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 DELIVERING QUALITY SINCE 1952.
Challenges in Designing Flex
Circuits for Medical Applications
08.26.16
2
Introduction
 Same High Density and Packaging Challenges as many
other industries.
 Higher Level of reliability requirements both in
performance and manufacturing / QC (IPC Class 3).
 Flex & Rigid – Flex advantages for medical applications:
– Higher density packaging capabilities
– Design reliability improvement opportunities
– Meets environment requirements
3
Agenda
 Design Reliability
 Design Flexibility
 Rigid – Flex Construction Requirements
 Bend Capabilities
 Manufacturing & QC Requirements
 Material Call Outs
 Environmental Requirements & Capabilities
4
 Integration:
– Reduced # of Interconnects Eliminates Points of Failure
Design Reliability
5
 Combination Signal Designs:
– Power distribution
– Controlled impedance
– Standard signals
 Distributed Functionality:
– Functionality can be more
readily distributed across
multiple rigid areas
Design Flexibility
6
 Bend Capabilities:
– Thinner materials / constructions allow for tighter bends with
reduced mechanical stresses.
 Shock & Vibration Performance:
– Reduced weight equals
improved performance.
Design Reliability
7
Design Flexibility
 Many Creative Routing Solutions:
– External flex jumpers
 Additional Shielding Options:
– Purpose designed shielding films
– Eliminates need for additional copper layers
8
Rigid – Flex Construction
 IPC 2223C Design Guide Recommended
Constructions:
– Adhesiveless Flex Core(s)
– Selective Coverlay Construction
(Flex areas only)
– Air Gap Constructions
(higher flex layer count applications)
– Pre-Preg Bonding Layers in Rigid areas
9
Rigid – Flex Construction
 6 layer Rigid with 2 Flex Layers Construction:
10
Rigid – Flex Construction
 6 Layer Rigid with 4 Layers Flex Air Gap Construction:
11
Bend Capabilities
 Static Bend Once to Fit Applications:
– Approx. 10 X the finished flex thickness
 Dynamic Flex Applications:
– Approx. 100 X finished flex thickness
12
Manufacturing & QC Requirements /
Material Callouts
 IPC 6013 Class 3:
– Increased Annular ring requirements
– Designed in at Gerber layout
– May vary depending upon part
design, part size and
manufacturing methods
 Material Callouts:
– Define per IPC material specifications
• E.G.: IPC 4202, 4203, 4204 etc.
• Example IPC 4202/11 = Adhesiveless Flex Core
13
Environmental Capabilities
 Sterilization And Cleaning Requirements:
– Suitable for Autoclaving processes
– Impervious to majority of acids, basics, solvents and gases
– Excellent resistance to UV and Radiation
– IR, if excessive, may require additional testing
14
Summary
 Medical applications have unique combinations of design
and reliability requirements.
 Flex and Rigid – Flex has proven to be an enabling
technology which allows for a wide variety of applications
at ever increasing technology levels.
 There is a large number of design, material and
construction options available that can that can facilitate
applications from simple disposable designs to high tech
diagnostic equipment.
 We invite you to submit any questions you may have and
thank you for attending our webinar today.
15
Our Products
Battery Packs Flex & Rigid-Flex PCB’s User Interfaces
Fans & Motors Cable Assemblies Printed Circuit Boards
16
Design Centers & Technical Support
 Battery Pack & Power Management – Denver, CO
 User Interfaces – Largo, FL
 Fans & Motors – New Bedford, MA & Wales, UK
 PCB’s – New Bedford, MA & Shenzhen, China
 Flex & Rigid Flex – Toronto, Canada
 Cable Assemblies – Largo, FL
 Our Engineering and Design teams are ready to help
our customers create world class and cost effective
product solutions.
17
Q&A
 Questions?
– Enter any questions you may have
in the Control Panel
– If we don’t have time to get to it, we
will reply via email
18
Thank You
Check out our previous webinars at www.epectec.com.
For more information email sales@epectec.com.
