In order to properly manufacture mil/aero, flex/rigid-flex PCBs, and RF/Microwave PCBs, significant investment in specialized equipment to meet the demanding tolerances required in these applications.
COVID-19 has turned the world of manufacturing, and everything else, upside down. For printed circuit boards, it was especially painful. Close to 75% of all PCBs are made in Asia, and this made it even more difficult to manage. Currently, less than 5% of all PCBs are made in the U.S., and that is not going to change anytime soon as our cost base is much too high to be price competitive. It is also very difficult to get a new site permitted given the type and amount of chemicals that go into PCB manufacturing.
With this being the reality that we live in at the moment, we must truly understand all of the aspects of the PCB supply chain in Asia (not just China) and how to position ourselves with a partner that has made the significant financial investment in a resilient supply chain.
In this webinar, we reviewed some topics we have been asked to elaborate on by our customers, along with managing your freight costs, delivery times, laminate availability, and stocking programs we offer.
For more information on our quick-turns PCBs, visit https://www.epectec.com/pcb/quick-turn-pcb-printed-circuit-board.html.
Have you ever designed a PCB and sent it out for quotation, only to receive a series of no-quotes or deviation requests from potential suppliers? If so, then you may be interested to find out why this happens and how to minimize the likelihood that it will happen again in the future.
Good circuit board design practices are essential, of course, but it is also helpful to understand your suppliers’ capabilities so that you can anticipate which features might make your high-tech PCB more difficult to build.
In this webinar as we discuss some of the key requirements you should know about your PCB suppliers’ capabilities to ensure your high-tech PCB is manufactured properly in a timely manner.
For more information on our printed circuit board solutions visit http://www.epectec.com/pcb/.
The flex and rigid-flex manufacturing process is inherently more complex with more process steps than those found in a rigid PCB of similar technology. When it comes to flex PCB designs, this is driven by the difference in materials combined with the many added items or features that can be incorporated into a design.
These include stiffeners (of varying materials / thickness / locations), pressure sensitive adhesives, shield layers, strain reliefs, etc. For rigid-flex designs this can become additionally complex as all the available flex items are combined with all the technical items found in rigid PCBs. These items potentially interact and can negatively impact the efficiency of the production process.
Streamlining is defined as making a process more efficient and effective. Having a design that streamlines the production process will have the benefits of improved delivery times, reduced part cost, improved manufacturing yield, and even potentially improved long-term part reliability.
In this webinar where we review the many areas of flex and rigid-flex designs that can impact how streamlined a design is for production.
For more information on our flex and rigid-flex PCB solutions visit https://www.epectec.com/flex/.
Critical flex and rigid-flex circuit applications often must pass very stringent electromagnetic (EM) or radio frequency (RF) interference requirements. This type of interference, if absorbed or emitted, can negatively impact the functionality and reliability of the end product when in use.
To prevent this from occurring, the circuit design must incorporate shielding to eliminate either the absorption or transmission of EM or RF interference. For flex and rigid-flex PCB designs, there are two types of shielding solutions that can be applied, but which is best suited will depend upon other design requirements.
In this webinar, we review shielding methods and how to implement them in a flex or rigid-flex PCB design to ensure interference free operation of your design.
For more information on our custom flex and rigid-flex circuit solutions, visit https://www.epectec.com/flex.
Epec Engineered Technologies is an experienced custom designer and manufacturer of high reliability user interface control panels. High reliability user interfaces are defined as being more dependable than standard membrane switches as they incorporate additional components into a full assembly such as displays, switches, interface electronics, and graphics with aesthetics to match demanding OEM applications.
We focus on helping our customers design the best custom battery pack products that are the most cost effective, environmentally safe and exceed all of their specifications. Our offering of batteries and custom battery packs allows us to work with our customers and their engineering teams to manage the power needs of their end products. Our goal is to exceed your specifications while keeping you under budget.
With the ever changing environment in the medical device market, companies face continuous pressure to make their products smaller, lighter, more portable and of course, less costly.
Epec has over 60 years of experience in working with medical customers and the stringent requirements that go along with medical devices. We will be presenting a webinar that outlines some new technologies and techniques that can help companies achieve all of their product goals.
Please join us for our upcoming product webinar for more information on how Epec can help you with all your medical device needs.
The document provides a checklist of information needed before starting a PCB design project. It discusses the importance of including schematic files, bills of materials, production timelines, certifications required, and delivery expectations. Providing all relevant design details upfront helps the PCB manufacturer properly scope the project, prevent issues, and ensure a successful design and manufacturing process.
COVID-19 has turned the world of manufacturing, and everything else, upside down. For printed circuit boards, it was especially painful. Close to 75% of all PCBs are made in Asia, and this made it even more difficult to manage. Currently, less than 5% of all PCBs are made in the U.S., and that is not going to change anytime soon as our cost base is much too high to be price competitive. It is also very difficult to get a new site permitted given the type and amount of chemicals that go into PCB manufacturing.
With this being the reality that we live in at the moment, we must truly understand all of the aspects of the PCB supply chain in Asia (not just China) and how to position ourselves with a partner that has made the significant financial investment in a resilient supply chain.
In this webinar, we reviewed some topics we have been asked to elaborate on by our customers, along with managing your freight costs, delivery times, laminate availability, and stocking programs we offer.
For more information on our quick-turns PCBs, visit https://www.epectec.com/pcb/quick-turn-pcb-printed-circuit-board.html.
Have you ever designed a PCB and sent it out for quotation, only to receive a series of no-quotes or deviation requests from potential suppliers? If so, then you may be interested to find out why this happens and how to minimize the likelihood that it will happen again in the future.
Good circuit board design practices are essential, of course, but it is also helpful to understand your suppliers’ capabilities so that you can anticipate which features might make your high-tech PCB more difficult to build.
In this webinar as we discuss some of the key requirements you should know about your PCB suppliers’ capabilities to ensure your high-tech PCB is manufactured properly in a timely manner.
For more information on our printed circuit board solutions visit http://www.epectec.com/pcb/.
The flex and rigid-flex manufacturing process is inherently more complex with more process steps than those found in a rigid PCB of similar technology. When it comes to flex PCB designs, this is driven by the difference in materials combined with the many added items or features that can be incorporated into a design.
These include stiffeners (of varying materials / thickness / locations), pressure sensitive adhesives, shield layers, strain reliefs, etc. For rigid-flex designs this can become additionally complex as all the available flex items are combined with all the technical items found in rigid PCBs. These items potentially interact and can negatively impact the efficiency of the production process.
Streamlining is defined as making a process more efficient and effective. Having a design that streamlines the production process will have the benefits of improved delivery times, reduced part cost, improved manufacturing yield, and even potentially improved long-term part reliability.
In this webinar where we review the many areas of flex and rigid-flex designs that can impact how streamlined a design is for production.
For more information on our flex and rigid-flex PCB solutions visit https://www.epectec.com/flex/.
Critical flex and rigid-flex circuit applications often must pass very stringent electromagnetic (EM) or radio frequency (RF) interference requirements. This type of interference, if absorbed or emitted, can negatively impact the functionality and reliability of the end product when in use.
To prevent this from occurring, the circuit design must incorporate shielding to eliminate either the absorption or transmission of EM or RF interference. For flex and rigid-flex PCB designs, there are two types of shielding solutions that can be applied, but which is best suited will depend upon other design requirements.
In this webinar, we review shielding methods and how to implement them in a flex or rigid-flex PCB design to ensure interference free operation of your design.
For more information on our custom flex and rigid-flex circuit solutions, visit https://www.epectec.com/flex.
