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Rigid-Flex Circuit Board Gerber Layout Guidelines Webinar
The document outlines guidelines for rigid-flex circuit design, emphasizing the importance of adhering to IPC standards for construction and layout to enhance reliability and performance. Key points include requirements for flex layer stack up, spacing of transition lines, and trace layout to ensure mechanical flexibility while minimizing risk during manufacturing. Additional resources and support for design and engineering are available to assist customers.
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Rigid-Flex Circuit Board Gerber Layout Guidelines Webinar
- 1. DELIVERING QUALITYSINCE 1952. Rigid – Flex Circuit Gerber Layout Guidelines 05.30.14
- 2. 2 Rigid –Flex circuits introduce additional design requirements which need to be accommodated at the Geber Layout phase: – Rigid to Flex Transition Lines – Layer Stack ups – Trace Layout in Flex Areas Introduction
- 3. 3 Introduction Guidelines basedon IPC 2223C recommended Rigid – Flex Construction(s): – Ensures the highest degree of reliability and performance – Key Elements • Adhesiveless Flex Core • Selective Flex Area Coverlay • No Flow Prepreg (rigid area layer lamination)
- 4. 4 Definition: Lineat which flex layers exit from Rigid area(s) – Special requirements due to: • IPC 2223C Selective Coverlay and Material Guidelines • Manufacturing Methods: – Rigid Materials (FR4 & Prepreg) are removed from flex areas prior to the layer lamination process Rigid to Flex Transition Lines
- 5. 5 Rigid to FlexTransition Lines: PTH Hole Spacing 0.050” Min. Requirement: – As measured from edge of drilled hole to “Rigid to Flex” transition line(s) – Prevents PTH holes from being drilled through Selective Coverlay adhesives – Accounts for manufacturing and material tolerances
- 6. 6 Rigid to FlexTransition Lines: Copper Feature Spacing 0.025” Min. Clearance (External Layers only) – Allows for manufacturing methods and tolerances during outer layer imaging processes – Accounts for prior removal of rigid materials in flex areas
- 7. 7 Rigid – FlexLayer Stack Up Guidelines Flex Layer Core Thickness(s): – 0.001” recommended • Improved flexibility, mechanical reliability and bend radius capability – 0.002” to 0.003” required for impedance controlled designs Balanced Construction with centrally located Flex Layers Recommended: – Minimizes potential warp and twist in assembly arrays – Avoids potential cost adders – Unbalanced builds possible but should be reviewed with supplier in advance Balanced Construction Unbalanced Construction
- 8. 8 Rigid – FlexLayer Stack Up Guidelines Same Finished Thickness in all Rigid Areas: – Avoids sequential lamination processes and significant added costs – Consult with supplier to determine viability Odd Layer Counts Allowed: – E.G.: 5 Layer Rigid with 1 or 3 layers flex etc. Flex Area Layer Count: – Minimize for thinnest possible construction • Improved flexibility, reliability and bend radius Flex Layer Copper Weight: – ½ OZ Copper recommended • Improved flexibility and mechanical reliability • Allows for impedance controlled circuits – 1 OZ Copper available for higher current carrying requirements
- 9. 9 Rigid – FlexLayer Stack Up Guidelines Paired Flex Layers Structure Recommended: – Eliminates flex adhesives from rigid areas for PTH reliability – Improves flex area flexibility and mechanical reliability 8 Layer Rigid – 2 Layer Flex 8 Layer Rigid – 4 Layer Flex (Air Gap)
- 10. 10 Rigid – FlexLayer Stack Up Guidelines Impedance Controlled / Shielded Designs: – May require 3 or more flex layers bonded together – Use of flex adhesives to be minimized to best conform to IPC 2223C – Potential negative impact on flexibility and bend requirements – Consult with supplier for best configuration 7 Layer with 3 Flex Layers 8Layer with 4 Flex Layers
- 11. 11 Flex Area TraceLayout Guidelines Offset Traces from Layer to Layer in Flex Area (if possible) – Improves mechanical flexibility by minimizing “I-Beam” effect – Impedance Controlled and Shielded Designs will not fully allow due to reference plane requirement Preferred Not Recommended Impedance Controlled Design
- 12. 12 Flex Area TraceLayout Guidelines Straight / Parallel Trace layout is preferred: – Eliminates potential mechanical stress concentrators in bend areas – If direction change is required then rounded trace corners are recommended • Up to 45 degree corners are allowed • 90 degree corners are not recommended
- 13. 13 Our Products Battery PacksFlex & Rigid-Flex PCB’s User Interfaces Fans & Motors Cable Assemblies Printed Circuit Boards
- 14. 14 Design Centers &Technical Support Battery Pack & Power Management – Denver, CO User Interfaces – Largo, FL Fans & Motors – Wales, UK PCB’s – New Bedford, MA & Shenzhen, China Flex & Rigid Flex – Toronto, Canada Cable Assemblies – New Bedford, MA Our Engineering and Design teams are ready to help our customers create world class and cost effective product solutions.
- 15. 15 Q&A Questions? – Enterany questions you may have in the Control Panel. – If we don’t have time to get to it, we will reply via email.
- 16. 16 Thank You Check outour previous webinars at www.epectec.com. For more information email sales@epectec.com. Stay Connected with Epec Engineered Technologies Follow us on our social media sites for continuous technical updates and information: