The document provides an overview of PCB laminates, including essential components like core, pre-preg, and foil, alongside critical properties and types such as fr-4 and modified epoxy systems. It highlights the differences between lead and lead-free assemblies and categorizes PCB types based on layer count and performance specifications. Key considerations for material qualification and manufacturing challenges are also discussed, emphasizing the need for careful vendor and customer communications.

1. PCB Laminates
What you need to know!

2. What Is It?
Components
•Core
•Pre-Preg
•Foil
Vendor Datasheet
• Thickness
• Glass Weave

3. What Is It?
• Fiberglass Reinforced Epoxy

4. High Speed vs. Glass Weave

5. The “Players”
• USA
• Asia

6. The “Choices”
*Isola’s Product Ladder

7. The “Choices”
• FR-4 - Flame Retardant Class 4
• DICY Epoxy
• Modified DICY Epoxy
• Fillers
• Low Loss
• Halogen-Free
• Others
• PTFE, LCP, Polyamide, CEM

8. Properties
• Tg - Glass Transition Temperature
• Td - Decomposition Temperature
• CTE - Coefficient of Thermal Expansion
• Dk - Dielectric Constant
• Df - Dissipation Factor
• Moisture Absorption
• Flammability
• Anti-CAF - Conductive Anodic Filament

9. Physical Properties
• Glass Transition Temperature (Tg)

10. Physical Properties
• Decomposition Temperature (Td)

11. Physical Properties
• Effects of Multiple Lead-Free Cycles

12. Anti-CAF?

13. Lead-Free Failures

14. Electrical Properties
• Dielectric Constant (Dk)

15. Electrical Properties
• Dissipation Factor (Df)

16. Why Do We Care?
• Lead-Free Assembly
• Higher Layer Counts
• Smaller Feature Sizes
• Faster Edge Rates

17. How Do They Stack-Up?

18. PCB Categories
• Lead Assembly
• 2L Lead-Free Assembly
• ≥4L Lead-Free Assembly
• ≥4L Lead-Free Assembly (High Speed)
• RF (>2GHz)

19. Lead Assembly
• Traditional Epoxy System (/21)
• I.e. Nan Ya NP-140
• I.e. TLM TLM-140
• Meets Customer Tg≥135˚C Requirement
• Low Cost Materials (~0.8x)
• Easy to Manufacture

20. 2L Lead-Free Assembly
• Modified Epoxy System (/101 /121)
• I.e. Nan Ya NP-140M - NOT NP-140!
• I.e. TLM TLM-140(mt)
• Pb-Free Compatible Materials
• Low Risk for Z-Axis CTE Failures
• Low-Medium Cost Materials (~0.9x)
• Easy to Manufacture

21. ≥4L Lead-Free Assembly
• Modified & Filled Epoxy System (/99 /126)
• I.e. Nan Ya NP-175F - NOT NP-170!
• I.e. TLM TLM-170(t)
• Pb-Free Compatible Materials
• Anti-CAF
• Low CTE Z-Axis Expansion
• Medium Cost Materials (~1.0x)
• Difficult to Manufacture
• Routed NOT Punched!

22. High Speed & RF
• Modified & Filled Epoxy Systems (/29 /129)
• I.e. Isola FR408HR
• I.e. Nelco N4000-SI
• I.e. Panasonic Megtron4
• Same as ≥4L Lead-Free Assembly, But Lower Dk/
Df c/o Specialty Fillers
• Higher Cost Materials (~1.8x)
• Difficult to Manufacture
• Other Important Considerations

23. Discussion
• HATS Testing
• Define Qualified Materials in PCB Specification
• Specify as IPC-4101 Slash Sheet
• More Engineering Consideration
• USA vs. Asia Materials
• Vendor Portability
• Customer Communication
• Cost vs. Quality