Epec Engineered Technologies is an experienced custom designer and manufacturer of high reliability user interface control panels. High reliability user interfaces are defined as being more dependable than standard membrane switches as they incorporate additional components into a full assembly such as displays, switches, interface electronics, and graphics with aesthetics to match demanding OEM applications.
We focus on helping our customers design the best custom battery pack products that are the most cost effective, environmentally safe and exceed all of their specifications. Our offering of batteries and custom battery packs allows us to work with our customers and their engineering teams to manage the power needs of their end products. Our goal is to exceed your specifications while keeping you under budget.
With the ever changing environment in the medical device market, companies face continuous pressure to make their products smaller, lighter, more portable and of course, less costly.
Epec has over 60 years of experience in working with medical customers and the stringent requirements that go along with medical devices. We will be presenting a webinar that outlines some new technologies and techniques that can help companies achieve all of their product goals.
Please join us for our upcoming product webinar for more information on how Epec can help you with all your medical device needs.
The document provides a checklist of information needed before starting a PCB design project. It discusses the importance of including schematic files, bills of materials, production timelines, certifications required, and delivery expectations. Providing all relevant design details upfront helps the PCB manufacturer properly scope the project, prevent issues, and ensure a successful design and manufacturing process.
The document discusses key considerations for designing lithium-ion batteries for portable devices. It emphasizes that specifications are important to outline physical, environmental, and performance requirements upfront to guide development. Physical constraints, operating ranges, safety systems, and smart battery capabilities that provide information to devices affect costs. A good specification treats the battery design like a blueprint and ensures all necessary factors are addressed to reduce risks.
This document discusses cable assembly capabilities from a company established in 1952 with estimated 2017 sales of $50 million. It provides details on their custom cable assembly solutions and testing capabilities. Case studies are presented on cable assemblies used in medical probes, rolling stock, outdoor applications, and maritime environments that were improved through their solutions.
When it comes to designing any type of radio frequency product, the footprint of the overall design may need to fit into a predefined package size. This often times causes the overall RF filter to be designed around these constraints.
In this webinar we will review some of the electrical performance and mechanical size issues when designing an RF filter for your application. We will also discuss what techniques should be used and how they affect the overall performance of the product.
For more information on our custom RF products solutions visit http://www.epectec.com/rf-products/
In a perfect world, a high-tech printed circuit board (PCB) design would incorporate every desirable feature and function, and cost would never enter the conversation. The real world, however, is very different.
Products are often designed to meet price targets. Sometimes this is because they are intended to compete with a competitor’s existing product, but there are many other market-related reasons as well.
In this webinar will provide some guidelines for keeping your PCB costs as low as possible, while still meeting your critical performance requirements.
For more information on our printed circuit board solutions visit http://www.epectec.com/pcb/.
This webinar will focus on Re-Engineering Obsolete Printed Circuit Boards. Many OEM's are finding their mature PCB designs are peppered with a dwindling supply of obsolete components and/or they are paying for additional labor to install inefficient thru-hole components. These challenges will often lead to compromised schedules and strained margins.
We will review the items required to make the process of redesigning a customer's antiquated or obsolete printed circuit board into a contemporary and cost effective product.
IC adapter technologies document shows various configurations of probing and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. Partnered with Agilent and Tektronix, enabling adapters to facilitate the use of in-circuit emulators and FPGA development systems.
In this webinar we review key flex and rigid-flex technical items that we routinely encounter during the design review and production tooling engineering processes. These items often require technical questions to be asked and answered which in turn delays the production release and delivery of an order.
The objective is to address these items, if necessary, early on during the design phase and in advance of an order being placed so as not to incur any delays. The most common items fall into 4 groups: Manufacturability, Materials, Functionality, and Reliability.
For more information on our flex and rigid-flex PCB solutions visit http://www.epectec.com/flex/
As resistive and capacitive touch technologies have become more cost effective with far greater performance, these high-tech HMI designs have become more widespread across all industries from consumer products, to medical, and even military applications. Manufacturers continue to phase out the legacy dome and tactile switches with higher reliability touchscreens that offer far superior flexibility, fewer moving parts, and the ability to downsize and consolidate system components.
However, this brings a new and unique set of program concerns such as integration, firmware development, obsolesce/material risk, and most importantly understanding what technology works best for the right application.
This webinar will review the technology behind today's touchscreen products and the steps necessary to bring next-generation products to market.
For more information on our human-machine interface solutions visit http://www.epectec.com/user-interfaces/.
Military and Aerospace applications require the upmost reliability for maximum performance. This webinar will explain the potential benefits of using heavy and extreme copper PCBs in high-reliability Military and Aerospace applications.
In this webinar as we discuss ways that heavy copper PCBs are a solution worth considering in instances where high current and high reliability are essential for trouble-free operation of mission-critical equipment.
To learn more about our printed circuit board solutions visit http://www.epectec.com/pcb/
The document discusses industry standards and how they impact cable assembly designs. It defines various types of standards including materials-centric, product-centric, safety-centric, and customer-centric standards. It also discusses key standards organizations, different types of standards documents, and examples of performance and safety standards that are important for cable assemblies. The document aims to provide an overview of the many industry standards that must be considered in cable assembly design.
Medical Flex and Rigid-Flex circuit applications require that the design provides the utmost in reliability. Unique combinations of electrical requirements, mechanical bend requirements, and in some cases medical operating environments, require careful and thorough design review.
In this webinar we will cover how these requirements interact and what their impact on circuitry layout, materials, and the construction of the design are.
To learn more about our flex and rigid-flex solutions visit http://www.epectec.com/flex/
As you know, component shortages are impacting product lead times around the world. Advanced smart battery packs and chargers are no exception. Over recent years, electronic circuit functionality has been consolidated into smaller ICs that can manage a lot of functionality into small, easy-to-use single ICs. Unfortunately, these ICs are single-sourced ICs with lead times stretching beyond 80 weeks. These extremely long lead times can kill projects and companies.
In this webinar, we reviewed methods that we use to minimize or eliminate these single-sourced components used in battery pack manufacturing. Along with ways to layout circuit boards to allow component flexibility preventing redesigns, and methods to use firmware to reduce dependencies on sole-sourced parts.
For more information on our custom battery pack solutions, visit https://www.epectec.com/batteries.
This document discusses trends in the IC packaging industry and technology. It provides an overview of the market growth in IC packaging units and revenues. Key challenges for the industry are declining ASPs and increasing materials costs. Emerging technologies discussed include wafer-level packaging, 2.5D/3D IC with TSV, and integrated passives. The document outlines SPIL's packaging portfolio and roadmaps for 3D IC and TSV development over the next few years. It also summarizes SPIL's testing and certification capabilities.
This document discusses various advanced rigid-flex circuit board constructions that offer benefits over standard constructions. It describes options for odd layer counts, asymmetrical constructions, varying flex layer counts, integrated ZIF connections, blind and buried vias, air gap flex layers, multiple rigid area thicknesses, and shielded flex layers. These advanced constructions allow for higher levels of design integration, tighter bend radii, impedance control, and EMI shielding compared to standard constructions.
Our webinar on custom battery packs gives an insider look of the battery Development Timeline and Expectations. This walk through guide introduces you to the necessary steps that will get you from concept to production. A clear set of expectations is laid out to ensure there are no blind spots in our customers’ plan.
From a complex multi-layer board to a double sided surface mount design, our goal is to provide you a quality product that meets your requirements and is the most cost effective to manufacture. Our experience in IPC Class III standards, very stringent cleanliness requirements, heavy copper, and production tolerances allow us to provide our customers exactly what they need for their end product.
