21. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 21 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison About System Plus Estimated Manufacturer Price
  • 22. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 22 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison o ST, Cree and Rohm 1200V SiC MOSFET o 1200V Si IGBT Vs SiC MOSFET About System Plus Comparison between ST, Cree and Rohm 1200V SiC MOSFET
  • 23. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 23 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison o ST, Cree and Rohm 1200V SiC MOSFET o 1200V Si IGBT Vs SiC MOSFET About System Plus Comparison between 1200V Si IGBT and SiC MOSFET
  • 24. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 24 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison About System Plus o Company services o Related reports o Feedbacks o Contact o Legal Business Models Fields of Expertise Custom Analyses (>130 analyses per year) Reports (>40 reports per year) Costing Tools Trainings
  • 25. ©2017 by System Plus Consulting | STMicroelectronics SCT30N120 25 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison About System Plus o Company services o Related reports o Feedbacks o Contact o Legal Contact Headquarters 21 rue La Noue Bras de Fer 44200 Nantes FRANCE +33 2 40 18 09 16 sales@systemplus.fr Europe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY +49 151 23 54 41 82 llevenez@systemplus.fr America Sales Office Steve LAFERRIERE Phoenix USA laferriere@yole.fr www.systemplus.fr Asia Sales Office Takashi ONOZAWA Tokyo JAPAN onozawa@yole.fr Mavis WANG GREATER CHINA wang@yole.fr NANTES Headquarter FRANKFURT/MAIN Europa Sales Office LYON YOLE HQ TOKYO YOLE KK GREATER CHINA YOLE PHOENIX YOLE Inc.
  • 26. ORDER FORM Please process my order for “STMicroelectronics 1200V SiC MOSFET STC30N120” Reverse Costing Report  Full Reverse Costing report: EUR 3,290*Ref.: SP17309 Performed by DELIVERY on receipt of payment: By credit card: Number: |__|__|__|__| |__|__|__|__| |__|__|__|__| |__|__|__|__| Expiration date: |__|__|/|__|__| Card Verification Value: |__|__|__| By bank transfer: BANK INFO: HSBC, 1 place de la Bourse, F-69002 Lyon, France, Bank code : 30056, Branch code : 00170 Account No : 0170 200 1565 87, SWIFT or BIC code : CCFRFRPP, IBAN : FR76 3005 6001 7001 7020 0156 587 Return order by: • FAX: +33 (0)472 83 01 83 • MAIL: YOLE DEVELOPPEMENT, 75 Cours Emile Zola, F - 69100 Lyon - Villeurbanne Contact: • Japan: Miho - Ohtake@yole.fr • Greater China: Mavis - Wang@yole.fr • Asia: Takashi - Onozawa@yole.fr • EMEA: Lizzie - Levenez@yole.fr • North America: Steve – laferriere@yole.fr • General: info@yole.fr SHIP TO PAYMENT BILLING CONTACT ABOUT YOLE DEVELOPPEMENT Name (Mr/Ms/Dr/Pr): ...................................................................................... Job Title: ...................................................................................... Company: ...................................................................................... Address: ...................................................................................... City: State: ...................................................................................... Postcode/Zip: ...................................................................................... Country: ...................................................................................... VAT ID Number for EU members: ...................................................................................... Tel: ...................................................................................... Email: ..................................................................................... Date: ....................................................................................... Signature: ...................................................................................... Distributed by First Name: .................................................................. Last Name: ............................................................................ Email:............................................................................ Phone:..................................................................................... Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management. The “More than Moore” company Yole, along with its partners System Plus Consulting, Blumorpho and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business. CUSTOM STUDIES • Market data & research, marketing analysis • Technology analysis • Reverse engineering & costing services • Strategy consulting • Patent analysis More information on www.yole.fr MEDIA • i-Micronews.com, online disruptive technologies website and its weekly e- newsletter, @Micronews • Communication & webcasts services • Events: Yole Seminars, Market Briefings More information on http://www.i-micronews.com/media-kit.html TECHNOLOGY & MARKET REPORTS • Collection of technology & market reports • Manufacturing cost simulation tools • Component reverse engineering & costing analysis • Patent investigation More information on http://www.i- micronews.com/reports.html *For price in dollars please use the day’s exchange rate. All reports are delivered electronically in pdf format. For French customer, add 20 % for VAT.
