In this Webinar, Epec will review primary design requirements that are best served by the utilization of flex or rigid-flex circuit boards within a given design. Additionally we will address the primary cost drivers that impact the per part cost. To learn more information on our flex & rigid-flex circuit board solutions visit http://www.epectec.com/flex/.

1.  DELIVERING QUALITY SINCE 1952.
Flex & Rigid Flex PCB’s:
Applications & Cost Drivers
08/28/2015

2. 2
Flex & Rigid Flex Applications
 Flex & Rigid Flex Applications:
– Present in every market segment:
• Medical
• Avionics
• Instrumentation
• Industrial Controls and Sensors
• Automotive
• Wearable Devices
• Military
• Etc.
– Applications cover both:
• Static: Bend once to fit
• Dynamic: Up to infinite number of bends

3. 3
Flex & Rigid Flex Applications
Laser Gun Sights
High Speed Communication Interconnects
Night Vision Goggles
Hearing Aids
Defibrillators
Portable CT Scanner
XRF Analyzer

4. 4
Flex & Rigid Flex Applications
 Primary Factors:
1. Packaging Requirement (#1)
2. Reliability Improvement (#2)
– Accounts for 80%+ of all applications.
– Capabilities beyond alternate solutions:
• Cable harnesses
• Discrete wires
• Mating connectors
– Alternate interconnect solutions, that meet your design
requirements, may provide cost savings but will not achieve as
high a packaging, reliability or performance level.

5. 5
Flex & Rigid Flex Applications:
Packaging
 Size Reduction:
– Occupies down to 10% the “space” of alternate solutions.
– Circuit density capability of Rigid PCBs.
– Tighter bend capabilities than wires / cables.
– Reduced rigid board space requirements
– Reduced enclosure dimension
opportunities
 Weight Reduction:
– Down to 10% of alternate solutions
– Improved Shock & Vibration
performance

6. 6
Flex & Rigid Flex Applications:
Packaging
 Added Functionality:
– Increased number of available interconnects between rigid areas
 Component Reduction:
– Connectors:
• Rigid – Flex constructions eliminate connectors completely
• ZIF Connectors:
– One part connector system.
– Flex circuit direct plug in with mating connector
• Lap Joint Direct Solder
– Flex Soldered directly to PCB
– Components:
• Higher level of design integration
may allow for reduced component
requirements.

7. 7
Flex & Rigid Flex Applications:
Reliability
 Point of Failure Reduction:
– Reduced number of interconnects required:
• Connector solder joints
• Mating connector interfaces
• Wire / Cable crimp connections
 Improved Shock & Vibration Performance
– Reduced weight
– Reduced number of interconnects

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Flex & Rigid Flex Applications:
Additional Items
 High Speed Signal Integrity:
– Exceptional performance over a wide range of requirements
• Lower material DK values
• Tightly controlled and uniform material thicknesses
• Homogenous flex core construction
 Improved Heat Dissipation:
– Thinner materials and constructions
– Greater surface area to volume ratios
 Assembly Cost Reduction:
– Fewer assembly steps
 Assembly Errors Reduction:
– “One way only” assembly

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Flex & Rigid Flex Cost Drivers:
Part Size
 Production Panel Manufacturing Process:
– Multiple individual parts arranged within a larger format production
panel (Same as traditional rigid boards)
– Applies to Roll to Roll manufacturing
 Material Quantity Requirements:
– Number of panels required to yield required number of parts.
– Higher quantity of parts per panel reduces total material
requirements and lowers per unit cost
 Design Configuration:
– Excessive levels of integration may lead to large part
configurations
 Part Length:
– May not match “well” with available production panel sizes

10. 10
Flex & Rigid Flex Cost Factors:
Part Shape
 Design Configuration:
– Technology allows for many unique configurations and shapes.
– Part shape / size combination may limit ability to “nest” parts within
a production panel decreasing material utilization:
• Circular or U shapes with empty center sections
• Non-rectangular configurations with unique angles and or extensions

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Flex & Rigid Flex Cost Factors:
Manufacturing Process
 Manufacturing Process Requirements:
– May dictate specific part orientations thus reducing parts per panel
• Rigid or rigidized areas to
flex areas relationship
• Stiffeners
• PSAs (Double Sided Adhesives)
• Breakaway tabs
– assembly arrays

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Flex & Rigid Flex Cost Factors:
Layer Count & Construction
 Flex Layer Count:
– Additional more costly materials
– Added Flex layer lamination process(s)

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Flex & Rigid Flex Cost Factors:
Layer Count & Construction
 Flex Layer Count (continued)

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Flex & Rigid Flex Cost Factors:
Layer Count & Construction
 Flex Layer Configuration:
– Air Gap Vs Single Stack Construction
• Added Coverlay materials & Coverlay lamination process for each flex
layer pair

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Flex & Rigid Flex Cost Factors:
Technology Requirements:
 Blind & Buried Vias:
– Added drilling, plating and lamination cycle(s)
– May also require more costly materials
 Via Fill:
– Required for Via in Pad component & fine pitch BGA applications
 Flex Only Area Plated Holes:
– Added drilling & plating cycle(s)
• Sequential build process
 Flex Area Stiffeners:
• Added material(s)
• Added lamination cycle(s)
 Epoxy Strain Reliefs:
– Applied to rigid to flex transitions if required

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Summary
 Applications:
– Wide variety of applications throughout all market segments
– Applications driven by packaging and reliability requirements which
alternate solutions cannot support.
 Cost Drivers:
– Multiple factors create a variety of combinations which impact the
final part cost.
 Your supplier can assist and support in the following areas to ensure
the highest degree of project success:
– Application Review
– Design Requirements
– Cost factors.

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Our Products
Battery Packs Flex & Rigid-Flex PCB’s User Interfaces
Fans & Motors Cable Assemblies Printed Circuit Boards

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Design Centers & Technical Support
 Battery Pack & Power Management – Denver, CO
 User Interfaces – Largo, FL
 Fans & Motors – Wales, UK
 PCB’s – New Bedford, MA & Shenzhen, China
 Flex & Rigid Flex – Toronto, Canada
 Cable Assemblies – New Bedford, MA
 Our Engineering and Design teams are ready to help
our customers create world class and cost effective
product solutions.

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Q&A
 Questions?
– Enter any questions you may have
in the Control Panel
– If we don’t have time to get to it, we
will reply via email

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Thank You
Check out our previous webinars at www.epectec.com.
For more information email sales@epectec.com.
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