1. Unimicron is a leading substrate manufacturer that has expanded its product portfolio over time to include finer line designs and smaller bump pitches, posing new challenges for metrology.
2. 2D AOI is used to detect small "mouse bite" defects not found by electrical tests that could cause reliability issues, but it faces challenges discerning real defects from false alarms or similar features like oxidation.
3. As designs evolve to include finer lines and pitches, equipment vendors are expected to provide higher resolution 3D metrology tools that can directly assess defects without multiple scans to reduce false alarms, while also offering faster throughput and automated defect mapping.
In this Webinar, Epec will review primary design requirements that are best served by the utilization of flex or rigid-flex circuit boards within a given design. Additionally we will address the primary cost drivers that impact the per part cost.
To learn more information on our flex & rigid-flex circuit board solutions visit http://www.epectec.com/flex/.
This webinar is an introduction to Flex and Rigid–Flex Gerber layout design methods and requirements that differ from standard rigid board technology.
Prepare to review some of the unique elements of Flex and Rigid–Flex Gerber layout to ensure functionality and mechanically reliability that meets or exceeds the design requirements.
For more than 50 years, Epec has continued its tradition of perfection in engineering and manufacturing printed circuit boards for the most discerning customers. Our years of manufacturing experience provide us with a competitive edge when it comes to PCB layout and design. From a simple single sided board to a complex multi-layer, double sided surface mount design, our goal is to provide you a design that meets your requirements and is the most cost effective to manufacture.
The document discusses key considerations for designing lithium-ion batteries for portable devices. It emphasizes that specifications are important to outline physical, environmental, and performance requirements upfront to guide development. Physical constraints, operating ranges, safety systems, and smart battery capabilities that provide information to devices affect costs. A good specification treats the battery design like a blueprint and ensures all necessary factors are addressed to reduce risks.
This document discusses cable assembly capabilities from a company established in 1952 with estimated 2017 sales of $50 million. It provides details on their custom cable assembly solutions and testing capabilities. Case studies are presented on cable assemblies used in medical probes, rolling stock, outdoor applications, and maritime environments that were improved through their solutions.
When it comes to designing any type of radio frequency product, the footprint of the overall design may need to fit into a predefined package size. This often times causes the overall RF filter to be designed around these constraints.
In this webinar we will review some of the electrical performance and mechanical size issues when designing an RF filter for your application. We will also discuss what techniques should be used and how they affect the overall performance of the product.
For more information on our custom RF products solutions visit http://www.epectec.com/rf-products/
In a perfect world, a high-tech printed circuit board (PCB) design would incorporate every desirable feature and function, and cost would never enter the conversation. The real world, however, is very different.
Products are often designed to meet price targets. Sometimes this is because they are intended to compete with a competitor’s existing product, but there are many other market-related reasons as well.
In this webinar will provide some guidelines for keeping your PCB costs as low as possible, while still meeting your critical performance requirements.
For more information on our printed circuit board solutions visit http://www.epectec.com/pcb/.
This webinar will focus on Re-Engineering Obsolete Printed Circuit Boards. Many OEM's are finding their mature PCB designs are peppered with a dwindling supply of obsolete components and/or they are paying for additional labor to install inefficient thru-hole components. These challenges will often lead to compromised schedules and strained margins.
We will review the items required to make the process of redesigning a customer's antiquated or obsolete printed circuit board into a contemporary and cost effective product.
IC adapter technologies document shows various configurations of probing and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. Partnered with Agilent and Tektronix, enabling adapters to facilitate the use of in-circuit emulators and FPGA development systems.
In this webinar we review key flex and rigid-flex technical items that we routinely encounter during the design review and production tooling engineering processes. These items often require technical questions to be asked and answered which in turn delays the production release and delivery of an order.
The objective is to address these items, if necessary, early on during the design phase and in advance of an order being placed so as not to incur any delays. The most common items fall into 4 groups: Manufacturability, Materials, Functionality, and Reliability.
For more information on our flex and rigid-flex PCB solutions visit http://www.epectec.com/flex/
As resistive and capacitive touch technologies have become more cost effective with far greater performance, these high-tech HMI designs have become more widespread across all industries from consumer products, to medical, and even military applications. Manufacturers continue to phase out the legacy dome and tactile switches with higher reliability touchscreens that offer far superior flexibility, fewer moving parts, and the ability to downsize and consolidate system components.
However, this brings a new and unique set of program concerns such as integration, firmware development, obsolesce/material risk, and most importantly understanding what technology works best for the right application.
This webinar will review the technology behind today's touchscreen products and the steps necessary to bring next-generation products to market.
For more information on our human-machine interface solutions visit http://www.epectec.com/user-interfaces/.
Military and Aerospace applications require the upmost reliability for maximum performance. This webinar will explain the potential benefits of using heavy and extreme copper PCBs in high-reliability Military and Aerospace applications.
In this webinar as we discuss ways that heavy copper PCBs are a solution worth considering in instances where high current and high reliability are essential for trouble-free operation of mission-critical equipment.
To learn more about our printed circuit board solutions visit http://www.epectec.com/pcb/
The document discusses industry standards and how they impact cable assembly designs. It defines various types of standards including materials-centric, product-centric, safety-centric, and customer-centric standards. It also discusses key standards organizations, different types of standards documents, and examples of performance and safety standards that are important for cable assemblies. The document aims to provide an overview of the many industry standards that must be considered in cable assembly design.
Medical Flex and Rigid-Flex circuit applications require that the design provides the utmost in reliability. Unique combinations of electrical requirements, mechanical bend requirements, and in some cases medical operating environments, require careful and thorough design review.
In this webinar we will cover how these requirements interact and what their impact on circuitry layout, materials, and the construction of the design are.
To learn more about our flex and rigid-flex solutions visit http://www.epectec.com/flex/
As you know, component shortages are impacting product lead times around the world. Advanced smart battery packs and chargers are no exception. Over recent years, electronic circuit functionality has been consolidated into smaller ICs that can manage a lot of functionality into small, easy-to-use single ICs. Unfortunately, these ICs are single-sourced ICs with lead times stretching beyond 80 weeks. These extremely long lead times can kill projects and companies.
In this webinar, we reviewed methods that we use to minimize or eliminate these single-sourced components used in battery pack manufacturing. Along with ways to layout circuit boards to allow component flexibility preventing redesigns, and methods to use firmware to reduce dependencies on sole-sourced parts.
For more information on our custom battery pack solutions, visit https://www.epectec.com/batteries.
This document discusses trends in the IC packaging industry and technology. It provides an overview of the market growth in IC packaging units and revenues. Key challenges for the industry are declining ASPs and increasing materials costs. Emerging technologies discussed include wafer-level packaging, 2.5D/3D IC with TSV, and integrated passives. The document outlines SPIL's packaging portfolio and roadmaps for 3D IC and TSV development over the next few years. It also summarizes SPIL's testing and certification capabilities.
This document discusses various advanced rigid-flex circuit board constructions that offer benefits over standard constructions. It describes options for odd layer counts, asymmetrical constructions, varying flex layer counts, integrated ZIF connections, blind and buried vias, air gap flex layers, multiple rigid area thicknesses, and shielded flex layers. These advanced constructions allow for higher levels of design integration, tighter bend radii, impedance control, and EMI shielding compared to standard constructions.
Our webinar on custom battery packs gives an insider look of the battery Development Timeline and Expectations. This walk through guide introduces you to the necessary steps that will get you from concept to production. A clear set of expectations is laid out to ensure there are no blind spots in our customers’ plan.