Stay Connected with Epec Engineered Technologies
Follow us on our social media sites for continuous technical updates and information:

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Challenges for Designing Flex Circuits for Medical Applications

  • 1.  DELIVERING QUALITY SINCE 1952. Challenges in Designing Flex Circuits for Medical Applications 08.26.16
  • 2. 2 Introduction  Same High Density and Packaging Challenges as many other industries.  Higher Level of reliability requirements both in performance and manufacturing / QC (IPC Class 3).  Flex & Rigid – Flex advantages for medical applications: – Higher density packaging capabilities – Design reliability improvement opportunities – Meets environment requirements
  • 3. 3 Agenda  Design Reliability  Design Flexibility  Rigid – Flex Construction Requirements  Bend Capabilities  Manufacturing & QC Requirements  Material Call Outs  Environmental Requirements & Capabilities
  • 4. 4  Integration: – Reduced # of Interconnects Eliminates Points of Failure Design Reliability
  • 5. 5  Combination Signal Designs: – Power distribution – Controlled impedance – Standard signals  Distributed Functionality: – Functionality can be more readily distributed across multiple rigid areas Design Flexibility
  • 6. 6  Bend Capabilities: – Thinner materials / constructions allow for tighter bends with reduced mechanical stresses.  Shock & Vibration Performance: – Reduced weight equals improved performance. Design Reliability
  • 7. 7 Design Flexibility  Many Creative Routing Solutions: – External flex jumpers  Additional Shielding Options: – Purpose designed shielding films – Eliminates need for additional copper layers
  • 8. 8 Rigid – Flex Construction  IPC 2223C Design Guide Recommended Constructions: – Adhesiveless Flex Core(s) – Selective Coverlay Construction (Flex areas only) – Air Gap Constructions (higher flex layer count applications) – Pre-Preg Bonding Layers in Rigid areas
  • 9. 9 Rigid – Flex Construction  6 layer Rigid with 2 Flex Layers Construction:
  • 10. 10 Rigid – Flex Construction  6 Layer Rigid with 4 Layers Flex Air Gap Construction:
  • 11. 11 Bend Capabilities  Static Bend Once to Fit Applications: – Approx. 10 X the finished flex thickness  Dynamic Flex Applications: – Approx. 100 X finished flex thickness
  • 12. 12 Manufacturing & QC Requirements / Material Callouts  IPC 6013 Class 3: – Increased Annular ring requirements – Designed in at Gerber layout – May vary depending upon part design, part size and manufacturing methods  Material Callouts: – Define per IPC material specifications • E.G.: IPC 4202, 4203, 4204 etc. • Example IPC 4202/11 = Adhesiveless Flex Core
  • 13. 13 Environmental Capabilities  Sterilization And Cleaning Requirements: – Suitable for Autoclaving processes – Impervious to majority of acids, basics, solvents and gases – Excellent resistance to UV and Radiation – IR, if excessive, may require additional testing
  • 14. 14 Summary  Medical applications have unique combinations of design and reliability requirements.  Flex and Rigid – Flex has proven to be an enabling technology which allows for a wide variety of applications at ever increasing technology levels.  There is a large number of design, material and construction options available that can that can facilitate applications from simple disposable designs to high tech diagnostic equipment.  We invite you to submit any questions you may have and thank you for attending our webinar today.
  • 15. 15 Our Products Battery Packs Flex & Rigid-Flex PCB’s User Interfaces Fans & Motors Cable Assemblies Printed Circuit Boards
  • 16. 16 Design Centers & Technical Support  Battery Pack & Power Management – Denver, CO  User Interfaces – Largo, FL  Fans & Motors – New Bedford, MA & Wales, UK  PCB’s – New Bedford, MA & Shenzhen, China  Flex & Rigid Flex – Toronto, Canada  Cable Assemblies – Largo, FL  Our Engineering and Design teams are ready to help our customers create world class and cost effective product solutions.
  • 17. 17 Q&A  Questions? – Enter any questions you may have in the Control Panel – If we don’t have time to get to it, we will reply via email
  • 18. 18 Thank You Check out our previous webinars at www.epectec.com. For more information email sales@epectec.com. Stay Connected with Epec Engineered Technologies Follow us on our social media sites for continuous technical updates and information: