This document discusses the ARM7TDMI microprocessor. It provides an overview of embedded systems and applications, describing how embedded microprocessors account for most microprocessor sales. It also discusses the basic structure of a microprocessor system, including the CPU, memory, I/O, and system bus. The document examines why the ARM architecture was chosen and provides information on the ARM7TDMI implementation, pipeline execution, and performance measures like latency and throughput.

1. Advanced RISC Machine
ARM7 TDMI
Prof. Anish Goel

2. µP Systems Overview
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3. µP Systems Overview
Complexity growth
Like no other industry
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4. µP Systems Overview
Embedded Systems and Applications
Embedded microprocessors account for about 94% of all
microprocessor sales.
Embedded microprocessors extend over a much larger
performance range than PC’s.
Terminology
GP Systems vs. Embedded Systems
What are the key design parameters?
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5. µP Systems Overview
Basic microprocessor system structure
Central processing unit (CPU)
Memory
Input/Output (I/O)
System bus
A microcontroller or SoC will include some or all
components on the same chip as the CPU.
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6. Why the ARM?
Many possible devices to study (or use!)…
Intel, Motorola, Microchip, Atmel, TI, Zilog, Philips, Rabbit,
Siemens, Hitachi, AMD, etc.
Considerations
Installed base and software compatibility
Development tool availability
Complexity and architectural issues
Computational capabilities
Why not use the Pentium 4 instead?
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7. System Design
User needs
1 Requirements Analysis
2 Specification
3 System Architecture
4 HW Design 4 SW Design
5 HW Implementation 5 SW Implementation
6 HW Testing 6 SW Testing
7 System Integration
8 System Validation
9 O & M, Evolution
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8. Microprocessor System Design
Options
Discrete microprocessor/microcontroller
System-on-Chip (SoC)
ASIC
Programmable logic
Soft cores
Hard cores
Specialized microprocessors
Digital signal processors
Network processors
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9. Simplified Pentium 4 Architecture
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10. Caches: CPU-Memory Performance Gap
350 nm
(94%) 130 nm
180 nm (93%)
StrongArm SA-110
(86%) Itanium® 2 Processors
From Dileep Bhandarkar, Intel
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11. Topics
Microprocessor Organization
Organization of Microprocessor Systems
Endian-ness
ARM History and Characteristics
ARM7TDMI Implementation
NXP LPC 2148 Overview
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12. Microprocessor Components
Register file
Program counter
General purpose registers
Hidden registers
ALU
Buses
Memory interface
Signal conventions
Control and timing unit
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13. A Simple µP Architecture
16
ADDR
TR0 PC AR
TEMPORARY REGISTER PROGRAM COUNTER ADDRESS REGISTER
8
DATA
Internal Data Bus
A IR
ACCUMULATOR TEMP REG GEN REG 0 R0 INST REG
GEN REG 1 R1
F GEN REG 2 R2
FLAGS
INSTRUCTION DECODER
/RD
ARITHMETIC AND LOGIC UNIT GEN REG 3 R3 TIMING AND CONTROL
(ALU) /WR
CLOCK
GENERATOR /RESET
A less simple architecture
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14. Instruction Set Architecture (ISA)
Complex Instruction Set (CISC)
Single instructions for complex tasks (string search, block
move, RMW, etc.)
Usually have variable length instructions
Registers have specialized functions
Reduced Instruction Set (RISC) (load/store)
Instructions for simple operations only
Usually fixed length instructions
Large register sets (Register File based)
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15. Register Architectures
Accumulator
One instruction operand comes from a dedicated register
(the accumulator) closely coupled to the ALU.