From a complex multi-layer board to a double sided surface mount design, our goal is to provide you a quality product that meets your requirements and is the most cost effective to manufacture. Our experience in IPC Class III standards, very stringent cleanliness requirements, heavy copper, and production tolerances allow us to provide our customers exactly what they need for their end product.
1. Unimicron is a leading substrate manufacturer that has expanded its product portfolio over time to include finer line designs and smaller bump pitches, posing new challenges for metrology.
2. 2D AOI is used to detect small "mouse bite" defects not found by electrical tests that could cause reliability issues, but it faces challenges discerning real defects from false alarms or similar features like oxidation.
3. As designs evolve to include finer lines and pitches, equipment vendors are expected to provide higher resolution 3D metrology tools that can directly assess defects without multiple scans to reduce false alarms, while also offering faster throughput and automated defect mapping.
In this Webinar, Epec will review primary design requirements that are best served by the utilization of flex or rigid-flex circuit boards within a given design. Additionally we will address the primary cost drivers that impact the per part cost.
To learn more information on our flex & rigid-flex circuit board solutions visit http://www.epectec.com/flex/.
This webinar is an introduction to Flex and Rigid–Flex Gerber layout design methods and requirements that differ from standard rigid board technology.
Prepare to review some of the unique elements of Flex and Rigid–Flex Gerber layout to ensure functionality and mechanically reliability that meets or exceeds the design requirements.
For more than 50 years, Epec has continued its tradition of perfection in engineering and manufacturing printed circuit boards for the most discerning customers. Our years of manufacturing experience provide us with a competitive edge when it comes to PCB layout and design. From a simple single sided board to a complex multi-layer, double sided surface mount design, our goal is to provide you a design that meets your requirements and is the most cost effective to manufacture.
There are many special features that are designed into the printed circuit board (PCB) that will increase the number of processing steps that it takes to complete the order. The combination of features can add additional cost to the raw PCB and increase the lead time to process.
When considering a PCB design and layout or redesign, it would be advantageous to consult with experts. Your printed circuit board supplier should have engineering resources to consult and review preliminary information and be able to assist with design suggestions.
In this webinar, we discuss multilayer features for printed circuit boards that add cost and processing time. We will also look at base costing materials, copper weights, common cost adders, plating finishes, processing, less common features, and more.
For more information on our custom PCB solutions, visit https://www.epectec.com/pcb.
Kokomo Operations of GM Components Holdings, LLCboilerfunk
Overview of world-class vertically integrated supplier of Contract Manufacturing and Electronic Manufacturing Services. Gives high-level overview of Semiconductors, Thick Film Printing and Electronic Assembly capability located at its Kokomo, Indiana facility.
Merix Corporation provides circuit board solutions for the defense and aerospace industries. They have multiple facilities certified to quality and reliability standards required for these markets. Merix focuses on advanced technology, engineering support, and quality management to deliver reliable boards for critical programs such as the B787 Dreamliner, Falcon III radio, and Rockwell Collins systems. Their goal is to grow defense and aerospace sales to over 25% of their business.
Merix Corporation provides circuit board solutions for the defense and aerospace industries. They have multiple facilities certified to quality and reliability standards required for these markets. Merix focuses on advanced technology, engineering support, and quality management to deliver reliable boards and differentiate their offerings for programs such as the B787 Dreamliner, Falcon III radio, and Rockwell Collins where they have been named supplier of the year. Their goal is to grow defense and aerospace sales to over 25% of their business.
Corporate brochure for Saturn Electronics Corporation featuring PCB Manufacturing Equipment, advanced technologies, IPC standards and industry certifications. PCB Buyer's Guide included for industry comparisons.
This document summarizes the products and services of a cable manufacturing company. The company produces raw cables, interconnect designs, and cable assemblies. It has capabilities in materials for harsh environments, mixed copper and fiber optic cabling, and custom solutions. The company provides design services including 3D modeling, PCB design, and value engineering. Example applications discussed include automotive consumer ports, telecom assemblies, and solar panel cable assemblies.
Discuss how to navigate in the Military RF Multi Chip Module (MCM) arena using commercial technology.
Discuss how to develop a successful strategy to
support typical Military Product Life Cycles
in conflict with Moore’s Law.
Discuss the Future of Microelectronics Technology
Gemtron technologies european presentation (2)DMacspain
Gemtron Technologies is an electronics manufacturing services company established in 1988 in Taiwan that provides cable assemblies, plastic molding, metal stamping, and OEM manufacturing services. The company aims to build long-term global partnerships through quality services and total solutions. It has locations in Taiwan, Hong Kong, USA, Japan, UK, China, and Hungary.
Technological Trends in the Field of Circuit Board Design and ManufacturingToradex
This document provides an overview of technological trends in circuit board design and manufacturing. It discusses how the circuit board market is dominated by Asia, with standard multilayer boards making up the largest share. Emerging technologies like HDI, rigid-flex boards, and embedded components are allowing for increased miniaturization and functionality. Key challenges include further reducing board thickness while maintaining performance. The document outlines several advanced manufacturing techniques and new substrate materials enabling these trends.
While many perceive high-tech PCBs as those with more layers, our aim is to outline the key areas that need to be understood when evaluating the capabilities of 2- and 4-layer PCB manufacturers. These versatile and cost-effective circuit boards can be as high-tech as their multi-layer counterparts, and our objective is to educate our audience as to what to look for to ensure that you get exactly what you are looking for.
Low Layer Count PCBs - Why They Are Not All Created Equal Because of changes in technology, 2- and 4-layer PCBs continue to be at the forefront of high-tech electronics manufacturing, design strategies, manufacturing requirements, and the future of PCB technology, showcasing how these compact boards can rise to any challenge.
In this webinar, we cover design strategies, manufacturing requirements, and the future of PCB technology, showcasing how these compact boards can rise to any challenge. We will also delve into the advantages and limitations of 2- and 4-layer PCBs, compare them to multi-layer boards, and discuss design tips to maximize their performance.
For more information on our printed circuit board solutions, visit https://www.epectec.com/pcb/.
Quick Circuits provides 24-hour turnaround for PCB manufacturing and assembly services. They have skilled staff and offer value pricing. Their facilities allow for prototype to medium volume production of high-density surface mount and conventional PCB assembly. They provide full procurement, inspection, testing and mechanical assembly services under one roof.
This document summarizes Nujay Technologies, Inc. as a premier partner for printed circuit boards (PCBs) and liquid crystal displays (LCDs) that offers customized, reliable, and affordable PCB solutions through its California headquarters and global supplier relationships. It provides PCB manufacturing capabilities including up to 52 layer rigid PCBs, flexible PCBs, rigid-flex PCBs, and high frequency PCBs to serve various market segments.
Pactron is an electronics manufacturing services provider that offers end-to-end design and manufacturing services. They have expertise in board-level design, engineering, and manufacturing. Pactron can compress time to market for customers through their integrated approach from design to manufacturing. They have experience serving industries such as semiconductor, medical devices, telecom, aerospace, and defense.
This document provides contact and product information for multiple electronics component suppliers. It lists websites and contact details for companies that supply items like keypads, membranes switches, capacitors, power supplies, fans, thermal management products, connectors, switches, EMI/RFI products, and industrial sensors. The document also provides multiple international contact locations.
