Download to read offline
Uploaded byEpec Engineered Technologies
Tachyon 100G PCB Performance Attributes and Applications
The document details tachyon® 100g, a high-speed, ultra-low loss substrate suitable for various electronic applications including wired telecom, RF/microwave, and automotive electronics. It highlights key performance attributes such as low dielectric constant (3.02 - 3.25), low dissipation factor (0.0018 - 0.0025), and excellent thermal stability, making it ideal for high-frequency designs. The product is suitable for multilayer printed circuit boards and demonstrates superior mechanical and electrical characteristics compared to competitors.
More Related Content
Similar to Tachyon 100G PCB Performance Attributes and Applications
More from Epec Engineered Technologies
Tachyon 100G PCB Performance Attributes and Applications
- 1. Tachyon® 100G Ultra-low Loss,Lead-free Materials for High-speed Digital & RF/MW Applications April 2024
- 2. A Little AboutUs We’ve spent more than a century creating robust, tested and proven products that serve as the very foundation upon which the electronics we count on in our daily lives are built. It all starts with us, and we take that responsibility seriously. Our Commitment to Quality: Electrical performance that remains consistent across each and every lot of material we produce. Performance levels that are steady over the long haul. How our products stand up to your specific requirements and needs. 2 How easy it is to work with our materials in your processes. Process ability Consistency Long-term reliability Specific applications
- 3. Product Profile I-Speed® (RFTuned) Dk 3.44 Df 0.0060 Tg 180°C Td 360°C IS400 Dk 3.90 Df 0.022 Tg 150°C Td 330°C 370HR Dk 4.04 Df 0.021 Tg 180°C Td 340°C 185HR Dk 4.01 Df 0.020 Tg 180°C Td 340°C FR408HR Dk 3.68 Df 0.0092 Tg 190°C Td 360°C I-Tera® MT40 Dk 3.45 Df 0.0031 Tg 200°C Td 360°C IS580G Dk 3.80 Df 0.0060 Tg 195°C Td 385°C I-Speed® Dk 3.64 Df 0.0060 Tg 180°C Td 360°C Astra® MT77 Dk 3.0 Df 0.0017 Tg 200°C Td 360°C Tachyon® 100G Dk 3.02 Df 0.0021 Tg 200°C Td 360°C FR406N Dk 4.3 Df 0.025 Tg 170°C Td 300°C P25N Dk 3.67 Df 0.0187 Tg 250°C Td 383°C P95/P25 Dk 3.76 Df 0.017 Tg 260°C Td 416°C P96/P26 Dk 3.76 Df 0.017 Tg 260°C Td 396°C Specialty Products No Flow High Temperature I-Tera® MT40 (RF/MW) Dk 3.38 - 3.75 Df 0.0028 - 0.0035 Tg 200°C Td 360°C TerraGreen® 400G (RF/MW) Dk 3.08 Df 0.0018 Tg 210°C Td 400°C TerraGreen® 400G Dk 3.05 Df 0.0018 Tg 210°C Td 400°C IS580G (RF Tuned) Dk 3.53 Df 0.0060 Tg 195°C Td 385°C IS550H Dk 4.43 Df 0.016 Tg 200°C Td 400°C NEW NEW NEW NEW NEW Coming Soon
- 4. a a a Tachyon 100G- Common Applications by Market Wired Telecom & Computing High Speed Digital Wireless Telecommunications RF/Microwave Automotive High Reliability & V2X Mid and Back Planes Line Cards PCIe 5 & 6 Servers AI Servers AI Computing High Speed Switches High End Routers Video Collaboration Systems MIMO Antennae Systems RRU - Remote Radio Unit BBU - Baseband Unit AAU – Active Antenna Unit Phased Arrays Satellite Communication Systems Military Communications & Infrastructure Electric (EV) & Hybrid Electric (HEV) Vehicle electronics V2X – Vehicle to Everything - People, Infrastructure, Vehicle, Network Control Systems Short and Long Range Radar Systems LIDAR systems In Cabin Sensor Systems 4
