The document discusses techniques for reducing power consumption in integrated circuits and systems. It covers optimization opportunities at various levels of design from system to transistor level. Key techniques discussed include multi-voltage/multi-threshold designs, clock gating, power gating, dynamic voltage and frequency scaling, and reducing switching activity through logic restructuring. The document emphasizes that low power design requires a holistic approach across all levels of the design hierarchy.
The document discusses the MicroBlaze soft processor core designed by Xilinx for implementation in FPGAs. It provides details on the MicroBlaze architecture such as its RISC design, support for PLB and LMB buses, optional cache blocks, and FSL for custom functions. Advantages are highlighted like flexibility, high performance, and support in Xilinx development tools. Limitations around instruction set and lack of MMU/atomic operations are also outlined.
PowerArtist™ includes production-proven RTL power analysis with interactive visual debug, analysis-driven automatic RTL power reduction, and a Tcl interface to the database enabling custom reports and tracking of power through regressions. PowerArtist generated models bridge the RTL and layout gap delivering physical-aware RTL power accuracy and RTL-power driven early power grid integrity. This presentation provides an overview of PowerArtist and covers RTL design-for-power best practices using real-life examples. Learn more on our website: https://bit.ly/10Rpcxu
This document discusses engineering change orders (ECOs) used to fix timing, functional, power, and clock issues after physical design and sign-off. It describes the motivation for ECOs due to tool limitations and differences between implementation and sign-off. Common ECO techniques are listed for timing (driver upsizing, buffer insertion, etc.), power (vt-swapping, downsizing, etc.), and metal-only ECOs. Timing ECO tools from Synopsys, Cadence, and other vendors are also mentioned. Upcoming ECO technologies like dynamic power optimization and automatic legalization are noted.
The document discusses system-on-chip (SOC) architectures and designs. It covers topics like different processor types (e.g. superscalar, VLIW), on-chip storage like caches and memory, interconnects like buses and networks-on-chip, and how SOCs are customized for applications like graphics, media, and security. Examples of SOCs include the iPhone SOC with an ARM processor and AMD's Barcelona multicore processor. The document also discusses design tradeoffs involving time, area, power, and costs as SOCs increase in complexity.
Basic synthesis flow and commands in digital VLSISurya Raj
This document discusses logic synthesis, including the basic synthesis flow and commands, synthesis script flow, technology libraries, design objects like cells and ports, timing paths, and constraints like defining clocks and input/output delays. It provides examples of setting library variables, reading and writing designs, and applying constraints to clocks and I/O. The document contains information on synthesis tools and processes at a high level.
Here are the key points about setup time, hold time, and insertion delay in VLSI physical design:
- Setup time is the minimum time before the clock edge that the data needs to be stable in order for it to be correctly captured by the flip-flop.
- Hold time is the minimum time after the clock edge that the data needs to remain stable. It provides a "window" after the clock edge for the data to remain valid.
- Insertion delay is the time it takes for the clock signal to propagate from the clock source to a flip-flop input pin through the clock tree.
- During clock tree synthesis, the tool aims to balance the insertion delays across the clock tree to minimize
The document discusses techniques for reducing power consumption in integrated circuits and systems. It covers optimization opportunities at various levels of design from system to transistor level. Key techniques discussed include multi-voltage/multi-threshold designs, clock gating, power gating, dynamic voltage and frequency scaling, and reducing switching activity through logic restructuring. The document emphasizes that low power design requires a holistic approach across all levels of the design hierarchy.
The document discusses the MicroBlaze soft processor core designed by Xilinx for implementation in FPGAs. It provides details on the MicroBlaze architecture such as its RISC design, support for PLB and LMB buses, optional cache blocks, and FSL for custom functions. Advantages are highlighted like flexibility, high performance, and support in Xilinx development tools. Limitations around instruction set and lack of MMU/atomic operations are also outlined.
PowerArtist™ includes production-proven RTL power analysis with interactive visual debug, analysis-driven automatic RTL power reduction, and a Tcl interface to the database enabling custom reports and tracking of power through regressions. PowerArtist generated models bridge the RTL and layout gap delivering physical-aware RTL power accuracy and RTL-power driven early power grid integrity. This presentation provides an overview of PowerArtist and covers RTL design-for-power best practices using real-life examples. Learn more on our website: https://bit.ly/10Rpcxu
This document discusses engineering change orders (ECOs) used to fix timing, functional, power, and clock issues after physical design and sign-off. It describes the motivation for ECOs due to tool limitations and differences between implementation and sign-off. Common ECO techniques are listed for timing (driver upsizing, buffer insertion, etc.), power (vt-swapping, downsizing, etc.), and metal-only ECOs. Timing ECO tools from Synopsys, Cadence, and other vendors are also mentioned. Upcoming ECO technologies like dynamic power optimization and automatic legalization are noted.
The document discusses system-on-chip (SOC) architectures and designs. It covers topics like different processor types (e.g. superscalar, VLIW), on-chip storage like caches and memory, interconnects like buses and networks-on-chip, and how SOCs are customized for applications like graphics, media, and security. Examples of SOCs include the iPhone SOC with an ARM processor and AMD's Barcelona multicore processor. The document also discusses design tradeoffs involving time, area, power, and costs as SOCs increase in complexity.
Basic synthesis flow and commands in digital VLSISurya Raj
This document discusses logic synthesis, including the basic synthesis flow and commands, synthesis script flow, technology libraries, design objects like cells and ports, timing paths, and constraints like defining clocks and input/output delays. It provides examples of setting library variables, reading and writing designs, and applying constraints to clocks and I/O. The document contains information on synthesis tools and processes at a high level.
Here are the key points about setup time, hold time, and insertion delay in VLSI physical design:
- Setup time is the minimum time before the clock edge that the data needs to be stable in order for it to be correctly captured by the flip-flop.
- Hold time is the minimum time after the clock edge that the data needs to remain stable. It provides a "window" after the clock edge for the data to remain valid.
- Insertion delay is the time it takes for the clock signal to propagate from the clock source to a flip-flop input pin through the clock tree.
