In today's technology-driven business, High-Speed Digital (HDI) has become more and more in demand. Bringing with it the demand for electrical and thermal performance, along with sequential lamination. To achieve this demand, the performance and reliability of the material have become much more important. Tachyon-100G laminate materials are designed for very high-speed digital applications. Tachyon-100G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature range between -55°C and +125°C up to 100 GHz and have proven to pass 10x lamination cycles. In this webinar, Isola Director of High-Performance Products Michael Gay presents Tachyon-100G, highlighting the product offering and properties, and focusing on key performance attributes, product comparison, electrical performance, lamination, and more. For more information on our printed circuit board solutions, visit https://www.epectec.com/pcb/.

1. Tachyon® 100G
Ultra-low Loss, Lead-free Materials for
High-speed Digital & RF/MW Applications
April 2024

2. A Little About Us
We’ve spent more than a century creating robust,
tested and proven products that serve as the very
foundation upon which the electronics we count on in
our daily lives are built. It all starts with us, and we take
that responsibility seriously.
Our Commitment to Quality:
Electrical performance that remains consistent
across each and every lot of material we
produce.
Performance levels that are steady over the long
haul.
How our products stand up to your specific
requirements and needs.
2
How easy it is to work with our materials in your
processes.
Process ability
Consistency
Long-term reliability Specific applications

3. Product Profile
I-Speed® (RF Tuned)
Dk 3.44 Df 0.0060
Tg 180°C Td 360°C
IS400
Dk 3.90 Df 0.022
Tg 150°C Td 330°C
370HR
Dk 4.04 Df 0.021
Tg 180°C Td 340°C
185HR
Dk 4.01 Df 0.020
Tg 180°C Td 340°C
FR408HR
Dk 3.68 Df 0.0092
Tg 190°C Td 360°C
I-Tera® MT40
Dk 3.45 Df 0.0031
Tg 200°C Td 360°C
IS580G
Dk 3.80 Df 0.0060
Tg 195°C Td 385°C
I-Speed®
Dk 3.64 Df 0.0060
Tg 180°C Td 360°C
Astra® MT77
Dk 3.0 Df 0.0017
Tg 200°C Td 360°C
Tachyon® 100G
Dk 3.02 Df 0.0021
Tg 200°C Td 360°C
FR406N
Dk 4.3 Df 0.025
Tg 170°C Td 300°C
P25N
Dk 3.67 Df 0.0187
Tg 250°C Td 383°C
P95/P25
Dk 3.76 Df 0.017
Tg 260°C Td 416°C
P96/P26
Dk 3.76 Df 0.017
Tg 260°C Td 396°C
Specialty Products
No Flow High Temperature
I-Tera® MT40 (RF/MW)
Dk 3.38 - 3.75 Df 0.0028 - 0.0035
Tg 200°C Td 360°C
TerraGreen® 400G (RF/MW)
Dk 3.08 Df 0.0018
Tg 210°C Td 400°C
TerraGreen® 400G
Dk 3.05 Df 0.0018
Tg 210°C Td 400°C
IS580G (RF Tuned)
Dk 3.53 Df 0.0060
Tg 195°C Td 385°C
IS550H
Dk 4.43 Df 0.016
Tg 200°C Td 400°C
NEW
NEW
NEW
NEW
NEW
Coming Soon

4. a
a a
Tachyon 100G - Common Applications by Market
Wired Telecom & Computing
High Speed Digital
Wireless Telecommunications
RF/Microwave
Automotive
High Reliability & V2X
Mid and Back Planes
Line Cards
PCIe 5 & 6 Servers
AI Servers
AI Computing
High Speed Switches
High End Routers
Video Collaboration Systems
MIMO Antennae Systems
RRU - Remote Radio Unit
BBU - Baseband Unit
AAU – Active Antenna Unit
Phased Arrays
Satellite Communication Systems
Military Communications &
Infrastructure
Electric (EV) & Hybrid Electric (HEV)
Vehicle electronics
V2X – Vehicle to Everything - People,
Infrastructure, Vehicle, Network
Control Systems
Short and Long Range Radar Systems
LIDAR systems
In Cabin Sensor Systems
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5. Product Offering and Properties Summary
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Tachyon® 100G