This document provides an overview of Carlisle Interconnect Technologies' locations and product offerings. It lists various locations and contact people around the world, describing what each location focuses on in terms of manufacturing and products. It then summarizes some of Carlisle's key product lines, including contacts and connectors, RF and microwave cables, optical cables, wire and cable, power and grounding products, and integrated systems. The document emphasizes Carlisle's vertical integration and capabilities across the supply chain. It provides high-level descriptions of products and manufacturing processes to give the reader a sense of Carlisle's broad range of capabilities in the interconnect industry.
AMPTECH is an electronics manufacturing company with facilities in Free Soil, Michigan and Beaver Falls, Pennsylvania. It provides printed circuit board assembly and turnkey product development services. AMPTECH aims to exceed customer requirements through continuous improvement and has an experienced staff of over 130 employees. It prides itself on quality, certified processes, and commitment to customer satisfaction.
White paper on ESD protection for 40nm/28nmbart_keppens
40/28nm ESD approach
On-chip ESD protection clamps for advanced 40nm and 28nm CMOS technology
Despite the rising cost for IC development, EDA tools and mask sets semiconductor design companies continue to use the most advanced CMOS technology for high performance applications because benefits like lower power dissipation, increased gate density, higher speed and lower manufacturing cost per die more than compensate the higher cost.
This return on investment however only pays off for ultra high volume applications. Due to the use of sensitive elements (such as ultra thin-oxide transistors, ultra-shallow junctions, narrow and thin metal layers), increased complexity through multiple voltage domains and the use of IP blocks from various vendors, a comprehensive ESD protection strategy becomes more important.
This white paper presents on-chip ESD protection clamps and approaches for 40/28nm CMOS that provide competitive advantage by improved yield, reduced silicon footprint and enable advanced multimedia and wireless interfaces like HDMI, USB 3.0, SATA, WiFi, GPS and Bluetooth. The solutions are validated in tens of products running in foundry and proprietary fabrication plants.
2017 Cable USA Company Overview PresentationJeremy Shaffer
A manufacturer of high performance, custom engineered wire and cable products supporting the Industrial Manufacturing, Utility, Aerospace & Defense, Transit and Test & Measurement Markets.
In the dynamic landscape of energy storage, choosing the right battery pack is a critical decision that significantly impacts performance, efficiency, and overall product design. This webinar aims to unravel the complexities surrounding standard and custom battery packs (primarily lithium), providing you with a comprehensive understanding to make informed decisions.
We'll embark on a journey to explore the fundamental distinctions between standard off-the-shelf battery packs and their bespoke counterparts tailored to specific applications.
We will delve into the nuance of what is defined as a standard battery pack along with its benefits, limitations, and how it caters to broad market needs.
Simultaneously, we will dissect the world of custom battery packs, diving into the advantages they offer in terms of precise energy requirements, form factors, and unique design considerations.
Whether you are a product designer, engineer, or industry professional, this webinar is designed to equip you with the knowledge necessary to navigate the intricate terrain of battery pack selection. Join us for this webinar as we navigate through the intricacies of standard and custom battery packs, empowering you to make strategic decisions that align with your project goal.
For more information on our battery pack solutions, visit https://www.epectec.com/batteries/.
In today's technology-driven business, High-Speed Digital (HDI) has become more and more in demand. Bringing with it the demand for electrical and thermal performance, along with sequential lamination. To achieve this demand, the performance and reliability of the material have become much more important.
Tachyon-100G laminate materials are designed for very high-speed digital applications. Tachyon-100G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature range between -55°C and +125°C up to 100 GHz and have proven to pass 10x lamination cycles.
In this webinar, Isola Director of High-Performance Products Michael Gay presents Tachyon-100G, highlighting the product offering and properties, and focusing on key performance attributes, product comparison, electrical performance, lamination, and more.
For more information on our printed circuit board solutions, visit https://www.epectec.com/pcb/.
Flex and rigid-flex circuit boards have a number of design requirements that either differ or do not exist in rigid PCB designs. Because of this, we routinely see technical issues in data sets supplied by our customers that need to be either resolved, updated, or corrected.
Some items are easily addressed, some require input from the supplier while others require updates/changes to the data set by the customer.
Understanding these issues and root causes allows for improved and complete data sets which will streamline both the quoting and production engineering processes. Any additional communications to resolve the technical items will be minimized and or eliminated.
In this webinar, we cover the three most common areas we see in the supplied flex and rigid-flex PCB data sets, that lead to technical issues that need to be addressed.
For more information on our flex and rigid-flex PCB solutions, visit https://www.epectec.com/flex/.
Building a custom enclosure or handheld device comes with many design challenges. Adding components like power cords, buttons, and displays to your application can become a painstaking engineering task taking several design iterations.
However, a few wise choices early on in the project’s design stage can help all parties involved in the application’s development. A truly custom user interface design solutions can be brought to market quickly without a huge development budget.
In this webinar, we cover several design examples and industry best practices for integrating keypads and cable assemblies within an injection molded enclosure.
For more information on our custom cable solutions, visit https://www.epectec.com/batteries.
Why spend the time and money to develop and manufacture a custom lithium-ion battery pack when off-the-shelf battery packs are radially available? Custom battery packs can be designed to fit the unique needs of an end product’s size and shape, temperature, power, voltage, runtime, and interface requirements, which generic battery packs cannot meet.
Supply chain issues can be avoided with better control of all the components and “end-of-life” surprises prevented. Custom battery packs come with a host of design and manufacturing challenges. Each battery is unique and must be designed and fully tested for the intended application.
In addition, regulatory testing is mandatory to ensure that the new design can safely withstand environmental abuses expected and unexpected in the field.
For more information on our custom battery pack solutions, visit https://www.epectec.com/batteries.
Over the last several years, the technical complexity of printed circuit boards that we fabricate on a day-to-day basis has risen exponentially. Many companies embrace this complexity, but for customers, the overall financial risk increases dramatically.
Printed circuit boards are a complex product that requires many steps to produce, and all customer’s specifications are a little different. This requires a PCB fabricator to have a very clear process and understanding of how these requirements affect production.
In this webinar, we share with you how to better understand what each of the requirements means for you and the fabricator, how to ensure that you are getting exactly what you specified and how to protect your data from falling into the wrong hands.
For more information on our printed circuit board solutions, visit https://www.epectec.com/pcb/.
A standard requirement for all flexible and rigid-flex circuit board designs is that they all contain both electrical and mechanical requirements. The demands of each of these two distinct areas, when combined in a specific design, can create conflicts that may compromise it. A complete review of all the requirements, and how they interact, is part of the design process that ensures all performance requirements are met reliability.
In this webinar, we identify the specific technical items, for both electrical and mechanical portions, that can create design challenges or limitations and the methods used to resolve them.
For more information on our flex and rigid-flex PCB solutions, visit https://www.epectec.com/flex.
Custom multiconductor cable assemblies and wire harnesses are used in just about all electronic products in the world today. Ranging from UL-approved internal appliance wiring to highly flexible moisture-resistant extension cords, to household lamp cords, low-cost cabling options are available in a wide range of wire sizes, temperature limits, and voltage ratings.
Choosing the best wire type in terms of function, cost, and delivery can be overwhelming with the thousands of wire options available. But with a few design tips from an experienced manufacturing partner like Epec and the flexibility to specify off-brand UL-approved wire and connectors, our customers can get to market faster with less risk for countless types of custom cable assemblies.
In this webinar as we review common UL wire types and applications, form, fit, and function equivalency for wire and connectors, simplified documentation to get started, and more.
For more information on our custom cable assembly solutions, visit https://www.epectec.com/cable-assemblies.