- 5. Product Offering andProperties Summary 5 Tachyon® 100G
- 6. TACHYON 100G PRODUCTOFFERING 6 Laminate constructions from 0.002” to 0.020” Optimized constructions for excellent lead-free assembly performance and thickness control Low Dk glass is standard Significantly improves SI performance High Performance Copper – reduces conductor losses Standard HVLP (VLP2) ≥2.5 µm Advanced RTF ≥2.3 µm HVLP3 (VLP1) ≥1.0 µm Square weave, mechanically spread glass Glass Offerings: 1035, 1078, 1067, 1086 & 3313 Reduces ‘Fiber Weave Effect’ mitigates skew and micro-Dk effect Improves CAF performance UL Approvals: 130 MOT & 94 V-0
- 7. Tachyon® 100G KeyProduct Performance Attributes 7 Ultra low loss Df ≈ 0.0021, Very low Dk ≈ 3.02 For 40+ Gb/s backplane and line card designs High Speed Digital 56G PAM4 applications and beyond High Tg: 200°C & Td: 360°C Thermally robust for fine pitch applications HDI capability to 10x sequential lamination Ease of Processing Use FR-4 process equipment Hybrid stack ups with 185HR, 370HR, IS415, FR408HR, I-Speed®, I- Tera®MT40 and Astra®MT77 Prepreg Storage – No special refrigeration required Standard FR-4 storage with tacky free surface High RC% prepregs for heavy copper applications – no high pressure Consistent thickness control across the panel
- 8. Tachyon® 100G KeyProduct Performance Attributes 8 Excellent CAF Performance Passes MRT7 16 and 20 mil HW-HW spacing Solid thermal cycling performance Passes D-Coupon 4+N+4 stack up – Stacked & staggered over Buried (Customer tested up to 9x) Excellent thermal stability during PCB fabrication Short press cycle to reduce cost – 60-80 minutes @ 200°C Survives multiple lamination cycles for HDI / µVia designs Combined press cycle with FR-4 materials Superior drill performance Increased tool life for reduced processing cost Consistent quality of mechanically drilled PTH and laser defined µvias significantly reduces via defects Plasma desmear is not required on low aspect ratio designs
- 9. 9 Tachyon 100G Whereit is Made? Chandler Az Huizhou China Tachyon 100G Pressing Only Tachyon 100G Future Treating and Pressing ~2025 Tachyon 100G Treating and Pressing NA Tachyon 100G Pressing Only 7 3 1 2 Headquarters Sales 6 8 5 4 Tachyon 100G Treating and Pressing Manufacturing Research & Development 1. Chandler, AZ 2. Ridgeway. SC 3. Düren, DE 4. Singapore 5. Hong Kong 6. Huizhou, CN 7. Suzhou, CN 8. Taoyuan City, TW 9. Düren Germany Ridgeway SC Suzhou China Taoyuan Taiwan
- 10.
- 11. HSD Laminate Comparison PropertyUnits Megtron 6G Megtron 7N Meteorwave 4000 Tachyon® 100G Tg °C °C 185 200 250 215 Td @ 5 % wt loss °C 410 400 390 360 CTE z-axis ( α1/α2) ) ppm/°C 45/260 42/280 55/260 45/250 CTE x-y axis pre-Tg ppm/°C 14/16 14/16 10/14 12/13 T-260 ( TMA ) minutes >120 >120 >120 > 60 T-288 ( TMA ) minutes >120 >120 >120 > 60 Dk @ 2 GHz - 3.46 - 3.71 3.18 – 3.37 3.5 3.02 - 3.25 Dk @ 10 GHz - 3.38 - 3.64 3.16 – 3.35 3.5 3.02 - 3.25 Df @ 2 GHz - 0.002 0.002 0.0032 0.0018 - 0.0025 Df @ 10 GHz - 0.004 0.002 0.0028 0.0018 – 0.0025 Elelctrical Strength volts/mil - - 1100 Peel Strength lb/in 4.5 (HVLP) 4.5 (HVLP) 5.5(HVLP) 4.0 (HVLP) Flammability - V-0 V-0 V-0 V-0 Moisture Absorption % 0.14 0.06 0.12 0.016 Slash Sheets IPC 4101 Rev E IPC 4101 IPC 4101 IPC 4101 IPC 4101/4103 /102 /102 - /102, /17 Thermal test data is based on rigid core material Dk Df data by Bereskin Stripline Test Method Data sheets provide generic information – basic comparison 11