- During clock tree synthesis, the tool aims to balance the insertion delays across the clock tree to minimize
In VLSI design, Design for Testability (DFT) is an approach that aims to make digital circuits easier to test during the manufacturing and debugging process. DFT in VLSI design involves incorporating additional circuitry and design features such as scan chains, built-in self-test (BIST) circuits, and boundary scan cells into the chip design to facilitate testing. Design for testability in VLSI design is essential to ensure that the fabricated chips are free from any kind of manufacturing defects. It also reduces the overall test time and thereby the cost of testing, and debugging. By incorporating DFT techniques into the chip design, it becomes easier to test the structural correctness of the chip, leading to higher-quality products and faster time-to-market.
The physical design flow begins with placement which involves assigning exact locations to modules like gates and standard cells to minimize area and interconnect cost while meeting timing constraints, with the goal of enabling easier routing; placement tools take as input the netlist, floorplan, libraries, and constraints to perform global and detailed placement as well as optimization. The quality of placement significantly impacts the ability to route the design successfully.
Semiconductor engineering is becoming more dynamic fiels since the technology scaling is taking place. Power reduction techniques are lucrative solutions to the performance, area and power trade off. Therefore Power reduction of VLSI designs are critical.
The document discusses various techniques for reducing power consumption at different levels, from circuit-level optimizations like transistor sizing and voltage scaling, to logic synthesis techniques like clock gating and state encoding, to algorithm-level optimizations and architecturally-static pipelining supported by an optimizing compiler. It notes that power optimization is important for cost, dependability, and extending battery life, and that while proposed approaches show potential, accurate energy assessments of new techniques are still needed.
Timing and Design Closure in Physical Design Flows Olivier Coudert
A physical design flow consists of producing a production-worthy layout from a gate-level netlist subject to a set of constraints. We focus on the problems imposed by shrinking process technologies. It exposes the problems of timing closure, signal integrity, design variable dependencies, clock and power/ground routing, and design signoff. It also surveys some physical design flows, and outlines a refinement-based flow.
This document discusses low power VLSI design. It defines power dissipation as being either static, from leakage current, or dynamic, from transistor switching activities. The key strategies for low power design are reducing supply voltage, physical capacitance, and switching activity. Specific techniques mentioned include clock gating, power gating, reducing chip capacitance, scaling voltage, better design methods, and power management. The document also discusses calculating and minimizing switching activity and using CAD tools at different design levels.
This document discusses various clock generation and distribution strategies for digital systems. It covers topics such as clock skew, jitter, ring oscillators, Pierce crystal oscillators, generating non-overlapping clock signals, H-tree networks, clock decoders, buffering clock signals, and eliminating clock skew through buffer cross-connections. The document provides an overview of ideal clock signal properties and challenges in practical implementations, as well as important considerations for high-performance clock distribution such as minimizing load capacitance and inductive networks.
The document discusses low power design techniques in VLSI. It begins by explaining why low power has become important, especially with the rise of mobile devices. It then discusses the different sources of power consumption, including dynamic and static power. Several low power design techniques are covered, such as clock gating, multi-Vt libraries, multi-voltage design, and power gating. The document emphasizes analyzing power at the system level and using EDA tools to implement low power techniques throughout the design flow. Overall, it provides an overview of analyzing power consumption and the goals and methods of low power VLSI design.
Low Power Design Techniques for ASIC / SOC DesignRajesh_navandar
1. Low power techniques aim to reduce both dynamic and static/leakage power in integrated circuits. Dynamic power is reduced through techniques like lowering supply voltage and clock frequency, while leakage power is reduced by increasing transistor threshold voltage.
2. Power gating is a widely used technique that temporarily turns off unused circuit blocks to drastically reduce leakage power. It requires additional power switches and isolation cells to safely turn blocks on and off.
3. Multi-threshold CMOS uses both low and high threshold voltage transistors optimized for performance and leakage respectively. Further scaling presents new challenges as leakage power becomes dominant.
Clock tree synthesis log messages provide information about:
1) Preprocessing steps like design updates, buffer characterization, and clock tree constraints.
2) The clock tree synthesis process which includes clustering, meeting timing targets, and reporting results.
3) Post processing steps like embedded clock tree optimization, DRC fixing, and placement legalization.
This presentation gives an overview of FPGA devices. An FPGA is a device that contains a matrix of re-configurable gate array logic circuitry. When a FPGA is configured, the internal circuitry is connected in a way that creates a hardware implementation of the software application.
FPGA devices can deliver the performance and reliability of dedicated hardware circuitry.
This document discusses various concepts related to physical design implementation. It describes the inputs and outputs of physical design tools, important checks to perform before starting design such as clock and high fanout net budgeting, and concepts like floorplanning, placement, routing, libraries, multi-voltage design, and clock tree synthesis and optimization.
Power gating is the main power reduction techniques for the static power. As long as technology scaling is taking place, static power becomes paramount important factor to the VLSI designs.Therefore Power gating is the recent power reduction technique that is actively in research areas.
Visit https://www.vlsiuniverse.com/
https://www.vlsiuniverse.com/2020/05/complete-asic-design-flow.html
This is the standard VLSI design flow that every semiconductor company follows. The complete ASIC design flow is explained by considering each and every stage.
POWER CONSUMPTION AT CIRCUIT OR LOGIC LEVEL IN CIRCUITAnil Yadav
This document discusses sources of power consumption in digital CMOS circuits and techniques for low power VLSI design at the circuit level. It covers the four main sources of power consumption: leakage power, short-circuit power, static power, and switching power. It then discusses various low power design techniques at the circuit level, including transistor and gate sizing, equivalent pin ordering, network restructuring, transistor network partitioning, and low power flip-flop designs. The goal is to optimize power consumption through techniques like minimizing switching activity, reducing capacitive loads, and optimizing transistor sizing.
UPF-Based Static Low-Power Verification in Complex Power Structure SoC Design...shaotao liu
This paper presents a UPF-based static low-power verification flow for complex system-on-chip designs using VCLP. It describes challenges in verifying large SoC designs with complex power structures. Techniques for reducing UPF complexity include restructuring the UPF file, managing power states, merging analog power pins, and using black boxes. The paper demonstrates using VCLP for static low-power verification and discusses its limitations and potential enhancements.
This document discusses physical design verification checks that are performed on an integrated circuit layout. It describes design rule checking (DRC) which checks that a layout adheres to foundry design rules for manufacturability. Layout versus schematic (LVS) checks that the layout connectivity matches the schematic netlist. Electrical rule checking (ERC) identifies electrical issues like floating devices or short circuits. The document provides examples of DRC, LVS, and ERC checks and typical issues found during these verification steps.