CNC machining costs will always vary depending on many different factors, including the length of time required to complete the project, materials specified, as well as the type of machine used, such as 3- and 5-axis machines.
CNC machining is an integral part of many industries, getting the tools and parts you need with an accuracy that is difficult to achieve. Businesses are often looking for ways to trim their budgets; reducing CNC machining costs is no exception. If you are interested in CNC machining cost reduction, you need to understand the factors that impact the cost of CNC parts — machining time, start-up costs, material costs, and more.
In this webinar, we review some of the biggest factors that can affect your CNC machining costs and specific ways to help you reduce costs on your CNC machined parts.
For more information on our precision CNC machined parts, visit http://www.epectec.com/cnc-machining.
Epec Engineered Technologies is the ideal choice for an OEM seeking customized product solutions from a focused and agile partner having supported over 5,000 customers across all sectors of the electronics industry. By providing highly experienced technical resources, a proven manufacturing platform and the fastest delivery in the industry, we are able to provide cost effective and innovative solutions that deliver the highest reliability products to the market faster.
Flexible heaters are just that…heaters designed to be flexible enough to accommodate tight areas and intricate geometries that need heating properties. These highly-customized heaters are engineered specifically to meet your specific requirements. They’re thin, bendable, and can be designed using the most complex shapes, geometries, and curves to fit almost any type of application.
Historically, chemical fuses have been used to disable the battery in the event that the secondary safety becomes active. Many of these fuse manufactures do not support medical applications or their fuses are too small to use in very high-current applications.
This webinar will discuss using FETs in secondary protection applications, which have many advantages over using chemical fuses from multi sourcing to full medical application support, and potential to lower cost depending on the application.
Additionally exploring latching and non-latching applications and how to implement them and integrate them with popular safety circuits in wide use today.
For more information on our custom battery pack solutions visit http://www.epectec.com/ batteries/.
artificial intelligence and data science contents.pptxGauravCar
What is artificial intelligence? Artificial intelligence is the ability of a computer or computer-controlled robot to perform tasks that are commonly associated with the intellectual processes characteristic of humans, such as the ability to reason.
› ...
Artificial intelligence (AI) | Definitio
Software Engineering and Project Management - Introduction, Modeling Concepts...Prakhyath Rai
Introduction, Modeling Concepts and Class Modeling: What is Object orientation? What is OO development? OO Themes; Evidence for usefulness of OO development; OO modeling history. Modeling
as Design technique: Modeling, abstraction, The Three models. Class Modeling: Object and Class Concept, Link and associations concepts, Generalization and Inheritance, A sample class model, Navigation of class models, and UML diagrams
Building the Analysis Models: Requirement Analysis, Analysis Model Approaches, Data modeling Concepts, Object Oriented Analysis, Scenario-Based Modeling, Flow-Oriented Modeling, class Based Modeling, Creating a Behavioral Model.
Applications of artificial Intelligence in Mechanical Engineering.pdfAtif Razi
Historically, mechanical engineering has relied heavily on human expertise and empirical methods to solve complex problems. With the introduction of computer-aided design (CAD) and finite element analysis (FEA), the field took its first steps towards digitization. These tools allowed engineers to simulate and analyze mechanical systems with greater accuracy and efficiency. However, the sheer volume of data generated by modern engineering systems and the increasing complexity of these systems have necessitated more advanced analytical tools, paving the way for AI.
AI offers the capability to process vast amounts of data, identify patterns, and make predictions with a level of speed and accuracy unattainable by traditional methods. This has profound implications for mechanical engineering, enabling more efficient design processes, predictive maintenance strategies, and optimized manufacturing operations. AI-driven tools can learn from historical data, adapt to new information, and continuously improve their performance, making them invaluable in tackling the multifaceted challenges of modern mechanical engineering.
Embedded machine learning-based road conditions and driving behavior monitoringIJECEIAES
Car accident rates have increased in recent years, resulting in losses in human lives, properties, and other financial costs. An embedded machine learning-based system is developed to address this critical issue. The system can monitor road conditions, detect driving patterns, and identify aggressive driving behaviors. The system is based on neural networks trained on a comprehensive dataset of driving events, driving styles, and road conditions. The system effectively detects potential risks and helps mitigate the frequency and impact of accidents. The primary goal is to ensure the safety of drivers and vehicles. Collecting data involved gathering information on three key road events: normal street and normal drive, speed bumps, circular yellow speed bumps, and three aggressive driving actions: sudden start, sudden stop, and sudden entry. The gathered data is processed and analyzed using a machine learning system designed for limited power and memory devices. The developed system resulted in 91.9% accuracy, 93.6% precision, and 92% recall. The achieved inference time on an Arduino Nano 33 BLE Sense with a 32-bit CPU running at 64 MHz is 34 ms and requires 2.6 kB peak RAM and 139.9 kB program flash memory, making it suitable for resource-constrained embedded systems.
Comparative analysis between traditional aquaponics and reconstructed aquapon...bijceesjournal
The aquaponic system of planting is a method that does not require soil usage. It is a method that only needs water, fish, lava rocks (a substitute for soil), and plants. Aquaponic systems are sustainable and environmentally friendly. Its use not only helps to plant in small spaces but also helps reduce artificial chemical use and minimizes excess water use, as aquaponics consumes 90% less water than soil-based gardening. The study applied a descriptive and experimental design to assess and compare conventional and reconstructed aquaponic methods for reproducing tomatoes. The researchers created an observation checklist to determine the significant factors of the study. The study aims to determine the significant difference between traditional aquaponics and reconstructed aquaponics systems propagating tomatoes in terms of height, weight, girth, and number of fruits. The reconstructed aquaponics system’s higher growth yield results in a much more nourished crop than the traditional aquaponics system. It is superior in its number of fruits, height, weight, and girth measurement. Moreover, the reconstructed aquaponics system is proven to eliminate all the hindrances present in the traditional aquaponics system, which are overcrowding of fish, algae growth, pest problems, contaminated water, and dead fish.
Batteries -Introduction – Types of Batteries – discharging and charging of battery - characteristics of battery –battery rating- various tests on battery- – Primary battery: silver button cell- Secondary battery :Ni-Cd battery-modern battery: lithium ion battery-maintenance of batteries-choices of batteries for electric vehicle applications.
Fuel Cells: Introduction- importance and classification of fuel cells - description, principle, components, applications of fuel cells: H2-O2 fuel cell, alkaline fuel cell, molten carbonate fuel cell and direct methanol fuel cells.
Redefining brain tumor segmentation: a cutting-edge convolutional neural netw...IJECEIAES
Medical image analysis has witnessed significant advancements with deep learning techniques. In the domain of brain tumor segmentation, the ability to
precisely delineate tumor boundaries from magnetic resonance imaging (MRI)
scans holds profound implications for diagnosis. This study presents an ensemble convolutional neural network (CNN) with transfer learning, integrating
the state-of-the-art Deeplabv3+ architecture with the ResNet18 backbone. The
model is rigorously trained and evaluated, exhibiting remarkable performance
metrics, including an impressive global accuracy of 99.286%, a high-class accuracy of 82.191%, a mean intersection over union (IoU) of 79.900%, a weighted
IoU of 98.620%, and a Boundary F1 (BF) score of 83.303%. Notably, a detailed comparative analysis with existing methods showcases the superiority of
our proposed model. These findings underscore the model’s competence in precise brain tumor localization, underscoring its potential to revolutionize medical
image analysis and enhance healthcare outcomes. This research paves the way
for future exploration and optimization of advanced CNN models in medical
imaging, emphasizing addressing false positives and resource efficiency.
