SEARAY is a high density, high speed board-to-board interconnect system from Samtec with up to 500 I/Os and 1.27mm pitch. It can be configured for single-ended or differential signaling with performance up to 10.5GHz. The document discusses SEARAY's applications in RapidIO and recommends a minimum stencil thickness of 0.005" for processing.

1. SEARAY ™ Open Pin Field Interconnects Source: Samtec

2. Introduction Purpose This training module introduces SEARAY connectors from Samtec, their applications and processing recommendations. Outline Introduction to SEARAY connectors SEARAY with single-end configuration & the measurements SEARAY in RapidIO application Processing recommendation Content 14 pages

3. SEARAY ™ SEARAY is a 0.050” high density, high speed board-to-board interconnect system. SEARAY can be mapped as a single-ended application, differential pair application, or a combination of both. The contacts in the SEARAY system are robust and allow for “zippering” when mating and unmating the connectors. Open pin field for maximum routing and design flexibility Up to 500 I/Os Solder charge terminations allows for easier processing Low insertion / extraction forces SEAF SEAM

4. SEAM / SEAF Series Characteristics 1.27mm x 1.27mm pitch interconnects system Available in 5, 6, 8 and 10 row open pin field arrays 20, 30, 40, and 50 positions High speed rating Single-Ended: up to 9.5GHz / 19Gbps Differential: Optimal Vertical: up to 9.5GHz / 19Gbps Optimal horizontal: up to 10.5GHz / 21Gbps High Density Vertical: up to 8.5GHz / 17Gbps

5. SEARAY in Single-Ended Configuration Single Ended Impedance Waveforms shown are from both the SEAM and SEAF side of the connector.

6. SEARAY in Single-Ended Configuration Single-Ended Impedance Filtered Waveform shows how the connect works with faster and slower edge rates in the Time Domain.

7. SEARAY in Single-Ended Configuration TDT Risetime Measurements TDT measurements were taken from the SEAM port to the SEAF port.

8. SEARAY in Single-Ended Configuration Single-End Crosstalk The waveforms are for all NEXT measurements. Most FEXT measurements showed a Crosstalk of less than 1%.

9. SEARAY™ in RapidIO Application Circuit Model

10. RapidIO Application – Interconnect Budget RapidIO short run driver template intervals at 2.5Gbps RapidIO short run driver template intervals at 3.125Gbps

11. RapidIO Application – 2.5Gbps Eye Pattern

12. RapidIO Application – 3.125Gbps Eye Pattern

13. Processing Recommendations Minimum stencil thickness to be 0.005” (0.12mm) Complete solder pad coverage is critical. Stencil cleaning may need to be monitored more frequently to ensure complete solder pad coverage is maintained. The connector must be fully seated. As the solder charges reflow, the weight of the connector causes it to settle so that the body rests on or slight above the board after processing. Time and temperature must be controlled prior to processing or production. Thermocouples should be placed as close to the solder charger as possible in the center and on the outside edge.

14. Additional Resource For ordering the SEARAY connectors, please click the part list or Call our sales hotline For additional inquires contact our technical service hotline For more product information go to http://www.samtec.com/technical_specifications/overview.aspx?series=SEAF Newark 1 Farnell 1 Newark 2 Farnell 2