For more than 50 years, Epec has continued its tradition of perfection in engineering and manufacturing printed circuit boards for the most discerning customers. Our years of manufacturing experience provide us with a competitive edge when it comes to PCB layout and design. From a simple single sided board to a complex multi-layer, double sided surface mount design, our goal is to provide you a design that meets your requirements and is the most cost effective to manufacture.

1.  High-Tech
Printed Circuit Boards Overview
 DELIVERING QUALITY SINCE 1952.

2. America's Oldest,
A History of Innovation
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Privately held company, established in 1952.
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Estimated 2013: Sales: US$40 Million
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100+ Employees Worldwide
(70 – North America, 30 – Asia, 3 – Europe)
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Design and manufacture customized, built-to-print,
performance-critical products for all sectors of the
electronics industry.
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Leading provider of printed circuit boards, membrane switches, graphic
overlays, silicone rubber products, electronic heaters, fans, motors and
custom battery packs.
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Integrated supply chain management solutions to handle the complexity of
today’s global marketplace while making sure that every order is being
manufactured at the “right” factory.
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3. Global Operations
Significant Investment in People and
Facilities across the globe.
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4. Our Customers - The Top Global
OEM’s In Growth Industries
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5. Industry Breakdown
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6. Technology Road Map
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7. Focus on the Right Market
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Key Markets to go after:
– Industrial
• Avionics
• Aerospace
• Automation
– Telecommunications
– Information Technologies
– Military
• Communications
• Antenna
• Satellite
• Ordinance
• Aerospace
– Medical
– Transportation
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8. Quickturn PCB Capabilities
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Up to 18 Layers
Laminate – FR-4 (All Tg & Td Ranges), CEM-1, Teflon, Ceramic, Polyimide
Finished Thickness Up to .300”
Minimum Dielectric Spacing = .003”
Green, Blue, Red, Black, Clear and White Solder Masks and Legend Inks
Immersion Gold, Gold Fingers, Full Body Gold, Bondable Gold
Immersion Silver, Immersion Tin, Lead Free HAL, OSP, ENEPIG
Minimum Lines & Spaces =.003”
Blind & Buried Vias
Maximum Panel Size = 24” x 36”
Minimum Finished Hole Size = .005” +/- .003”
Maximum Hole Aspect Ratio = 15:1
Maximum Copper Weight = 6 oz. (UL Approved)
Laser Direct Imaging and Laser Drilling
Controlled Impedance +/- 10%
Carbon Ink
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9. Clear Focus in Manufacturing
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Focusing on Technology:
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2.7 Mil Signals
26:1 Via Aspect Ratio
Impedance down to 5%
Micro via Laser & Stacked Drill and
rout
– Thermal Solutions & Cavities
– Oversize Boards and Backplanes
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Backplanes & Back panels
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Up to 24 x 34 panels
Up to .400” thickness
Hi Performance dielectrics
24 Hour Quickturn are available
All surface finishes are available
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10. To Be Successful
You Need the Right Tools
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Laser Direct Imaging:
– Orbotech LDI System
– 60 Scans per hour w/ 1 Mil signal
resolution
– 5 Colight Exposure Units
– 3 Collimated Exposure Units
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Develop Etch & Strip:
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HMS Hollmuller DES
Steady State processing
Accelerated Cycles
Increased thru-put
Enhanced yields
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11. Continued Investment
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Autoclave Vacuum Lamination:
– Vacuum Press International
– Allows for oversized
panels/backplanes
– Improves adhesion
– Improves tolerance
– Reduces Cycle Time
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12. Capital Investment
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Excellon Dual Laser
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Microvias
3k holes/minute
Stacked Vias
Laser Trim
Laser Route
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13. Capital Investment
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Drill Optimize & Register:
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Multiline System
Real Time x-Ray
Sub lam registration
Optimize scale factors
Enhanced yields
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14. PCB Services
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Delivery
STANDARD LEAD TIME - 20 Working Days
Technology
1 Day
2 Day
3 Day
5 Day
7 Day
10 Day
1 - 4 Layers
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
6 - 10 Layers
> 10 Layers
Both Prototype and Production Quantities
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15. HDI – High Density Interconnect PCB
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HDI is a PCB with a higher wiring density per area, finer lines and space, smaller vias and pads than
conventional PCB’s.
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HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.
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To produce HDI boards, laser direct imaging and laser drilling equipment is a must along with
investment in other high tech equipment to ensure high quality production.
HDI Production Capabilities
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Laser Microvias
Blind and Buried Via’s
Sequential Lamination
Via-In-Pad Technology
2/2 lines and spacing
Copper filled stacked microvia’s
Up to 18 Layers
Down to 2 mil dielectrics
Tight Impedance Control
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16. Value Added Capabilities
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Castellated Edges
Counter Sinks/Counter Bores
– Plated/Non-Plated
Standoff’s, Spacers & Pem Nuts Installed
Connectors (Soldered/Press Fit)
Aluminum Clad Boards
Silver Thru Hole Volume Production
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FR-4 Custom Board Spacers
Ultra Clean Ionic Cleanliness
Eyelets
Peelable Solder Mask
Edge Plating
MIL-55110 & 31032
Back Planes
 Hole Tolerance +/- .002”
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17. Material Used in Fabrication
ISOLA
ITEQ
ROGERS TACNOIC
NANYA
NELCO
AD
370HR
IT-140
3003
TMM6
RF-35
NP140
N4000-13
527
CLTE
FR406
IT-156
4003
TLT
N400013EP
870
CUCLAD
FR408
4350
TLX
N400013SI
933
DICLAD
FR408H
R
5870
TLY
N4000-6
25FR
GX
GETEK
5880
TSM30
25N GY
IS410
6002
35N LX
IS415
6010
Arlon
522
85N
ULTRALAM
IT-180A
TMM10
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18. Industry’s Leading Online Tools