An improved modulation technique suitable for a three level flying capacitor ...IJECEIAES
This research paper introduces an innovative modulation technique for controlling a 3-level flying capacitor multilevel inverter (FCMLI), aiming to streamline the modulation process in contrast to conventional methods. The proposed
simplified modulation technique paves the way for more straightforward and
efficient control of multilevel inverters, enabling their widespread adoption and
integration into modern power electronic systems. Through the amalgamation of
sinusoidal pulse width modulation (SPWM) with a high-frequency square wave
pulse, this controlling technique attains energy equilibrium across the coupling
capacitor. The modulation scheme incorporates a simplified switching pattern
and a decreased count of voltage references, thereby simplifying the control
algorithm.
Rainfall intensity duration frequency curve statistical analysis and modeling...bijceesjournal
Using data from 41 years in Patna’ India’ the study’s goal is to analyze the trends of how often it rains on a weekly, seasonal, and annual basis (1981−2020). First, utilizing the intensity-duration-frequency (IDF) curve and the relationship by statistically analyzing rainfall’ the historical rainfall data set for Patna’ India’ during a 41 year period (1981−2020), was evaluated for its quality. Changes in the hydrologic cycle as a result of increased greenhouse gas emissions are expected to induce variations in the intensity, length, and frequency of precipitation events. One strategy to lessen vulnerability is to quantify probable changes and adapt to them. Techniques such as log-normal, normal, and Gumbel are used (EV-I). Distributions were created with durations of 1, 2, 3, 6, and 24 h and return times of 2, 5, 10, 25, and 100 years. There were also mathematical correlations discovered between rainfall and recurrence interval.
Findings: Based on findings, the Gumbel approach produced the highest intensity values, whereas the other approaches produced values that were close to each other. The data indicates that 461.9 mm of rain fell during the monsoon season’s 301st week. However, it was found that the 29th week had the greatest average rainfall, 92.6 mm. With 952.6 mm on average, the monsoon season saw the highest rainfall. Calculations revealed that the yearly rainfall averaged 1171.1 mm. Using Weibull’s method, the study was subsequently expanded to examine rainfall distribution at different recurrence intervals of 2, 5, 10, and 25 years. Rainfall and recurrence interval mathematical correlations were also developed. Further regression analysis revealed that short wave irrigation, wind direction, wind speed, pressure, relative humidity, and temperature all had a substantial influence on rainfall.
Originality and value: The results of the rainfall IDF curves can provide useful information to policymakers in making appropriate decisions in managing and minimizing floods in the study area.
Null Bangalore | Pentesters Approach to AWS IAMDivyanshu
#Abstract:
- Learn more about the real-world methods for auditing AWS IAM (Identity and Access Management) as a pentester. So let us proceed with a brief discussion of IAM as well as some typical misconfigurations and their potential exploits in order to reinforce the understanding of IAM security best practices.
- Gain actionable insights into AWS IAM policies and roles, using hands on approach.
#Prerequisites:
- Basic understanding of AWS services and architecture
- Familiarity with cloud security concepts
- Experience using the AWS Management Console or AWS CLI.
- For hands on lab create account on [killercoda.com](https://killercoda.com/cloudsecurity-scenario/)
# Scenario Covered:
- Basics of IAM in AWS
- Implementing IAM Policies with Least Privilege to Manage S3 Bucket
- Objective: Create an S3 bucket with least privilege IAM policy and validate access.
- Steps:
- Create S3 bucket.
- Attach least privilege policy to IAM user.
- Validate access.
- Exploiting IAM PassRole Misconfiguration
-Allows a user to pass a specific IAM role to an AWS service (ec2), typically used for service access delegation. Then exploit PassRole Misconfiguration granting unauthorized access to sensitive resources.
- Objective: Demonstrate how a PassRole misconfiguration can grant unauthorized access.
- Steps:
- Allow user to pass IAM role to EC2.
- Exploit misconfiguration for unauthorized access.
- Access sensitive resources.
- Exploiting IAM AssumeRole Misconfiguration with Overly Permissive Role
- An overly permissive IAM role configuration can lead to privilege escalation by creating a role with administrative privileges and allow a user to assume this role.
- Objective: Show how overly permissive IAM roles can lead to privilege escalation.
- Steps:
- Create role with administrative privileges.
- Allow user to assume the role.
- Perform administrative actions.
- Differentiation between PassRole vs AssumeRole
Try at [killercoda.com](https://killercoda.com/cloudsecurity-scenario/)
Electric vehicle and photovoltaic advanced roles in enhancing the financial p...IJECEIAES
Climate change's impact on the planet forced the United Nations and governments to promote green energies and electric transportation. The deployments of photovoltaic (PV) and electric vehicle (EV) systems gained stronger momentum due to their numerous advantages over fossil fuel types. The advantages go beyond sustainability to reach financial support and stability. The work in this paper introduces the hybrid system between PV and EV to support industrial and commercial plants. This paper covers the theoretical framework of the proposed hybrid system including the required equation to complete the cost analysis when PV and EV are present. In addition, the proposed design diagram which sets the priorities and requirements of the system is presented. The proposed approach allows setup to advance their power stability, especially during power outages. The presented information supports researchers and plant owners to complete the necessary analysis while promoting the deployment of clean energy. The result of a case study that represents a dairy milk farmer supports the theoretical works and highlights its advanced benefits to existing plants. The short return on investment of the proposed approach supports the paper's novelty approach for the sustainable electrical system. In addition, the proposed system allows for an isolated power setup without the need for a transmission line which enhances the safety of the electrical network
Design and optimization of ion propulsion dronebjmsejournal
Electric propulsion technology is widely used in many kinds of vehicles in recent years, and aircrafts are no exception. Technically, UAVs are electrically propelled but tend to produce a significant amount of noise and vibrations. Ion propulsion technology for drones is a potential solution to this problem. Ion propulsion technology is proven to be feasible in the earth’s atmosphere. The study presented in this article shows the design of EHD thrusters and power supply for ion propulsion drones along with performance optimization of high-voltage power supply for endurance in earth’s atmosphere.
1. Manufacturing That Eliminates Risk & Improves Reliability
Domestic PCB Capabilities
A History of Innovation…
10-28-2020
2. Manufacturing That Eliminates Risk & Improves Reliability
2
America's Oldest, a History of Innovation
Privately held company, established in 1952.
Estimated 2020 sales: US$60 million
210 employees worldwide
(177 – North America, 30 – Asia, 3 – Europe)
Design and manufacture customized, build-to-print,
performance-critical products for all sectors of the electronics
industry.
Leading provider of printed circuit boards, custom battery packs, energy efficient fans & motors,
cable assemblies, flex and rigid-flex PCB’s, RF/Microwave filter products, flexible heaters and high
reliability SMART user interfaces.
Integrated supply chain management solutions to handle the complexity of today’s global
marketplace while making sure that every order is being manufactured at the “right” factory.
