Epec Engineered Technologies, established in 1952, is a high-tech printed circuit board manufacturer that specializes in customized, build-to-print products for various electronics sectors. The company emphasizes manufacturing reliability through advanced technologies, certifications, and a robust supply chain, serving top global OEMs. Its comprehensive capabilities include high-density interconnect PCBs, heavy copper boards, and integrated inventory management solutions tailored to unique customer needs.

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 PCB Capabilities
High-Tech Printed Circuit Board Manufacturer
April 2017

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America's Oldest, A History of Innovation
 Privately held company, established in 1952.
 Estimated 2017: Sales: US$50 Million
 117 Employees Worldwide
(84 – North America, 30 – Asia, 3 – Europe)
 Design and manufacture customized, build-to-print,
performance-critical products for all sectors of the
electronics industry.
 Leading provider of custom battery packs, flex & rigid-flex PCBs, high reliability SMART
user interfaces, energy efficient fans & motors, cable assemblies, and printed circuit
boards.
 Integrated supply chain management solutions to handle the complexity of today’s
global marketplace while making sure that every order is being manufactured at the
“right” factory.

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Our Products
Custom Battery Packs Flex & Rigid-Flex PCB’s High Reliability SMART HMIs
Energy Efficient Fans & Motors Cable Assemblies Printed Circuit Boards

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Our Customers - The Top Global
OEMs In Growth Industries

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PCB Capabilities Summary
 Printed circuit boards have been in
our blood since 1952.
 Our PCB offering focuses on high mix –
medium/low volume customers who
require the highest level of technology
and service.
 Our experience and dedicated technical
resources ensure that our customers
get quality product on time.
Full Range of Products
Standard Technology
Typical parameters that we manufacture every day using our well
established and documented processes and procedures.
01
Advanced Technology
Requires significant investment in engineering time in order to
provide the significant technical advantage of these attributes.
02
RF & Hybrid PCB’s
Experience in the design and manufacture of PCB’s for
analog, digital and mixed signal applications.
03
Heavy/EXTREME Copper
PCB’s up to 20 oz and EXTREME Copper to 200 oz.
04
HDI PCBS
Containing blind and buried via’s often with microvia’s of .006” or less.
05

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Standard PCB Capabilities
 Up to 34 Layers
 Laminate – FR-4 (All Tg & Td Ranges), Teflon, Ceramic, Polyimide
 Finished Thickness Up to .478”
 Minimum Dielectric Spacing = .003”
 Via in Pad and Extreme Copper
 Immersion Gold, Gold Fingers, Full Body Gold, Bondable Gold
 Immersion Silver, Immersion Tin, Lead Free HAL, OSP, ENEPIG
 Minimum Lines & Spaces =.003”
 Blind & Buried Vias
 Maximum Panel Size = 24” x 36”
 Minimum Finished Hole Size = .005” +/- .003”
 HDI (Types I, II, III, IV)
 Maximum Hole Aspect Ratio = 25:1
 Maximum Copper Weight = 6 oz. (UL Approved)
 Laser Direct Imaging and Laser Drilling
 Controlled Impedance +/- 10%
 Conductive Filled Via’s and Back Drilled Vias

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Advanced Capabilities Full Etch Back
 Z Axis Milling
 Edge Plating
 Micro BGA
 Heat Sinks and Thermal Planes
 LPI, Dry Film and Epoxy Soldermask
 Selective Tin/Lead & Nickel Gold Plating
 Up to 6 lamination cycles
 Rogers Material in Stock
 Mixed and Un-Balanced Copper Constructions
 Cu & Aluminum Cores
 Exposed Cavities and Air Gaps
 Castellated Edges
 Counter Sinks/Counter Bores
 Standoff’s, Spacers & Pem Nuts Installed
 Aluminum Clad Boards

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High Technology Capabilities
 High tech PCB’s require careful attention to design parameters to
successfully yield reliable and robust boards and assemblies.
Micro Via’s using
Laser Drilling
Buried Via w/Via Fill

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RF, Hybrid & Advanced Technologies
 Hybrid construction
typically involve a low
loss material such as
Nelco or Rogers
combined with another
core material like FR-4
Advanced Technologies like filled and plugged via’s require
investment in specialized equipment such as:
• Vacuum and controlled pressure plugging equipment
• Alkaline Permanganate Desmear
• Advance Planarization Equipment
• Laser/X-Ray Guided Registration for Secondary Drilling
FR-4 & Rogers Mixed
Copper Hybrid