The document provides information on the L6238 sensorless spindle motor controller integrated circuit. Key features include:
- Sensorless commutation and speed control of a 3-phase brushless DC spindle motor.
- Integrated start-up and synchronization algorithms for spin-up and multi-drive arrays.
- Digital PLL for high accuracy speed control and locking to a reference frequency.
- Protection features and programmable functions for efficiency and noise reduction.
- Master/slave synchronization capability and bidirectional serial communication interface.
This document discusses techniques for reducing power consumption in integrated circuits and systems. It begins by providing background on technology trends that increase power needs such as rising transistor counts. It then discusses sources of power dissipation in CMOS circuits and how power is affected by voltage, frequency, capacitance, and switching activity. The document outlines a design flow for analyzing power at different levels of abstraction. It presents techniques for reducing dynamic, short-circuit, and leakage power through voltage scaling, transistor sizing, clock gating, and other methods. Architecture-level, circuit-level, and logic-level power optimization techniques are also summarized.
In VLSI design, Design for Testability (DFT) is an approach that aims to make digital circuits easier to test during the manufacturing and debugging process. DFT in VLSI design involves incorporating additional circuitry and design features such as scan chains, built-in self-test (BIST) circuits, and boundary scan cells into the chip design to facilitate testing. Design for testability in VLSI design is essential to ensure that the fabricated chips are free from any kind of manufacturing defects. It also reduces the overall test time and thereby the cost of testing, and debugging. By incorporating DFT techniques into the chip design, it becomes easier to test the structural correctness of the chip, leading to higher-quality products and faster time-to-market.
The physical design flow begins with placement which involves assigning exact locations to modules like gates and standard cells to minimize area and interconnect cost while meeting timing constraints, with the goal of enabling easier routing; placement tools take as input the netlist, floorplan, libraries, and constraints to perform global and detailed placement as well as optimization. The quality of placement significantly impacts the ability to route the design successfully.
Semiconductor engineering is becoming more dynamic fiels since the technology scaling is taking place. Power reduction techniques are lucrative solutions to the performance, area and power trade off. Therefore Power reduction of VLSI designs are critical.
The document discusses various techniques for reducing power consumption at different levels, from circuit-level optimizations like transistor sizing and voltage scaling, to logic synthesis techniques like clock gating and state encoding, to algorithm-level optimizations and architecturally-static pipelining supported by an optimizing compiler. It notes that power optimization is important for cost, dependability, and extending battery life, and that while proposed approaches show potential, accurate energy assessments of new techniques are still needed.
Timing and Design Closure in Physical Design Flows Olivier Coudert
A physical design flow consists of producing a production-worthy layout from a gate-level netlist subject to a set of constraints. We focus on the problems imposed by shrinking process technologies. It exposes the problems of timing closure, signal integrity, design variable dependencies, clock and power/ground routing, and design signoff. It also surveys some physical design flows, and outlines a refinement-based flow.
This document discusses low power VLSI design. It defines power dissipation as being either static, from leakage current, or dynamic, from transistor switching activities. The key strategies for low power design are reducing supply voltage, physical capacitance, and switching activity. Specific techniques mentioned include clock gating, power gating, reducing chip capacitance, scaling voltage, better design methods, and power management. The document also discusses calculating and minimizing switching activity and using CAD tools at different design levels.
This document discusses various clock generation and distribution strategies for digital systems. It covers topics such as clock skew, jitter, ring oscillators, Pierce crystal oscillators, generating non-overlapping clock signals, H-tree networks, clock decoders, buffering clock signals, and eliminating clock skew through buffer cross-connections. The document provides an overview of ideal clock signal properties and challenges in practical implementations, as well as important considerations for high-performance clock distribution such as minimizing load capacitance and inductive networks.
The document discusses low power design techniques in VLSI. It begins by explaining why low power has become important, especially with the rise of mobile devices. It then discusses the different sources of power consumption, including dynamic and static power. Several low power design techniques are covered, such as clock gating, multi-Vt libraries, multi-voltage design, and power gating. The document emphasizes analyzing power at the system level and using EDA tools to implement low power techniques throughout the design flow. Overall, it provides an overview of analyzing power consumption and the goals and methods of low power VLSI design.
Low Power Design Techniques for ASIC / SOC DesignRajesh_navandar
1. Low power techniques aim to reduce both dynamic and static/leakage power in integrated circuits. Dynamic power is reduced through techniques like lowering supply voltage and clock frequency, while leakage power is reduced by increasing transistor threshold voltage.
2. Power gating is a widely used technique that temporarily turns off unused circuit blocks to drastically reduce leakage power. It requires additional power switches and isolation cells to safely turn blocks on and off.
3. Multi-threshold CMOS uses both low and high threshold voltage transistors optimized for performance and leakage respectively. Further scaling presents new challenges as leakage power becomes dominant.
Clock tree synthesis log messages provide information about:
1) Preprocessing steps like design updates, buffer characterization, and clock tree constraints.
2) The clock tree synthesis process which includes clustering, meeting timing targets, and reporting results.
3) Post processing steps like embedded clock tree optimization, DRC fixing, and placement legalization.
This presentation gives an overview of FPGA devices. An FPGA is a device that contains a matrix of re-configurable gate array logic circuitry. When a FPGA is configured, the internal circuitry is connected in a way that creates a hardware implementation of the software application.
FPGA devices can deliver the performance and reliability of dedicated hardware circuitry.
This document discusses various concepts related to physical design implementation. It describes the inputs and outputs of physical design tools, important checks to perform before starting design such as clock and high fanout net budgeting, and concepts like floorplanning, placement, routing, libraries, multi-voltage design, and clock tree synthesis and optimization.
Power gating is the main power reduction techniques for the static power. As long as technology scaling is taking place, static power becomes paramount important factor to the VLSI designs.Therefore Power gating is the recent power reduction technique that is actively in research areas.
Visit https://www.vlsiuniverse.com/
https://www.vlsiuniverse.com/2020/05/complete-asic-design-flow.html
This is the standard VLSI design flow that every semiconductor company follows. The complete ASIC design flow is explained by considering each and every stage.