Register-Memory
Instruction operands can be obtained from both registers and
memory
Commonly used in CISC machines
Load-Store
All operands must be in general-purpose registers
Only a very limited number of instructions (loads/stores) can
“touch” memory
Commonly used in RISC machines
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16. Microprocessor System Organization
Memory Architectures
Von Neumann architecture
Harvard architecture
Input/Output (I/O)
Memory-mapped I/O
Isolated I/O
Programmer’s Model
aka Register View
Memory Maps
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17. Endian-ness
Byte Ordering for Little Endian vs. Big Endian
Byte Byte Byte Byte
3 2 1 0
Most Significant Least Significant Byte
Byte (MSB) (LSB)
Memory Address +0 +1 +2 +3
Big Endian Byte Byte Byte Byte MSB in the lowest (first)
3 2 1 0 memory address
Little Endian Byte Byte Byte Byte LSB in the lowest (first)
0 1 2 3 memory address
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18. ARM Ltd
Founded in November 1990
Spun out of Acorn Computers
Designs the ARM range of RISC processor cores
Licenses ARM core designs to semiconductor partners
who fabricate and sell to their customers.
ARM does not fabricate silicon itself
Also develop technologies to assist with the design-in of
the ARM architecture
Software tools, boards, debug hardware, application
software, bus architectures, peripherals etc
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19. ARM Partnership Model
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20. ARM Powered Products
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21. ARM Characteristics
Designed to be a simple, efficient RISC core
Small die area
Low power
Low interrupt latency
These characteristics enabled ARM to become
dominant in the cell phone market.
Most cell phones contain a heterogenous multiprocessor
SoC with an ARM and a DSP.
Advanced ARM designs (ARM9,10,11) have
become much more sophisticated (i.e. Intel Xscale
in PDAs), but have had less success in penetrating
other markets where power consumption issues
are not as severe.
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22. CASE STUDY….
ARM powered Product.
Nintendo DS Lite
Features:
Touch Screen: Same specs as top
screen, but with a transparent analog
touch screen.
Wireless Communication: IEEE 802.11
embedded microphone for voice
recognition
embedded real-time clock; date, time
and alarm
CPUs: One ARM9 and one ARM7
power-saving sleep mode
http://www.arm.com/markets/home_solutions/app.html
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23. ARM7TDMI Implementation
The ARM7TDMI uses the ARM v4T ISA.
All instructions are conditional
The ARM7TDMI is a basic load-store RISC
Sixteen GP registers (R15-R0) with banking
Three stage pipeline (FDE)
No caches
Support for ARM (32-bit) and Thumb (16-bit) instruction sets
Multiply-accumulate (MAC) unit
On-chip hardware debug support
Test Access Port controller
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24. ARM7TDMI Processor Block Diagram
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25. ARM7TDMI Processor Core
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26. CPU Performance: Pipelining
Several instructions are executed simultaneously at
different stages of completion.
Various conditions can cause pipeline bubbles that reduce
utilization:
branches;
memory system delays;
etc.
Both ARM and SHARC have 3-stage pipes:
fetch instruction from memory;
decode opcode and operands;
execute.
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27. ARM Pipeline Execution
fetch decode execute add r0,r1,#5
sub r2,r3,r6 fetch decode execute
cmp r2,#3 fetch decode execute
time
1 2 3
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28. Performance Measures
Latency: time it takes for an instruction to get through
the pipeline.
Throughput: number of instructions executed per time
period.
Pipelining increases throughput without reducing latency.
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29. Pipeline Stalls
If every step cannot be completed in the same amount of
time, pipeline stalls.
Bubbles introduced by stall increase latency, reduce
throughput.
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30. ARM Multi-cycle LDMIA Instruction
ldmia fetch decodeex ld r2ex ld r3
r0,{r2,r3}
sub fetch decode ex sub
r2,r3,r6
cmp fetch decodeex cmp
r2,#3
time
http://www.sesp.cse.clrc.ac.uk/html/SoftwareTools/vtune/users_guide/mergedProj
ects/analyzer_ec/mergedProjects/reference_olh/mergedProjects/instructions/xscin
struct_hh/LDMIA_(Thumb).htm
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31. Control Stalls
Branches often introduce stalls (branch penalty).
Stall time may depend on whether branch is taken.
May have to squash instructions that already started
executing.
Don’t know what to fetch until condition is evaluated.
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32. ARM Pipelined Branch
bne foo fetch decode ex bne ex bne ex bne
sub fetch decode
r2,r3,r6
foo add fetch decode ex add
r0,r1,r2
2 cycle time
penalty
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