6. TACHYON 100G PRODUCT OFFERING
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Laminate constructions from 0.002” to 0.020”
Optimized constructions for excellent lead-free assembly
performance and thickness control
Low Dk glass is standard
Significantly improves SI performance
High Performance Copper – reduces conductor losses
Standard HVLP (VLP2) ≥2.5 µm
Advanced RTF ≥2.3 µm
HVLP3 (VLP1) ≥1.0 µm
Square weave, mechanically spread glass
Glass Offerings: 1035, 1078, 1067, 1086 & 3313
Reduces ‘Fiber Weave Effect’ mitigates skew and micro-Dk effect
Improves CAF performance
UL Approvals: 130 MOT & 94 V-0

7. Tachyon® 100G Key Product Performance Attributes
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Ultra low loss Df ≈ 0.0021, Very low Dk ≈ 3.02
For 40+ Gb/s backplane and line card designs
High Speed Digital 56G PAM4 applications and beyond
High Tg: 200°C & Td: 360°C
Thermally robust for fine pitch applications
HDI capability to 10x sequential lamination
Ease of Processing
Use FR-4 process equipment
Hybrid stack ups with 185HR, 370HR, IS415, FR408HR, I-Speed®, I-
Tera®MT40 and Astra®MT77
Prepreg Storage – No special refrigeration required
Standard FR-4 storage with tacky free surface
High RC% prepregs for heavy copper applications – no high pressure
Consistent thickness control across the panel

8. Tachyon® 100G Key Product Performance Attributes
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Excellent CAF Performance
Passes MRT7 16 and 20 mil HW-HW spacing
Solid thermal cycling performance
Passes D-Coupon 4+N+4 stack up – Stacked & staggered over
Buried (Customer tested up to 9x)
Excellent thermal stability during PCB fabrication
Short press cycle to reduce cost – 60-80 minutes @ 200°C
Survives multiple lamination cycles for HDI / µVia designs
Combined press cycle with FR-4 materials
Superior drill performance
Increased tool life for reduced processing cost
Consistent quality of mechanically drilled PTH and laser defined
µvias significantly reduces via defects
Plasma desmear is not required on low aspect ratio designs

9. 9
Tachyon 100G Where it is Made?
Chandler Az Huizhou China
Tachyon 100G
Pressing Only
Tachyon 100G
Future Treating
and Pressing
~2025
Tachyon 100G
Treating and
Pressing
NA
Tachyon 100G
Pressing Only
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3
1 2
Headquarters
Sales
6
8
5
4
Tachyon 100G
Treating and
Pressing
Manufacturing
Research &
Development
1. Chandler, AZ
2. Ridgeway. SC
3. Düren, DE 4. Singapore
5. Hong Kong
6. Huizhou, CN
7. Suzhou, CN
8. Taoyuan City, TW
9.
Düren Germany
Ridgeway SC Suzhou China
Taoyuan Taiwan

10. Competitive Product Comparison
10
Tachyon® 100G

11. HSD Laminate Comparison
Property Units Megtron 6G Megtron 7N Meteorwave 4000 Tachyon®
100G
Tg °C °C 185 200 250 215
Td @ 5 % wt loss °C 410 400 390 360
CTE z-axis ( α1/α2) ) ppm/°C 45/260 42/280 55/260 45/250
CTE x-y axis pre-Tg ppm/°C 14/16 14/16 10/14 12/13
T-260 ( TMA ) minutes >120 >120 >120 > 60
T-288 ( TMA ) minutes >120 >120 >120 > 60
Dk @ 2 GHz - 3.46 - 3.71 3.18 – 3.37 3.5 3.02 - 3.25
Dk @ 10 GHz - 3.38 - 3.64 3.16 – 3.35 3.5 3.02 - 3.25
Df @ 2 GHz - 0.002 0.002 0.0032 0.0018 - 0.0025
Df @ 10 GHz - 0.004 0.002 0.0028 0.0018 – 0.0025
Elelctrical Strength volts/mil - - 1100
Peel Strength lb/in 4.5 (HVLP) 4.5 (HVLP) 5.5(HVLP) 4.0 (HVLP)
Flammability - V-0 V-0 V-0 V-0
Moisture Absorption % 0.14 0.06 0.12 0.016
Slash Sheets IPC 4101 Rev E IPC 4101 IPC 4101 IPC 4101 IPC 4101/4103
/102 /102 - /102, /17
Thermal test data is based on rigid core material
Dk Df data by Bereskin Stripline Test Method
Data sheets provide generic information – basic comparison
11