Sign up today and try InstantPCBQuote™, the most
flexible and user friendly internet quoting and ordering tool
in the PCB industry.
Try it Now!
www.epectec.com/instantpcbquote/
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19. PCB Design and Layout
Our Capabilities Encompass The Full Design Flow From Start To
Finish Including:
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Micro BGA / Micro Via / Blind and Buried Vias
Rules Driven Designs
Schematic Capture
Library Development
Database Construction and Verification
Signal Integrity/Design Verification
EMI Checking
Full Document Package Creation
Electrical Engineering Expertise
We are fully licensed and utilize industry leading tools, including Cadence Allegro, Mentor Expedition,
Mentor's PADS, Altium, Valor for DFM Analysis.
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20. World Class Quality Assurance &
Engineering
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US Based QA Capabilities Include:
– Full Cross Section/Microsection Reporting and Ionic
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Testing Equipment
X-Ray Fisherscope for all Metal Thickness & Purity
Measurement on every lot.
Scienscope DMP-1000 stereo zoom microscope with
digital picture capability up to 100x
Vision Engineering Mantis Elite for 10X full range
visual inspection.
World Class Electronics Test Lab
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Epec’s superior on-time delivery rates are the
result of our significant, dedicated engineering
resources and processes.
– Perform all DRC, DFM, Graphic Art and Engineering reviews
at our Engineering Center outside of Boston, MA
– Documentation of all manufacturing and detailed planning
processes, for all special requirements,
– Consistent documentation and tooling at all manufacturing
locations to ensure seamless prototype through production
manufacturing.
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21. The Epec Value Added Operation
The Broker
Customer
Delivery in
5-8 weeks
Send order
to the
factory
broker
works with
Receive
Customer
Order
80% On-Time
80% Quality
The Epec Operation
Receive
Customer
Order
Production
Planning
matches
order with
our optimal
domestic or
Asian
facility
Complete
Epec Eng
Analysis,
work with
customer
to resolve
all
technical
and build
issues.
Continual
Epec US &
process and
Asian
on-site
Operations
technical
groups
improvement
Manufacturing
manages
program, to order status,
Begins
optimize
on-site; daily
delivery and WIP analysis
quality
through ERP
performance
System
On-site QA
Inspection
at factory
by Epec
employees.
Product
arrives at
Epec, is reinspected,
final QA is
completed
before
shipping to
customer.
Customer
Delivery in
as little as 1
day.
98%
On-Time
99.5%
Quality
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22. Our Products
Battery Packs
Flex & Rigid-Flex PCB’s
User Interfaces
Fans & Motors
Cable Assemblies
Printed Circuit Boards
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23. Inventory Management
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Customer requirements are always unique and customized, therefore
our inventory management system must accommodate for this type of
environment.
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We Offer:
– Kanban
– Consignment
– JIT Programs
– Blanket Orders
– Customer Fulfillment
– Bonded Warehousing
– Kitting
– Safety Stock
– Other flexible solutions
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24. The Difference is Quality and Delivery
1.
Quicker Delivery - Epec's technology infrastructure and people, including the
Asian and US based operations and engineering teams, enable jobs to get started the
same day the order data is electronically received by our factory.
2.
Accurate Information - Epec's on-site personnel provide accurate daily Work
In Process reports so customers can receive immediate order status information, along
with in person verification of all daily reports by Epec staff.
3.
Better Quality - Epec ensures higher levels of quality through three key additional
processes. On-site QA inspectors at each facility provide an additional audit before it
leaves Asia, Epec maintains dual UL approval at each facility with quarterly audits, and
perform QA audits at our headquarters in Boston, MA.
4.
Flexibility - Each of our manufacturing facilities have been selected for their
best-in-class niche product and delivery solutions, ensuring our optimal facility is
building every order.
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25. 
If you require additional information please contact us with any
questions or requests.
North American Headquarters
174 Duchaine Blvd.
New Bedford, MA 02745
Tel: (508) 995-5171
Fax: (508) 998-8694
Contact Us By Email:
Sales
Quotes
Engineering
sales@epectec.com
quoting@epectec.com
engineering@epectec.com
Visit Our Website For More Information
www.epectec.com
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