There are many special features that are designed into the printed circuit board (PCB) that will increase the number of processing steps that it takes to complete the order. The combination of features can add additional cost to the raw PCB and increase the lead time to process. When considering a PCB design and layout or redesign, it would be advantageous to consult with experts. Your printed circuit board supplier should have engineering resources to consult and review preliminary information and be able to assist with design suggestions. In this webinar, we discuss multilayer features for printed circuit boards that add cost and processing time. We will also look at base costing materials, copper weights, common cost adders, plating finishes, processing, less common features, and more. For more information on our custom PCB solutions, visit https://www.epectec.com/pcb.

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Why High-Tech Multi-Layer PCB Features
Add Cost and Processing Time
5.20.22

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Agenda
 PCB base cost
 Common cost adders
 Specialty processing not as common
 Additional time needed for production
 Least common specialty process
cost and lead time
 Summary

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Base Pricing of a Printed Circuit Board

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The Base Cost
 What are the base cost considerations when costing a PCB?
– Layer count
– X,Y
– Material FR4
• Copper weight
– Thickness overall
– Classification – II, III, ITAR, domestic, military, or medical grade
– Surface finish
 If we have only the above information for the PCB, we can then
calculate a base cost.

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Common Cost Adders of a Printed Circuit Board

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Common Features That Add Cost
 From the base pricing, additional costs may be added to the unit price.
Depending on what those items are, the price can quickly increase.
– Copper wt. above 2oz, mixed
• 3oz, 4oz, 5oz are more standard
– Impedance
• Controlled dielectrics
– RoHS finishes
• ENIG, Immersion Silver, LF-HASL, OSP, Immersion Tin, Gold Tabs
– High-temperature material >130tg, 170tg, 180tg
– A specific brand or type of material
• Isola, Nelco, Nanya, Arlon, Rogers, Taconic, I-speed, Panasonic
– Specifying a brand will add cost

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Using IPC-4101 and 4103 Spec
 Not all fabricators support or stock every possible
laminate material.
 IPC-4101 and IPC-4103 standards specify various
requirements for PCB laminate materials that help
ensure interchangeability and compatibility in a
PCB stack-up.
 Specs contain 2 sets of data on a particular
material system: primary structural/material
properties and some testing results as determined
under IPC testing standards.
 Call out a slash number rather than a tradename
or brand on your fabrication drawing.

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There Are New Materials Available
 For RF/microwave
designs, there are new
materials that are:
– More available
– Cost less per panel
– Cost less to process
 Work with your
fabricator so that you
get the same
performance for less
overall cost.

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How is the Cost of a PCB Determined?
Base Cost from
Supplied Fabrication
Drawing
• LxW of PCB/array
• Thickness
• Layer count
• Material(s)
• Copper weight
• Surface finish
What else to look for?
• Impedance
• Specified
dielectrics
• Copper wt. >2oz
• High temp.
More …
• Blind/buried vias
• Stacked vias
• Via-in-pad
• Plated slots
• Gold tabs

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Printed Circuit Board Specialty Processing

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Plated Edges – Castellated Holes
 Hole/edge plating PCB edge
 Drill/rout as a primary process
 > 0.016”
– Drill & cleaning
– Plating
– Image
– Routing special requirements

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Milling & Excessive Routing
 Milling
– Time-consuming
– Cost
• Programming/engineering
• Control depth routing
• Additional processing

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Excessive Routing
 Excessive Routing
– Time-consuming
– Cost
• Materials
• Labor
• Engineering

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Counterbore – Countersink
 Counterbore – primary drilling, plating, secondary drilling
– Processing time
– Special tools  Not all sizes are available
– Setting and controls
 Countersink – primary drilling, plating or non-plated, secondary
– Processing
– Tools
– Settings and controls
 Back Drilling – primary drilling, secondary drilling
– In lieu of blind via processing
– Engineering – production time
– Danger of scrapping – high cost

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Counterbore – Countersink

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Back Drilling
 PCB Back Drilling
– Added drill time
• +0.010” min +0.020” typical
• 0.003” accuracy
– Engineering
– Scrap Risk
– Labor

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Cavity Boards
 Cavity Boards
– FR4 or POLYIMIDE
– Set up and processing
– Engineering
• Tolerance +- 0.005”
• Plug holes in cavity
• Holes 0.100” from cavity edge
– Labor

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Copper Plated Shut Vias
 Copper plated shut
– Price
– Processing equipment
– DC chemistry
– 0.006” - 0.012” single size
– 12:1< aspect ratio
– Time 15-18hrs
– Risk low
• Voids
• Air/gas
• Chemistry

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Blind Vias
 Blind via
– Top – bottom side to a
mid-layer
• Processing time –
engineering

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Buried Vias
 Buried via
– Mid-layer to mid-layer no
external connection
• Engineering – Processing

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Stacked Vias
 Stacked via
– Processed vias on top of
each other different entry
and exit layer
• Engineering –
processing stack-up
calculation
• Additional lamination
cycles

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Odd But Not Out
 Jump V-Score
– Cost and time
 Peelable Mask
– Time, shelf-life, low volume
 Combined Surface Treatments
– Gold contacts, tabs, or fingers
– Carbon ink
– ENEPIG

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Summary

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Summary
 PCB costing starts the same way with each unique design.
 All PCBs are a built-to-print product; because no two are exactly alike,
pricing can vary.
 Engineering and production review during the design and lay out
phase can improve on cost and lead time challenges.
 DFM is another option to help improve costing and material stack-up
challenges.
 Using a trusted supplier with an expansive capable supply chain
allows for the best cost, delivery, and quality product.

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Our Products
Battery Packs Flex & Rigid-Flex PCBs Cable Assemblies Printed Circuit Boards
CNC Machining User Interfaces Flexible Heaters EC Fans & Motors

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Q&A
 Questions?
– Enter any questions you may have
in the control panel
– If we don’t have time to get to it, we
will reply via email

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Thank You
Check out our website at www.epectec.com.
For more information email sales@epectec.com.
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