12. HSD Substitution using Tachyon 100G
Megtron 6G
Megtron 7N
Meteorwave 4000
Tachyon 100G better than Very Low Loss Performance
Dielectric Constant Range - 3.02 to 3.25 Lower Dk
Dissipation Factor Range – 0.0018 – 0.0025 Much Lower Df
HVLP (VLP2) - 2 µm copper reduces conductor loss
Same Ultra Low Loss performance level
Same available construction options – 1035, 1067 and 1078
Availability of lower loss ARTF and HVLP3 (VLP-1) copper foil to
match competitive products
Global availability – US, Europe, Asia
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13. RF/MW Laminate Comparison
Property Units RO4350B RO4003C RO3003 Tachyon®
100G
Tg °C °C >280 >280 - 200
Td @ 5 % wt loss °C - - - 360
CTE z-axis ( 50 to 260 C ) % 50 46 2.90
CTE x-y axis pre-Tg ppm/°C 14/16 11/14 - 12/13
T-260 ( TMA ) minutes - - - > 60
T-288 ( TMA ) minutes - - - > 60
Dk @ 2 GHz - 3.48 3.38 3.0 3.02 - 3.25
Dk @ 10 GHz - 3.48 3.38 3.0 3.02 - 3.25
Df @ 2 GHz - 0.0037 0.0027 0.0013 0.0018 - 0.0025
Df @ 10 GHz - 0.0031 0.0021 0.0013 0.0018 – 0.0025
Elelctrical Strength volts/mil 780 780 1100
Peel Strength - after Thermal Stress lb/in 5.0 (1 oz HTE) 6.0 (1 oz HTE) 17.6 (1 oz HTE) 4.0 (1 oz HVLP)
Flammability - V-0 NA V-0 V-0
Moisture Absorption % 0.04 0.04 - 0.016
Slash Sheets IPC 4101 Rev E IPC 4103 IPC 4103 IPC 4103 IPC 4103
/11 /10 /102, /17
Thermal test data is based on rigid core material
Dk Df data by Bereskin Stripline Test Method
Data sheets provide generic information – basic comparison
13

14. RF/MW Substitution using Tachyon 100G
RO4350B 3.45 Dk
RO4003C 3.38 Dk
RO3003 3.0 Dk
Tachyon 100G Flexibility
Dielectric Constant Range - 3.02 to 3.25 Lower Dk
Dissipation Factor Range – 0.0018 – 0.0025 Lower Df
Wider range of CCL thickness 2 - 20 mils
Full compliment of same resin system prepregs
HVLP (VLP2) - 2 µm copper reduces conductor loss
Ease of Processing using FR-4 equipment. No special processing
Ease of Hybrid Stackups with FR-4 – similar x-y CTE performance
Global Availability – US, Europe, Asia
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15. Electrical Performance
15
Tachyon® 100G

16. DELTA L STACK UP & SECTION EXAMPLES
Layer Cu Weight
Thickness
(mil)
Copper
Remain
Glass Fiber
Style
Solder Mask 0.5
L1 (sigs) 0.5 oz. plated 1.9 >80% Microstrip
Prepreg 3.3 1x 1078 70.5%
L2 GND/PWR 1.0 oz. 1.2 >90%
Core 4 1x 3313 59.5%
L3 (sigs) 1.0 oz. 1.2 >80% Stripline
Prepreg 4.1 1x 3313 66.5%
L4 GND/PWR 1.0 oz. 4.6 >90%
Core 5 2x 1078 62.0%
L5 (sigs) 1.0 oz. 1.2 >80% Stripline
Prepreg 5.6 2x 1078 67.5%
L6 GND/PWR 1.0 oz. 1.2 >90%
Core 12 3x 3313 59.5%
L7 (sigs) 1.0 oz. 1.2 >90%
Prepreg 5.6 2x 1078 67.5%
L8 GND/PWR 1.0 oz. 1.2 >80% Stripline
Core 5 2x1078 62.0%
L9 GND/PWR 1.0 oz. 1.2 >90%
Prepreg 4.6 1x 3313 66.5%
L10 (sigs) 1.0 oz. 1.2 >80%
Core 4 1x 3313 59.5%
L11 (GND) 1.0 oz. 1.2 >90%
Prepreg 3.3 1x 1078 70.5%
L12 (sigs) 1.0 oz. 1.2 >80%
Solder Mask 0.5
Thickness 76
HTE Outer Copper
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17. Tachyon 100G Delta L Test Results using VLP2 Copper foil
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18. Materials SI Performance Characterization
TPCA - Intel Delta L Comparison
of Ultra Low Loss Materials
Panasonic Megtron 6G & 7N
Multiple PCB Fabricators
Multiple PCB’s measured
Impedance Range: 85 Ohms +/-10%
Layer 1: HTE Copper Foil
Stack up: 12 Layer
Testing Metrology: Delta L
Average of three samples per PCB
fabricator
Virtually
identical
performance
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19. Tachyon 100G – Loss (dB/in) 14 GHz and 28 GHz
Layer 3 Horizontal SE
Layer 3 Horizontal Diff
Isola 8 Layer Delta L SITV
Single Ended - 14.0 and 0.6 inch traces
Differential Traces - 10.4 and 2.0 inch traces
Manufacturer: Anritsu Model: MS4647B
Tested range: 100 MHz to 40 GHz
Cable Type: Coaxial K
Copper #1
Copper #2
Copper #1
Copper #2
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20. Difference in Loss: Compared to current base copper foil
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21. HDI & Sequential Lamination Summary
21
Tachyon® 100G