POWER CONSUMPTION AT CIRCUIT OR LOGIC LEVEL IN CIRCUITAnil Yadav
This document discusses sources of power consumption in digital CMOS circuits and techniques for low power VLSI design at the circuit level. It covers the four main sources of power consumption: leakage power, short-circuit power, static power, and switching power. It then discusses various low power design techniques at the circuit level, including transistor and gate sizing, equivalent pin ordering, network restructuring, transistor network partitioning, and low power flip-flop designs. The goal is to optimize power consumption through techniques like minimizing switching activity, reducing capacitive loads, and optimizing transistor sizing.
UPF-Based Static Low-Power Verification in Complex Power Structure SoC Design...shaotao liu
This paper presents a UPF-based static low-power verification flow for complex system-on-chip designs using VCLP. It describes challenges in verifying large SoC designs with complex power structures. Techniques for reducing UPF complexity include restructuring the UPF file, managing power states, merging analog power pins, and using black boxes. The paper demonstrates using VCLP for static low-power verification and discusses its limitations and potential enhancements.
This document discusses physical design verification checks that are performed on an integrated circuit layout. It describes design rule checking (DRC) which checks that a layout adheres to foundry design rules for manufacturability. Layout versus schematic (LVS) checks that the layout connectivity matches the schematic netlist. Electrical rule checking (ERC) identifies electrical issues like floating devices or short circuits. The document provides examples of DRC, LVS, and ERC checks and typical issues found during these verification steps.
The document provides information on the L6238 sensorless spindle motor controller integrated circuit. Key features include:
- Sensorless commutation and speed control of a 3-phase brushless DC spindle motor.
- Integrated start-up and synchronization algorithms for spin-up and multi-drive arrays.
- Digital PLL for high accuracy speed control and locking to a reference frequency.
- Protection features and programmable functions for efficiency and noise reduction.
- Master/slave synchronization capability and bidirectional serial communication interface.
This document discusses techniques for reducing power consumption in integrated circuits and systems. It begins by providing background on technology trends that increase power needs such as rising transistor counts. It then discusses sources of power dissipation in CMOS circuits and how power is affected by voltage, frequency, capacitance, and switching activity. The document outlines a design flow for analyzing power at different levels of abstraction. It presents techniques for reducing dynamic, short-circuit, and leakage power through voltage scaling, transistor sizing, clock gating, and other methods. Architecture-level, circuit-level, and logic-level power optimization techniques are also summarized.
This document summarizes the features and operation of the A4988 microstepping motor driver IC. It has built-in current regulation and motor control logic to drive bipolar stepper motors in various microstep modes. Key features include mixed and slow current decay modes for reduced noise and accurate stepping, internal protection from overcurrent and thermal issues, and a simple interface requiring only a STEP input to drive the motor. It operates from a single power supply and comes in a small QFN package well-suited for motor driver applications.
The document describes the MC3PHAC monolithic intelligent motor controller chip. It is designed for low-cost variable speed 3-phase AC motor control without requiring software development. Key features include volts-per-hertz speed control, digital signal processing for speed stability, 6 PWM outputs for 3-phase waveform generation, and analog and digital I/O. It can operate in standalone mode for motor control or interface with a host computer via serial communication.
Xem chi tiết và đặt mua sản phẩm tại http://hungphu.com.vn/vn/bien-tan-3-pha-220v/bien-tan-3-phase-220v-ig5a-series.html
Biến tần LS iG5 - Tài liệu biến tần LS iG5 (English manual, P.1). Biến tần LS iG5 hiện đang được cung cấp và phân phối tại công ty Hưng Phú Automation.
The document provides specifications for LG Variable Frequency Drives (VFDs) including the Starvert iG5 model. Key specifications include:
- Power ratings from 0.37 to 22 kW for 1 or 3 phase 200-230V and 3 phase 380-460V models
- IP00 to IP20 enclosure types
- Built-in PID control, preset speeds, skip frequencies, inputs/outputs
- Compact size that is 50% smaller than previous models
- Built-in RS-485 and Modbus RTU communication
This document provides an overview of ALC radio equipment training topics, including:
1. The structure of ALC equipment, which consists of indoor and outdoor units.
2. Installation, configuration and operation of ALC equipment, including installing indoor and outdoor units, configuring parameters using the SCT and LCT software.
3. Network management using the SCT software, including routing, alarm monitoring, equipment configuration backup and restoration, and troubleshooting.
4. Maintenance of ALC equipment, including periodic checks, understanding alarm meanings, troubleshooting root causes of failures, and using loop facilities for testing.
Glitch Analysis and Reduction in Combinational Circuitscsandit
Hazard in digital circuits is unnecessary transitions due to gate propagation delay in that
circuit. Hazards occur due to uneven delay offered in the path of the various ongoing signals.
One of the important reasons for power dissipation in CMOS circuits is the switching activity
.This include activities such as spurious pulses, called glitches. Power optimization techniques
that concentrate on the reduction of switching power dissipation of a given circuit are
called glitch reduction techniques. In this paper, we analyse various Glitch reduction
techniques such as Hazard filtering Technique, Balanced Path Technique, Multiple Threshold
Technique and Gate Freezing Technique. Using simulation, we also measure the parameters
such as noise and delay of the circuits on application of various techniques to check the
reliability of different circuits in various situations.
GLITCH ANALYSIS AND REDUCTION IN COMBINATIONAL CIRCUITS cscpconf
Hazard in digital circuits is unnecessary transitions due to gate propagation delay in that
circuit. Hazards occur due to uneven delay offered in the path of the various ongoing signals.
One of the important reasons for power dissipation in CMOS circuits is the switching activity
.This include activities such as spurious pulses, called glitches. Power optimization techniques
that concentrate on the reduction of switching power dissipation of a given circuit are
called glitch reduction techniques. In this paper, we analyse various Glitch reduction
techniques such as Hazard filtering Technique, Balanced Path Technique, Multiple Threshold
Technique and Gate Freezing Technique. Using simulation, we also measure the parameters
such as noise and delay of the circuits on application of various techniques to check the
reliability of different circuits in various situations.
This document provides specifications for a 100Gb/s QSFP28 SR4 optical transceiver module. It has 4 independent channels with a maximum data rate of 28Gb/s per channel and 100m transmission over OM4 multi-mode fiber. Key features include low power consumption of 2.5W, operating temperature range of 0-70°C, and digital diagnostic monitoring via a 2-wire interface. Application areas include data center rack-to-rack connections and 100GbE.
session-2_track-6_advanced-bldc-motor-drive.pdfLi (Eric) Sun
The document provides information about advanced BLDC motor drive and control, including:
- An overview of a 3-phase BLDC motor control block diagram showing the main components.