- 12. HSD Substitution usingTachyon 100G Megtron 6G Megtron 7N Meteorwave 4000 Tachyon 100G better than Very Low Loss Performance Dielectric Constant Range - 3.02 to 3.25 Lower Dk Dissipation Factor Range – 0.0018 – 0.0025 Much Lower Df HVLP (VLP2) - 2 µm copper reduces conductor loss Same Ultra Low Loss performance level Same available construction options – 1035, 1067 and 1078 Availability of lower loss ARTF and HVLP3 (VLP-1) copper foil to match competitive products Global availability – US, Europe, Asia 12
- 13. RF/MW Laminate Comparison PropertyUnits RO4350B RO4003C RO3003 Tachyon® 100G Tg °C °C >280 >280 - 200 Td @ 5 % wt loss °C - - - 360 CTE z-axis ( 50 to 260 C ) % 50 46 2.90 CTE x-y axis pre-Tg ppm/°C 14/16 11/14 - 12/13 T-260 ( TMA ) minutes - - - > 60 T-288 ( TMA ) minutes - - - > 60 Dk @ 2 GHz - 3.48 3.38 3.0 3.02 - 3.25 Dk @ 10 GHz - 3.48 3.38 3.0 3.02 - 3.25 Df @ 2 GHz - 0.0037 0.0027 0.0013 0.0018 - 0.0025 Df @ 10 GHz - 0.0031 0.0021 0.0013 0.0018 – 0.0025 Elelctrical Strength volts/mil 780 780 1100 Peel Strength - after Thermal Stress lb/in 5.0 (1 oz HTE) 6.0 (1 oz HTE) 17.6 (1 oz HTE) 4.0 (1 oz HVLP) Flammability - V-0 NA V-0 V-0 Moisture Absorption % 0.04 0.04 - 0.016 Slash Sheets IPC 4101 Rev E IPC 4103 IPC 4103 IPC 4103 IPC 4103 /11 /10 /102, /17 Thermal test data is based on rigid core material Dk Df data by Bereskin Stripline Test Method Data sheets provide generic information – basic comparison 13
- 14. RF/MW Substitution usingTachyon 100G RO4350B 3.45 Dk RO4003C 3.38 Dk RO3003 3.0 Dk Tachyon 100G Flexibility Dielectric Constant Range - 3.02 to 3.25 Lower Dk Dissipation Factor Range – 0.0018 – 0.0025 Lower Df Wider range of CCL thickness 2 - 20 mils Full compliment of same resin system prepregs HVLP (VLP2) - 2 µm copper reduces conductor loss Ease of Processing using FR-4 equipment. No special processing Ease of Hybrid Stackups with FR-4 – similar x-y CTE performance Global Availability – US, Europe, Asia 14
- 15.
- 16. DELTA L STACKUP & SECTION EXAMPLES Layer Cu Weight Thickness (mil) Copper Remain Glass Fiber Style Solder Mask 0.5 L1 (sigs) 0.5 oz. plated 1.9 >80% Microstrip Prepreg 3.3 1x 1078 70.5% L2 GND/PWR 1.0 oz. 1.2 >90% Core 4 1x 3313 59.5% L3 (sigs) 1.0 oz. 1.2 >80% Stripline Prepreg 4.1 1x 3313 66.5% L4 GND/PWR 1.0 oz. 4.6 >90% Core 5 2x 1078 62.0% L5 (sigs) 1.0 oz. 1.2 >80% Stripline Prepreg 5.6 2x 1078 67.5% L6 GND/PWR 1.0 oz. 1.2 >90% Core 12 3x 3313 59.5% L7 (sigs) 1.0 oz. 1.2 >90% Prepreg 5.6 2x 1078 67.5% L8 GND/PWR 1.0 oz. 1.2 >80% Stripline Core 5 2x1078 62.0% L9 GND/PWR 1.0 oz. 1.2 >90% Prepreg 4.6 1x 3313 66.5% L10 (sigs) 1.0 oz. 1.2 >80% Core 4 1x 3313 59.5% L11 (GND) 1.0 oz. 1.2 >90% Prepreg 3.3 1x 1078 70.5% L12 (sigs) 1.0 oz. 1.2 >80% Solder Mask 0.5 Thickness 76 HTE Outer Copper 16
- 17. Tachyon 100G DeltaL Test Results using VLP2 Copper foil 17
- 18. Materials SI PerformanceCharacterization TPCA - Intel Delta L Comparison of Ultra Low Loss Materials Panasonic Megtron 6G & 7N Multiple PCB Fabricators Multiple PCB’s measured Impedance Range: 85 Ohms +/-10% Layer 1: HTE Copper Foil Stack up: 12 Layer Testing Metrology: Delta L Average of three samples per PCB fabricator Virtually identical performance 18