22. RESULTS SUMMARY – 10x BUILD UP SIMULATION
No degradation found on any thermal or electrical parameter that was measured
All thermal measurements were within expected range
All electrical properties were within expected range
Oxide bond was not degraded
Tachyon 100G resin system is very stable under repeated lamination cycles
22

23. HDI OM THERMAL CYCLING TEST
96 mils 4+10+4 Stack up
4 lamination cycles
IPC-2221B D-Type Coupon
Air to Air Method – 6 cycles to pass
24 cycles 35 to 230°C
23 Fabrication courtesy of TTM Anaheim Division

24. REFLOW STATISTICS
Initial room temperature resistances
greater than 15 ohms are “open”
Reference resistances greater than 3
times their initial room temperature
resistance are “open”
Reference resistances are based on
cycle 1 at high temperature
Cells highlighted in red indicate failures
Cells indicated in blue indicate
suspensions
No failures found
24

25. TEST SUMMARY
No degradation found on any thermal or electrical parameter
that was measured
All thermal measurements were within expected range
All electrical properties were within expected range
Oxide bond was not degraded
Tachyon 100G resin system is very stable under
Repeated lamination cycles
Extended OM and IST thermal cycling tests
Consistent, good overall performance compared to peer
products
25 Fabrication courtesy of TTM Anaheim Division

26. MRT Test Vehicle Summary
26
Tachyon® 100G

27. MRT TEST VEHICLE & STACK UP
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28. • Low overall z-CTE and expansion with copper
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TACHYON 100G PCB TEST DATA
• Results surpassed expectations

29. TACHYON® 100G HRC 0.8 MM ATC & IST COUPONS
After 6x Reflow @ 260°C & 6x TS @ 288°C
ATC after 6x Reflow @ 260°C IST after 6x Reflow @ 260°C
ATC after 6x TS @ 288°C IST after 6x TS @ 288°C
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30. TACHYON® 100G IST DATA 0.8 MM
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31. TACHYON® 100G CAF 20 MIL HW-HW
20 Layer MRT6 LRC design
Glass used – 2116 & 1078
100 VDC, 65C, 87% RH
Data shows no wear out over 1000 hours
One failure after 900+ hours out of 20
coupons
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32. Product Summary
Tachyon 100G

33. TACHYON® 100G PRODUCT SUMMARY
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Engineered to improve insertion loss on the most demanding high-speed digital designs
Tachyon® 100G is recommended for 40+ Gb/s backplanes and line cards
Optimized constructions for superior CAF and lead-free assembly performance
Complete line of laminate and prepreg with spread glass weaves to minimize micro-Dk
effects of glass fabrics and to mitigate skew
HDI-design friendly
Hybrid compatible with other Isola products
Consolidated press cycle with Isola FR4 - short cure lamination cycle
Proven in space, phased array applications, radar systems, communications and
high end computing
Global technical and applications support with seasoned industry PCB fabrication and
laminate material experts
Global production site capacity – the only true global partner

34. Thank You
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