- Details about STMicroelectronics products that can be used for BLDC motor control, such as MCUs, gate drivers, power modules, and development tools.
- Descriptions of permanent magnet synchronous motors (PMSM) and brushless DC (BLDC) motors, and an explanation of field oriented control (FOC), which is used to control these types of motors.
Study Of 30W Digital Audio Amplifier with Integrated ADC: CS4525Premier Farnell
The document summarizes a study of the CS4525 30W digital audio amplifier with an integrated analog-to-digital converter (ADC) from Cirrus Logic. The amplifier has fully integrated power MOSFETs, a built-in protection system, and a 24-bit 48 kHz ADC. It can be configured for various output configurations including half-bridge, full-bridge, and parallel modes to power multiple speakers and subwoofers. The document provides details on features, specifications, typical application diagrams, and configuration options.
Three-phase ac motors have been the workhorse of industry since the earliest days of electrical engineering. They are reliable, efficient, cost-effective and need little or no maintenance. In addition, ac motors such as induction and reluctance motors need no electrical connection to the rotor, so can easily be made flameproof for use in hazardous environments such as in mines.
In order to provide proper speed control of an ac motor, it is necessary to supply the motor with a three phase supply of which both the voltage and the frequency can be varied. Such a supply will create a variable speed rotating field in the stator that will allow the rotor to rotate at the required speed with low slip. This ac motor drive can efficiently provide full torque from zero speed to full speed, can overspeed if necessary, and can, by changing phase rotation, easily provide bi-directional operation of the motor. A drive with these characteristics is known as a PWM (Pulse Width Modulated) motor drive.
Drives and motors are an integral part of industrial equipment from packaging,robotics, computer numerical control (CNC), machine tools, industrial pumps,and fans. Designing next-generation drive systems to lower operating costs requires complex control algorithms at very low latencies as well as a flexibleplatform to support changing needs and the ability to design multiple-axis systems.
Traditional drive systems based on ASICs, digital signal processors (DSPs), and microcontroller units lack the performance and flexibility to address these needs. Altera’s family of FPGAs provides a scalable platform that can be used to offload control algorithm elements in hardware. You may also integrate the whole drive system with industry-proven processor architectures while supporting multipletypes of encoders and industrial Ethernet protocols. This “drive on a chip” system reduces cost and simplifies development.
International Journal of Engineering Research and Applications (IJERA) is a team of researchers not publication services or private publications running the journals for monetary benefits, we are association of scientists and academia who focus only on supporting authors who want to publish their work. The articles published in our journal can be accessed online, all the articles will be archived for real time access.
Our journal system primarily aims to bring out the research talent and the works done by sciaentists, academia, engineers, practitioners, scholars, post graduate students of engineering and science. This journal aims to cover the scientific research in a broader sense and not publishing a niche area of research facilitating researchers from various verticals to publish their papers. It is also aimed to provide a platform for the researchers to publish in a shorter of time, enabling them to continue further All articles published are freely available to scientific researchers in the Government agencies,educators and the general public. We are taking serious efforts to promote our journal across the globe in various ways, we are sure that our journal will act as a scientific platform for all researchers to publish their works online.
This document discusses using real-time simulation with FPGA-based hardware to model renewable energy systems. It describes challenges in modeling electric drives, modular multilevel converters, microgrids, and other renewable energy technologies. The document introduces OPAL-RT's eHS solution for modeling power electronics circuits on FPGAs for real-time simulation. eHS allows generating circuit models automatically without programming FPGAs directly. Examples are presented showing an eHS model of a PV system connected to the grid running in real-time on an FPGA. Real-time FPGA simulation provides benefits over CPU simulation like higher resolution, lower latency, and specialized models.
The document describes a project to control the speed of a fan using a microcontroller based on temperature readings from an LM35 temperature sensor. It uses an ATMEGA32 microcontroller to read the analog output from the LM35 sensor, convert it to a digital value, and generate a PWM signal to control the speed of a brushless DC motor fan. The PWM duty cycle is varied in steps from 20% to 80% over temperature ranges from 25°C to 65°C to efficiently control the fan speed based on temperature. Hardware and software implementation details are provided along with applications and a conclusion on open loop control performance.
- The document discusses various techniques for reducing power consumption in FPGAs, including power analysis tools, power-driven synthesis and fitting, clock gating, using dedicated resources like DSP blocks and RAM blocks efficiently, and newer FPGA technologies that enable programmable power and lower voltages.
- Key technologies for reducing power mentioned include moving to smaller process nodes, programmable power technology which allows tiles to operate in high-speed or low-power mode, lower core voltages, more granular clock gating, and dynamic on-chip termination.
- Power analysis involves estimating power using tools like Early Power Estimator and PowerPlay Power Analyzer which require accurate toggle rate data and power models.
Similar to Power Saving Design Techniques with Low Cost FPGAs (20)
Being a business assistant with element14 in krakowPremier Farnell
The document provides information about the Business Assistant role at element14, including:
1) The responsibilities of a Business Assistant include project management, communication, preparing for meetings, research, and process improvement.
2) The role requires working in a fast-paced environment, developing networks, managing priorities, clear communication, and independent decision making.
3) Desired skills are strong IT skills, planning, producing quality work under pressure, excellent English skills, interpersonal skills, and project management experience.
The document provides an overview of optical encoders from Grayhill Inc., including how they work, common parameters, and applications. It describes incremental and absolute encoders, as well as human interface, general purpose, special function, and machine interface encoder products. Specific encoder models are detailed along with their typical resolution, features, and suitable applications.
PSA-T Series Spectrum Analyser: PSA1301T/ PSA2701TPremier Farnell
The document provides an overview of the PSA-T series spectrum analyzers from TTi, which are handheld instruments built around a Palm computer. It describes the key features and parameters of the PSA1301T and PSA2701T models, including their frequency range, resolution bandwidth, and phase noise. It also discusses the target applications and functions of the integrated Palm computer.
The document introduces the TPS2492/93 positive high voltage hotswap controllers from Texas Instruments. It provides an overview of hotswap technology and describes the key features of the TPS2492/93 controllers, including their voltage range of 9V to 80V, fault protection capabilities, and output for monitoring load current. It also includes a functional block diagram and description of typical application and basic operation, involving turning on an external N-FET transistor during board insertion and responding to short circuits. Design tools like a calculator and evaluation modules are also mentioned.