  • 27. Performed by TERMS AND CONDITIONS OF SALES . Definitions: “Acceptance”: Action by which the Buyer accepts the terms and conditions of sale in their entirety. It is done by signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”. “Buyer”: Any business user (i.e. any person acting in the course of its business activities, for its business needs) entering into the following general conditions to the exclusion of consumers acting in their personal interests. “Contracting Parties” or “Parties”: The Seller on the one hand and the Buyer on the other hand. “Intellectual Property Rights” (“IPR”) means any rights held by the Seller in its Products, including any patents, trademarks, registered models, designs, copyrights, inventions, commercial secrets and know-how, technical information, company or trading names and any other intellectual property rights or similar in any part of the world, notwithstanding the fact that they have been registered or not and including any pending registration of one of the above mentioned rights. “License”: For the reports and databases, 3 different licenses are proposed. The buyer has to choose one license: • One user license: one person at the company can use the report. • Multi-user license: the report can be used by unlimited users within the company. Subsidiaries and Joint-Ventures are not included. • Corporate license: purchased under “Annual Subscription” program, the report can be used by unlimited users within the company. Joint-Ventures are not included. “Products”: Depending on the purchase order, reports or database on MEMS, CSC, Optics/MOEMS, Nano, bio… to be bought either on a unit basis or as an annual subscription. (i.e. subscription for a period of 12 calendar months). The annual subscription to a package (i.e. a global discount based on the number of reports that the Buyer orders or accesses via the service, a global search service on line on I-micronews and a consulting approach), is defined in the order. Reports are established in PowerPoint and delivered on a PDF format and the database may include Excel files. “Seller”: Based in Lyon (France headquarters), Yole Développement is a market research and business development consultancy company, facilitating market access for advanced technology industrial projects. With more than 20 market analysts, Yole works worldwide with the key industrial companies, R&D institutes and investors to help them understand the markets and technology trends. 1. Scope 1.1 The Contracting Parties undertake to observe the following general conditions when agreed by the Buyer and the Seller. ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS AND CONDITIONS IN ANY OTHER DOCUMENTS ISSUED BY THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE MADE HEREUNDER AND SHALL NOT BE BINDING IN ANY WAY ON THE SELLER. 1.2 This agreement becomes valid and enforceable between the Contracting Parties after clear and non-equivocal consent by any duly authorized person representing the Buyer. For these purposes, the Buyer accepts these conditions of sales when signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”. This results in acceptance by the Buyer. 1.3 Orders are deemed to be accepted only upon written acceptance and confirmation by the Seller, within [7 days] from the date of order, to be sent either by email or to the Buyer’s address. In the absence of any confirmation in writing, orders shall be deemed to have been accepted. 2. Mailing of the Products 2.1 Products are sent by email to the Buyer: - within [1] month from the order for Products already released; or - within a reasonable time for Products ordered prior to their effective release. In this case, the Seller shall use its best endeavours to inform the Buyer of an indicative release date and the evolution of the work in progress. 2.2 Some weeks prior to the release date the Seller can propose a pre-release discount to the Buyer The Seller shall by no means be responsible for any delay in respect of article 2.2 above, and including incases where a new event or access to new contradictory information would require for the analyst extra time to compute or compare the data in order to enable the Seller to deliver a high quality Products. 2.3 The mailing of the Product will occur only upon payment by the Buyer, in accordance with the conditions contained in article 3. 2.4. The mailing is operated through electronic means either by email via the sales department or automatically online via an email/password. If the Product’s electronic delivery format is defective, the Seller undertakes to replace it at no charge to the Buyer provided that it is informed of the defective formatting within 90 days from the date of the original download or receipt of the Product. 2.5 The person receiving the Products on behalf of the Buyer shall immediately verify the quality of the Products and their conformity to the order. Any claim for apparent defects or for non-conformity shall be sent in writing to the Seller within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects. . 2.6 No return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. Any Product returned to the Seller without providing prior information to the Seller as required under article 2.5 shall remain at the Buyer’s risk. 3. Price, invoicing and payment 3.1 Prices are given in the orders corresponding to each Product sold on a unit basis or corresponding to annual subscriptions. They are expressed to be inclusive of all taxes. The prices may be reevaluated from time to time. The effective price is deemed to be the one applicable at the time of the order. 3.2 Yole may offer a pre release discount for the companies willing to acquire in the future the specific report and agreeing on the fact that the report may be release later than the anticipated release date. In exchange to this uncertainty, the company will get a discount that can vary from 15% to 10%. 3.3 Payments due by the Buyer shall be sent by cheque payable to Yole Développement, credit card or by electronic transfer to the following account: HSBC, 1 place de la Bourse 69002 Lyon France Bank code: 30056 Branch code: 00170 Account n°: 0170 200 1565 87 BIC or SWIFT code: CCFRFRPP IBAN: FR76 3005 6001 7001 7020 0156 587 To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order. 3.4 Payment is due by the Buyer to the Seller within 30 days from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the latter shall be entitled to invoice interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L. 441-6 of the French Commercial Code. Our publications (report, database, tool...) are delivered only after reception of the payment. 3.5 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages. 4. Liabilities 4.1 The Buyer or any other individual or legal person acting on its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the use and interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof. 4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement 4.3 In no event shall the Seller be liable for: a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or information) arising out of the use of or inability to use the Seller’s website or the Products, or any information provided on the website, or in the Products; b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof. 4.4All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot be guaranteed to be free from errors. 4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered. 4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in article 5 below. 4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down payment to the exclusion of any further damages. 4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that any Product will be free from infection. 5. Force majeure The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties, equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller. 6. Protection of the Seller’s IPR 6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions. 6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as: - Information storage and retrieval systems; - Recordings and re-transmittals over any network (including any local area network); - Use in any timesharing, service bureau, bulletin board or similar arrangement or public display; - Posting any Product to any other online service (including bulletin boards or the Internet); - Licensing, leasing, selling, offering for sale or assigning the Product. 6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety. 6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the copyrights and will guaranty that the Products are not disseminated out of the company. 6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password. 6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company, the joint venture done with a third party etc..cannot access the report and should pay a full license price. 7. Termination 7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision. 7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation. 8. Miscellaneous All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer. Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party. The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due time. 9. Governing law and jurisdiction 9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which shall have exclusive jurisdiction upon such issues. 9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions. Distributed by