3. Manufacturing That Eliminates Risk & Improves Reliability
3
Custom Battery Packs Flex & Rigid-Flex PCBs
High Reliability SMART
User Interfaces
Quick Turn – High Tech
Printed Circuit Boards
CNC Machining Printed Circuit Boards
Class III
Cable Assemblies
RF/Microwave Filter
Products
Our Manufactured in the USA Products
4. Manufacturing That Eliminates Risk & Improves Reliability
4
USA PCB Manufacturing Facility
Opened in 1984
Located in Irving, TX (Dallas)
ITAR Registered
46 Employees
45,000 Square Feet
ISO 9001:2015 Certified
Cage Code: 67370
5. Manufacturing That Eliminates Risk & Improves Reliability
5
PCB Capabilities
Up to 34 Layers
Compliant to MIL31032 and MIL55110, IPC
Class III
AS9100 - full reporting capabilities
Full Etch Back
ENIG, Hard Gold, HASL & ENEPIG
Z Axis Milling
Edge Plating
Micro BGA
Controlled Impedance to +/-5%
Via-In-Pad Technology
3/3 lines and spacing
Down to 2 mil dielectrics
Reverse Pulse Plating for high aspect ratio
X Ray fluorescence metallurgical analysis
Heat Sinks and Thermal Planes
LPI, Dry Film and Epoxy Soldermask
Selective Tin/Lead & Nickel Gold Plating
Up to 6 lamination cycles
Pneumatic via fill for Filled, Plugged & Stacked Vias
Mixed and Un-Balanced Copper Constructions
Cu & Aluminum Cores
Exposed Cavities and Air Gaps
6. Manufacturing That Eliminates Risk & Improves Reliability
6
Heavy Copper PCB’s
Epec is the industry leader in
building Heavy Copper PCBs up
to 20 oz. and EXTREME Copper
to 200 oz.
Heavy Copper Production Capabilities:
– Maximum Number of Layers = 50
– Laminate – FR-4 (All Tg Ranges), Teflon,
Ceramic, Polyimide
– Finished Thickness = 0.020" - 0.500"
– Minimum Soldermask Clearance – 6 mils
– Minimum Solderdam Width – 5.5 mils
– Hot Air Solder Leveling (HASL)
– Immersion Gold (ENIG) & Immersion Silver
– ITAR
– Blind & Buried Vias
– Minimum Drill Bit Hole Size = .012"
– Minimum Holes Size - 0.008" +0.005"/-0.008"
– Maximum Hole Aspect Ratio = 10:1
– Maximum Copper Weight = 200 oz.
– Controlled Impedance +/- 10%
– Minimum Silkscreen Line Width – 8 mils
– Multiple Copper Weights on the Outer Layers
7. Manufacturing That Eliminates Risk & Improves Reliability
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Significant Equipment Investment
Investing 10% of revenues in new equipment every year.
2 Lamination Presses 6 CNC Drill Machines
Laser Drill
Laser Direct Imaging
Planarizer Flying Probe ET Ink Jet Silk Screen AOI
9. Manufacturing That Eliminates Risk & Improves Reliability
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Domestic Flex & Rigid Flex
Over 30 years of design and manufacturing experience in high reliability applications that address
many design parameters.
Shielded Applications:
• EMI & RF
• Multiple options available
– Silver Ink
– Copper Layers
– EMI Shielding Films
10. Manufacturing That Eliminates Risk & Improves Reliability
10
Domestic Rigid-Flex Capabilities
Fine lines down to 50 microns (0.002”)
Minimum pitch 100 microns (0.004”)
Microvias to 100 microns (0.004”) for 2-layer flex
Precision mask registration
Eccobond
Adhesiveless or adhesive based laminate
– Dupont Kapton
– Panasonic
– TaiFlex
Thermal dissipative materials
Stiffeners – FR-4, Polyimide, Stainless Steel,
Aluminum
Maximum Panel Size – 24″ x 30″
Book Binders
11. Manufacturing That Eliminates Risk & Improves Reliability
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Our capabilities
Metal backed and metal core PCBs
CNC Tolerance Milling
– We own our own machine shop
Back drilling
Embedder Resistors
12. Manufacturing That Eliminates Risk & Improves Reliability
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Specialized Equipment
In order to properly manufacture mil/aero, flex/rigid-flex PCBs, and RF/Microwave
PCBs, significant investment in specialized equipment to meet the demanding
tolerances required in these applications, including:
– Laser Direct Imaging
– Plasma Etch
– Autoclave Lamination
– X-Ray Drill
– CNC/Optical Machining
– Laser Drilling
– High Speed Flying Probe Test
– X-Ray Inspection and Registration
– Genesis CAM System
13. Manufacturing That Eliminates Risk & Improves Reliability
13
Technical Assistance
Field Application Engineers Available 24/7 that can assist with:
– DFM Reviews
– Impedance Calculations
– DRC
– Test Coupon Design
– Laminate Selection
All the latest design tools from:
– Mentor Graphics
– Polar Instruments
– IGI
– Altium
– Orbotech
14. Manufacturing That Eliminates Risk & Improves Reliability
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Aerospace PCB Mfg. Footprint
Domestic PCB Manufacturing – Dallas, TX
Offshore PCB Manufacturing – China, Taiwan, Malaysia
All PCB manufacturing engineering done in the USA
Full ITAR data management capabilities including customer specific ShareFile
account access in order to transfer PCB data
Description Result
Overall Sales $60M
Military/Aerospace Business $21M (35%)
Domestic PCB Mfg. – Mil/Aero $12M
Off Shore PCB Mfg. - Mil/Aero $4M
AS9100 Shipments/Mo Average 40
Flex/Rigid Flex PCB $6M
16. Manufacturing That Eliminates Risk & Improves Reliability
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AS9100 Inspection Investment
InspectionXpert Software
Balloon your part drawings and extract the characteristics in one step.
Your tolerances are automatically applied, and the spec limits are
calculated.
Reduces time and cost to complete AS9100 reports and improves
accuracy
Import our CMM data into our project and have the measurement
results auto-assign to the corresponding feature. Then publish the
data directly to your inspection report.
17. Manufacturing That Eliminates Risk & Improves Reliability
17
Epec Quality Certifications
AS9100C Compliant
ISO 9001:2015
ITAR Registered: M27406
CAGE Code: 08817
IPC Level A Instructor In House
Full HALT/HASS and Environmental Testing In House
18. Manufacturing That Eliminates Risk & Improves Reliability
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Application Experience
BAE Systems - User Interface - On Board Handset
Boeing 777
HONEYWELL Aerospace - Backup Battery for a flight
Altimeter
Northrop Grumman - Extreme Copper PCB - Copper
Slugs imbedded in a PCB - Nuclear Rod Control
Board for Submarines
Cobham - User Interface - Helicopter Cockpit Control
Northrop Grumman - Mixed Extreme Copper PCB -
IED Detection System ASTAMIDS
Lockheed Martin - PCB's - Countermeasure systems
and submarine antenna systems
L3 - User Interfaces & PCB's - SATCOM Subsystems
Raytheon - PCB's - Communication Systems
Cobham Mission Systems - User Interface & PCB -
Battery Test Unit for Parachute Deployment in Cockpit
Pratt & Whitney – Flex PCB - Engine Harmonic
Sensor used during initial engine start up and test
Radiant Power – Rigid PCB – Flex PCB - Small craft
black box data recorder
Ametek Aerospace – PCB’s – Aircraft Cooling
Systems
PCB's & Flex - Applications Unknown
– Naval Surface Warfare
– NASA
– US Army Research Lab
– Jet Propulsion Labs
– SPAWAR
19. Manufacturing That Eliminates Risk & Improves Reliability
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PCB Delivery Services
STANDARD LEAD TIME - 20 Working Days
Technology 1 Day 2 Day 3 Day 5 Day 7 Day 10 Day
1 - 4 Layers x x x x x x
6 - 10 Layers x x x x
> 10 Layers x x x
* Both Prototype and Production Quantities
20. Manufacturing That Eliminates Risk & Improves Reliability
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Thank You
Check out our website at www.epectec.com.
For more information email sales@epectec.com.
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