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Heavy/EXTREME Copper PCB’s
Epec is the industry leader in building
Heavy Copper PCB’s up to 20 oz and
EXTREME Copper to 200 oz.
 Maximum Number of Layers = 50
 Laminate – FR-4 (All Tg Ranges), Teflon, Ceramic,
Polyimide
 Finished Thickness = .020" - 1.500"
 Hot Air Solder Leveling (HASL)
 Immersion Gold (ENIG) & Immersion Silver
 ITAR, Military and AS9100
 Blind & Buried Vias
 Minimum Holes Size - .008" +.005"/-.008"
 Maximum Hole Aspect Ratio = 10:1
 Maximum Copper Weight = 200 oz.
 Controlled Impedance +/- 10%
 Copper forms up to 1” thick can be embedded into the
PCB laminate
Heavy Copper Production Capabilities
Check out our web site for heavy copper production minimums

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HDI – High Density Interconnect PCB
 HDI is a PCB with a higher wiring density per area, finer lines and space,
smaller vias and pads than conventional PCB’s.
 HDI Boards contain blind and/or buried vias and often contain microvias of
.006 or less in diameter.
 To produce HDI boards, investment in laser direct imaging, laser drilling
equipment, vacuum controlled pressure plugging equipment, alkaline
permanganate desmear, and advance Planarization equipment is a must.
HDI Production Capabilities
 Microvias & Plated Over Via’s
 Blind and Buried Via’s
 Sequential Lamination
 Via-In-Pad Technology
 3/3 lines and spacing
 Copper filled stacked microvia’s
 Up to 18 Layers
 Down to 2 mil dielectrics
 Tight Impedance Control

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Equipment Investment
 Laser Direct Imaging
– Tighter Impedance Control and No Film Growth due to heat expansion
– Layer to Layer Registration within .0004”
 Precision DES (Develop-Etch-Strip)
– 2 micron variation over the panel
– 1 mil core capacity for HDI and rigid flex
 Laser Drills
– 3:1 Aspect Ratio; .0014” hole with .004” Pad
 In Process X-Ray and Automated AOI (Optical Inspection)
 This equipment investments helps us get 97% yields on the most
demanding technology PCB’s.

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Certifications & Materials
CERTIFICATIONS
IPC-6012 Class II
IPC-6012 Class 3 (Military)
IPC-6012 Class 3 (Hi-Rel)
MIL-PRF-55110
MIL-PRF-31032/1
MIL-PRF-50884
MIL-PRF-31032/2
IPC-6013 (Flex, R-Flex)
IPC-6016 (HDI/Micro-Via)
IPC-6018 (RF)
NADCAP Certified
AS9100
IPC-1752 Materials Declaration
Capable
MATERIALS
Isola
370HR
Sheng Yi
ITEQ
Polyimide
Getek
Rogers
Taconic
Nelco
Arlon
Panasonic
Matsushita
DuPont
TaiFlex

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Design Centers & Technical Support
 Battery Pack & Power Management – Denver, CO
 SMART User Interfaces – Largo, FL
 Fans & Motors – Wales, UK
 Printed Circuit Boards – New Bedford, MA & Shenzhen, China
 Flex & Rigid Flex – Toronto, Canada
 Cable Assemblies – Largo, FL
 Our Engineering and Design teams are ready to help our
customers create world class and cost effective product
solutions.

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Inventory Management
 Customer requirements are always unique and customized, therefore our
inventory management system must accommodate for this type of
environment.
 Our Solutions Include:
– Kanban
– Consignment
– JIT Programs
– Blanket Orders
– Customer Fulfillment
– Bonded Warehousing
– Kitting
– Safety Stock
– Other Flexible Solutions

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The Difference is Measureable
01
WORLD CLASS DESIGNS
With industry leading technical resources for all of our product groups, our design and engineering group
works with customers to help minimize unit production costs of finished products, reduce project risks,
and speed time to market.
02
QUICKER DELIVERY
Epec's technology infrastructure and people, including the Asian and US based operations,
manufacturing, quality and engineering teams, enable jobs to get started the same day the order is
received with no delays due to 24/7 coverage.
03
BETTER QUALITY
Epec ensures higher levels of quality through actual investment in all of our processes. Whether it is our
10+ people strong quality organization in Asia, equipping our tech centers with the latest tech gear, or our
A3 improvement auditing process, real investment is made to ensure quality.
04
FLEXIBILITY
Each of our manufacturing facilities have been selected for their best-in-class niche product, delivery
and technology solutions, ensuring our optimal facility is building every order.

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Thank You
Check out our website at www.epectec.com.
For more information email sales@epectec.com.
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