- 19. Tachyon 100G –Loss (dB/in) 14 GHz and 28 GHz Layer 3 Horizontal SE Layer 3 Horizontal Diff Isola 8 Layer Delta L SITV Single Ended - 14.0 and 0.6 inch traces Differential Traces - 10.4 and 2.0 inch traces Manufacturer: Anritsu Model: MS4647B Tested range: 100 MHz to 40 GHz Cable Type: Coaxial K Copper #1 Copper #2 Copper #1 Copper #2 19
- 20. Difference in Loss:Compared to current base copper foil 20
- 21. HDI & SequentialLamination Summary 21 Tachyon® 100G
- 22. RESULTS SUMMARY –10x BUILD UP SIMULATION No degradation found on any thermal or electrical parameter that was measured All thermal measurements were within expected range All electrical properties were within expected range Oxide bond was not degraded Tachyon 100G resin system is very stable under repeated lamination cycles 22
- 23. HDI OM THERMALCYCLING TEST 96 mils 4+10+4 Stack up 4 lamination cycles IPC-2221B D-Type Coupon Air to Air Method – 6 cycles to pass 24 cycles 35 to 230°C 23 Fabrication courtesy of TTM Anaheim Division
- 24. REFLOW STATISTICS Initial roomtemperature resistances greater than 15 ohms are “open” Reference resistances greater than 3 times their initial room temperature resistance are “open” Reference resistances are based on cycle 1 at high temperature Cells highlighted in red indicate failures Cells indicated in blue indicate suspensions No failures found 24
- 25. TEST SUMMARY No degradationfound on any thermal or electrical parameter that was measured All thermal measurements were within expected range All electrical properties were within expected range Oxide bond was not degraded Tachyon 100G resin system is very stable under Repeated lamination cycles Extended OM and IST thermal cycling tests Consistent, good overall performance compared to peer products 25 Fabrication courtesy of TTM Anaheim Division
- 26. MRT Test VehicleSummary 26 Tachyon® 100G
- 27. MRT TEST VEHICLE& STACK UP 27
- 28. • Low overallz-CTE and expansion with copper 28 TACHYON 100G PCB TEST DATA • Results surpassed expectations
- 29. TACHYON® 100G HRC0.8 MM ATC & IST COUPONS After 6x Reflow @ 260°C & 6x TS @ 288°C ATC after 6x Reflow @ 260°C IST after 6x Reflow @ 260°C ATC after 6x TS @ 288°C IST after 6x TS @ 288°C 29
- 30. TACHYON® 100G ISTDATA 0.8 MM 30
- 31. TACHYON® 100G CAF20 MIL HW-HW 20 Layer MRT6 LRC design Glass used – 2116 & 1078 100 VDC, 65C, 87% RH Data shows no wear out over 1000 hours One failure after 900+ hours out of 20 coupons 31
- 32.
- 33. TACHYON® 100G PRODUCTSUMMARY 33 Engineered to improve insertion loss on the most demanding high-speed digital designs Tachyon® 100G is recommended for 40+ Gb/s backplanes and line cards Optimized constructions for superior CAF and lead-free assembly performance Complete line of laminate and prepreg with spread glass weaves to minimize micro-Dk effects of glass fabrics and to mitigate skew HDI-design friendly Hybrid compatible with other Isola products Consolidated press cycle with Isola FR4 - short cure lamination cycle Proven in space, phased array applications, radar systems, communications and high end computing Global technical and applications support with seasoned industry PCB fabrication and laminate material experts Global production site capacity – the only true global partner
- 34.