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[OReilly Superstream] Occupy the Space: A grassroots guide to engineering (an...Jason Yip
The typical problem in product engineering is not bad strategy, so much as “no strategy”. This leads to confusion, lack of motivation, and incoherent action. The next time you look for a strategy and find an empty space, instead of waiting for it to be filled, I will show you how to fill it in yourself. If you’re wrong, it forces a correction. If you’re right, it helps create focus. I’ll share how I’ve approached this in the past, both what works and lessons for what didn’t work so well.
5th LF Energy Power Grid Model Meet-up SlidesDanBrown980551
5th Power Grid Model Meet-up
It is with great pleasure that we extend to you an invitation to the 5th Power Grid Model Meet-up, scheduled for 6th June 2024. This event will adopt a hybrid format, allowing participants to join us either through an online Mircosoft Teams session or in person at TU/e located at Den Dolech 2, Eindhoven, Netherlands. The meet-up will be hosted by Eindhoven University of Technology (TU/e), a research university specializing in engineering science & technology.
Power Grid Model
The global energy transition is placing new and unprecedented demands on Distribution System Operators (DSOs). Alongside upgrades to grid capacity, processes such as digitization, capacity optimization, and congestion management are becoming vital for delivering reliable services.
Power Grid Model is an open source project from Linux Foundation Energy and provides a calculation engine that is increasingly essential for DSOs. It offers a standards-based foundation enabling real-time power systems analysis, simulations of electrical power grids, and sophisticated what-if analysis. In addition, it enables in-depth studies and analysis of the electrical power grid’s behavior and performance. This comprehensive model incorporates essential factors such as power generation capacity, electrical losses, voltage levels, power flows, and system stability.
Power Grid Model is currently being applied in a wide variety of use cases, including grid planning, expansion, reliability, and congestion studies. It can also help in analyzing the impact of renewable energy integration, assessing the effects of disturbances or faults, and developing strategies for grid control and optimization.
What to expect
For the upcoming meetup we are organizing, we have an exciting lineup of activities planned:
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In the realm of cybersecurity, offensive security practices act as a critical shield. By simulating real-world attacks in a controlled environment, these techniques expose vulnerabilities before malicious actors can exploit them. This proactive approach allows manufacturers to identify and fix weaknesses, significantly enhancing system security.
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The Microsoft 365 Migration Tutorial For Beginner.pptxoperationspcvita
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Driving Business Innovation: Latest Generative AI Advancements & Success StorySafe Software
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During the hour, we’ll take you through:
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This webinar is ideal for professionals seeking to harness the power of AI within their data management systems while ensuring high levels of customization and security. Whether you're a novice or an expert, gain actionable insights and strategies to elevate your data processes. Join us to see how FME and AI can revolutionize how you work with data!
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Read Taking AI to the Next Level in Manufacturing to gain insights on AI adoption in the manufacturing industry, such as:
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2. Which barriers stand in the way of AI adoption.
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I develop the Ruby programming language, RubyGems, and Bundler, which are package managers for Ruby. Today, I will introduce how to enhance the security of your application using open-source software (OSS) examples from Ruby and RubyGems.
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Next, let's discuss package managers. Package managers play a critical role in the OSS ecosystem. I'll explain how to manage library dependencies in your application.
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During this demo, the founders of Secludy will demonstrate how their system utilizes Milvus to store and manipulate embeddings for generating privacy-protected synthetic data. Their approach not only maintains the confidentiality of the original data but also enhances the utility and scalability of LLMs under privacy constraints. Attendees, including machine learning engineers, data scientists, and data managers, will witness first-hand how Secludy's integration with Milvus empowers organizations to harness the power of LLMs securely and efficiently.
Power Saving Design Techniques with Low Cost FPGAs
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7. Static and Dynamic Power vs. Node Source: International Technology Roadmap for Semiconductors (ITRS) 2001,2002.Moore’s Law Meets Static Power, Computer, December 2003, IEEE ComputerSociety
Welcome to this module on the EPC2M family FPGA from Lattice. This module will provide an overview of the sources of FPGA power dissipation, design practices that can help reduce consumption and thus junction temperature, how to estimate and analyze power, and then some tips for managing a variety of power sources required for an FPGA implementation
Here are some key problems you might face with any FPGA power implementation. What will be the system level power supply requirements? What will be the current draw? What voltage levels will be required, and what power up/down issues will there be? What will be the thermal conditions of the device, and will it work reliably given the environment and the design I expect to run? Will I need to design in cooling mechanics for the board to counteract a hot part? And then, given the variety of voltage sources for core voltage, how can I manage sequencing? So while management of FPGA power has become an important consideration for many designers, increased dissipation can lead to larger power supplies and cooling systems. So, using good design techniques can help reduce the demand on power-hungry. Reducing power consumption increases the reliability of integrated circuits and can help lower the costs of production with leaner power supplies and fewer cooling requirements. Traditionally, FPGA designers have been concerned with timing and area efficiently; however, as FPGAs have moved more and more into the role of replacing ASSPs and ASICs, they have been pressured to developed lower-power designs, produce better power estimates earlier in the design flow, and then manage the sequence in a variety of core and I/O voltages that often accompany an FPGA implementation.
Understanding FPGA thermodynamics will help you identify the high-impact, low-effort methods to reduce power. Total power is a function of certain types of sub-power producers, along with the characteristics of the process node and device packaging.
Powering electronic devices is often defined as the amount of work done by an electric current. Devices tend to convert work into heat, which is unfortunately not considered very useful for most applications unless your design is a heater or a light bulb. Power is expressed as Jules per second or Watts, given the equation -- equals V times I. CMOS FPGAs contribute to power dissipation from two primary sources, static and dynamic, and the total power dissipation is the sum of the static and dynamic power. The DC power depends on process, voltage, and temperature, or PVT variation. AC power is a strong function of the frequency and activity of the resources, and a weaker function of PVT. So Power Dynamic is expressed in the second equation: one-half beta times capacitance types VDD squared times frequency. The AC portion of the power consumption is associated with used resources of the device. The dynamic part of the power consumption. Dissipation is directly proportional to the frequency and activity at which the resource is running and the number of resource units used. From the equation, it becomes obvious that how power consumption can be influenced by lowering supply voltage -- the largest factor -- switch capacitance, switching activity of nodes, with a frequency of signal transitions.
This graph illustrates the relative consumption of static versus dynamic power consumption of the Lattice ECP15, a 130 nanometer FPGA, and the Lattice ECP2/M, a 90 nanometer. With a design that models 90% logic utilization, 100% utilization of embedded ASIC blocks like PLLs, memory, and DSP features, and around 80% utilization of I/Os using a mixture of LDCMOS1.2 and LDDS 2.3 DDR type signal standard. DC power can be further subdivided into the power consumption of the used and unused resources of FPGA.
In the older process nodes, CMOS FPGAs have a very low static DC power dissipation. Most energy was consumed during or by switching activity and by charge/discharge of load capacitances, largely a function of user design. But this convention changes around 90 nanometer process nodes and smaller. Transistor physics changes at smaller geometry such that the static leakage is now more significant. The graph here shows how static power is growing exponentially due to increasing transistor leakage. And the crossover point, where static power overtakes dynamic, is around 65 nanometer node. How does another semiconductor vendors address these issues largely in the respective fabrication processes and their transistor mix used in each device. This trend, however, makes adoption of a power verification methodology all the more important with 90 nanometer devices.
To illustrate the effects of node switching activity, this graph plots power consumption versus frequency with the sample hardware model described earlier in the ECP2/M and the ECP 130 nanometer device. The power benefit of the 90 nanometer FPGA is clear in this example.
This figure illustrates power consumption of the ECP2 versus the ECP, but looking at I/Os, here, based on the average output load capacitance and puffs. This plot demonstrates how power consumption of I/Os remains relatively constant between 130 and the 90 nanometer device families.
The relevant consumption by resource type also changes between process nodes. As an example, the figures illustrate contribution by resource, routing, logic -- such as gates and registers -- embedded block RAM, etc., in the 130 nanometer versus the 90 nanometer part. The charts demonstrate that while overall power consumption drops given the 90 nanometer device, the relative amount represented by I/Os increases. So at first glance, as FPGA technology process geometry shrinks, designers should benefit from reduced power consumption of smaller transistors and IC dies. However, this benefit could be many times offset by larger designs and higher speeds.
The primary sources of power: static, which is a function of PVT, dynamic, which is a function of activity -- and especially dynamic I/O activity should be accounted for when designing and verifying a design.
Heat is a key byproduct of work performed by a device and must be addressed to ensure an FPGA operations within the junction temperature specification. Semiconductor devices will operate normally as long as the temperature does not exceed an upper limit specified as the ambient temperature and the temperature of the junctions inside the semiconductor. If this upper limit is exceeded then the semiconductor stops working and operating normally and will be damaged. Thermal management is indispensable when using the FPGA for high-power applications or using it under high operating temperature. The concept of thermal resistance is used when considering heat dissipation. The basis for a power design methodology is based on the thermal device specs published in the respective datasheet. So for example, on the ECP2/M device datasheet, you'll find t JCOM and t JIND in the absolutely maximum rating section of the datasheet. While total power, ambient temperature, thermal resistance, and airflow all contribute to device thermal dynamics, the junction temperature t J is key to reliable device operation. You should also be aware of the min/max numbers for supply voltages, since they may help you reduce static power.
So to avoid reliability issues, semiconductor vendors specify a maximum allowable junction temperature in the datasheet that we've seen. You should always complete a thermal analysis of your design to ensure the device and the package don't exceed the junction temperature requirements. The internal data shown is relative, and the actual values depend on a variety of factors like die size, paddle size, airflow, power supplied, the PCB design itself, and, of course, the user application data there will superseded the package thermal data provided by the device vendor. The most common examples are θ JA , thermal resistance junction-to-ambient, θ JC , thermal resistance junction-to-case, and a common other factor is θ JB , the thermal resistance junction-to-board. The maximum junction temperature of the device is going to be calculated by these expressions: T J is T A plus the product of power times θ JA . We use the total power consumption of the device, and θ JA is commonly used with natural or forced convection air-cooled systems, and θ JC is useful when you're considering that the package has a high conductivity case mounted directly to the PCB or a heatsink.
This chart illustrates the thermal resistance, θ JA and θ JC characteristics across the package range of the ECP2/M family. It demonstrates the benefits of certain package types and airflow. When designing a system, designers much make sure that the devices will operate at specified temperatures within the system environment. This is particular important to consider before a system is designed. The ability the estimate the device's operating temperature prior to board design also allows the designer to better plan for budgeting and airflow. A commercial device is likely to show speed degradation in a junction temperature above 85 degrees C, and an industrial device at over 100 degrees C. It's required that the device temperature be kept below these limits to achieve your guaranteed speed operation.
Static or DC power reduction tips include using a sleep mode if it's available. For example, during a period of system activity with the LatticeXP device, they can be placed on a sleep mode. And during this mode standby current is reduced by over one thousand times. The power supplies don't have to be switched. Another technique is to reduce your operating voltage obviously to look at the specs for VCC and VCCJ at the lower end the device specification. Also, clearly minimizing the operating temperature can be counted for by using packages with a lower thermal impedance.
Here are some more I/O specific techniques for static consumption. Try reducing the switch capacitances and frequencies of I/Os, decouple I/Os when you're in the sleep mode. If this is impossible, power down the core and leave the VCCO applied. Try reducing the I/O voltage swing so keep the I/O drive as low as possible. Use lower voltage standards of your I/Os. Look at slew rate controls to reduce output switching current. Some FPGAs provide control over LVCMOS or LVTTL buffers. It can be configured for either a low noise or high speed performance. Also another possibility here is not to power I/O banks that are unused.
Also look for opportunities to lower your clock speed on your non-high performance clock domains. This reduced power consumption so that the dynamic power's directly proportional to the frequency of operation. Designers must determine if proportions are designed to be clocked at a lower rate. Also disable timing driven mapping and enable register retiming to optimization options you can find with the back end place and route tools will benefit power. The next set of reduction tips are more, again, design related and depend on how you write your HDL. Use signal encoding optimization of counters or state machines. Designers should be trying to target the embedded ASCI blocks of the device versus general fabric logic. So EBRs, DSPs, modern FPGAs will have a lower consumption over generic LUT or register logic.
In this arena, of course this is largely affecting the design itself. Your RTL or your source code actual contents of your design. One technique is to enable a synthesis area of optimization on all or a portion of your design. So by reducing the span of the device or the design across the device, a more closely placed design will help utilize fewer routing resources for less power consumption. The clock gating optimization and quadrant clocking is tied together. And then there are certainly approaches to use clock enable approaches, using gating clocks rather than operating on those on every cycle.
Here's an example of some of these products called Push Button optimization. So that the area of optimization technique and the register retiming approaches. In this case the impact of performance and power with a sample design implemented and an ECB2 device are measured. Using the area optimized synthesis, and register retiming, and the ICP lever design mapper, it can get power to drop around 20% and performance impact however on this case declined at about 10%.
Like simulation, FPGA thermal analysis is a verification flow that runs in parallel with the traditional FPGA implementation tools and then an ISP lever design flow for example. FPGA designers can estimate consumption at any stage, pre-synthesis, post-map, pre-route, post-route, and post-simulation. Use the ISP lever power calculator to estimate used resources, activity factors of logic blocks, and toggle rates of I/Os before synthesis and place a route, or designers can use it at a later stage as more implementation details are available.
Here's a screenshot of the power calculator UI. The calculator application inputs are at power parameters such as device characteristics, voltage, temperature, device variations, airflow, heat sink, resource utilization, activity and frequency. Uses all these factors to calculate the device consumption, and then it reports both the DC and AC portion of consumption. Once the device is imported or provided all the required information software produced power estimate and predict the junction temperature. Any time junction temperature is outside the limits specified in the data sheet, the viability of operating the device without some cooling technique must be reevaluated.
Here's an example equation from power calculator used to estimate consumption of the device look up tables. So in this expression, total AC Power for LUT is the power constant for the LUT blocks in millowatts per MHz that max frequency of the LUT clock measured in MHz, times the activity factory of the LUT, times the number of LUTs used in design. Activity factor is the percentage of switching activity. Power calculator use activity factors and toggle rates as a means to model dynamic power consumption.
AF percentages defined as the percentage of frequency or time that a signal is active or toggling the output. Most resources associated with a clock domain are running or toggling at some percentage of the frequency of which the clock is running. Activity factor can be calculated per each routing resource, output, or PFU. However, this can involve long calculations, so our general rule of thumb is that for design occupying roughly 30-70% of the device, an activity factor between 15-25% average value. The accurate value of activity factor depends on clock frequency, the stimulus to your design, and the final output. The key input term used for I/O consumption estimates is the I/O toggle rate. The activity of I/Os is determined by the signals provided by the user in the case of inputs, or is an output of the design in case of output signals. The rates at which I/Os toggle define their activity. The toggle rate or TR in MHz is the output as defined in the expression as shown.
Given an application where you must account for power consumption, power closure methodology should be adopted. The first step the designer should look for opportunities to create power-friendly RTL, high impact low effort practices include targeting embedded blocks, coding smaller state machines, organizing blocks in a manner that area optimization won't overly impact the performance. And if a device is a higher density 90 nanometer device, I/O programming and switching should be given extra scrutiny to save power. Next power friendly synthesis in place route optimizations like power registry time and area optimization should be applied. And finally, a robust test bench that reflects actual operating conditions will help build an accurate activity factor and toggle rate factors or post simulation analysis and that power estimation software.
The main point is this graph of the power rails. The power supply sequencing is an important consideration when you're managing the power budget of an FPGA. So for an example, there are three main power supplies that are required to power up the ECP2M device for proper operation. VCC, VCCAUX, and VCCIO8, BANK 8. Power management circuits have become an important companion on the circuit board to deal with power up and down sequencing. The sequencing circuit below illustrates how the Lattice impact POWR1014 device serves as a programmable controller with the various voltage rails attached to ECB2M FPGA. If there's a sample sequencing circuit, you can see the blue boxes here at DC to DC supplies and the input enables coming in from the controller. And they're sourcing up a variety of voltage rails with the FPGA on the right. There's supervisory and control signals coming in on the left and right, into the power manager.
The sequencing circuit as shown illustrates how the Lattice impact POWR1014 device serves as a programmable controller with the various voltage rails attached to ECB2M FPGA. If there's a sample sequencing circuit, you can see the blue boxes here at DC to DC supplies and the input enables coming in from the controller. And they're sourcing up a variety of voltage rails with the FPGA on the right. There's supervisory and control signals coming in on the left and right, into the power manager.
The ispPAC-POWR1014/A is a general-purpose power-supply monitor and sequence controller, incorporating both in-system programmable logic and in-system programmable analog functions implemented in non-volatile E2CMOS® technology. The ispPAC-POWR1014/A integrates many power management functions typically requiring multiple ICs.
In step one, the power manager is going to wait for an internal all-good signal to indicate its own power's available. In step two it turns on the 1.2, 2.5, and 3.3 supplies for the FPGA. In step three and four, once the VCC is crossed the VCC min value, it turns on the VCCAUX. Next it waits for all of these supplies to stabilize, and then a good power output signal is enabled to indicate that PGA is ready to be programmed. And in step seven, the sequence controller waits for the FPGA done to be issued from the ECB2M. At this -- if it exceeds using the internal timer, if it exceeds 520 milliseconds, the sub routine is run to initiate a shutdown. Finally step eight, the controller waits for any supply to fail or shutdown signal to go active. In step 9 through 14, this is the shut down sequence. The controller first disables the VCCAUX MOSFET and waits for it to reach 100 millivolts in the threshold. And then it powers off all of the other supplies and waits for a recycle signal to start the FPGA sequencing again.
One of the most critical factors in design is reducing the system power consumption, especially important for handheld devices and other modern electronic products. Low power design techniques depending on the device type targeted in the characteristics of the design to an understanding of the sources of the FPGA power consumption, static and dynamic, core and I/O will influence your power reduction strategy. Even the variety of voltage rails and sequencing requirements of modern FPGAs sequencing circuits and programmable controllers should be considered as part of any implementation.
Thank you for taking the time to view this presentation on Power Saving Design Techniques with Low Cost FPGAs . If you would like to learn more or go on to purchase some of these devices, you can either click on the link embedded in this presentation, or simple call our sales hotline. For more technical information you can either visit the Lattice site – link shown – or if you would prefer to speak to someone live, please call our hotline number, or even use our ‘live chat’ online facility.